CN101156241B - 散热装置 - Google Patents

散热装置 Download PDF

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Publication number
CN101156241B
CN101156241B CN2006800113253A CN200680011325A CN101156241B CN 101156241 B CN101156241 B CN 101156241B CN 2006800113253 A CN2006800113253 A CN 2006800113253A CN 200680011325 A CN200680011325 A CN 200680011325A CN 101156241 B CN101156241 B CN 101156241B
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CN
China
Prior art keywords
stress
heat abstractor
parts
insulated substrate
aluminium sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2006800113253A
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English (en)
Chinese (zh)
Other versions
CN101156241A (zh
Inventor
大年浩太
河野荣次
久保秀人
金原雅彦
古川裕一
山内忍
星野良一
若林信弘
中川信太郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Toyoda Automatic Loom Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK, Toyoda Automatic Loom Works Ltd filed Critical Showa Denko KK
Publication of CN101156241A publication Critical patent/CN101156241A/zh
Application granted granted Critical
Publication of CN101156241B publication Critical patent/CN101156241B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0373—Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN2006800113253A 2005-04-06 2006-04-06 散热装置 Expired - Fee Related CN101156241B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005110175A JP4621531B2 (ja) 2005-04-06 2005-04-06 放熱装置
JP110175/2005 2005-04-06
PCT/JP2006/307307 WO2006109660A1 (ja) 2005-04-06 2006-04-06 放熱装置

Publications (2)

Publication Number Publication Date
CN101156241A CN101156241A (zh) 2008-04-02
CN101156241B true CN101156241B (zh) 2010-05-19

Family

ID=37086936

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2006800113253A Expired - Fee Related CN101156241B (zh) 2005-04-06 2006-04-06 散热装置

Country Status (6)

Country Link
US (1) US20090139704A1 (ja)
EP (2) EP1873827B1 (ja)
JP (1) JP4621531B2 (ja)
KR (1) KR101242286B1 (ja)
CN (1) CN101156241B (ja)
WO (1) WO2006109660A1 (ja)

Families Citing this family (86)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4604954B2 (ja) * 2005-10-13 2011-01-05 株式会社デンソー 半導体モジュールの絶縁構造
JP5007296B2 (ja) 2006-03-13 2012-08-22 株式会社豊田自動織機 パワーモジュール用ベース
JP5064111B2 (ja) * 2006-06-28 2012-10-31 株式会社ティラド 複合放熱板およびその製造方法並びに、それに用いる熱応力緩和プレート
KR100798474B1 (ko) 2006-11-22 2008-01-28 한국표준과학연구원 전도성 도핑층과 금속층을 갖는 반도체 칩
JP4752785B2 (ja) * 2007-02-15 2011-08-17 三菱マテリアル株式会社 ヒートシンク付パワーモジュール用基板の製造方法
DE102007019885B4 (de) 2007-04-27 2010-11-25 Wieland-Werke Ag Kühlkörper mit matrixförmig strukturierter Oberfläche
JP4867793B2 (ja) * 2007-05-25 2012-02-01 株式会社豊田自動織機 半導体装置
JP4945319B2 (ja) 2007-05-25 2012-06-06 昭和電工株式会社 半導体装置
JP2008294281A (ja) * 2007-05-25 2008-12-04 Showa Denko Kk 半導体装置及び半導体装置の製造方法
JP2008294279A (ja) 2007-05-25 2008-12-04 Showa Denko Kk 半導体装置
JP2009130060A (ja) 2007-11-21 2009-06-11 Toyota Industries Corp 放熱装置
JP5070014B2 (ja) * 2007-11-21 2012-11-07 株式会社豊田自動織機 放熱装置
JP4832419B2 (ja) * 2007-12-25 2011-12-07 トヨタ自動車株式会社 半導体モジュール
JP5011088B2 (ja) * 2007-12-26 2012-08-29 日新製鋼株式会社 放熱装置及びパワーモジュール
KR101463075B1 (ko) * 2008-02-04 2014-11-20 페어차일드코리아반도체 주식회사 히트 싱크 패키지
JP4380774B2 (ja) * 2008-03-19 2009-12-09 トヨタ自動車株式会社 パワーモジュール
TWI501360B (zh) * 2008-04-17 2015-09-21 Samsung Electronics Co Ltd 散熱構件用膠帶、包含散熱構件之薄膜上晶片型半導體封裝以及包含該封裝之電子裝置
JP4989552B2 (ja) 2008-05-08 2012-08-01 トヨタ自動車株式会社 電子部品
JP5114323B2 (ja) * 2008-07-04 2013-01-09 株式会社豊田自動織機 半導体装置
JP5114324B2 (ja) * 2008-07-07 2013-01-09 株式会社豊田自動織機 半導体装置
JP5227681B2 (ja) * 2008-07-11 2013-07-03 株式会社豊田自動織機 半導体装置
US8472193B2 (en) * 2008-07-04 2013-06-25 Kabushiki Kaisha Toyota Jidoshokki Semiconductor device
EP2166569A1 (de) * 2008-09-22 2010-03-24 ABB Schweiz AG Kühlvorrichtung für ein Leistungsbauelement
JP2010171279A (ja) * 2009-01-23 2010-08-05 Toyota Motor Corp 放熱装置
JP5261214B2 (ja) * 2009-01-29 2013-08-14 住友軽金属工業株式会社 発熱部品冷却装置用アルミニウム・クラッド材の製造方法
DE102009000514A1 (de) * 2009-01-30 2010-08-26 Robert Bosch Gmbh Verbundbauteil sowie Verfahren zum Herstellen eines Verbundbauteil
TW201041496A (en) * 2009-05-15 2010-11-16 High Conduction Scient Co Ltd A manufacturing method of circuit board module equipped with heat sink, and its product
US8860210B2 (en) 2009-06-10 2014-10-14 Toyota Jidosha Kabushiki Kaisha Semiconductor device
CN101929819A (zh) * 2009-06-26 2010-12-29 富准精密工业(深圳)有限公司 平板式热管
JP2011023545A (ja) * 2009-07-15 2011-02-03 Nisshin Steel Co Ltd 放熱構造体およびパワーモジュール
WO2011018882A1 (en) 2009-08-10 2011-02-17 Fuji Electric Systems Co., Ltd. Semiconductor module and cooling unit
DE102009042519A1 (de) * 2009-09-16 2011-03-24 Esw Gmbh Vorrichtung zur Kühlung von Halbleitern
CN102574361B (zh) * 2009-11-27 2015-08-19 昭和电工株式会社 层合材料及其制造方法
JP5515947B2 (ja) * 2010-03-29 2014-06-11 株式会社豊田自動織機 冷却装置
US20110240280A1 (en) * 2010-03-31 2011-10-06 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) Aluminum alloy brazing sheet and heat exchanger
JP2011228563A (ja) * 2010-04-22 2011-11-10 Showa Denko Kk 絶縁積層材のろう付方法
WO2011136362A1 (ja) 2010-04-28 2011-11-03 株式会社 豊田自動織機 放熱装置および半導体装置
JP5613452B2 (ja) * 2010-05-19 2014-10-22 昭和電工株式会社 絶縁積層材のろう付方法
JP5382049B2 (ja) * 2010-06-30 2014-01-08 株式会社デンソー 半導体装置
US8587116B2 (en) 2010-09-30 2013-11-19 Infineon Technologies Ag Semiconductor module comprising an insert
JP5671351B2 (ja) * 2011-01-12 2015-02-18 昭和電工株式会社 電子素子搭載用基板の製造方法
JP2012169319A (ja) * 2011-02-10 2012-09-06 Showa Denko Kk 絶縁積層材、絶縁回路基板、パワーモジュール用ベースおよびパワーモジュール
JP5764342B2 (ja) * 2011-02-10 2015-08-19 昭和電工株式会社 絶縁回路基板、ならびにパワーモジュール用ベースおよびその製造方法
JP5349572B2 (ja) 2011-04-18 2013-11-20 株式会社豊田自動織機 放熱装置及び放熱装置の製造方法
JP5234138B2 (ja) * 2011-05-06 2013-07-10 船井電機株式会社 放熱板
JP5913834B2 (ja) * 2011-05-16 2016-04-27 昭和電工株式会社 放熱装置用ろう材箔
DE102012208767A1 (de) * 2011-06-17 2012-12-20 Robert Bosch Gmbh Elektronische Schaltungsanordnung mit Verlustwärme abgebenden Komponenten
JP2013038123A (ja) * 2011-08-04 2013-02-21 Showa Denko Kk 絶縁回路基板の製造方法
US20130056176A1 (en) * 2011-08-26 2013-03-07 Mikros Manufacturing, Inc. Heat Exchanger with Controlled Coefficient of Thermal Expansion
JP2013115201A (ja) * 2011-11-28 2013-06-10 Toyota Industries Corp 半導体装置
CN103988297B (zh) * 2011-12-12 2018-11-23 三菱综合材料株式会社 功率模块及其制造方法
JP5856838B2 (ja) * 2011-12-22 2016-02-10 昭和電工株式会社 放熱装置用ろう材箔
JP5990925B2 (ja) * 2012-02-16 2016-09-14 富士通株式会社 冷却装置及びその製造方法
JP5969235B2 (ja) * 2012-03-23 2016-08-17 昭和電工株式会社 熱交換器用アルミニウムクラッド材およびその製造方法
JP6060553B2 (ja) * 2012-04-06 2017-01-18 株式会社豊田自動織機 半導体装置
KR101499665B1 (ko) * 2012-05-29 2015-03-06 포리프라스틱 가부시키가이샤 복합 성형체의 제조방법
JP2014017318A (ja) * 2012-07-06 2014-01-30 Toyota Industries Corp 半導体装置
JP2014072314A (ja) * 2012-09-28 2014-04-21 Toyota Industries Corp 半導体装置、及び半導体装置の製造方法
JP5708613B2 (ja) * 2012-11-01 2015-04-30 株式会社豊田自動織機 モジュール
JP6064886B2 (ja) 2012-12-26 2017-01-25 株式会社豊田中央研究所 熱伝導性応力緩和構造体
JP6197329B2 (ja) * 2013-03-28 2017-09-20 三菱マテリアル株式会社 パワーモジュール、及び熱インターフェース板の製造方法
JP5648705B2 (ja) * 2013-04-08 2015-01-07 三菱マテリアル株式会社 ヒートシンク付パワーモジュール用基板、ヒートシンク付パワーモジュール及び緩衝層付パワーモジュール用基板
JP6197365B2 (ja) * 2013-05-21 2017-09-20 三菱マテリアル株式会社 パワーモジュール、及び熱インターフェース板の製造方法
JP6116404B2 (ja) * 2013-07-01 2017-04-19 昭和電工株式会社 放熱装置
DE102013218826A1 (de) * 2013-09-19 2015-03-19 Siemens Aktiengesellschaft Kühlkörper
JP6152893B2 (ja) 2013-09-30 2017-06-28 富士電機株式会社 半導体装置、半導体装置の組み立て方法、半導体装置用部品及び単位モジュール
KR101534744B1 (ko) * 2013-12-16 2015-07-24 현대자동차 주식회사 터보차저를 갖는 디젤엔진의 냉각 시스템
JP6316219B2 (ja) * 2015-01-22 2018-04-25 三菱電機株式会社 パワー半導体モジュール
WO2016121159A1 (ja) 2015-01-26 2016-08-04 三菱電機株式会社 半導体装置および半導体装置の製造方法
US20160229689A1 (en) * 2015-02-11 2016-08-11 Analog Devices, Inc. Packaged Microchip with Patterned Interposer
DE112016001221T5 (de) * 2015-03-16 2017-12-21 Dana Canada Corporation Wärmetauscher mit Oberflächenmuster aufweisenden Platten zur Verbesserung der Ebenheit und Verfahren zum Herstellen derselben
JP6805743B2 (ja) * 2015-12-24 2020-12-23 アイシン精機株式会社 絶縁基板
JP6549502B2 (ja) * 2016-02-26 2019-07-24 京セラ株式会社 放熱基板およびそれを用いた半導体パッケージならびに半導体モジュール
DE102016218522B3 (de) * 2016-09-27 2017-06-22 Jenoptik Laser Gmbh Optische oder optoelektronische Baugruppe und Verfahren zur Herstellung dafür
DE102017203217A1 (de) * 2017-02-28 2018-08-30 Robert Bosch Gmbh Kontaktanordnung
US11276617B2 (en) * 2017-11-28 2022-03-15 Kyocera Corporation Electronic device mounting board, electronic package, and electronic module
CN108337862B (zh) * 2018-03-02 2019-09-06 惠州市博宇科技有限公司 一种新能源电动车专用铝基板
ES2977976T3 (es) * 2018-07-13 2024-09-03 Abb Schweiz Ag Un disipador de calor para aparamenta de alta tensión
US10490482B1 (en) * 2018-12-05 2019-11-26 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling devices including jet cooling with an intermediate mesh and methods for using the same
JP7367309B2 (ja) * 2019-02-08 2023-10-24 富士電機株式会社 半導体モジュール、半導体装置及び半導体装置の製造方法
JP2020141023A (ja) * 2019-02-27 2020-09-03 株式会社 日立パワーデバイス 半導体装置
US11217505B2 (en) * 2019-09-10 2022-01-04 Aptiv Technologies Limited Heat exchanger for electronics
CN110634822B (zh) * 2019-10-08 2024-04-26 广东美的制冷设备有限公司 安装基板、智能功率模块及空调器
CN210959284U (zh) * 2019-12-06 2020-07-07 阳光电源股份有限公司 散热器及电气设备
CN112318790B (zh) * 2020-09-09 2022-08-19 西安近代化学研究所 一种高粘度硅基绝热层硫化成型工艺
DE102021201270A1 (de) * 2021-02-10 2022-08-11 Vitesco Technologies GmbH Elektronische Baugruppe mit zumindest einem ersten elektronischen Bauteil und einem zweiten elektronischen Bauteil

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5515912A (en) * 1990-03-02 1996-05-14 Hitachi, Ltd. Cooling apparatus of electronic devices

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0612795B2 (ja) * 1989-11-07 1994-02-16 株式会社日立製作所 マルチチップモジュールの冷却構造
JPH05299549A (ja) * 1992-04-20 1993-11-12 Hitachi Ltd 熱伝達冷却装置
JP3401089B2 (ja) * 1994-09-09 2003-04-28 京セラ株式会社 半導体素子収納用パッケージ
JP3346657B2 (ja) * 1994-09-09 2002-11-18 京セラ株式会社 半導体素子収納用パッケージ
JPH10189845A (ja) * 1996-12-25 1998-07-21 Denso Corp 半導体素子の放熱装置
US6124635A (en) * 1997-03-21 2000-09-26 Honda Giken Kogyo Kabushiki Kaisha Functionally gradient integrated metal-ceramic member and semiconductor circuit substrate application thereof
US5988488A (en) * 1997-09-02 1999-11-23 Mcdonnell Douglas Corporation Process of bonding copper and tungsten
US6756019B1 (en) * 1998-02-24 2004-06-29 Caliper Technologies Corp. Microfluidic devices and systems incorporating cover layers
JP2000236050A (ja) * 1999-02-12 2000-08-29 Sony Corp 放熱装置、電子機器及び放熱装置用スペーサ
JP4649027B2 (ja) * 1999-09-28 2011-03-09 株式会社東芝 セラミックス回路基板
US6485816B2 (en) * 2000-01-31 2002-11-26 Ngk Insulators, Ltd. Laminated radiation member, power semiconductor apparatus, and method for producing the same
JP2002237556A (ja) * 2001-02-09 2002-08-23 Mitsubishi Electric Corp パワー半導体装置
KR100565139B1 (ko) * 2001-02-22 2006-03-30 니뽄 가이시 가부시키가이샤 전자 회로용 부재 및 그 제조 방법과 전자 부품
US20020185726A1 (en) * 2001-06-06 2002-12-12 North Mark T. Heat pipe thermal management of high potential electronic chip packages
JP4969738B2 (ja) * 2001-06-28 2012-07-04 株式会社東芝 セラミックス回路基板およびそれを用いた半導体モジュール
JP3793562B2 (ja) * 2001-09-27 2006-07-05 京セラ株式会社 セラミック回路基板
JP2003101184A (ja) * 2001-09-27 2003-04-04 Kyocera Corp セラミック回路基板およびその製造方法
JP2003163315A (ja) * 2001-11-29 2003-06-06 Denki Kagaku Kogyo Kk モジュール
JP2004153075A (ja) 2002-10-31 2004-05-27 Mitsubishi Materials Corp パワーモジュール用基板及びパワーモジュール
JP4044449B2 (ja) * 2003-01-30 2008-02-06 株式会社住友金属エレクトロデバイス パワーモジュール用基板
US6903929B2 (en) * 2003-03-31 2005-06-07 Intel Corporation Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink
DE10337640A1 (de) * 2003-08-16 2005-03-17 Semikron Elektronik Gmbh Leistungshalbleitermodul mit verbessertem thermischen Kontakt
KR100542188B1 (ko) * 2003-08-26 2006-01-10 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
JP4617209B2 (ja) * 2005-07-07 2011-01-19 株式会社豊田自動織機 放熱装置
US8472193B2 (en) * 2008-07-04 2013-06-25 Kabushiki Kaisha Toyota Jidoshokki Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5515912A (en) * 1990-03-02 1996-05-14 Hitachi, Ltd. Cooling apparatus of electronic devices

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
JP特开2003-17627A 2003.01.17
JP特开平8-78586A 1996.03.22
JP特开平8-83872A 1996.03.26

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WO2006109660A1 (ja) 2006-10-19
US20090139704A1 (en) 2009-06-04
EP2863425A2 (en) 2015-04-22
EP2863425A3 (en) 2015-08-19
JP2006294699A (ja) 2006-10-26
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EP1873827A4 (en) 2014-01-01
CN101156241A (zh) 2008-04-02

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