WO2001031984A1 - Panneau de cablage realise en carte imprimee multicouche et procede de production - Google Patents
Panneau de cablage realise en carte imprimee multicouche et procede de production Download PDFInfo
- Publication number
- WO2001031984A1 WO2001031984A1 PCT/JP2000/007037 JP0007037W WO0131984A1 WO 2001031984 A1 WO2001031984 A1 WO 2001031984A1 JP 0007037 W JP0007037 W JP 0007037W WO 0131984 A1 WO0131984 A1 WO 0131984A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- hole
- resin
- printed wiring
- wiring board
- layer
- Prior art date
Links
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/05568—Disposition the whole external layer protruding from the surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05573—Single external layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
Claims
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP00964763A EP1162867B1 (en) | 1999-10-26 | 2000-10-10 | Multilayer printed wiring board and method of producing multilayer printed wiring board |
DE60027141T DE60027141T2 (de) | 1999-10-26 | 2000-10-10 | Gedruckte mehrschichtleiterplatte und herstellungsverfahren für gedruckte mehrschichtleiterplatte |
US09/830,963 US6930258B1 (en) | 1999-10-26 | 2000-10-20 | Multilayer printed wiring board and method of producing multilayer printed wiring board |
US11/106,642 US7178234B2 (en) | 1999-10-26 | 2005-04-15 | Method of manufacturing multi-layer printed circuit board |
US11/333,228 US7795542B2 (en) | 1999-10-26 | 2006-01-18 | Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board |
US12/179,201 US7999194B2 (en) | 1999-10-26 | 2008-07-24 | Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board |
US12/560,208 US8106310B2 (en) | 1999-10-26 | 2009-09-15 | Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board |
US13/307,213 US8822839B2 (en) | 1999-10-26 | 2011-11-30 | Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board |
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11/303306 | 1999-10-26 | ||
JP30330699A JP2001127435A (ja) | 1999-10-26 | 1999-10-26 | 多層プリント配線板及び多層プリント配線板の製造方法 |
JP11/303307 | 1999-10-26 | ||
JP11/303305 | 1999-10-26 | ||
JP30330799A JP2001127436A (ja) | 1999-10-26 | 1999-10-26 | 多層プリント配線板の製造方法 |
JP30330599A JP4832621B2 (ja) | 1999-10-26 | 1999-10-26 | 多層プリント配線板 |
JP2000-29988 | 2000-02-08 | ||
JP2000029988A JP2001223466A (ja) | 2000-02-08 | 2000-02-08 | プリント配線板の製造方法 |
Related Child Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09830963 A-371-Of-International | 2000-10-10 | ||
US09830953 A-371-Of-International | 2000-10-10 | ||
US09/830,963 A-371-Of-International US6930258B1 (en) | 1999-10-26 | 2000-10-20 | Multilayer printed wiring board and method of producing multilayer printed wiring board |
US11/106,642 Division US7178234B2 (en) | 1999-10-26 | 2005-04-15 | Method of manufacturing multi-layer printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2001031984A1 true WO2001031984A1 (fr) | 2001-05-03 |
Family
ID=27479844
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2000/007037 WO2001031984A1 (fr) | 1999-10-26 | 2000-10-10 | Panneau de cablage realise en carte imprimee multicouche et procede de production |
Country Status (8)
Country | Link |
---|---|
US (6) | US6930258B1 (ja) |
EP (2) | EP1162867B1 (ja) |
KR (1) | KR100833723B1 (ja) |
CN (2) | CN1199536C (ja) |
DE (1) | DE60027141T2 (ja) |
MY (2) | MY148600A (ja) |
TW (1) | TWI252723B (ja) |
WO (1) | WO2001031984A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1432293A1 (en) * | 2001-09-28 | 2004-06-23 | Ibiden Co., Ltd. | Printed wiring board and production method for printed wiring board |
Families Citing this family (109)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1199536C (zh) | 1999-10-26 | 2005-04-27 | 伊比登株式会社 | 多层印刷配线板及多层印刷配线板的制造方法 |
AUPR090300A0 (en) | 2000-10-20 | 2000-11-16 | AMC Technologies Pty Limited | An electrical lead |
US6861757B2 (en) * | 2001-09-03 | 2005-03-01 | Nec Corporation | Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device |
EP1437703A1 (en) * | 2001-09-07 | 2004-07-14 | Matsushita Electric Industrial Co., Ltd. | Display apparatus and its manufacturing method |
WO2003041271A2 (en) * | 2001-11-02 | 2003-05-15 | Fred Bassali | Circuit board microwave filters |
JP4062907B2 (ja) * | 2001-11-12 | 2008-03-19 | 松下電器産業株式会社 | 回路基板およびその製造方法 |
AUPS226402A0 (en) * | 2002-05-13 | 2002-06-13 | Advanced Metal Coatings Pty Limited | An ablation catheter |
AUPS226502A0 (en) * | 2002-05-13 | 2002-06-13 | Advanced Metal Coatings Pty Limited | A multi-electrode lead |
AU2002952318A0 (en) * | 2002-10-29 | 2002-11-14 | Advanced Metal Coatings Pty Limited | Production of lesions in a body |
EP1439689A1 (de) * | 2003-01-15 | 2004-07-21 | Siemens Aktiengesellschaft | Mobiltelefon mit einer Scan-Hilfe |
JP2004282033A (ja) * | 2003-02-28 | 2004-10-07 | Ngk Spark Plug Co Ltd | 樹脂製配線基板 |
TWI310670B (en) * | 2003-08-28 | 2009-06-01 | Ibm | Printed wiring board manufacturing method and printed wiring board |
JP4198566B2 (ja) * | 2003-09-29 | 2008-12-17 | 新光電気工業株式会社 | 電子部品内蔵基板の製造方法 |
EP1686909B1 (en) | 2003-11-25 | 2018-08-01 | Cathrx Ltd | A modular catheter |
TWI335195B (en) * | 2003-12-16 | 2010-12-21 | Ngk Spark Plug Co | Multilayer wiring board |
AU2005207078B2 (en) | 2004-01-26 | 2011-03-17 | Cathrx Ltd | A catheter assembly with an adjustable loop |
EP1677349A4 (en) * | 2004-02-24 | 2010-12-01 | Ibiden Co Ltd | SUBSTRATE FOR MOUNTING A SEMICONDUCTOR |
WO2005094661A1 (en) * | 2004-03-30 | 2005-10-13 | Cathrx Ltd | A catheter steering device |
DE102004032706A1 (de) * | 2004-07-06 | 2006-02-02 | Epcos Ag | Verfahren zur Herstellung eines elektrischen Bauelements und das Bauelement |
US7196274B2 (en) * | 2004-07-20 | 2007-03-27 | Dragonwave Inc. | Multi-layer integrated RF/IF circuit board |
US7202419B2 (en) * | 2004-07-20 | 2007-04-10 | Dragonwave Inc. | Multi-layer integrated RF/IF circuit board including a central non-conductive layer |
AU2005269245B2 (en) * | 2004-08-05 | 2011-09-15 | Cathrx Ltd | A steerable catheter |
WO2006012671A1 (en) * | 2004-08-05 | 2006-02-09 | Cathrx Ltd | A process of manufacturing an electrical lead |
JP4079927B2 (ja) * | 2004-09-16 | 2008-04-23 | Tdk株式会社 | 多層基板及びその製造方法 |
TW200618705A (en) * | 2004-09-16 | 2006-06-01 | Tdk Corp | Multilayer substrate and manufacturing method thereof |
TWI301656B (en) * | 2004-11-26 | 2008-10-01 | Via Tech Inc | Circuit board and process thereof |
US7528006B2 (en) * | 2005-06-30 | 2009-05-05 | Intel Corporation | Integrated circuit die containing particle-filled through-silicon metal vias with reduced thermal expansion |
TWI294757B (en) * | 2005-07-06 | 2008-03-11 | Delta Electronics Inc | Circuit board with a through hole wire, and forming method thereof |
US7602062B1 (en) * | 2005-08-10 | 2009-10-13 | Altera Corporation | Package substrate with dual material build-up layers |
TWI288591B (en) * | 2005-10-17 | 2007-10-11 | Phoenix Prec Technology Corp | Circuit board structure and dielectric structure thereof |
US20070206364A1 (en) * | 2006-03-02 | 2007-09-06 | Saint-Gobain Performance Plastics Corporation | Methods of forming a flexible circuit board |
US20080030030A1 (en) * | 2006-08-02 | 2008-02-07 | Taiwan Fu Hsing Industrial Co., Ltd. | Door lever and door lever assembly |
KR100771467B1 (ko) * | 2006-10-30 | 2007-10-30 | 삼성전기주식회사 | 회로기판 및 그 제조방법 |
TW200830961A (en) * | 2007-01-02 | 2008-07-16 | Unimicron Technology Corp | Circuit substrate and surface treatment process thereof |
US8877565B2 (en) * | 2007-06-28 | 2014-11-04 | Intel Corporation | Method of forming a multilayer substrate core structure using sequential microvia laser drilling and substrate core structure formed according to the method |
US8440916B2 (en) * | 2007-06-28 | 2013-05-14 | Intel Corporation | Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method |
KR100922810B1 (ko) * | 2007-12-11 | 2009-10-21 | 주식회사 잉크테크 | 흑화 전도성 패턴의 제조방법 |
KR20090067249A (ko) * | 2007-12-21 | 2009-06-25 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
US20090188710A1 (en) * | 2008-01-30 | 2009-07-30 | Cisco Technology, Inc. | System and method for forming filled vias and plated through holes |
JP2009218545A (ja) * | 2008-03-12 | 2009-09-24 | Ibiden Co Ltd | 多層プリント配線板及びその製造方法 |
JP5138459B2 (ja) * | 2008-05-15 | 2013-02-06 | 新光電気工業株式会社 | 配線基板の製造方法 |
US8989837B2 (en) | 2009-12-01 | 2015-03-24 | Kyma Medical Technologies Ltd. | Methods and systems for determining fluid content of tissue |
FR2933975B1 (fr) * | 2008-07-17 | 2011-02-18 | Servier Lab | Nouveau procede de preparation de benzocyclobutenes fonctionnalises,et application a la synthese de l'ivabradine et de ses sels d'addition a un acide pharmaceutiquement acceptable. |
JPWO2010024233A1 (ja) | 2008-08-27 | 2012-01-26 | 日本電気株式会社 | 機能素子を内蔵可能な配線基板及びその製造方法 |
JP5715747B2 (ja) * | 2008-09-30 | 2015-05-13 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 回路装置およびその製造方法 |
EP2345933A4 (en) * | 2008-10-20 | 2013-01-23 | Sumitomo Bakelite Co | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION FOR SPRAY COATING AND PROCESS FOR PRODUCING THROUGH ELECTRODE USING THE SAME |
TWI402173B (zh) * | 2008-11-17 | 2013-07-21 | Fujitsu Ltd | 電路板及其製造方法(一) |
JP5142967B2 (ja) * | 2008-12-10 | 2013-02-13 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
KR101019706B1 (ko) * | 2008-12-30 | 2011-03-07 | 주식회사 하이닉스반도체 | 반도체 패키지 및 이의 제조 방법 |
KR101060862B1 (ko) * | 2009-09-14 | 2011-08-31 | 삼성전기주식회사 | 인터포저 및 그의 제조방법 |
CN102026498B (zh) * | 2009-09-21 | 2012-11-28 | 日月光半导体制造股份有限公司 | 线路板的制作方法、线路板及晶片封装结构 |
US20110114372A1 (en) * | 2009-10-30 | 2011-05-19 | Ibiden Co., Ltd. | Printed wiring board |
EP2506762B1 (en) | 2009-12-01 | 2019-03-06 | Kyma Medical Technologies Ltd | Locating features in the heart using radio frequency imaging |
KR101737478B1 (ko) * | 2009-12-14 | 2017-05-19 | 엘지이노텍 주식회사 | 카메라 모듈 및 그 제조 방법 |
US8207453B2 (en) | 2009-12-17 | 2012-06-26 | Intel Corporation | Glass core substrate for integrated circuit devices and methods of making the same |
US9420707B2 (en) * | 2009-12-17 | 2016-08-16 | Intel Corporation | Substrate for integrated circuit devices including multi-layer glass core and methods of making the same |
CN102149255B (zh) * | 2010-02-04 | 2013-07-24 | 日月光半导体制造股份有限公司 | 多引线通孔的形成方法 |
EP2543065A4 (en) * | 2010-03-03 | 2018-01-24 | Georgia Tech Research Corporation | Through-package-via (tpv) structures on inorganic interposer and methods for fabricating same |
JP6081355B2 (ja) | 2010-07-21 | 2017-02-15 | キマ メディカル テクノロジーズ リミテッド | 埋込み式無線周波数センサ |
JP5592808B2 (ja) * | 2010-09-15 | 2014-09-17 | 日東電工株式会社 | 配線回路基板 |
GB2502934B (en) * | 2011-04-04 | 2015-08-12 | Murata Manufacturing Co | Chip component-embedded resin multilayer substrate and manufacturing method thereof |
JP2013008880A (ja) * | 2011-06-24 | 2013-01-10 | Fujitsu Ltd | 積層回路基板の製造方法及び積層回路基板 |
KR20130007022A (ko) * | 2011-06-28 | 2013-01-18 | 삼성전기주식회사 | 인쇄회로기판 및 이의 제조방법 |
KR101310256B1 (ko) | 2011-06-28 | 2013-09-23 | 삼성전기주식회사 | 인쇄회로기판의 무전해 표면처리 도금층 및 이의 제조방법 |
WO2013041971A2 (en) * | 2011-09-19 | 2013-03-28 | Cima Nanotech Israel Ltd. | Process for preparing transparent conductive coatings |
US8895873B2 (en) * | 2011-09-28 | 2014-11-25 | Ibiden Co., Ltd. | Printed wiring board |
US8969732B2 (en) * | 2011-09-28 | 2015-03-03 | Ibiden Co., Ltd. | Printed wiring board |
US20130168132A1 (en) * | 2011-12-29 | 2013-07-04 | Sumsung Electro-Mechanics Co., Ltd. | Printed circuit board and method of manufacturing the same |
KR20130089475A (ko) * | 2012-02-02 | 2013-08-12 | 삼성전자주식회사 | 회로 기판 및 이의 제조 방법과 이를 이용한 반도체 패키지 |
WO2013133827A1 (en) | 2012-03-07 | 2013-09-12 | Intel Corporation | Glass clad microelectronic substrate |
US8961550B2 (en) | 2012-04-17 | 2015-02-24 | Indian Wells Medical, Inc. | Steerable endoluminal punch |
JP6003194B2 (ja) * | 2012-04-27 | 2016-10-05 | セイコーエプソン株式会社 | ベース基板、電子デバイスおよびベース基板の製造方法 |
CN102723306B (zh) * | 2012-06-28 | 2014-10-08 | 中国科学院上海微系统与信息技术研究所 | 一种利用穿硅通孔的微波多芯片封装结构及其制作方法 |
US9001520B2 (en) | 2012-09-24 | 2015-04-07 | Intel Corporation | Microelectronic structures having laminated or embedded glass routing structures for high density packaging |
KR20140071561A (ko) * | 2012-11-27 | 2014-06-12 | 삼성전자주식회사 | 회로 기판과 이를 구비하는 반도체 패키지 |
JP6013960B2 (ja) * | 2013-03-28 | 2016-10-25 | 京セラ株式会社 | 配線基板 |
JP6266907B2 (ja) * | 2013-07-03 | 2018-01-24 | 新光電気工業株式会社 | 配線基板及び配線基板の製造方法 |
JP6309096B2 (ja) | 2013-10-29 | 2018-04-11 | キマ メディカル テクノロジーズ リミテッド | アンテナシステムおよびデバイス、およびそれらの製造方法 |
US9288917B2 (en) * | 2013-11-07 | 2016-03-15 | Unimicron Technology Corp. | Manufacturing method for multi-layer circuit board |
EP3102100B1 (en) | 2014-02-05 | 2023-08-09 | ZOLL Medical Israel Ltd. | Apparatuses for determining blood pressure |
JP2015213124A (ja) * | 2014-05-02 | 2015-11-26 | イビデン株式会社 | パッケージ基板 |
CN105225976A (zh) * | 2014-06-25 | 2016-01-06 | 中芯国际集成电路制造(上海)有限公司 | 焊盘的制作方法及半导体器件 |
JP2016051847A (ja) * | 2014-09-01 | 2016-04-11 | イビデン株式会社 | プリント配線板、その製造方法及び半導体装置 |
WO2016040337A1 (en) | 2014-09-08 | 2016-03-17 | KYMA Medical Technologies, Inc. | Monitoring and diagnostics systems and methods |
SG11201702107RA (en) * | 2014-09-16 | 2017-04-27 | Amphenol Fci Asia Pte Ltd | Hermetically sealed electrical connector assembly |
US9818682B2 (en) * | 2014-12-03 | 2017-11-14 | International Business Machines Corporation | Laminate substrates having radial cut metallic planes |
US10548485B2 (en) | 2015-01-12 | 2020-02-04 | Zoll Medical Israel Ltd. | Systems, apparatuses and methods for radio frequency-based attachment sensing |
KR101795480B1 (ko) * | 2015-04-06 | 2017-11-10 | 코닝정밀소재 주식회사 | 집적회로 패키지용 기판 |
KR20170002179A (ko) * | 2015-06-29 | 2017-01-06 | 삼성전기주식회사 | 인쇄회로기판 및 인쇄회로기판의 제조방법 |
EP3319120A1 (en) * | 2015-07-03 | 2018-05-09 | Renesas Electronics Corporation | Semiconductor device |
US9780052B2 (en) | 2015-09-14 | 2017-10-03 | Micron Technology, Inc. | Collars for under-bump metal structures and associated systems and methods |
US10282585B2 (en) | 2015-11-13 | 2019-05-07 | Cypress Semiconductor Corporation | Sensor-compatible overlay |
US10832029B2 (en) | 2015-11-13 | 2020-11-10 | Cypress Semiconductor Corporation | Sensor-compatible overlay |
US9639734B1 (en) * | 2015-11-13 | 2017-05-02 | Cypress Semiconductor Corporation | Fingerprint sensor-compatible overlay material |
CN105744722A (zh) * | 2016-02-19 | 2016-07-06 | 罗嘉妤 | 一种计算机散热pcb板 |
CN105575938B (zh) * | 2016-02-26 | 2018-10-26 | 中国科学院微电子研究所 | 一种硅基转接板及其制备方法 |
US9922951B1 (en) * | 2016-11-12 | 2018-03-20 | Sierra Circuits, Inc. | Integrated circuit wafer integration with catalytic laminate or adhesive |
EP3598461A4 (en) | 2017-03-16 | 2021-01-13 | Asahi Kasei Kabushiki Kaisha | DISPERSION, METHOD OF MANUFACTURING A STRUCTURE WITH CONDUCTIVE PATTERNS USING THE DISPERSION AND STRUCTURE WITH CONDUCTIVE PATTERNS |
US11328835B2 (en) | 2017-03-16 | 2022-05-10 | Asahi Kasei Kabushiki Kaisha | Dispersing element, method for manufacturing structure with conductive pattern using the same, and structure with conductive pattern |
WO2019017363A1 (ja) * | 2017-07-18 | 2019-01-24 | 旭化成株式会社 | 導電性パターン領域を有する構造体及びその製造方法、積層体及びその製造方法、並びに、銅配線 |
KR20190012485A (ko) * | 2017-07-27 | 2019-02-11 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조 방법 |
US11760895B2 (en) | 2017-07-27 | 2023-09-19 | Asahi Kasei Kabushiki Kaisha | Copper oxide ink and method for producing conductive substrate using same, product containing coating film and method for producing product using same, method for producing product with conductive pattern, and product with conductive pattern |
EP3664694A4 (en) | 2017-08-10 | 2021-07-28 | Zoll Medical Israel Ltd. | SYSTEMS, DEVICES AND METHODS FOR THE PHYSIOLOGICAL MONITORING OF PATIENTS |
CN109673112B (zh) * | 2017-10-13 | 2021-08-20 | 鹏鼎控股(深圳)股份有限公司 | 柔性电路板以及柔性电路板的制作方法 |
US10602622B2 (en) * | 2017-10-27 | 2020-03-24 | Kyocera Corporation | Wiring board |
US11523518B2 (en) * | 2017-11-28 | 2022-12-06 | Sumitomo Electric Printed Circuits, Inc. | Method of making flexible printed circuit board and flexible printed circuit board |
JP7089453B2 (ja) * | 2018-10-10 | 2022-06-22 | 新光電気工業株式会社 | 配線基板及びその製造方法 |
EP3709779A1 (en) * | 2019-03-12 | 2020-09-16 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier and method of manufacturing the same |
CN113035834B (zh) * | 2021-05-28 | 2021-07-30 | 浙江集迈科微电子有限公司 | 转接板及其制备方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06283847A (ja) * | 1993-03-29 | 1994-10-07 | Hitachi Chem Co Ltd | プリント配線板 |
JPH09246732A (ja) * | 1996-03-01 | 1997-09-19 | Ibiden Co Ltd | 多層プリント配線板およびその製造方法 |
JPH09331152A (ja) * | 1996-06-11 | 1997-12-22 | Tokuyama Corp | 回路基板の製造方法 |
JPH1187930A (ja) * | 1997-09-11 | 1999-03-30 | Hitachi Aic Inc | 多層印刷配線板の製造方法 |
JPH11261216A (ja) * | 1998-03-09 | 1999-09-24 | Ibiden Co Ltd | プリント配線板及びその製造方法 |
JPH11266079A (ja) * | 1998-03-18 | 1999-09-28 | Hitachi Ltd | ビルドアップ多層配線基板及びその製造方法 |
JPH11266078A (ja) * | 1998-03-17 | 1999-09-28 | Ibiden Co Ltd | スルーホール充填用樹脂組成物および多層プリント配線板 |
Family Cites Families (60)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US557844A (en) * | 1896-04-07 | maloney | ||
US4496475A (en) | 1980-09-15 | 1985-01-29 | Potters Industries, Inc. | Conductive paste, electroconductive body and fabrication of same |
JPS6366993A (ja) * | 1986-09-08 | 1988-03-25 | 日本電気株式会社 | 多層配線基板 |
JP2570866B2 (ja) | 1989-08-29 | 1997-01-16 | 日本電気株式会社 | パタン正規化装置 |
JPH0651010Y2 (ja) | 1989-12-22 | 1994-12-21 | 富士通株式会社 | プリント配線板構造 |
US5004639A (en) * | 1990-01-23 | 1991-04-02 | Sheldahl, Inc. | Rigid flex printed circuit configuration |
US5118385A (en) * | 1991-05-28 | 1992-06-02 | Microelectronics And Computer Technology Corporation | Multilayer electrical interconnect fabrication with few process steps |
US5153986A (en) * | 1991-07-17 | 1992-10-13 | International Business Machines | Method for fabricating metal core layers for a multi-layer circuit board |
US5231751A (en) * | 1991-10-29 | 1993-08-03 | International Business Machines Corporation | Process for thin film interconnect |
US5450290A (en) * | 1993-02-01 | 1995-09-12 | International Business Machines Corporation | Printed circuit board with aligned connections and method of making same |
JPH07283538A (ja) | 1994-04-14 | 1995-10-27 | Ibiden Co Ltd | 多層プリント配線板の製造方法 |
JPH07283539A (ja) | 1994-04-14 | 1995-10-27 | Sony Corp | ビルドアップ多層プリント配線板 |
US5590460A (en) * | 1994-07-19 | 1997-01-07 | Tessera, Inc. | Method of making multilayer circuit |
US5557884A (en) * | 1994-07-27 | 1996-09-24 | Deppe; Gregory | Spraying and level control for aero-hydroponic system |
US5487218A (en) * | 1994-11-21 | 1996-01-30 | International Business Machines Corporation | Method for making printed circuit boards with selectivity filled plated through holes |
WO1996017503A1 (fr) | 1994-12-01 | 1996-06-06 | Ibiden Co., Ltd. | Carte a circuit imprime multicouche et son procede de production |
JP3101197B2 (ja) | 1994-12-01 | 2000-10-23 | イビデン株式会社 | 多層プリント配線板およびその製造方法 |
TW323432B (ja) | 1995-04-28 | 1997-12-21 | Victor Company Of Japan | |
US5890460A (en) * | 1995-05-08 | 1999-04-06 | Ball; Ronald C. | Electrical generator set |
US6195883B1 (en) | 1998-03-25 | 2001-03-06 | International Business Machines Corporation | Full additive process with filled plated through holes |
AUPN416395A0 (en) * | 1995-07-14 | 1995-08-03 | Matchplay Ltd | Ball hitting sports implement and/or sports balls |
JP3084352B2 (ja) * | 1995-08-28 | 2000-09-04 | 太陽インキ製造株式会社 | 銅箔ラミネート方式ビルドアップ用絶縁樹脂組成物とこれを用いた多層プリント配線板の製造方法 |
US5699613A (en) * | 1995-09-25 | 1997-12-23 | International Business Machines Corporation | Fine dimension stacked vias for a multiple layer circuit board structure |
US5906042A (en) * | 1995-10-04 | 1999-05-25 | Prolinx Labs Corporation | Method and structure to interconnect traces of two conductive layers in a printed circuit board |
CN1090891C (zh) | 1995-10-23 | 2002-09-11 | 揖斐电株式会社 | 多层印刷电路板的制造方法及其制成的多层印刷电路板 |
JP3172456B2 (ja) | 1995-10-23 | 2001-06-04 | イビデン株式会社 | プリント配線板 |
US6010768A (en) * | 1995-11-10 | 2000-01-04 | Ibiden Co., Ltd. | Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler |
JPH09148748A (ja) | 1995-11-20 | 1997-06-06 | Taiyo Ink Mfg Ltd | 多層プリント配線板及びその製造方法並びにそれに用いる樹脂絶縁層形成用組成物 |
JP3266778B2 (ja) | 1995-11-30 | 2002-03-18 | シャープ株式会社 | 多層フレキシブルリジットプリント配線板の製造方法 |
JPH09260849A (ja) | 1996-03-19 | 1997-10-03 | Matsushita Electric Works Ltd | 内層用回路板の製造方法、及び、多層プリント配線板の製造方法 |
JP3580638B2 (ja) | 1996-05-29 | 2004-10-27 | 京セラ株式会社 | 配線基板及びその製造方法 |
TW331698B (en) * | 1996-06-18 | 1998-05-11 | Hitachi Chemical Co Ltd | Multi-layered printed circuit board |
JP3050807B2 (ja) | 1996-06-19 | 2000-06-12 | イビデン株式会社 | 多層プリント配線板 |
JP3050812B2 (ja) | 1996-08-05 | 2000-06-12 | イビデン株式会社 | 多層プリント配線板 |
JPH10107449A (ja) | 1996-09-27 | 1998-04-24 | Ibiden Co Ltd | 多層プリント配線板の製造方法 |
US5891606A (en) * | 1996-10-07 | 1999-04-06 | Motorola, Inc. | Method for forming a high-density circuit structure with interlayer electrical connections method for forming |
US6103992A (en) * | 1996-11-08 | 2000-08-15 | W. L. Gore & Associates, Inc. | Multiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-vias |
US6217987B1 (en) | 1996-11-20 | 2001-04-17 | Ibiden Co. Ltd. | Solder resist composition and printed circuit boards |
JPH10200265A (ja) | 1997-01-06 | 1998-07-31 | Ibiden Co Ltd | 多層プリント配線板 |
JPH10261868A (ja) | 1997-03-19 | 1998-09-29 | Nec Toyama Ltd | 多層印刷配線板の製造方法 |
US5827804A (en) * | 1997-04-04 | 1998-10-27 | Harris; Phillip C. | Borate cross-linked well treating fluids and methods |
JPH10322024A (ja) | 1997-05-16 | 1998-12-04 | Hitachi Ltd | 非貫通ビアホールを有するビルドアップ多層プリント配線板及びその製造方法 |
JPH10334499A (ja) | 1997-05-29 | 1998-12-18 | Nec Gumma Ltd | 光学式ピックアップ装置 |
JPH1140949A (ja) | 1997-07-23 | 1999-02-12 | Hitachi Aic Inc | 多層配線板と面付部品の実装構造 |
JPH11186729A (ja) | 1997-10-14 | 1999-07-09 | Ibiden Co Ltd | 多層プリント配線板 |
USRE40947E1 (en) * | 1997-10-14 | 2009-10-27 | Ibiden Co., Ltd. | Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole |
JP3415430B2 (ja) | 1997-11-11 | 2003-06-09 | 日本特殊陶業株式会社 | プリント配線板用穴埋め材及びそれを用いたプリント配線板 |
JPH11177237A (ja) | 1997-12-16 | 1999-07-02 | Hitachi Chem Co Ltd | ビルドアップ多層プリント配線板とその製造方法 |
JPH11204944A (ja) | 1998-01-12 | 1999-07-30 | Hitachi Chem Co Ltd | 多層印刷配線板の製造方法 |
JPH11214846A (ja) | 1998-01-28 | 1999-08-06 | Ibiden Co Ltd | 多層プリント配線板 |
JP3421240B2 (ja) | 1998-03-26 | 2003-06-30 | イビデン株式会社 | 多層プリント配線板の製造方法 |
JP2000165046A (ja) | 1998-09-24 | 2000-06-16 | Ibiden Co Ltd | 多層ビルドアップ配線板 |
JP2000101245A (ja) * | 1998-09-24 | 2000-04-07 | Ngk Spark Plug Co Ltd | 積層樹脂配線基板及びその製造方法 |
JP2000244129A (ja) | 1998-12-25 | 2000-09-08 | Ngk Spark Plug Co Ltd | 配線基板、コア基板及びその製造方法 |
JP4442832B2 (ja) | 1999-04-13 | 2010-03-31 | イビデン株式会社 | 多層プリント配線板 |
US6373717B1 (en) * | 1999-07-02 | 2002-04-16 | International Business Machines Corporation | Electronic package with high density interconnect layer |
US6452117B2 (en) | 1999-08-26 | 2002-09-17 | International Business Machines Corporation | Method for filling high aspect ratio via holes in electronic substrates and the resulting holes |
CN1199536C (zh) | 1999-10-26 | 2005-04-27 | 伊比登株式会社 | 多层印刷配线板及多层印刷配线板的制造方法 |
US6729019B2 (en) * | 2001-07-11 | 2004-05-04 | Formfactor, Inc. | Method of manufacturing a probe card |
US6826830B2 (en) * | 2002-02-05 | 2004-12-07 | International Business Machines Corporation | Multi-layered interconnect structure using liquid crystalline polymer dielectric |
-
2000
- 2000-10-10 CN CNB008023913A patent/CN1199536C/zh not_active Expired - Lifetime
- 2000-10-10 DE DE60027141T patent/DE60027141T2/de not_active Expired - Lifetime
- 2000-10-10 KR KR1020017008133A patent/KR100833723B1/ko active IP Right Grant
- 2000-10-10 EP EP00964763A patent/EP1162867B1/en not_active Expired - Lifetime
- 2000-10-10 WO PCT/JP2000/007037 patent/WO2001031984A1/ja active IP Right Grant
- 2000-10-10 CN CNB2005100526249A patent/CN100521868C/zh not_active Expired - Lifetime
- 2000-10-10 EP EP06003111A patent/EP1672970B1/en not_active Expired - Lifetime
- 2000-10-20 US US09/830,963 patent/US6930258B1/en not_active Expired - Lifetime
- 2000-10-24 TW TW089122342A patent/TWI252723B/zh not_active IP Right Cessation
- 2000-10-25 MY MYPI20051618A patent/MY148600A/en unknown
- 2000-10-25 MY MYPI20005015A patent/MY129285A/en unknown
-
2005
- 2005-04-15 US US11/106,642 patent/US7178234B2/en not_active Expired - Lifetime
-
2006
- 2006-01-18 US US11/333,228 patent/US7795542B2/en not_active Expired - Fee Related
-
2008
- 2008-07-24 US US12/179,201 patent/US7999194B2/en not_active Expired - Fee Related
-
2009
- 2009-09-15 US US12/560,208 patent/US8106310B2/en not_active Expired - Fee Related
-
2011
- 2011-11-30 US US13/307,213 patent/US8822839B2/en not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06283847A (ja) * | 1993-03-29 | 1994-10-07 | Hitachi Chem Co Ltd | プリント配線板 |
JPH09246732A (ja) * | 1996-03-01 | 1997-09-19 | Ibiden Co Ltd | 多層プリント配線板およびその製造方法 |
JPH09331152A (ja) * | 1996-06-11 | 1997-12-22 | Tokuyama Corp | 回路基板の製造方法 |
JPH1187930A (ja) * | 1997-09-11 | 1999-03-30 | Hitachi Aic Inc | 多層印刷配線板の製造方法 |
JPH11261216A (ja) * | 1998-03-09 | 1999-09-24 | Ibiden Co Ltd | プリント配線板及びその製造方法 |
JPH11266078A (ja) * | 1998-03-17 | 1999-09-28 | Ibiden Co Ltd | スルーホール充填用樹脂組成物および多層プリント配線板 |
JPH11266079A (ja) * | 1998-03-18 | 1999-09-28 | Hitachi Ltd | ビルドアップ多層配線基板及びその製造方法 |
Non-Patent Citations (1)
Title |
---|
See also references of EP1162867A4 * |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1432293A1 (en) * | 2001-09-28 | 2004-06-23 | Ibiden Co., Ltd. | Printed wiring board and production method for printed wiring board |
EP1432293A4 (en) * | 2001-09-28 | 2005-12-07 | Ibiden Co Ltd | PCB AND MANUFACTURING PROCESS FOR THE PCB |
US7129158B2 (en) | 2001-09-28 | 2006-10-31 | Ibiden Co., Ltd. | Printed wiring board and production method for printed wiring board |
EP1915041A1 (en) * | 2001-09-28 | 2008-04-23 | Ibiden Co., Ltd. | Printed wiring board and printed wiring board manufacturing method |
EP1915040A3 (en) * | 2001-09-28 | 2008-04-30 | Ibiden Co., Ltd. | Printed wiring board and printed wiring board manufacturing method |
US7449781B2 (en) | 2001-09-28 | 2008-11-11 | Ibiden Co., Ltd. | Printed wiring board |
US8013256B2 (en) | 2001-09-28 | 2011-09-06 | Ibiden Co., Ltd. | Printed wiring board |
US8878078B2 (en) | 2001-09-28 | 2014-11-04 | Ibiden Co., Ltd. | Printed wiring board |
Also Published As
Publication number | Publication date |
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US7795542B2 (en) | 2010-09-14 |
US6930258B1 (en) | 2005-08-16 |
MY148600A (en) | 2013-05-15 |
US8822839B2 (en) | 2014-09-02 |
EP1672970A2 (en) | 2006-06-21 |
EP1162867A4 (en) | 2004-03-24 |
EP1672970A3 (en) | 2007-08-01 |
US20100006328A1 (en) | 2010-01-14 |
US8106310B2 (en) | 2012-01-31 |
CN1199536C (zh) | 2005-04-27 |
US7178234B2 (en) | 2007-02-20 |
EP1162867A1 (en) | 2001-12-12 |
DE60027141D1 (de) | 2006-05-18 |
TWI252723B (en) | 2006-04-01 |
KR20010089702A (ko) | 2001-10-08 |
US20060191708A1 (en) | 2006-08-31 |
CN1327710A (zh) | 2001-12-19 |
EP1672970B1 (en) | 2011-06-08 |
KR100833723B1 (ko) | 2008-05-29 |
US20080283282A1 (en) | 2008-11-20 |
US20050189136A1 (en) | 2005-09-01 |
MY129285A (en) | 2007-03-30 |
US7999194B2 (en) | 2011-08-16 |
CN100521868C (zh) | 2009-07-29 |
EP1162867B1 (en) | 2006-04-05 |
DE60027141T2 (de) | 2006-12-28 |
CN1652662A (zh) | 2005-08-10 |
US20120067633A1 (en) | 2012-03-22 |
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