JP4803966B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP4803966B2 JP4803966B2 JP2004102048A JP2004102048A JP4803966B2 JP 4803966 B2 JP4803966 B2 JP 4803966B2 JP 2004102048 A JP2004102048 A JP 2004102048A JP 2004102048 A JP2004102048 A JP 2004102048A JP 4803966 B2 JP4803966 B2 JP 4803966B2
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- Japan
- Prior art keywords
- electrode pad
- probe area
- pad
- probe
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 238000012360 testing method Methods 0.000 claims description 78
- 239000011229 interlayer Substances 0.000 claims description 19
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 description 70
- 239000002184 metal Substances 0.000 description 70
- 238000007689 inspection Methods 0.000 description 17
- 238000012986 modification Methods 0.000 description 9
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
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- 229910052737 gold Inorganic materials 0.000 description 4
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
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- 208000002925 dental caries Diseases 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
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Description
2 内部回路
3 I/O回路
4 電極パッド
4U 上層パッド
4D 下層パッド
41a〜41d,42a〜42d,43a,43b,44a,44b プローブエリアマーク
5 配線
101 半導体基板
105 素子(MOSトランジスタ)
111〜115 層間絶縁膜
116 表面絶縁膜
121〜125 金属層(金属配線層,パッド)
131〜133 ビア
TPA テストパッドエリア
TP テストパッド
CX クラック
PX プローブ痕
Claims (7)
- 一つの電極パッドの一部領域をテストプローブエリアとして定義し、他の領域をボンディングエリアとして定義するプローブエリアマークを備えており、前記プローブエリアマークは、平面形状が矩形に形成された前記電極パッドの一辺に沿って所要の間隔をおいて設けられた2つのプローブエリアマークと、前記一辺と直交する辺に沿って所要の間隔をおいて設けられた2つのプローブエリアマークとで構成され、これら4つのプローブエリアマークをそれぞれ通り前記電極パッドの辺に平行な仮想線で囲まれる前記電極パッドのエリアをテストプローブエリアとして定義し、
前記電極パッドの下部に1層以上の配線層を備え、前記テストプローブエリアの直下には、前記配線層のうち前記他の領域の直下に配設されている最上層の配線層が配設されていないことを特徴とする半導体装置。 - 前記電極パッドは積層された上層パッドと下層パッドとで2層に構成され、前記下層パッドに前記4つのプローブエリアマークを備え、前記プローブエリアマークを半導体装置の表面側から目視可能に構成したことを特徴とする請求項1に記載の半導体装置。
- 前記上層パッドと下層パッドとは両パッド間に介在される層間絶縁膜を上下に貫通するビアによって機械的及び電気的に連結されていることを特徴とする請求項2に記載の半導体装置。
- 前記電極パッドは1層のパッドとして構成され、前記プローブエリアマークは、当該1層の電極パッドに前記4つのプローブエリアマークを備えていることを特徴とする請求項1に記載の半導体装置。
- 前記プローブエリアマークは、前記電極パッドの一辺と、前記電極パッドとは異なる電極又は配線の前記一辺と直交する方向の辺にそれぞれ所要の間隔をおいて2つずつ設けられていることを特徴とする請求項1に記載の半導体装置。
- 前記電極パッドの一辺に沿って設けられた2つのプローブエリアマークが当該一辺の一
方に偏って配設されており、前記直交する辺に沿って設けられた2つのプローブエリアマ
ークは当該偏った側の直交する辺に沿って配設されていることを特徴とする請求項1ない
し5のいずれかに記載の半導体装置。 - 前記プローブエリアマークは三角形に形成され、前記仮想線は当該三角形の頂点を通る仮想線で構成されることを特徴とする請求項1ないし6のいずれかに記載の半導体装置。
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US11/094,673 US7282940B2 (en) | 2004-03-31 | 2005-03-31 | Semiconductor device with electrode pads for test probe |
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JP4426166B2 (ja) * | 2002-11-01 | 2010-03-03 | ユー・エム・シー・ジャパン株式会社 | 半導体装置の設計方法、半導体装置設計用プログラム、及び半導体装置 |
JP4519571B2 (ja) * | 2004-08-26 | 2010-08-04 | ルネサスエレクトロニクス株式会社 | 半導体装置及びその検査方法と検査装置並びに半導体装置の製造方法 |
KR100739629B1 (ko) * | 2005-12-02 | 2007-07-16 | 삼성전자주식회사 | 프로브 센싱용 패드 및 이를 이용한 프로브 니들 접촉 위치검사 방법. |
JP5148825B2 (ja) * | 2005-10-14 | 2013-02-20 | ルネサスエレクトロニクス株式会社 | 半導体装置および半導体装置の製造方法 |
JP2008098225A (ja) * | 2006-10-06 | 2008-04-24 | Nec Electronics Corp | 半導体装置 |
JP5036336B2 (ja) * | 2007-02-05 | 2012-09-26 | オンセミコンダクター・トレーディング・リミテッド | 半導体チップの位置合わせ方法 |
JP5027605B2 (ja) * | 2007-09-25 | 2012-09-19 | パナソニック株式会社 | 半導体装置 |
JP5205066B2 (ja) * | 2008-01-18 | 2013-06-05 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
JP2010153478A (ja) * | 2008-12-24 | 2010-07-08 | Renesas Electronics Corp | 半導体集積回路 |
JP5160498B2 (ja) * | 2009-05-20 | 2013-03-13 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
IT1402434B1 (it) | 2010-06-10 | 2013-09-04 | St Microelectronics Srl | Struttura di rilevamento dell'allineamento di una sonda atta a testare circuiti integrati |
JP2012023238A (ja) * | 2010-07-15 | 2012-02-02 | Renesas Electronics Corp | 半導体装置、半導体装置の製造方法、及び半導体装置の設計方法 |
US8614508B2 (en) | 2011-09-21 | 2013-12-24 | Stats Chippac Ltd. | Integrated circuit system with test pads and method of manufacture thereof |
JP5896682B2 (ja) * | 2011-10-18 | 2016-03-30 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置 |
JP2013206905A (ja) * | 2012-03-27 | 2013-10-07 | Renesas Electronics Corp | 半導体装置およびその製造方法 |
JP5331934B2 (ja) * | 2012-12-12 | 2013-10-30 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP5564557B2 (ja) * | 2012-12-26 | 2014-07-30 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP2014179657A (ja) * | 2014-06-16 | 2014-09-25 | Renesas Electronics Corp | 半導体装置 |
JP6476000B2 (ja) * | 2015-02-17 | 2019-02-27 | 三菱電機株式会社 | 半導体装置および半導体モジュール |
JP6118923B2 (ja) * | 2016-01-26 | 2017-04-19 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置 |
CN108140577B (zh) * | 2016-02-23 | 2022-09-09 | 瑞萨电子株式会社 | 半导体器件及其制造方法 |
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