AU2003218145A1 - Semiconductor device having a bond pad and method therefor - Google Patents

Semiconductor device having a bond pad and method therefor

Info

Publication number
AU2003218145A1
AU2003218145A1 AU2003218145A AU2003218145A AU2003218145A1 AU 2003218145 A1 AU2003218145 A1 AU 2003218145A1 AU 2003218145 A AU2003218145 A AU 2003218145A AU 2003218145 A AU2003218145 A AU 2003218145A AU 2003218145 A1 AU2003218145 A1 AU 2003218145A1
Authority
AU
Australia
Prior art keywords
semiconductor device
bond pad
method therefor
therefor
bond
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003218145A
Other languages
English (en)
Inventor
Dieu Van Dinh
Peter R. Harper
George R. Leal
Jeffrey W. Metz
Tu Anh Tran
Lois E. Yong
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP USA Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of AU2003218145A1 publication Critical patent/AU2003218145A1/en
Abandoned legal-status Critical Current

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    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/32—Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors
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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
AU2003218145A 2002-03-13 2003-03-12 Semiconductor device having a bond pad and method therefor Abandoned AU2003218145A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/097,036 2002-03-13
US10/097,036 US6844631B2 (en) 2002-03-13 2002-03-13 Semiconductor device having a bond pad and method therefor
PCT/US2003/007782 WO2003079437A2 (en) 2002-03-13 2003-03-12 Semiconductor device having a bond pad and method therefor

Publications (1)

Publication Number Publication Date
AU2003218145A1 true AU2003218145A1 (en) 2003-09-29

Family

ID=28039099

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003218145A Abandoned AU2003218145A1 (en) 2002-03-13 2003-03-12 Semiconductor device having a bond pad and method therefor

Country Status (8)

Country Link
US (2) US6844631B2 (enExample)
EP (1) EP1483787A2 (enExample)
JP (2) JP5283300B2 (enExample)
KR (1) KR100979081B1 (enExample)
CN (1) CN100435327C (enExample)
AU (1) AU2003218145A1 (enExample)
TW (1) TWI266402B (enExample)
WO (1) WO2003079437A2 (enExample)

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US6844631B2 (en) * 2002-03-13 2005-01-18 Freescale Semiconductor, Inc. Semiconductor device having a bond pad and method therefor
US6921979B2 (en) 2002-03-13 2005-07-26 Freescale Semiconductor, Inc. Semiconductor device having a bond pad and method therefor
JP2003338519A (ja) * 2002-05-21 2003-11-28 Renesas Technology Corp 半導体装置及びその製造方法
US6777318B2 (en) * 2002-08-16 2004-08-17 Taiwan Semiconductor Manufacturing Company Aluminum/copper clad interconnect layer for VLSI applications
JP3724464B2 (ja) * 2002-08-19 2005-12-07 株式会社デンソー 半導体圧力センサ
US6781150B2 (en) * 2002-08-28 2004-08-24 Lsi Logic Corporation Test structure for detecting bonding-induced cracks
US6765228B2 (en) * 2002-10-11 2004-07-20 Taiwan Semiconductor Maunfacturing Co., Ltd. Bonding pad with separate bonding and probing areas
JP4426166B2 (ja) * 2002-11-01 2010-03-03 ユー・エム・シー・ジャパン株式会社 半導体装置の設計方法、半導体装置設計用プログラム、及び半導体装置
TWI221527B (en) * 2003-04-11 2004-10-01 Fujitsu Ltd Semiconductor device
JP4213672B2 (ja) * 2003-04-15 2009-01-21 富士通マイクロエレクトロニクス株式会社 半導体装置及びその製造方法
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