ATE397779T1 - Referenzstromgenerator und verfahren zum programmieren, einstellen und/oder betreiben des generators - Google Patents
Referenzstromgenerator und verfahren zum programmieren, einstellen und/oder betreiben des generatorsInfo
- Publication number
- ATE397779T1 ATE397779T1 AT04751987T AT04751987T ATE397779T1 AT E397779 T1 ATE397779 T1 AT E397779T1 AT 04751987 T AT04751987 T AT 04751987T AT 04751987 T AT04751987 T AT 04751987T AT E397779 T1 ATE397779 T1 AT E397779T1
- Authority
- AT
- Austria
- Prior art keywords
- generator
- reference current
- programming
- adjusting
- operating
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/02—Detection or location of defective auxiliary circuits, e.g. defective refresh counters
- G11C29/028—Detection or location of defective auxiliary circuits, e.g. defective refresh counters with adaption or trimming of parameters
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
- G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
- G11C11/409—Read-write [R-W] circuits
- G11C11/4099—Dummy cell treatment; Reference voltage generators
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/26—Sensing or reading circuits; Data output circuits
- G11C16/28—Sensing or reading circuits; Data output circuits using differential sensing or reference cells, e.g. dummy cells
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/02—Detection or location of defective auxiliary circuits, e.g. defective refresh counters
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
- G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
- G11C29/12005—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details comprising voltage or current generators
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/14—Dummy cell management; Sense reference voltage generators
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/50—Marginal testing, e.g. race, voltage or current testing
- G11C2029/5006—Current
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2211/00—Indexing scheme relating to digital stores characterized by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C2211/401—Indexing scheme relating to cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C2211/4016—Memory devices with silicon-on-insulator cells
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Dram (AREA)
- Oscillators With Electromechanical Resonators (AREA)
- Credit Cards Or The Like (AREA)
- Stored Programmes (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US47046203P | 2003-05-13 | 2003-05-13 | |
| US47027603P | 2003-05-14 | 2003-05-14 | |
| US10/840,902 US6912150B2 (en) | 2003-05-13 | 2004-05-07 | Reference current generator, and method of programming, adjusting and/or operating same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE397779T1 true ATE397779T1 (de) | 2008-06-15 |
Family
ID=33425219
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT04751987T ATE397779T1 (de) | 2003-05-13 | 2004-05-12 | Referenzstromgenerator und verfahren zum programmieren, einstellen und/oder betreiben des generators |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US6912150B2 (de) |
| EP (1) | EP1620859B1 (de) |
| AT (1) | ATE397779T1 (de) |
| DE (1) | DE602004014269D1 (de) |
| WO (1) | WO2004102631A2 (de) |
Families Citing this family (91)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6912150B2 (en) * | 2003-05-13 | 2005-06-28 | Lionel Portman | Reference current generator, and method of programming, adjusting and/or operating same |
| JP4110115B2 (ja) * | 2004-04-15 | 2008-07-02 | 株式会社東芝 | 半導体記憶装置 |
| US7035131B2 (en) * | 2004-05-06 | 2006-04-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Dynamic random access memory cell leakage current detector |
| US7177220B2 (en) * | 2004-05-07 | 2007-02-13 | Taiwan Semiconductor Manufacturing Co., Ltd | Refresh counter with dynamic tracking of process, voltage and temperature variation for semiconductor memory |
| JP4195427B2 (ja) * | 2004-08-31 | 2008-12-10 | 株式会社東芝 | 半導体記憶装置 |
| JP4083160B2 (ja) * | 2004-10-04 | 2008-04-30 | 株式会社東芝 | 半導体記憶装置およびfbcメモリセルの駆動方法 |
| US7301838B2 (en) | 2004-12-13 | 2007-11-27 | Innovative Silicon S.A. | Sense amplifier circuitry and architecture to write data into and/or read from memory cells |
| US7301803B2 (en) * | 2004-12-22 | 2007-11-27 | Innovative Silicon S.A. | Bipolar reading technique for a memory cell having an electrically floating body transistor |
| JP4772363B2 (ja) * | 2005-04-12 | 2011-09-14 | 株式会社東芝 | 不揮発性半導体記憶装置 |
| JP2006294144A (ja) * | 2005-04-12 | 2006-10-26 | Toshiba Corp | 不揮発性半導体記憶装置 |
| US7956669B2 (en) * | 2005-04-15 | 2011-06-07 | International Business Machines Corporation | High-density low-power data retention power gating with double-gate devices |
| US20070023833A1 (en) * | 2005-07-28 | 2007-02-01 | Serguei Okhonin | Method for reading a memory cell having an electrically floating body transistor, and memory cell and array implementing same |
| US7606066B2 (en) | 2005-09-07 | 2009-10-20 | Innovative Silicon Isi Sa | Memory cell and memory cell array having an electrically floating body transistor, and methods of operating same |
| US7355916B2 (en) | 2005-09-19 | 2008-04-08 | Innovative Silicon S.A. | Method and circuitry to generate a reference current for reading a memory cell, and device implementing same |
| US7542345B2 (en) * | 2006-02-16 | 2009-06-02 | Innovative Silicon Isi Sa | Multi-bit memory cell having electrically floating body transistor, and method of programming and reading same |
| US7492632B2 (en) | 2006-04-07 | 2009-02-17 | Innovative Silicon Isi Sa | Memory array having a programmable word length, and method of operating same |
| US7606098B2 (en) | 2006-04-18 | 2009-10-20 | Innovative Silicon Isi Sa | Semiconductor memory array architecture with grouped memory cells, and method of controlling same |
| US7933142B2 (en) | 2006-05-02 | 2011-04-26 | Micron Technology, Inc. | Semiconductor memory cell and array using punch-through to program and read same |
| US7499352B2 (en) * | 2006-05-19 | 2009-03-03 | Innovative Silicon Isi Sa | Integrated circuit having memory array including row redundancy, and method of programming, controlling and/or operating same |
| US8069377B2 (en) | 2006-06-26 | 2011-11-29 | Micron Technology, Inc. | Integrated circuit having memory array including ECC and column redundancy and method of operating the same |
| US7542340B2 (en) | 2006-07-11 | 2009-06-02 | Innovative Silicon Isi Sa | Integrated circuit including memory array having a segmented bit line architecture and method of controlling and/or operating same |
| US7733707B2 (en) * | 2006-07-21 | 2010-06-08 | Hynix Semiconductor Inc. | 1-transistor type DRAM cell, DRAM device and DRAM comprising thereof and driving method thereof and manufacturing method thereof |
| US7645617B2 (en) * | 2006-07-27 | 2010-01-12 | Hynix Semiconductor, Inc. | Nonvolatile ferroelectric memory device using silicon substrate, method for manufacturing the same, and refresh method thereof |
| US7932547B2 (en) * | 2006-07-27 | 2011-04-26 | Hynix Semiconductor Inc. | Nonvolatile ferroelectric memory device using silicon substrate, method for manufacturing the same, and refresh method thereof |
| US7410856B2 (en) * | 2006-09-14 | 2008-08-12 | Micron Technology, Inc. | Methods of forming vertical transistors |
| US9391079B2 (en) | 2007-11-29 | 2016-07-12 | Zeno Semiconductor, Inc. | Compact semiconductor memory device having reduced number of contacts, methods of operating and methods of making |
| US8514622B2 (en) * | 2007-11-29 | 2013-08-20 | Zeno Semiconductor, Inc. | Compact semiconductor memory device having reduced number of contacts, methods of operating and methods of making |
| US9601493B2 (en) | 2006-11-29 | 2017-03-21 | Zeno Semiconductor, Inc | Compact semiconductor memory device having reduced number of contacts, methods of operating and methods of making |
| US8547756B2 (en) | 2010-10-04 | 2013-10-01 | Zeno Semiconductor, Inc. | Semiconductor memory device having an electrically floating body transistor |
| US7724578B2 (en) * | 2006-12-15 | 2010-05-25 | Globalfoundries Inc. | Sensing device for floating body cell memory and method thereof |
| KR101406604B1 (ko) | 2007-01-26 | 2014-06-11 | 마이크론 테크놀로지, 인코포레이티드 | 게이트형 바디 영역으로부터 격리되는 소스/드레인 영역을 포함하는 플로팅-바디 dram 트랜지스터 |
| US8518774B2 (en) | 2007-03-29 | 2013-08-27 | Micron Technology, Inc. | Manufacturing process for zero-capacitor random access memory circuits |
| US7408800B1 (en) * | 2007-05-03 | 2008-08-05 | International Business Machines Corporation | Apparatus and method for improved SRAM device performance through double gate topology |
| US20080273366A1 (en) * | 2007-05-03 | 2008-11-06 | International Business Machines Corporation | Design structure for improved sram device performance through double gate topology |
| US8064274B2 (en) | 2007-05-30 | 2011-11-22 | Micron Technology, Inc. | Integrated circuit having voltage generation circuitry for memory cell array, and method of operating and/or controlling same |
| US8085594B2 (en) | 2007-06-01 | 2011-12-27 | Micron Technology, Inc. | Reading technique for memory cell with electrically floating body transistor |
| US8194487B2 (en) | 2007-09-17 | 2012-06-05 | Micron Technology, Inc. | Refreshing data of memory cells with electrically floating body transistors |
| US20090078999A1 (en) * | 2007-09-20 | 2009-03-26 | Anderson Brent A | Semiconductor device structures with floating body charge storage and methods for forming such semiconductor device structures. |
| JP2009093708A (ja) * | 2007-10-04 | 2009-04-30 | Toshiba Corp | 半導体記憶装置およびその駆動方法 |
| US8536628B2 (en) | 2007-11-29 | 2013-09-17 | Micron Technology, Inc. | Integrated circuit having memory cell array including barriers, and method of manufacturing same |
| US8349662B2 (en) | 2007-12-11 | 2013-01-08 | Micron Technology, Inc. | Integrated circuit having memory cell array, and method of manufacturing same |
| US8773933B2 (en) | 2012-03-16 | 2014-07-08 | Micron Technology, Inc. | Techniques for accessing memory cells |
| US8014195B2 (en) | 2008-02-06 | 2011-09-06 | Micron Technology, Inc. | Single transistor memory cell |
| US8189376B2 (en) | 2008-02-08 | 2012-05-29 | Micron Technology, Inc. | Integrated circuit having memory cells including gate material having high work function, and method of manufacturing same |
| US7957206B2 (en) | 2008-04-04 | 2011-06-07 | Micron Technology, Inc. | Read circuitry for an integrated circuit having memory cells and/or a memory cell array, and method of operating same |
| US8339176B2 (en) | 2008-05-30 | 2012-12-25 | Infineon Technologies Ag | System and method for providing a low-power self-adjusting reference current for floating supply stages |
| JP6053250B2 (ja) * | 2008-06-12 | 2016-12-27 | ピーエスフォー ルクスコ エスエイアールエルPS4 Luxco S.a.r.l. | 半導体装置 |
| US7947543B2 (en) | 2008-09-25 | 2011-05-24 | Micron Technology, Inc. | Recessed gate silicon-on-insulator floating body device with self-aligned lateral isolation |
| US8159204B2 (en) * | 2008-09-29 | 2012-04-17 | Active-Semi, Inc. | Regulating current output from a buck converter without external current sensing |
| US7933140B2 (en) | 2008-10-02 | 2011-04-26 | Micron Technology, Inc. | Techniques for reducing a voltage swing |
| US7924630B2 (en) | 2008-10-15 | 2011-04-12 | Micron Technology, Inc. | Techniques for simultaneously driving a plurality of source lines |
| US8223574B2 (en) | 2008-11-05 | 2012-07-17 | Micron Technology, Inc. | Techniques for block refreshing a semiconductor memory device |
| US8213226B2 (en) * | 2008-12-05 | 2012-07-03 | Micron Technology, Inc. | Vertical transistor memory cell and array |
| US8319294B2 (en) | 2009-02-18 | 2012-11-27 | Micron Technology, Inc. | Techniques for providing a source line plane |
| WO2010102106A2 (en) | 2009-03-04 | 2010-09-10 | Innovative Silicon Isi Sa | Techniques for forming a contact to a buried diffusion layer in a semiconductor memory device |
| CN102365628B (zh) | 2009-03-31 | 2015-05-20 | 美光科技公司 | 用于提供半导体存储器装置的技术 |
| US8139418B2 (en) | 2009-04-27 | 2012-03-20 | Micron Technology, Inc. | Techniques for controlling a direct injection semiconductor memory device |
| US8508994B2 (en) | 2009-04-30 | 2013-08-13 | Micron Technology, Inc. | Semiconductor device with floating gate and electrically floating body |
| US8498157B2 (en) * | 2009-05-22 | 2013-07-30 | Micron Technology, Inc. | Techniques for providing a direct injection semiconductor memory device |
| US8537610B2 (en) | 2009-07-10 | 2013-09-17 | Micron Technology, Inc. | Techniques for providing a semiconductor memory device |
| US9076543B2 (en) | 2009-07-27 | 2015-07-07 | Micron Technology, Inc. | Techniques for providing a direct injection semiconductor memory device |
| US8199595B2 (en) | 2009-09-04 | 2012-06-12 | Micron Technology, Inc. | Techniques for sensing a semiconductor memory device |
| JP5584895B2 (ja) * | 2009-10-08 | 2014-09-10 | ルネサスエレクトロニクス株式会社 | 半導体信号処理装置 |
| US8009498B2 (en) * | 2009-11-12 | 2011-08-30 | National Tsing Hua University | Memory refresh system and operating method thereof |
| US8174881B2 (en) | 2009-11-24 | 2012-05-08 | Micron Technology, Inc. | Techniques for reducing disturbance in a semiconductor device |
| US8310893B2 (en) | 2009-12-16 | 2012-11-13 | Micron Technology, Inc. | Techniques for reducing impact of array disturbs in a semiconductor memory device |
| US8164942B2 (en) * | 2010-02-01 | 2012-04-24 | International Business Machines Corporation | High performance eDRAM sense amplifier |
| US8416636B2 (en) | 2010-02-12 | 2013-04-09 | Micron Technology, Inc. | Techniques for controlling a semiconductor memory device |
| US9922981B2 (en) | 2010-03-02 | 2018-03-20 | Zeno Semiconductor, Inc. | Compact semiconductor memory device having reduced number of contacts, methods of operating and methods of making |
| US10461084B2 (en) | 2010-03-02 | 2019-10-29 | Zeno Semiconductor, Inc. | Compact semiconductor memory device having reduced number of contacts, methods of operating and methods of making |
| US8411513B2 (en) | 2010-03-04 | 2013-04-02 | Micron Technology, Inc. | Techniques for providing a semiconductor memory device having hierarchical bit lines |
| US8576631B2 (en) | 2010-03-04 | 2013-11-05 | Micron Technology, Inc. | Techniques for sensing a semiconductor memory device |
| US8369177B2 (en) | 2010-03-05 | 2013-02-05 | Micron Technology, Inc. | Techniques for reading from and/or writing to a semiconductor memory device |
| CN102812552B (zh) | 2010-03-15 | 2015-11-25 | 美光科技公司 | 半导体存储器装置及用于对半导体存储器装置进行偏置的方法 |
| US8411524B2 (en) | 2010-05-06 | 2013-04-02 | Micron Technology, Inc. | Techniques for refreshing a semiconductor memory device |
| WO2012058324A2 (en) | 2010-10-29 | 2012-05-03 | Rambus Inc. | Resistance change memory cell circuits and methods |
| FR2967522B1 (fr) * | 2010-11-12 | 2012-12-21 | St Microelectronics Sa | Memoire non-volatile securisee |
| US8531878B2 (en) | 2011-05-17 | 2013-09-10 | Micron Technology, Inc. | Techniques for providing a semiconductor memory device |
| US9559216B2 (en) | 2011-06-06 | 2017-01-31 | Micron Technology, Inc. | Semiconductor memory device and method for biasing same |
| CN103366790A (zh) * | 2012-03-30 | 2013-10-23 | 硅存储技术公司 | 用于读出放大器的可调整参考发生器 |
| US8885428B2 (en) * | 2013-02-22 | 2014-11-11 | Sandisk 3D Llc | Smart read scheme for memory array sensing |
| US9029922B2 (en) | 2013-03-09 | 2015-05-12 | Zeno Semiconductor, Inc. | Memory device comprising electrically floating body transistor |
| US9275723B2 (en) | 2013-04-10 | 2016-03-01 | Zeno Semiconductor, Inc. | Scalable floating body memory cell for memory compilers and method of using floating body memories with memory compilers |
| US9368625B2 (en) | 2013-05-01 | 2016-06-14 | Zeno Semiconductor, Inc. | NAND string utilizing floating body memory cell |
| GB2529861A (en) | 2014-09-04 | 2016-03-09 | Ibm | Current-mode sense amplifier |
| US9851738B2 (en) | 2015-08-13 | 2017-12-26 | Arm Ltd. | Programmable voltage reference |
| US9748943B2 (en) | 2015-08-13 | 2017-08-29 | Arm Ltd. | Programmable current for correlated electron switch |
| US9979385B2 (en) * | 2015-10-05 | 2018-05-22 | Arm Ltd. | Circuit and method for monitoring correlated electron switches |
| US9508397B1 (en) * | 2015-12-03 | 2016-11-29 | Freescale Semiconductor, Inc. | Non-volatile memory (NVM) with endurance control |
| JP6956204B2 (ja) * | 2017-12-29 | 2021-11-02 | パナソニック株式会社 | 抵抗変化型不揮発性記憶装置 |
| CN117316245A (zh) * | 2022-06-22 | 2023-12-29 | 世界先进积体电路股份有限公司 | 非挥发性存储器装置及其控制方法 |
Family Cites Families (194)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3439214A (en) | 1968-03-04 | 1969-04-15 | Fairchild Camera Instr Co | Beam-junction scan converter |
| US4032947A (en) | 1971-10-20 | 1977-06-28 | Siemens Aktiengesellschaft | Controllable charge-coupled semiconductor device |
| IT979035B (it) | 1972-04-25 | 1974-09-30 | Ibm | Dispositivo a circuito integrato per la memorizzazione di informa zioni binarie ad emissione elettro luminescente |
| FR2197494A5 (de) | 1972-08-25 | 1974-03-22 | Radiotechnique Compelec | |
| US3997799A (en) | 1975-09-15 | 1976-12-14 | Baker Roger T | Semiconductor-device for the storage of binary data |
| JPS5567993A (en) | 1978-11-14 | 1980-05-22 | Fujitsu Ltd | Semiconductor memory unit |
| US4250569A (en) | 1978-11-15 | 1981-02-10 | Fujitsu Limited | Semiconductor memory device |
| EP0014388B1 (de) | 1979-01-25 | 1983-12-21 | Nec Corporation | Halbleiterspeicher-Vorrichtung |
| JPS55113359A (en) | 1979-02-22 | 1980-09-01 | Fujitsu Ltd | Semiconductor integrated circuit device |
| EP0030856B1 (de) | 1979-12-13 | 1984-03-21 | Fujitsu Limited | Ladungspumpende Halbleiterspeicherzelle mit Ladungsspeicherzone und Speicheranordnung mit einer solchen Zelle |
| JPS5742161A (en) | 1980-08-28 | 1982-03-09 | Fujitsu Ltd | Semiconductor and production thereof |
| JPS5982761A (ja) | 1982-11-04 | 1984-05-12 | Hitachi Ltd | 半導体メモリ |
| JPS6070760A (ja) | 1983-09-27 | 1985-04-22 | Fujitsu Ltd | 半導体記憶装置 |
| JPS6177359A (ja) | 1984-09-21 | 1986-04-19 | Fujitsu Ltd | 半導体記憶装置 |
| JPS61280651A (ja) | 1985-05-24 | 1986-12-11 | Fujitsu Ltd | 半導体記憶装置 |
| JPH0671067B2 (ja) | 1985-11-20 | 1994-09-07 | 株式会社日立製作所 | 半導体装置 |
| JPS62272561A (ja) | 1986-05-20 | 1987-11-26 | Seiko Epson Corp | 1トランジスタ型メモリセル |
| JPS6319847A (ja) | 1986-07-14 | 1988-01-27 | Oki Electric Ind Co Ltd | 半導体記憶装置 |
| US4816884A (en) | 1987-07-20 | 1989-03-28 | International Business Machines Corporation | High density vertical trench transistor and capacitor memory cell structure and fabrication method therefor |
| JP2582794B2 (ja) | 1987-08-10 | 1997-02-19 | 株式会社東芝 | 半導体装置及びその製造方法 |
| EP0333426B1 (de) | 1988-03-15 | 1996-07-10 | Kabushiki Kaisha Toshiba | Dynamischer RAM |
| JPH0666443B2 (ja) | 1988-07-07 | 1994-08-24 | 株式会社東芝 | 半導体メモリセルおよび半導体メモリ |
| US4910709A (en) | 1988-08-10 | 1990-03-20 | International Business Machines Corporation | Complementary metal-oxide-semiconductor transistor and one-capacitor dynamic-random-access memory cell |
| US5144390A (en) | 1988-09-02 | 1992-09-01 | Texas Instruments Incorporated | Silicon-on insulator transistor with internal body node to source node connection |
| US5258635A (en) | 1988-09-06 | 1993-11-02 | Kabushiki Kaisha Toshiba | MOS-type semiconductor integrated circuit device |
| JPH02168496A (ja) | 1988-09-14 | 1990-06-28 | Kawasaki Steel Corp | 半導体メモリ回路 |
| NL8802423A (nl) | 1988-10-03 | 1990-05-01 | Imec Inter Uni Micro Electr | Werkwijze voor het bedrijven van een mos-structuur en daarvoor geschikte mos-structuur. |
| US4894697A (en) | 1988-10-31 | 1990-01-16 | International Business Machines Corporation | Ultra dense dram cell and its method of fabrication |
| JPH02294076A (ja) | 1989-05-08 | 1990-12-05 | Hitachi Ltd | 半導体集積回路装置 |
| JPH03171768A (ja) | 1989-11-30 | 1991-07-25 | Toshiba Corp | 半導体記憶装置 |
| US5366917A (en) | 1990-03-20 | 1994-11-22 | Nec Corporation | Method for fabricating polycrystalline silicon having micro roughness on the surface |
| US5024993A (en) | 1990-05-02 | 1991-06-18 | Microelectronics & Computer Technology Corporation | Superconducting-semiconducting circuits, devices and systems |
| DE69111929T2 (de) | 1990-07-09 | 1996-03-28 | Sony Corp | Halbleiteranordnung auf einem dielektrischen isolierten Substrat. |
| US5331197A (en) | 1991-04-23 | 1994-07-19 | Canon Kabushiki Kaisha | Semiconductor memory device including gate electrode sandwiching a channel region |
| US5424567A (en) | 1991-05-15 | 1995-06-13 | North American Philips Corporation | Protected programmable transistor with reduced parasitic capacitances and method of fabrication |
| DE69226687T2 (de) | 1991-10-16 | 1999-04-15 | Sony Corp., Tokio/Tokyo | Verfahren zur Herstellung einer SOI-Struktur mit einem DRAM |
| EP0836194B1 (de) | 1992-03-30 | 2000-05-24 | Mitsubishi Denki Kabushiki Kaisha | Halbleiteranordnung |
| US5528062A (en) | 1992-06-17 | 1996-06-18 | International Business Machines Corporation | High-density DRAM structure on soi |
| EP0599388B1 (de) | 1992-11-20 | 2000-08-02 | Koninklijke Philips Electronics N.V. | Halbleitervorrichtung mit einem programmierbaren Element |
| JPH06216338A (ja) | 1992-11-27 | 1994-08-05 | Internatl Business Mach Corp <Ibm> | 半導体メモリセル及びその製造方法 |
| JPH0799251A (ja) | 1992-12-10 | 1995-04-11 | Sony Corp | 半導体メモリセル |
| EP0606758B1 (de) | 1992-12-30 | 2000-09-06 | Samsung Electronics Co., Ltd. | Verfahren zur Herstellung einer SOI-Transistor-DRAM |
| JP3613594B2 (ja) | 1993-08-19 | 2005-01-26 | 株式会社ルネサステクノロジ | 半導体素子およびこれを用いた半導体記憶装置 |
| US5448513A (en) | 1993-12-02 | 1995-09-05 | Regents Of The University Of California | Capacitorless DRAM device on silicon-on-insulator substrate |
| US5489792A (en) | 1994-04-07 | 1996-02-06 | Regents Of The University Of California | Silicon-on-insulator transistors having improved current characteristics and reduced electrostatic discharge susceptibility |
| US5446299A (en) | 1994-04-29 | 1995-08-29 | International Business Machines Corporation | Semiconductor random access memory cell on silicon-on-insulator with dual control gates |
| JP3273582B2 (ja) | 1994-05-13 | 2002-04-08 | キヤノン株式会社 | 記憶装置 |
| JPH0832040A (ja) | 1994-07-14 | 1996-02-02 | Nec Corp | 半導体装置 |
| US5627092A (en) | 1994-09-26 | 1997-05-06 | Siemens Aktiengesellschaft | Deep trench dram process on SOI for low leakage DRAM cell |
| JP3304635B2 (ja) | 1994-09-26 | 2002-07-22 | 三菱電機株式会社 | 半導体記憶装置 |
| US5593912A (en) | 1994-10-06 | 1997-01-14 | International Business Machines Corporation | SOI trench DRAM cell for 256 MB DRAM and beyond |
| FR2726935B1 (fr) | 1994-11-10 | 1996-12-13 | Commissariat Energie Atomique | Dispositif a memoire non-volatile electriquement effacable et procede de realisation d'un tel dispositif |
| JP3315293B2 (ja) | 1995-01-05 | 2002-08-19 | 株式会社東芝 | 半導体記憶装置 |
| US6292424B1 (en) | 1995-01-20 | 2001-09-18 | Kabushiki Kaisha Toshiba | DRAM having a power supply voltage lowering circuit |
| JP3274306B2 (ja) | 1995-01-20 | 2002-04-15 | 株式会社東芝 | 半導体集積回路装置 |
| EP0724266B1 (de) * | 1995-01-27 | 2001-12-12 | STMicroelectronics S.r.l. | Schnittweises Annäherungsverfahren zum Abtasten von nichtflüchtigen Mehrfachniveauspeicherzellen und dementsprechende Abtastschaltung |
| JP2806286B2 (ja) | 1995-02-07 | 1998-09-30 | 日本電気株式会社 | 半導体装置 |
| JP3407232B2 (ja) | 1995-02-08 | 2003-05-19 | 富士通株式会社 | 半導体記憶装置及びその動作方法 |
| JPH08222648A (ja) | 1995-02-14 | 1996-08-30 | Canon Inc | 記憶装置 |
| EP0727820B1 (de) | 1995-02-17 | 2004-03-24 | Hitachi, Ltd. | Halbleiter-Speicherbauelement und Verfahren zum Herstellen desselben |
| JP3600335B2 (ja) | 1995-03-27 | 2004-12-15 | 株式会社東芝 | 半導体装置 |
| JPH08274277A (ja) | 1995-03-31 | 1996-10-18 | Toyota Central Res & Dev Lab Inc | 半導体記憶装置およびその製造方法 |
| US5568356A (en) | 1995-04-18 | 1996-10-22 | Hughes Aircraft Company | Stacked module assembly including electrically interconnected switching module and plural electronic modules |
| DE69632098T2 (de) | 1995-04-21 | 2005-03-24 | Nippon Telegraph And Telephone Corp. | MOSFET Schaltung und ihre Anwendung in einer CMOS Logikschaltung |
| US5606188A (en) | 1995-04-26 | 1997-02-25 | International Business Machines Corporation | Fabrication process and structure for a contacted-body silicon-on-insulator dynamic random access memory |
| DE19519159C2 (de) | 1995-05-24 | 1998-07-09 | Siemens Ag | DRAM-Zellenanordnung und Verfahren zu deren Herstellung |
| EP0744722B1 (de) | 1995-05-24 | 2001-07-18 | Innovative Sputtering Technology N.V. (I.S.T.) | Magnetisches Antidiebstahletikett |
| US5629546A (en) | 1995-06-21 | 1997-05-13 | Micron Technology, Inc. | Static memory cell and method of manufacturing a static memory cell |
| JPH0946688A (ja) | 1995-07-26 | 1997-02-14 | Fujitsu Ltd | ビデオ情報提供/受信システム |
| DE69516402T2 (de) * | 1995-07-31 | 2000-11-02 | Stmicroelectronics S.R.L., Agrate Brianza | Gemischtes serielles paralleles dichotomisches Leseverfahren für nichtflüchtige Mehrpegel-Speicherzellen und Leseschaltung mit Verwendung eines solchen Verfahrens |
| JPH0982912A (ja) | 1995-09-13 | 1997-03-28 | Toshiba Corp | 半導体記憶装置及びその製造方法 |
| US5585285A (en) | 1995-12-06 | 1996-12-17 | Micron Technology, Inc. | Method of forming dynamic random access memory circuitry using SOI and isolation trenches |
| DE19603810C1 (de) | 1996-02-02 | 1997-08-28 | Siemens Ag | Speicherzellenanordnung und Verfahren zu deren Herstellung |
| US5959306A (en) * | 1996-02-08 | 1999-09-28 | Bright Solutions, Inc. | Portable light source and system for use in leak detection |
| JP3759648B2 (ja) | 1996-03-04 | 2006-03-29 | 株式会社ルネサステクノロジ | 半導体記憶装置 |
| US5936265A (en) | 1996-03-25 | 1999-08-10 | Kabushiki Kaisha Toshiba | Semiconductor device including a tunnel effect element |
| TW435007B (en) | 1996-04-08 | 2001-05-16 | Hitachi Ltd | Semiconductor integrated circuit device |
| EP0801427A3 (de) | 1996-04-11 | 1999-05-06 | Matsushita Electric Industrial Co., Ltd. | Feldeffekttransistor, Halbleiter-Speicheranordnung, Verfahren zur Herstellung und Verfahren zum Steuern der Halbleiter-Speicheranordnung |
| US6424016B1 (en) | 1996-05-24 | 2002-07-23 | Texas Instruments Incorporated | SOI DRAM having P-doped polysilicon gate for a memory pass transistor |
| DE69626631T2 (de) * | 1996-06-05 | 2003-11-06 | Stmicroelectronics S.R.L., Agrate Brianza | Seitenmodusspeicher mit Mehrpegelspeicherzellen |
| US5886376A (en) | 1996-07-01 | 1999-03-23 | International Business Machines Corporation | EEPROM having coplanar on-insulator FET and control gate |
| US5778243A (en) | 1996-07-03 | 1998-07-07 | International Business Machines Corporation | Multi-threaded cell for a memory |
| US5811283A (en) | 1996-08-13 | 1998-09-22 | United Microelectronics Corporation | Silicon on insulator (SOI) dram cell structure and process |
| JP3260660B2 (ja) | 1996-08-22 | 2002-02-25 | 株式会社東芝 | 半導体装置およびその製造方法 |
| JP2877103B2 (ja) | 1996-10-21 | 1999-03-31 | 日本電気株式会社 | 不揮発性半導体記憶装置およびその製造方法 |
| JP3602939B2 (ja) | 1996-11-19 | 2004-12-15 | 松下電器産業株式会社 | 半導体記憶装置 |
| KR19980057003A (ko) | 1996-12-30 | 1998-09-25 | 김영환 | 반도체 메모리 디바이스 및 그 제조방법 |
| JP3161354B2 (ja) | 1997-02-07 | 2001-04-25 | 日本電気株式会社 | 半導体装置及びその製造方法 |
| US5732014A (en) | 1997-02-20 | 1998-03-24 | Micron Technology, Inc. | Merged transistor structure for gain memory cell |
| EP0860878A2 (de) | 1997-02-20 | 1998-08-26 | Texas Instruments Incorporated | Integrierte Schaltung mit programmierbaren Elementen |
| JP3441330B2 (ja) | 1997-02-28 | 2003-09-02 | 株式会社東芝 | 半導体装置及びその製造方法 |
| JPH11191596A (ja) | 1997-04-02 | 1999-07-13 | Sony Corp | 半導体メモリセル及びその製造方法 |
| US6424011B1 (en) | 1997-04-14 | 2002-07-23 | International Business Machines Corporation | Mixed memory integration with NVRAM, dram and sram cell structures on same substrate |
| US5881010A (en) | 1997-05-15 | 1999-03-09 | Stmicroelectronics, Inc. | Multiple transistor dynamic random access memory array architecture with simultaneous refresh of multiple memory cells during a read operation |
| JP3190011B2 (ja) * | 1997-05-23 | 2001-07-16 | ローム株式会社 | 強誘電体記憶素子およびその製造方法 |
| US5784311A (en) | 1997-06-13 | 1998-07-21 | International Business Machines Corporation | Two-device memory cell on SOI for merged logic and memory applications |
| US6556336B2 (en) * | 1997-07-24 | 2003-04-29 | Scientific Materials, Corp. | Optical laser light limiter |
| JPH1187649A (ja) | 1997-09-04 | 1999-03-30 | Hitachi Ltd | 半導体記憶装置 |
| US5943581A (en) | 1997-11-05 | 1999-08-24 | Vanguard International Semiconductor Corporation | Method of fabricating a buried reservoir capacitor structure for high-density dynamic random access memory (DRAM) circuits |
| US6262625B1 (en) | 1999-10-29 | 2001-07-17 | Hewlett-Packard Co | Operational amplifier with digital offset calibration |
| US5976945A (en) | 1997-11-20 | 1999-11-02 | Vanguard International Semiconductor Corporation | Method for fabricating a DRAM cell structure on an SOI wafer incorporating a two dimensional trench capacitor |
| DE19752968C1 (de) | 1997-11-28 | 1999-06-24 | Siemens Ag | Speicherzellenanordnung und Verfahren zu deren Herstellung |
| JP3378879B2 (ja) | 1997-12-10 | 2003-02-17 | 松下電器産業株式会社 | 不揮発性半導体記憶装置及びその駆動方法 |
| DE59814170D1 (de) | 1997-12-17 | 2008-04-03 | Qimonda Ag | Speicherzellenanordnung und Verfahren zu deren Herstellung |
| US5943258A (en) | 1997-12-24 | 1999-08-24 | Texas Instruments Incorporated | Memory with storage cells having SOI drive and access transistors with tied floating body connections |
| US6097056A (en) | 1998-04-28 | 2000-08-01 | International Business Machines Corporation | Field effect transistor having a floating gate |
| US6225158B1 (en) | 1998-05-28 | 2001-05-01 | International Business Machines Corporation | Trench storage dynamic random access memory cell with vertical transfer device |
| TW432545B (en) | 1998-08-07 | 2001-05-01 | Ibm | Method and improved SOI body contact structure for transistors |
| JP4030198B2 (ja) | 1998-08-11 | 2008-01-09 | 株式会社ルネサステクノロジ | 半導体集積回路装置の製造方法 |
| KR100268419B1 (ko) | 1998-08-14 | 2000-10-16 | 윤종용 | 고집적 반도체 메모리 장치 및 그의 제조 방법 |
| US6423596B1 (en) | 1998-09-29 | 2002-07-23 | Texas Instruments Incorporated | Method for two-sided fabrication of a memory array |
| US6096598A (en) | 1998-10-29 | 2000-08-01 | International Business Machines Corporation | Method for forming pillar memory cells and device formed thereby |
| US6214694B1 (en) | 1998-11-17 | 2001-04-10 | International Business Machines Corporation | Process of making densely patterned silicon-on-insulator (SOI) region on a wafer |
| KR100290787B1 (ko) | 1998-12-26 | 2001-07-12 | 박종섭 | 반도체 메모리 소자의 제조방법 |
| US6258672B1 (en) * | 1999-02-18 | 2001-07-10 | Taiwan Semiconductor Manufacturing Company | Method of fabricating an ESD protection device |
| US6535415B2 (en) | 1999-02-22 | 2003-03-18 | Hitachi, Ltd. | Semiconductor device |
| JP3384350B2 (ja) | 1999-03-01 | 2003-03-10 | 株式会社村田製作所 | 低温焼結セラミック組成物の製造方法 |
| DE19912108A1 (de) | 1999-03-18 | 2000-09-28 | Porsche Ag | Schmiermittelbehälter für eine Brennkraftmaschine |
| US6157216A (en) | 1999-04-22 | 2000-12-05 | International Business Machines Corporation | Circuit driver on SOI for merged logic and memory circuits |
| US6111778A (en) | 1999-05-10 | 2000-08-29 | International Business Machines Corporation | Body contacted dynamic memory |
| IT1312471B1 (it) * | 1999-05-11 | 2002-04-17 | St Microelectronics Srl | Metodo di verifica in scrittura del valore di soglia nelle memorie non volatili |
| FI111028B (fi) * | 1999-05-26 | 2003-05-15 | Outokumpu Oy | Menetelmä sulatusuunin kaasuvirtauksen jäähdyttämiseksi |
| US7071837B2 (en) * | 1999-07-07 | 2006-07-04 | Expro North Sea Limited | Data transmission in pipeline systems |
| US6333532B1 (en) | 1999-07-16 | 2001-12-25 | International Business Machines Corporation | Patterned SOI regions in semiconductor chips |
| JP2001044391A (ja) | 1999-07-29 | 2001-02-16 | Fujitsu Ltd | 半導体記憶装置とその製造方法 |
| US6566177B1 (en) | 1999-10-25 | 2003-05-20 | International Business Machines Corporation | Silicon-on-insulator vertical array device trench capacitor DRAM |
| US6391658B1 (en) | 1999-10-26 | 2002-05-21 | International Business Machines Corporation | Formation of arrays of microelectronic elements |
| IT1308857B1 (it) * | 1999-10-29 | 2002-01-11 | St Microelectronics Srl | Metodo e circuito di lettura per una memoria non volatile. |
| JP2001180633A (ja) | 1999-12-27 | 2001-07-03 | Toshiba Tec Corp | ラベルプリンタ |
| DE10012846A1 (de) | 2000-03-16 | 2001-09-27 | Fico Itm Sa | Geflockte Sonnenblende |
| US6544837B1 (en) | 2000-03-17 | 2003-04-08 | International Business Machines Corporation | SOI stacked DRAM logic |
| US6359802B1 (en) | 2000-03-28 | 2002-03-19 | Intel Corporation | One-transistor and one-capacitor DRAM cell for logic process technology |
| JP2002064150A (ja) | 2000-06-05 | 2002-02-28 | Mitsubishi Electric Corp | 半導体装置 |
| DE10028424C2 (de) | 2000-06-06 | 2002-09-19 | Infineon Technologies Ag | Herstellungsverfahren für DRAM-Speicherzellen |
| DE10030255A1 (de) * | 2000-06-20 | 2002-01-03 | Deere & Co | Landwirtschaftliches Gerät |
| JP2002009081A (ja) | 2000-06-26 | 2002-01-11 | Toshiba Corp | 半導体装置及びその製造方法 |
| JP4011833B2 (ja) | 2000-06-30 | 2007-11-21 | 株式会社東芝 | 半導体メモリ |
| KR100339425B1 (ko) | 2000-07-21 | 2002-06-03 | 박종섭 | 리세스된 소이 구조를 갖는 반도체 소자 및 그의 제조 방법 |
| JP4226205B2 (ja) | 2000-08-11 | 2009-02-18 | 富士雄 舛岡 | 半導体記憶装置の製造方法 |
| US6621725B2 (en) | 2000-08-17 | 2003-09-16 | Kabushiki Kaisha Toshiba | Semiconductor memory device with floating storage bulk region and method of manufacturing the same |
| US6492211B1 (en) | 2000-09-07 | 2002-12-10 | International Business Machines Corporation | Method for novel SOI DRAM BICMOS NPN |
| JP4064607B2 (ja) | 2000-09-08 | 2008-03-19 | 株式会社東芝 | 半導体メモリ装置 |
| US20020070411A1 (en) | 2000-09-08 | 2002-06-13 | Alcatel | Method of processing a high voltage p++/n-well junction and a device manufactured by the method |
| JP2002094027A (ja) | 2000-09-11 | 2002-03-29 | Toshiba Corp | 半導体記憶装置とその製造方法 |
| US6350653B1 (en) | 2000-10-12 | 2002-02-26 | International Business Machines Corporation | Embedded DRAM on silicon-on-insulator substrate |
| US6496402B1 (en) | 2000-10-17 | 2002-12-17 | Intel Corporation | Noise suppression for open bit line DRAM architectures |
| US6849871B2 (en) | 2000-10-20 | 2005-02-01 | International Business Machines Corporation | Fully-depleted-collector silicon-on-insulator (SOI) bipolar transistor useful alone or in SOI BiCMOS |
| US6429477B1 (en) | 2000-10-31 | 2002-08-06 | International Business Machines Corporation | Shared body and diffusion contact structure and method for fabricating same |
| US6440872B1 (en) | 2000-11-03 | 2002-08-27 | International Business Machines Corporation | Method for hybrid DRAM cell utilizing confined strap isolation |
| US6549450B1 (en) | 2000-11-08 | 2003-04-15 | Ibm Corporation | Method and system for improving the performance on SOI memory arrays in an SRAM architecture system |
| US6441436B1 (en) | 2000-11-29 | 2002-08-27 | United Microelectronics Corp. | SOI device and method of fabrication |
| JP3808700B2 (ja) | 2000-12-06 | 2006-08-16 | 株式会社東芝 | 半導体装置及びその製造方法 |
| US20020072155A1 (en) | 2000-12-08 | 2002-06-13 | Chih-Cheng Liu | Method of fabricating a DRAM unit |
| US7101772B2 (en) | 2000-12-30 | 2006-09-05 | Texas Instruments Incorporated | Means for forming SOI |
| US6552398B2 (en) | 2001-01-16 | 2003-04-22 | Ibm Corporation | T-Ram array having a planar cell structure and method for fabricating the same |
| US6441435B1 (en) | 2001-01-31 | 2002-08-27 | Advanced Micro Devices, Inc. | SOI device with wrap-around contact to underside of body, and method of making |
| JP4216483B2 (ja) | 2001-02-15 | 2009-01-28 | 株式会社東芝 | 半導体メモリ装置 |
| JP3884266B2 (ja) | 2001-02-19 | 2007-02-21 | 株式会社東芝 | 半導体メモリ装置及びその製造方法 |
| JP4354663B2 (ja) | 2001-03-15 | 2009-10-28 | 株式会社東芝 | 半導体メモリ装置 |
| US6548848B2 (en) | 2001-03-15 | 2003-04-15 | Kabushiki Kaisha Toshiba | Semiconductor memory device |
| JP4071476B2 (ja) | 2001-03-21 | 2008-04-02 | 株式会社東芝 | 半導体ウェーハ及び半導体ウェーハの製造方法 |
| JP4053738B2 (ja) | 2001-04-26 | 2008-02-27 | 株式会社東芝 | 半導体メモリ装置 |
| EP1253634A3 (de) | 2001-04-26 | 2005-08-31 | Kabushiki Kaisha Toshiba | Halbleiterbauelement |
| US6556477B2 (en) | 2001-05-21 | 2003-04-29 | Ibm Corporation | Integrated chip having SRAM, DRAM and flash memory and method for fabricating the same |
| TWI230392B (en) | 2001-06-18 | 2005-04-01 | Innovative Silicon Sa | Semiconductor device |
| US6592406B2 (en) | 2001-06-28 | 2003-07-15 | An-Hom Liu | Adapter with fuse and indicator and capable of being used as plug |
| JP2003031693A (ja) | 2001-07-19 | 2003-01-31 | Toshiba Corp | 半導体メモリ装置 |
| US6567330B2 (en) | 2001-08-17 | 2003-05-20 | Kabushiki Kaisha Toshiba | Semiconductor memory device |
| JP2003132682A (ja) | 2001-08-17 | 2003-05-09 | Toshiba Corp | 半導体メモリ装置 |
| JP3984014B2 (ja) | 2001-09-26 | 2007-09-26 | 株式会社東芝 | 半導体装置用基板を製造する方法および半導体装置用基板 |
| US6784744B2 (en) * | 2001-09-27 | 2004-08-31 | Powerq Technologies, Inc. | Amplifier circuits and methods |
| JP4322453B2 (ja) | 2001-09-27 | 2009-09-02 | 株式会社東芝 | 半導体装置およびその製造方法 |
| US6586989B2 (en) | 2001-11-06 | 2003-07-01 | Hewlett-Packard Development Company, L.P. | Nonlinear digital differential amplifier offset calibration |
| US6657259B2 (en) | 2001-12-04 | 2003-12-02 | International Business Machines Corporation | Multiple-plane FinFET CMOS |
| US6518105B1 (en) | 2001-12-10 | 2003-02-11 | Taiwan Semiconductor Manufacturing Company | High performance PD SOI tunneling-biased MOSFET |
| US6870770B2 (en) | 2001-12-12 | 2005-03-22 | Micron Technology, Inc. | Method and architecture to calibrate read operations in synchronous flash memory |
| JP2003203967A (ja) | 2001-12-28 | 2003-07-18 | Toshiba Corp | 部分soiウェーハの製造方法、半導体装置及びその製造方法 |
| US20030123279A1 (en) | 2002-01-03 | 2003-07-03 | International Business Machines Corporation | Silicon-on-insulator SRAM cells with increased stability and yield |
| JP2003243528A (ja) | 2002-02-13 | 2003-08-29 | Toshiba Corp | 半導体装置 |
| US6661042B2 (en) | 2002-03-11 | 2003-12-09 | Monolithic System Technology, Inc. | One-transistor floating-body DRAM cell in bulk CMOS process with electrically isolated charge storage region |
| JP4880867B2 (ja) | 2002-04-10 | 2012-02-22 | セイコーインスツル株式会社 | 薄膜メモリ、アレイとその動作方法および製造方法 |
| EP1357603A3 (de) | 2002-04-18 | 2004-01-14 | Innovative Silicon SA | Halbleiterbauelement |
| EP1355316B1 (de) | 2002-04-18 | 2007-02-21 | Innovative Silicon SA | Datenspeichergerät sowie Verfahren zum Auffrischen der auf einem solchen Gerät gespeicherten Daten |
| JP3962638B2 (ja) | 2002-06-18 | 2007-08-22 | 株式会社東芝 | 半導体記憶装置、及び、半導体装置 |
| US6917078B2 (en) | 2002-08-30 | 2005-07-12 | Micron Technology Inc. | One transistor SOI non-volatile random access memory cell |
| US6903969B2 (en) | 2002-08-30 | 2005-06-07 | Micron Technology Inc. | One-device non-volatile random access memory cell |
| US6888200B2 (en) | 2002-08-30 | 2005-05-03 | Micron Technology Inc. | One transistor SOI non-volatile random access memory cell |
| US7103718B2 (en) | 2002-09-03 | 2006-09-05 | Hewlett-Packard Development Company, L.P. | Non-volatile memory module for use in a computer system |
| JP4044401B2 (ja) | 2002-09-11 | 2008-02-06 | 株式会社東芝 | 半導体記憶装置 |
| JP2004111643A (ja) | 2002-09-18 | 2004-04-08 | Toshiba Corp | 半導体記憶装置、及び、その制御方法 |
| US7030436B2 (en) * | 2002-12-04 | 2006-04-18 | Micron Technology, Inc. | Embedded DRAM gain memory cell having MOS transistor body provided with a bi-polar transistor charge injecting means |
| US6850585B2 (en) * | 2003-03-05 | 2005-02-01 | Ge Medical Systems Global Technology Company, Llc | Progressive updating approach for volumetric CT image reconstruction |
| US6912150B2 (en) * | 2003-05-13 | 2005-06-28 | Lionel Portman | Reference current generator, and method of programming, adjusting and/or operating same |
| US6952376B2 (en) | 2003-12-22 | 2005-10-04 | Intel Corporation | Method and apparatus to generate a reference value in a memory array |
-
2004
- 2004-05-07 US US10/840,902 patent/US6912150B2/en not_active Expired - Lifetime
- 2004-05-12 EP EP04751987A patent/EP1620859B1/de not_active Expired - Lifetime
- 2004-05-12 WO PCT/US2004/014843 patent/WO2004102631A2/en not_active Ceased
- 2004-05-12 AT AT04751987T patent/ATE397779T1/de not_active IP Right Cessation
- 2004-05-12 DE DE602004014269T patent/DE602004014269D1/de not_active Expired - Lifetime
-
2005
- 2005-02-18 US US11/061,069 patent/US6980461B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| EP1620859B1 (de) | 2008-06-04 |
| WO2004102631A3 (en) | 2005-03-31 |
| US20050162931A1 (en) | 2005-07-28 |
| EP1620859A4 (de) | 2007-02-21 |
| US6912150B2 (en) | 2005-06-28 |
| US6980461B2 (en) | 2005-12-27 |
| WO2004102631A2 (en) | 2004-11-25 |
| DE602004014269D1 (de) | 2008-07-17 |
| EP1620859A2 (de) | 2004-11-25 |
| US20040227166A1 (en) | 2004-11-18 |
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| Date | Code | Title | Description |
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| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |