CN101652695B - 晶片级相机模块及制造方法 - Google Patents
晶片级相机模块及制造方法 Download PDFInfo
- Publication number
- CN101652695B CN101652695B CN200880009978.7A CN200880009978A CN101652695B CN 101652695 B CN101652695 B CN 101652695B CN 200880009978 A CN200880009978 A CN 200880009978A CN 101652695 B CN101652695 B CN 101652695B
- Authority
- CN
- China
- Prior art keywords
- transparent element
- image capture
- capture apparatus
- array
- digital camera
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 34
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 239000000853 adhesive Substances 0.000 claims description 21
- 230000001070 adhesive effect Effects 0.000 claims description 21
- 239000004568 cement Substances 0.000 claims description 20
- 230000002093 peripheral effect Effects 0.000 claims description 12
- 230000003993 interaction Effects 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 10
- 238000001020 plasma etching Methods 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 238000000059 patterning Methods 0.000 claims description 7
- 238000000227 grinding Methods 0.000 claims description 6
- 238000001465 metallisation Methods 0.000 claims description 6
- 238000000926 separation method Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 238000003491 array Methods 0.000 abstract description 3
- 230000003287 optical effect Effects 0.000 abstract description 3
- ARXHIJMGSIYYRZ-UHFFFAOYSA-N 1,2,4-trichloro-3-(3,4-dichlorophenyl)benzene Chemical compound C1=C(Cl)C(Cl)=CC=C1C1=C(Cl)C=CC(Cl)=C1Cl ARXHIJMGSIYYRZ-UHFFFAOYSA-N 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 239000007767 bonding agent Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 2
- 239000005304 optical glass Substances 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000005499 meniscus Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000013618 particulate matter Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/40—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
- H04N25/41—Extracting pixel data from a plurality of image sensors simultaneously picking up an image, e.g. for increasing the field of view by combining the outputs of a plurality of sensors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Dicing (AREA)
- Lens Barrels (AREA)
Abstract
Description
Claims (37)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/698,776 | 2007-01-26 | ||
US11/698,776 US8456560B2 (en) | 2007-01-26 | 2007-01-26 | Wafer level camera module and method of manufacture |
PCT/US2008/001083 WO2008094499A2 (en) | 2007-01-26 | 2008-01-28 | Wafer level camera module and method of manufacture |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101652695A CN101652695A (zh) | 2010-02-17 |
CN101652695B true CN101652695B (zh) | 2015-07-08 |
Family
ID=39667503
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200880009978.7A Expired - Fee Related CN101652695B (zh) | 2007-01-26 | 2008-01-28 | 晶片级相机模块及制造方法 |
Country Status (5)
Country | Link |
---|---|
US (3) | US8456560B2 (zh) |
JP (2) | JP5768206B2 (zh) |
CN (1) | CN101652695B (zh) |
CA (1) | CA2676550A1 (zh) |
WO (1) | WO2008094499A2 (zh) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070236591A1 (en) * | 2006-04-11 | 2007-10-11 | Tam Samuel W | Method for mounting protective covers over image capture devices and devices manufactured thereby |
US8456560B2 (en) * | 2007-01-26 | 2013-06-04 | Digitaloptics Corporation | Wafer level camera module and method of manufacture |
US8605208B2 (en) | 2007-04-24 | 2013-12-10 | Digitaloptics Corporation | Small form factor modules using wafer level optics with bottom cavity and flip-chip assembly |
US20100214458A1 (en) * | 2007-08-02 | 2010-08-26 | Masashi Saito | Method for Manufacturing Imaging Device, Imaging Device and Portable Terminal |
KR20090048920A (ko) * | 2007-11-12 | 2009-05-15 | 삼성전자주식회사 | 카메라 모듈 및 이를 구비한 전자 기기 |
US9118825B2 (en) * | 2008-02-22 | 2015-08-25 | Nan Chang O-Film Optoelectronics Technology Ltd. | Attachment of wafer level optics |
JP5317586B2 (ja) * | 2008-08-28 | 2013-10-16 | ラピスセミコンダクタ株式会社 | カメラモジュール及びその製造方法 |
US9419032B2 (en) * | 2009-08-14 | 2016-08-16 | Nanchang O-Film Optoelectronics Technology Ltd | Wafer level camera module with molded housing and method of manufacturing |
CN102045494A (zh) * | 2009-10-22 | 2011-05-04 | 国碁电子(中山)有限公司 | 相机模组及其制作方法 |
US9065991B2 (en) * | 2010-11-04 | 2015-06-23 | Lensvector Inc. | Methods of adjustment free manufacture of focus free camera modules |
US8308379B2 (en) * | 2010-12-01 | 2012-11-13 | Digitaloptics Corporation | Three-pole tilt control system for camera module |
CN103679108B (zh) | 2012-09-10 | 2018-12-11 | 霍尼韦尔国际公司 | 具有多个图像传感器的光学标记读取装置 |
CN107657197B (zh) | 2012-09-25 | 2020-07-28 | 霍尼韦尔国际公司 | 基于层叠封装的集成电路芯片成像器 |
US9625684B2 (en) * | 2013-05-09 | 2017-04-18 | Google Technology Holdings LLC | Lens laminate and method |
DE102015216461A1 (de) * | 2015-08-28 | 2017-03-02 | Robert Bosch Gmbh | Mikroelektronische Bauelementanordnung, System mit einer mikroelektronischen Bauelementanordnung und entsprechendes Herstellungsverfahren für eine mikroelektronische Bauelementanordnung |
US10488632B2 (en) * | 2016-01-20 | 2019-11-26 | Mems Optical Zoom Corporation | MEMS lens actuator |
CN105549173A (zh) * | 2016-01-28 | 2016-05-04 | 宁波舜宇光电信息有限公司 | 光学镜头和摄像模组及其组装方法 |
WO2017216898A1 (ja) * | 2016-06-15 | 2017-12-21 | オリンパス株式会社 | 内視鏡用光学ユニットの製造方法、内視鏡用光学ユニット、および内視鏡 |
US20180234595A1 (en) * | 2017-02-10 | 2018-08-16 | Google Inc. | Camera Module |
JP6949515B2 (ja) * | 2017-03-15 | 2021-10-13 | ソニーセミコンダクタソリューションズ株式会社 | カメラモジュール及びその製造方法、並びに、電子機器 |
CN107454289A (zh) * | 2017-07-28 | 2017-12-08 | 中国科学院长春光学精密机械与物理研究所 | 应用于工业相机电路板的优化设计方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6285064B1 (en) * | 2000-03-28 | 2001-09-04 | Omnivision Technologies, Inc. | Chip scale packaging technique for optical image sensing integrated circuits |
CN1517736A (zh) * | 2003-01-27 | 2004-08-04 | ������������ʽ���� | 照相机模件及其制造方法 |
US6836382B2 (en) * | 2003-05-09 | 2004-12-28 | Alex Ning | Imaging module |
CN1682377A (zh) * | 2002-09-17 | 2005-10-12 | 皇家飞利浦电子股份有限公司 | 照相装置、制造照相装置的方法以及晶片尺度的封装 |
Family Cites Families (74)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4345021A (en) | 1979-09-25 | 1982-08-17 | Matsushita Electric Industrial Co., Ltd. | Solid-state image pickup element and process for fabricating the same |
JPH0864556A (ja) | 1994-08-19 | 1996-03-08 | Nec Corp | ガラス基板の分離方法 |
JP2679681B2 (ja) | 1995-04-28 | 1997-11-19 | 日本電気株式会社 | 半導体装置、半導体装置用パッケージ及びその製造方法 |
JPH09139484A (ja) * | 1995-11-14 | 1997-05-27 | Sony Corp | 固体撮像素子の製造方法 |
US6235141B1 (en) | 1996-09-27 | 2001-05-22 | Digital Optics Corporation | Method of mass producing and packaging integrated optical subsystems |
US5912872A (en) | 1996-09-27 | 1999-06-15 | Digital Optics Corporation | Integrated optical apparatus providing separated beams on a detector and associated methods |
US6096155A (en) | 1996-09-27 | 2000-08-01 | Digital Optics Corporation | Method of dicing wafer level integrated multiple optical elements |
US6669803B1 (en) | 1997-10-03 | 2003-12-30 | Digital Optics Corp. | Simultaneous provision of controlled height bonding material at a wafer level and associated structures |
US6426829B1 (en) | 1998-03-26 | 2002-07-30 | Digital Optics Corp. | Integrated micro-optical systems |
CN1129023C (zh) | 1998-03-26 | 2003-11-26 | 数字光学公司 | 集成微光学系统 |
JP4274602B2 (ja) | 1998-09-11 | 2009-06-10 | オリンパス株式会社 | 対物光学系 |
CN1497326A (zh) | 1999-03-19 | 2004-05-19 | ��ʿ��Ƭ��ʽ���� | 防水型带镜头摄影胶片单元及其组装方法 |
US6566745B1 (en) | 1999-03-29 | 2003-05-20 | Imec Vzw | Image sensor ball grid array package and the fabrication thereof |
US6324010B1 (en) | 1999-07-19 | 2001-11-27 | Eastman Kodak Company | Optical assembly and a method for manufacturing lens systems |
US6374004B1 (en) | 1999-10-14 | 2002-04-16 | Digital Optics Corporation | Optical subassembly |
JP3880278B2 (ja) * | 2000-03-10 | 2007-02-14 | オリンパス株式会社 | 固体撮像装置及びその製造方法 |
US6407381B1 (en) | 2000-07-05 | 2002-06-18 | Amkor Technology, Inc. | Wafer scale image sensor package |
US6528857B1 (en) | 2000-11-13 | 2003-03-04 | Amkor Technology, Inc. | Chip size image sensor bumped package |
TW523924B (en) | 2001-01-12 | 2003-03-11 | Konishiroku Photo Ind | Image pickup device and image pickup lens |
JP3540281B2 (ja) | 2001-02-02 | 2004-07-07 | シャープ株式会社 | 撮像装置 |
US6798931B2 (en) | 2001-03-06 | 2004-09-28 | Digital Optics Corp. | Separating of optical integrated modules and structures formed thereby |
JP3778817B2 (ja) * | 2001-07-11 | 2006-05-24 | 富士フイルムマイクロデバイス株式会社 | 固体撮像装置およびその製造方法 |
US6555967B2 (en) * | 2001-09-19 | 2003-04-29 | Supertex, Inc. | Low noise method and apparatus for driving electroluminescent panels |
JP4266106B2 (ja) | 2001-09-27 | 2009-05-20 | 株式会社東芝 | 粘着性テープの剥離装置、粘着性テープの剥離方法、半導体チップのピックアップ装置、半導体チップのピックアップ方法及び半導体装置の製造方法 |
JP3881888B2 (ja) * | 2001-12-27 | 2007-02-14 | セイコーエプソン株式会社 | 光デバイスの製造方法 |
JP2003234465A (ja) * | 2002-02-06 | 2003-08-22 | Sony Corp | 半導体装置の製造方法 |
US7074638B2 (en) | 2002-04-22 | 2006-07-11 | Fuji Photo Film Co., Ltd. | Solid-state imaging device and method of manufacturing said solid-state imaging device |
US6873024B1 (en) | 2002-05-15 | 2005-03-29 | Eastman Kodak Company | Apparatus and method for wafer level packaging of optical imaging semiconductor devices |
KR100476558B1 (ko) | 2002-05-27 | 2005-03-17 | 삼성전기주식회사 | 이미지 센서 모듈 및 그 제작 공정 |
JP2004088713A (ja) | 2002-06-27 | 2004-03-18 | Olympus Corp | 撮像レンズユニットおよび撮像装置 |
CN1332231C (zh) | 2002-07-01 | 2007-08-15 | 罗姆股份有限公司 | 图像传感器组件 |
JP4082573B2 (ja) | 2002-07-01 | 2008-04-30 | ローム株式会社 | イメージセンサモジュール |
EP1942522A3 (en) | 2002-07-29 | 2009-11-11 | FUJIFILM Corporation | Solid-state imaging device and method of manufacturing the same |
US6885107B2 (en) | 2002-08-29 | 2005-04-26 | Micron Technology, Inc. | Flip-chip image sensor packages and methods of fabrication |
JP5030360B2 (ja) | 2002-12-25 | 2012-09-19 | オリンパス株式会社 | 固体撮像装置の製造方法 |
JP4525000B2 (ja) * | 2003-05-09 | 2010-08-18 | ソニー株式会社 | 光学装置、レンズ鏡筒及び撮像装置 |
JP4551638B2 (ja) | 2003-08-01 | 2010-09-29 | 富士フイルム株式会社 | 固体撮像装置の製造方法 |
US6995462B2 (en) | 2003-09-17 | 2006-02-07 | Micron Technology, Inc. | Image sensor packages |
US7205095B1 (en) | 2003-09-17 | 2007-04-17 | National Semiconductor Corporation | Apparatus and method for packaging image sensing semiconductor chips |
US7199438B2 (en) | 2003-09-23 | 2007-04-03 | Advanced Semiconductor Engineering, Inc. | Overmolded optical package |
JP2005117253A (ja) | 2003-10-06 | 2005-04-28 | Tamron Co Ltd | 撮像装置 |
US7329861B2 (en) * | 2003-10-14 | 2008-02-12 | Micron Technology, Inc. | Integrally packaged imaging module |
JP4542768B2 (ja) * | 2003-11-25 | 2010-09-15 | 富士フイルム株式会社 | 固体撮像装置及びその製造方法 |
JP4236594B2 (ja) | 2004-01-27 | 2009-03-11 | シャープ株式会社 | 光学装置用モジュール及び光学装置用モジュールの製造方法 |
US7872686B2 (en) | 2004-02-20 | 2011-01-18 | Flextronics International Usa, Inc. | Integrated lens and chip assembly for a digital camera |
US7796187B2 (en) | 2004-02-20 | 2010-09-14 | Flextronics Ap Llc | Wafer based camera module and method of manufacture |
US8049806B2 (en) * | 2004-09-27 | 2011-11-01 | Digitaloptics Corporation East | Thin camera and associated methods |
TWI247409B (en) | 2004-05-13 | 2006-01-11 | Via Tech Inc | Flip chip package and process thereof |
KR100652375B1 (ko) | 2004-06-29 | 2006-12-01 | 삼성전자주식회사 | 와이어 본딩 패키지를 포함하는 이미지 센서 모듈 구조물및 그 제조방법 |
KR100592368B1 (ko) | 2004-07-06 | 2006-06-22 | 삼성전자주식회사 | 반도체 소자의 초박형 모듈 제조 방법 |
US7593057B2 (en) | 2004-07-28 | 2009-09-22 | Microsoft Corp. | Multi-view integrated camera system with housing |
WO2006026354A2 (en) | 2004-08-25 | 2006-03-09 | Newport Imaging Corporation | Apparatus for multiple camera devices and method of operating same |
EP1785750A1 (en) * | 2004-09-01 | 2007-05-16 | Matsushita Electric Industrial Co., Ltd. | Condensing element, solid-state imaging device and method for fabricating the same |
US7453636B2 (en) | 2004-09-13 | 2008-11-18 | Fusion Optix Inc. | High contrast optical path corrected screen |
EP1800340A4 (en) | 2004-09-29 | 2011-03-16 | Fujifilm Corp | MULTILAYER BODY GRINDING METHOD AND SEMICONDUCTOR IMAGE DETECTION DEVICE MANUFACTURING METHOD |
JP2006100587A (ja) * | 2004-09-29 | 2006-04-13 | Fuji Photo Film Co Ltd | 固体撮像装置の製造方法 |
JP2006184543A (ja) | 2004-12-27 | 2006-07-13 | Sony Corp | 組レンズの組立て方法、この方法によって組立てられた組レンズ、および撮像装置 |
CN1831575B (zh) * | 2005-03-11 | 2013-02-13 | 鸿富锦精密工业(深圳)有限公司 | 数码相机镜头结构 |
JP2007012995A (ja) * | 2005-07-01 | 2007-01-18 | Toshiba Corp | 超小型カメラモジュール及びその製造方法 |
JP4673721B2 (ja) | 2005-10-21 | 2011-04-20 | 富士通セミコンダクター株式会社 | 撮像装置及びその製造方法 |
JP2007129164A (ja) * | 2005-11-07 | 2007-05-24 | Sharp Corp | 光学装置用モジュール、光学装置用モジュールの製造方法、及び、構造体 |
TWI267208B (en) | 2006-01-18 | 2006-11-21 | Visera Technologies Co Ltd | Image sensor module |
US20070236591A1 (en) | 2006-04-11 | 2007-10-11 | Tam Samuel W | Method for mounting protective covers over image capture devices and devices manufactured thereby |
KR20090083932A (ko) * | 2006-11-17 | 2009-08-04 | 테쎄라 노쓰 아메리카, 아이엔씨. | 광학 스택을 이용해 카메라 시스템의 내부 노이즈를 줄이는 구조 및 방법 |
US8456560B2 (en) * | 2007-01-26 | 2013-06-04 | Digitaloptics Corporation | Wafer level camera module and method of manufacture |
JP2010525413A (ja) | 2007-04-24 | 2010-07-22 | フレックストロニクス エーピー エルエルシー | ウエハーレベル光学部品を用いた自動焦点/ズームモジュール |
US8605208B2 (en) | 2007-04-24 | 2013-12-10 | Digitaloptics Corporation | Small form factor modules using wafer level optics with bottom cavity and flip-chip assembly |
JP2008283002A (ja) | 2007-05-10 | 2008-11-20 | Sharp Corp | 撮像素子モジュールおよびその製造方法 |
US8270177B2 (en) | 2007-07-27 | 2012-09-18 | Renesas Electronics Corporation | Electronic device and method for manufacturing electronic device |
JP2009099680A (ja) | 2007-10-15 | 2009-05-07 | Panasonic Corp | 光学デバイスおよびその製造方法 |
US9118825B2 (en) | 2008-02-22 | 2015-08-25 | Nan Chang O-Film Optoelectronics Technology Ltd. | Attachment of wafer level optics |
JP5009209B2 (ja) | 2008-03-21 | 2012-08-22 | シャープ株式会社 | ウエハ状光学装置およびその製造方法、電子素子ウエハモジュール、センサウエハモジュール、電子素子モジュール、センサモジュール、電子情報機器 |
US20090243051A1 (en) | 2008-03-28 | 2009-10-01 | Micron Technology, Inc. | Integrated conductive shield for microelectronic device assemblies and associated methods |
US9419032B2 (en) | 2009-08-14 | 2016-08-16 | Nanchang O-Film Optoelectronics Technology Ltd | Wafer level camera module with molded housing and method of manufacturing |
-
2007
- 2007-01-26 US US11/698,776 patent/US8456560B2/en not_active Expired - Fee Related
-
2008
- 2008-01-28 CA CA002676550A patent/CA2676550A1/en not_active Abandoned
- 2008-01-28 CN CN200880009978.7A patent/CN101652695B/zh not_active Expired - Fee Related
- 2008-01-28 WO PCT/US2008/001083 patent/WO2008094499A2/en active Application Filing
- 2008-01-28 JP JP2009547318A patent/JP5768206B2/ja not_active Expired - Fee Related
-
2013
- 2013-06-04 US US13/909,808 patent/US8730369B2/en not_active Expired - Fee Related
-
2014
- 2014-05-19 US US14/281,371 patent/US20150026971A1/en not_active Abandoned
- 2014-06-26 JP JP2014131911A patent/JP2014239446A/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6285064B1 (en) * | 2000-03-28 | 2001-09-04 | Omnivision Technologies, Inc. | Chip scale packaging technique for optical image sensing integrated circuits |
CN1682377A (zh) * | 2002-09-17 | 2005-10-12 | 皇家飞利浦电子股份有限公司 | 照相装置、制造照相装置的方法以及晶片尺度的封装 |
CN1517736A (zh) * | 2003-01-27 | 2004-08-04 | ������������ʽ���� | 照相机模件及其制造方法 |
US6836382B2 (en) * | 2003-05-09 | 2004-12-28 | Alex Ning | Imaging module |
Also Published As
Publication number | Publication date |
---|---|
US8730369B2 (en) | 2014-05-20 |
WO2008094499A2 (en) | 2008-08-07 |
JP5768206B2 (ja) | 2015-08-26 |
US8456560B2 (en) | 2013-06-04 |
CA2676550A1 (en) | 2008-08-07 |
US20080180566A1 (en) | 2008-07-31 |
WO2008094499A3 (en) | 2008-09-25 |
US20150026971A1 (en) | 2015-01-29 |
US20130265481A1 (en) | 2013-10-10 |
JP2010517432A (ja) | 2010-05-20 |
JP2014239446A (ja) | 2014-12-18 |
CN101652695A (zh) | 2010-02-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101652695B (zh) | 晶片级相机模块及制造方法 | |
CN101730863B (zh) | 相机模块及其制造方法 | |
CN102577644B (zh) | 带有模制外壳的晶圆级照相机模块以及制造方法 | |
US20070269205A1 (en) | Camera module and manufacturing method thereof | |
US20100328525A1 (en) | Camera module | |
US7663234B2 (en) | Package of a semiconductor device with a flexible wiring substrate and method for the same | |
CN211089753U (zh) | 影像感测模块 | |
KR20030091389A (ko) | 이미지 센서 모듈 및 그 제작 공정 | |
TW201403205A (zh) | 相機模組及相機模組之製造方法 | |
JP2012029049A (ja) | 撮像装置および撮像装置の製造方法 | |
US10943938B2 (en) | Image sensor and manufacturing method thereof | |
JP2011123497A (ja) | カメラモジュール及びその製造方法 | |
CN103685881A (zh) | 照相机模块 | |
CN105489619B (zh) | 具有柔性互连层的图像传感器装置及相关方法 | |
US8440491B2 (en) | Methods of forming imager device with electric connections to electrical device | |
US9059058B2 (en) | Image sensor device with IR filter and related methods | |
US11393862B2 (en) | Manufacture of semiconductor module with dual molding | |
KR100715858B1 (ko) | 패턴된 전도접착제가 형성된 웨이퍼레벨 패키지 제작 방법및 이를 이용한 이미지 센서 모듈(ism) | |
CN204243042U (zh) | 一种图像传感器装置 | |
US7268346B2 (en) | Method of disassembling an image sensor package | |
CN118098069A (zh) | 屏幕组件、制备方法及电子设备 | |
CN117956256A (zh) | 镜头模组及电子装置 | |
CN117038679A (zh) | 一种封装结构、封装方法、终端设备 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: DIGITAL OPTICS CORP. Free format text: FORMER OWNER: FLEXTRONICS INTERNAT USA INC. Effective date: 20140416 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20140416 Address after: California, USA Applicant after: DIGITAL OPTICS Corp. Address before: American Colorado Applicant before: FLEXTRONICS AP LLC |
|
ASS | Succession or assignment of patent right |
Owner name: NANCHANG O-FILM TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: DIGITAL OPTICS CORP. Effective date: 20150109 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; TO: 330013 NANCHANG, JIANGXI PROVINCE |
|
TA01 | Transfer of patent application right |
Effective date of registration: 20150109 Address after: North to the East, 330013 in Jiangxi province Nanchang city Nanchang economic and technological development zones clove road Longtan ditch Applicant after: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Address before: California, USA Applicant before: Digital Optics Corp. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210616 Address after: 330096 no.1404, Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi Jinghao optics Co.,Ltd. Address before: 330013 Nanchang economic and Technological Development Zone, Nanchang, Jiangxi, north of the lilac road and the north of the Longtan canal. Patentee before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150708 Termination date: 20220128 |