JPS6489209A - Anisotropically conductive adhesive sheet - Google Patents
Anisotropically conductive adhesive sheetInfo
- Publication number
- JPS6489209A JPS6489209A JP24862287A JP24862287A JPS6489209A JP S6489209 A JPS6489209 A JP S6489209A JP 24862287 A JP24862287 A JP 24862287A JP 24862287 A JP24862287 A JP 24862287A JP S6489209 A JPS6489209 A JP S6489209A
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- plated layer
- adhesive sheet
- microspheres
- microsphere
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Non-Insulated Conductors (AREA)
- Adhesive Tapes (AREA)
Abstract
PURPOSE:To make it possible to hold anisotropic conductivity for a long time by using microspheres, wherein the first conductive nickel-plated layer and the second conductive gold-plated layer are formed on each microsphere made of resin, as a conductive agent. CONSTITUTION:Double-plated microspheres wherein the first conductive plated layer made of nickel is formed on the surface of each microsphere made of resin and on its surface the second conductive plated layer made of gold is formed, are dispersed in an insulating adhesive sheet. Thickness of the first conductive plated layer is generally made about 0.02-2mum, because when it is too thick, a surface state gets worse and when it is too thin, coming-off from the microsphere is likely to be caused, while the second conductive plated layer is made about 0.01-1mum thick from view of its price and cracks. These double-plated microspheres are and added dispersed generally by 5-40wt.% to 100wt.% of an insulating adhesive sheet. When it is less than this, anisotropic conductivity is hard to take place, and when it is more than this, adhesive strength is lowered. Thereby, the anisotropic conductive adhesive sheet excellent in durability such as thermal resistance and damp-proofness can be obtained.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24862287A JPS6489209A (en) | 1987-09-30 | 1987-09-30 | Anisotropically conductive adhesive sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24862287A JPS6489209A (en) | 1987-09-30 | 1987-09-30 | Anisotropically conductive adhesive sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6489209A true JPS6489209A (en) | 1989-04-03 |
Family
ID=17180853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24862287A Pending JPS6489209A (en) | 1987-09-30 | 1987-09-30 | Anisotropically conductive adhesive sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6489209A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6414078B1 (en) * | 1999-10-06 | 2002-07-02 | Shin-Etsu Chemical Co., Ltd. | Conductive silicone rubber composition |
| US6469090B2 (en) * | 2000-01-17 | 2002-10-22 | Shin-Etsu Chemical Co., Ltd. | Electrically conductive liquid silicone rubber composition |
| US6562448B1 (en) | 2000-04-06 | 2003-05-13 | 3M Innovative Properties Company | Low density dielectric having low microwave loss |
| JP2011061241A (en) * | 2006-04-26 | 2011-03-24 | Hitachi Chem Co Ltd | Adhesive |
-
1987
- 1987-09-30 JP JP24862287A patent/JPS6489209A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6414078B1 (en) * | 1999-10-06 | 2002-07-02 | Shin-Etsu Chemical Co., Ltd. | Conductive silicone rubber composition |
| US6469090B2 (en) * | 2000-01-17 | 2002-10-22 | Shin-Etsu Chemical Co., Ltd. | Electrically conductive liquid silicone rubber composition |
| US6562448B1 (en) | 2000-04-06 | 2003-05-13 | 3M Innovative Properties Company | Low density dielectric having low microwave loss |
| JP2011061241A (en) * | 2006-04-26 | 2011-03-24 | Hitachi Chem Co Ltd | Adhesive |
| JP2011066448A (en) * | 2006-04-26 | 2011-03-31 | Hitachi Chem Co Ltd | Bonding tape and solar cell module using the same |
| JP2012216843A (en) * | 2006-04-26 | 2012-11-08 | Hitachi Chem Co Ltd | Adhesive tape and solar cell module using the same |
| US8969706B2 (en) | 2006-04-26 | 2015-03-03 | Hitachi Chemical Company, Ltd. | Adhesive tape and solar cell module using the same |
| US8969707B2 (en) | 2006-04-26 | 2015-03-03 | Hitachi Chemical Company, Ltd. | Adhesive tape and solar cell module using the same |
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