TWI456020B - 黏著膠帶及使用其之太陽能電池模組 - Google Patents
黏著膠帶及使用其之太陽能電池模組 Download PDFInfo
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- TWI456020B TWI456020B TW100130429A TW100130429A TWI456020B TW I456020 B TWI456020 B TW I456020B TW 100130429 A TW100130429 A TW 100130429A TW 100130429 A TW100130429 A TW 100130429A TW I456020 B TWI456020 B TW I456020B
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- 239000002390 adhesive tape Substances 0.000 title 1
- 239000000853 adhesive Substances 0.000 claims 17
- 230000001070 adhesive effect Effects 0.000 claims 17
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims 13
- 239000002245 particle Substances 0.000 claims 7
- 229920005989 resin Polymers 0.000 claims 7
- 239000011347 resin Substances 0.000 claims 7
- 229920001187 thermosetting polymer Polymers 0.000 claims 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 4
- 239000003795 chemical substances by application Substances 0.000 claims 4
- 239000011888 foil Substances 0.000 claims 4
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims 4
- 229910052751 metal Inorganic materials 0.000 claims 4
- 239000002184 metal Substances 0.000 claims 4
- 150000001875 compounds Chemical class 0.000 claims 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims 3
- 239000000463 material Substances 0.000 claims 3
- 229920005992 thermoplastic resin Polymers 0.000 claims 3
- 229910019142 PO4 Inorganic materials 0.000 claims 2
- 238000001723 curing Methods 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- 229920006287 phenoxy resin Polymers 0.000 claims 2
- 239000013034 phenoxy resin Substances 0.000 claims 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims 2
- 239000010452 phosphate Substances 0.000 claims 2
- 229920000768 polyamine Polymers 0.000 claims 2
- 229920000728 polyester Polymers 0.000 claims 2
- 239000007870 radical polymerization initiator Substances 0.000 claims 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical group C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims 1
- 150000000703 Cerium Chemical class 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 claims 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims 1
- 239000002202 Polyethylene glycol Substances 0.000 claims 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 150000001412 amines Chemical class 0.000 claims 1
- -1 azo compound Chemical class 0.000 claims 1
- 230000001588 bifunctional effect Effects 0.000 claims 1
- 229910052796 boron Inorganic materials 0.000 claims 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims 1
- 150000002009 diols Chemical class 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 238000013007 heat curing Methods 0.000 claims 1
- 229910052746 lanthanum Inorganic materials 0.000 claims 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 claims 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 claims 1
- 150000002978 peroxides Chemical group 0.000 claims 1
- 239000004033 plastic Substances 0.000 claims 1
- 229920003023 plastic Polymers 0.000 claims 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims 1
- 229920001281 polyalkylene Polymers 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 229920000570 polyether Polymers 0.000 claims 1
- 229920001223 polyethylene glycol Polymers 0.000 claims 1
- 229920000193 polymethacrylate Polymers 0.000 claims 1
- 229920002635 polyurethane Polymers 0.000 claims 1
- 239000004814 polyurethane Substances 0.000 claims 1
- 150000003839 salts Chemical class 0.000 claims 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0512—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module made of a particular material or composition of materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2804—Next to metal
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Organic Chemistry (AREA)
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- Life Sciences & Earth Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Sustainable Energy (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Photovoltaic Devices (AREA)
- Adhesive Tapes (AREA)
- Non-Insulated Conductors (AREA)
- Conductive Materials (AREA)
Claims (9)
- 一種黏著劑,其係電性連接太陽能電池單元與金屬箔用的黏著劑,其特徵係含有絕緣性黏著劑組成物,前述絕緣性黏著劑組成物含有薄膜形成材、熱硬化性樹脂及熱硬化性樹脂用硬化劑,前述熱硬化性樹脂為環氧樹脂,前述熱硬化性樹脂之含有量,相對於前述絕緣性黏著劑組成物之全量,為10~80質量%,前述熱硬化性樹脂用硬化劑之含有量,相對於前述絕緣性黏著劑組成物之全量,為2~10質量%,前述薄膜形成材為重量平均分子量為10000~10000000之苯氧樹脂,前述薄膜形成材之含有量,相對於前述絕緣性黏著劑組成物之全量,為2~80質量%。
- 如申請專利範圍第1項之黏著劑,其中前述熱硬化性樹脂用硬化劑為咪唑系硬化劑、醯肼系硬化劑、三氟化硼-胺錯合物、鋶鹽、胺醯亞胺、聚胺之鹽或二氰二胺。
- 一種黏著劑,其係電性連接太陽能電池單元與金屬箔用的黏著劑,其特徵係含有絕緣性黏著劑組成物,前述絕緣性黏著劑組成物為含有熱可塑性樹脂、自由基聚合性化合物及自由基聚合起始劑所成,前述熱可塑性樹脂為聚醯胺類、苯氧樹脂類、聚(甲基)丙烯酸酯類、聚醯亞胺類、聚胺基甲酸酯類、聚酯類或聚乙烯醇縮丁醛類, 前述熱可塑性樹脂的重量平均分子量為5000~150000,前述自由基聚合性化合物具有(甲基)丙烯醯基,前述自由基聚合起始劑為過氧化物或偶氮化合物。
- 如申請專利範圍第3項之黏著劑,其中前述自由基聚合性化合物是選自環氧(甲基)丙烯酸酯寡聚物、胺基甲酸酯(甲基)丙烯酸酯寡聚物、聚醚(甲基)丙烯酸酯寡聚物、聚酯(甲基)丙烯酸酯寡聚物、三羥甲基丙烷三(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、聚烷撐二醇二(甲基)丙烯酸酯、二環戊烯基(甲基)丙烯酸酯、二環戊烯氧基乙基(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、二新戊四醇六(甲基)丙烯酸酯、異三聚氰酸改質2官能(甲基)丙烯酸酯、異三聚氰酸改質3官能(甲基)丙烯酸酯、2,2’-二(甲基)丙烯醯氧基二乙基磷酸酯、以及2-(甲基)丙烯醯氧基乙基酸式磷酸酯之族群中的一種或兩種以上。
- 如申請專利範圍第1~4項中任一項之黏著劑,其中前述黏著劑更包括導電性粒子。
- 如申請專利範圍第5項之黏著劑,其中前述導電性粒子之平均粒徑為2~20μm。
- 如申請專利範圍第5項之黏著劑,其中前述導電性粒子為帶刺之栗子狀(bur)或球狀。
- 如申請專利範圍第5項之黏著劑,其中前述導電性粒子為鍍金的鎳粒子或鍍金/鎳的塑料粒子。
- 一種太陽能電池模組的製造方法,所述太陽能電池模組具有藉由金屬箔電性連接的複數個太陽能電池單元,所述方法包括:使用如申請專利範圍第1~8項中任一項所述之黏著劑對該太陽能電池單元以及該金屬箔進行電性連接之製程。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2006121930 | 2006-04-26 |
Publications (2)
Publication Number | Publication Date |
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TW201213491A TW201213491A (en) | 2012-04-01 |
TWI456020B true TWI456020B (zh) | 2014-10-11 |
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Application Number | Title | Priority Date | Filing Date |
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TW100130428A TWI456019B (zh) | 2006-04-26 | 2007-04-26 | 黏著膠帶及使用其之太陽能電池模組 |
TW103129873A TW201446934A (zh) | 2006-04-26 | 2007-04-26 | 黏著膠帶及使用其之太陽能電池模組 |
TW100130429A TWI456020B (zh) | 2006-04-26 | 2007-04-26 | 黏著膠帶及使用其之太陽能電池模組 |
TW096114828A TWI408201B (zh) | 2006-04-26 | 2007-04-26 | Adhesive tape and the use of its solar module |
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TW100130428A TWI456019B (zh) | 2006-04-26 | 2007-04-26 | 黏著膠帶及使用其之太陽能電池模組 |
TW103129873A TW201446934A (zh) | 2006-04-26 | 2007-04-26 | 黏著膠帶及使用其之太陽能電池模組 |
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TW096114828A TWI408201B (zh) | 2006-04-26 | 2007-04-26 | Adhesive tape and the use of its solar module |
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US (4) | US20090235972A1 (zh) |
EP (4) | EP2012364B1 (zh) |
JP (5) | JPWO2007125903A1 (zh) |
KR (5) | KR20110011755A (zh) |
CN (9) | CN102176481B (zh) |
CA (1) | CA2650545A1 (zh) |
TW (4) | TWI456019B (zh) |
WO (1) | WO2007125903A1 (zh) |
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US20070116961A1 (en) * | 2005-11-23 | 2007-05-24 | 3M Innovative Properties Company | Anisotropic conductive adhesive compositions |
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2007
- 2007-04-24 KR KR1020117001580A patent/KR20110011755A/ko not_active Application Discontinuation
- 2007-04-24 EP EP07742253A patent/EP2012364B1/en not_active Expired - Fee Related
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- 2007-04-24 CA CA002650545A patent/CA2650545A1/en not_active Abandoned
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- 2007-04-24 EP EP10175040A patent/EP2251910B1/en not_active Not-in-force
- 2007-04-24 KR KR1020127015376A patent/KR101369626B1/ko active IP Right Grant
- 2007-04-24 JP JP2007528906A patent/JPWO2007125903A1/ja active Pending
- 2007-04-24 WO PCT/JP2007/058818 patent/WO2007125903A1/ja active Application Filing
- 2007-04-24 CN CN201310201994.9A patent/CN103360977B/zh not_active Expired - Fee Related
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- 2007-04-24 CN CN201210484390.5A patent/CN102942883B/zh not_active Expired - Fee Related
- 2007-04-24 CN CN201110077263.9A patent/CN102174300B/zh not_active Expired - Fee Related
- 2007-04-24 KR KR1020117001579A patent/KR101171646B1/ko active IP Right Grant
- 2007-04-24 KR KR1020127015377A patent/KR101296464B1/ko active IP Right Grant
- 2007-04-24 KR KR1020087028785A patent/KR101240145B1/ko active IP Right Grant
- 2007-04-24 CN CN201310566433.9A patent/CN103740287A/zh active Pending
- 2007-04-24 EP EP11189751A patent/EP2421054A1/en not_active Withdrawn
- 2007-04-24 CN CN2011100773561A patent/CN102176482B/zh not_active Expired - Fee Related
- 2007-04-26 TW TW100130428A patent/TWI456019B/zh active
- 2007-04-26 TW TW103129873A patent/TW201446934A/zh unknown
- 2007-04-26 TW TW100130429A patent/TWI456020B/zh active
- 2007-04-26 TW TW096114828A patent/TWI408201B/zh active
- 2007-04-27 US US12/298,633 patent/US20090235972A1/en not_active Abandoned
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2010
- 2010-12-20 JP JP2010283616A patent/JP2011066448A/ja active Pending
- 2010-12-20 JP JP2010283617A patent/JP2011061241A/ja active Pending
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2011
- 2011-08-31 US US13/222,236 patent/US8969706B2/en not_active Expired - Fee Related
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2012
- 2012-04-16 JP JP2012093013A patent/JP5819241B2/ja active Active
- 2012-11-02 US US13/667,869 patent/US20130056152A1/en not_active Abandoned
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