JP5317586B2 - カメラモジュール及びその製造方法 - Google Patents
カメラモジュール及びその製造方法 Download PDFInfo
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- JP5317586B2 JP5317586B2 JP2008219647A JP2008219647A JP5317586B2 JP 5317586 B2 JP5317586 B2 JP 5317586B2 JP 2008219647 A JP2008219647 A JP 2008219647A JP 2008219647 A JP2008219647 A JP 2008219647A JP 5317586 B2 JP5317586 B2 JP 5317586B2
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Description
図2は半導体ウエハ101の概略平面図である。図2に示すように、6インチもしくは8インチの半導体ウエハ101(厚さ625μm〜725μm)の表面に、半導体プロセスによりマトリクス状にセンサ形成領域111の複数すなわちアレイが形成される。図3は1つのカメラモジュールとなるべき半導体ウエハ101のセンサ形成領域の部分の概略部分拡大断面図である。
上記半導体ウエハと同じサイズ、6インチもしくは8インチの300〜500μm厚のガラスウエハ(ガラス平板4)を準備する。図4はかかるガラスウエハ4の概略平面図である。以下の工程で、半導体ウエハのマトリクス状センサ形成領域のアレイと一致するように、ガラスウエハにレンズ部の複数からなるアレイを形成して、透光性光学ウエハ(レンズウエハ)を作製する。
次に、図8に示すように、半導体ウエハ101のセンサ形成領域の受光部11にレンズの焦点を固定するためのスペーサ部151を接着剤を用いて接合する。スペーサ部151は半導体ウエハの第1主面上のセンサ形成領域の受光部11の各々を囲むような所定の位置にダイシング領域として配置される。スペーサ部151は、フランジバックを規定する所定厚のスペーサ9とその両面の接着剤層91からなる。接着剤の材料としては耐熱性のある、たとえばベンゾシクロブテン(Benzocyclobutene:BCB)、ポリイミドなどの感光性ポリマー材料が使用でき、紫外線硬化型或いは熱硬化型が用いられる。図9に示すように、半導体ウエハのダイシング領域の格子状のスペーサ部151に囲まれた受光部11がガラスウエハのレンズ部の各々に対応する。
次に、図11に示すように、レンズ保護用シート例えばバックグラインド用粘着シートBGSに透光性光学ウエハ4の平坦面を貼り付け、一体となった半導体ウエハ101の裏面を研削する。たとえば半導体ウエハ101を50〜100μm厚の所定厚にまでバックグラインドし、ウエハの第2主面を平坦化する。本実施例ではレンズ保護用シートとしては一般的な、紫外線(UV)露光により剥離可能な粘着材が塗布された柔軟性シートいわゆる公知のUVシートを利用できるが、薬品耐性を有するシートであれば、特にUVシートに限定されるものではないことは言うまでもない。
ガラスウエハ4と一体となった半導体ウエハ101の第2主面に貫通電極、外部配線及び外部端子を形成する。概要は、貫通穴を深堀エッチングを用いて設け、Cuメッキなどにより配線を引きだし、電極パッドを形成するのである。
図17に示すように、ガラスウエハ4と一体となった半導体ウエハ101を、所定のダイシングブレード52により、スペーサ部151の中央に沿って厚さ方向に個別のカメラモジュールに分割する。ガラスウエハ4及びウエハの貼着体のガラスウエハ4側にダイシングテープ200を貼着してダイシング装置に装着し、実行する。
ダイシング加工後、個別のカメラモジュールに遮光用のカバーをかぶせ、カバーを樹脂などの接着剤を用いて固定をする。図1に示すようなセンサチップ10、スペーサ部151及びレンズチップ40側面全体並びにレンズ部周りに黒色などの遮光性樹脂からなるカバー5を設け、側面からの光の進入を防ぐことで、カメラモジュールができる。先のダイシング工程において一時期に、レンズチップ40及びスペーサ部151を切断しているので、それらの側面が共通な外部平坦面で形成できることにより、カバー樹脂との接合が良好に達成できる。
実施例1では、レンズ部はセンサに対向する透光性光学ウエハ内面に設け、最外面はガラス平面とするレンズチップの1ピース及び1面構造であるが、この実施例では、レンズチップは2ピースで3面構造である。カメラモジュール製造は、透光性光学ウエハ作製工程において第2の透光性光学ウエハを更に作製し、貼り合わせ工程において第2の透光性光学ウエハを、先の半導体ウエハ101と平凸レンズの透光性光学ウエハ4との間に挿入した以外、実施例1と同様に実行される。
実施例2では、レンズは各々2ピース3面構造であるが、この実施例では、レンズチップは3ピースで5面構造である。カメラモジュール製造は、透光性光学ウエハ作製工程において第3の透光性光学ウエハを更に作製し、貼り合わせ工程において第3の透光性光学ウエハを、先の半導体ウエハ101と両凸レンズの透光性光学ウエハ4Bとの間に挿入した以外、実施例2と同様に実行される。
6 貫通電極
7 外部端子
8 金属パッド
10 センサチップ
11 受光部
14、16 絶縁膜
15 内部配線、外部配線
52 ダイシングブレード
62 開口
91 接着層
100 カメラモジュール
101 半導体ウエハ
111 センサ形成領域
121 レンズ部
151、152、153 スペーサ部
200 ダイシングテープ
Claims (9)
- 光電変換素子の受光部がそれぞれ形成された複数のセンサ形成領域と前記センサ形成領域の各々を囲むセンサ周辺領域とを有する主面と前記主面と対向する裏面とを具えた半導体ウエハと、レンズ部がそれぞれ形成された複数のレンズ形成領域と前記レンズ形成領域の各々を囲むレンズ周辺領域とを有するレンズ形成面と前記レンズ形成面と対向し平坦面であるレンズ非形成面とを具えたレンズウエハであって少なくとも1枚の透光性光学ウエハで構成された前記レンズウエハと、を準備する工程と、
各々の前記受光部と各々の前記レンズ部とがそれぞれ対向するように前記センサ周辺領域と前記レンズ周辺領域とがスペーサ部を介して空間を隔てて固着されることにより、前記スペーサ部を介して接合された前記半導体ウエハと前記レンズウエハとからなる貼着体を形成する工程と、
前記レンズ非形成面を介して前記貼着体を保持して前記半導体ウエハの前記裏面を研磨する工程と、
前記貼着体を前記センサ周辺領域及び前記レンズ周辺領域にて切断することにより、各々がスペーサ部にて接合されたセンサチップ及びレンズチップからなる複数のカメラモジュールに個片化する工程と、を含むことを特徴とするカメラモジュールの製造方法。 - 前記センサ形成領域に電気的に接続されかつ前記貼着体の前記半導体ウエハを貫通して前記裏面に露出する貫通電極を形成する工程を含むことを特徴とする請求項1に記載のカメラモジュールの製造方法。
- 前記半導体ウエハの前記裏面にて前記貫通電極に電気的に接続される外部配線を形成する工程を含むことを特徴とする請求項2に記載のカメラモジュールの製造方法。
- 前記レンズ非形成面にあらかじめレンズ保護用のシートを貼付する工程を含むことを特徴とする請求項1〜3のいずれか1に記載のカメラモジュールの製造方法。
- 前記レンズウエハがガラス平板と前記ガラス平板主面に接合されたレンズ部とからなり、前記レンズ部が樹脂からなることを特徴とする請求項1〜4のいずれか1に記載のカメラモジュールの製造方法。
- 光電変換素子の受光部が形成されたセンサ形成領域及び前記センサ形成領域を囲むセンサ周辺領域を具えたセンサチップと、
凸レンズ部及び前記凸レンズ部を囲むレンズ周辺領域を有するレンズ形成面並びに前記レンズ形成面反対側の平坦面であるレンズ非形成面を具えた平凸レンズチップを少なくとも1つ含む透光性光学チップと、
前記平凸レンズチップの前記平坦面であるレンズ非形成面が外部に露出し且つ前記凸レンズ部が前記受光部に向かうように、前記透光性光学チップを、前記受光部から空間を隔てて前記センサ周辺領域に接合するスペーサ部と、からなり、
前記センサチップ、前記透光性光学チップ及び前記スペーサ部の側面が共通な外部平坦面であること、並びに、
外部から前記平坦面であるレンズ非形成面及び前記凸レンズ部を経て前記受光部に光を通過させる開口を有し且つ前記平坦面であるレンズ非形成面の前記開口以外及び前記外部平坦面を共通に覆うカバーを備えたこと、を特徴とするカメラモジュール。 - 前記センサ形成領域に電気的に接続されかつ前記センサチップを貫通して露出する貫通電極を備えたことを特徴とする請求項6に記載のカメラモジュール。
- 前記貫通電極に電気的に接続された外部配線を備えたことを特徴とする請求項7に記載のカメラモジュール。
- 前記平凸レンズチップがガラス平板と前記ガラス平板主面に接合された凸レンズ部とからなり、前記凸レンズ部が樹脂からなることを特徴とする請求項6〜8のいずれか1に記載のカメラモジュール。
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