JPS63502786A - electrical circuit board interconnector - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] electrical circuit board interconnector Technical field This invention provides a device for interconnecting contacts of circuit board surfaces facing each other. About the chair.

Background technology Electrical interconnections between circuits facing each other were made in the past, e.g. by pin-socket engagement as shown in National Patent No. 4,249,787. has been given. Lamp U.S. Pat. No. 4,003,621, Luttmer U.S. Pat. No. 3,795,037; U.S. Pat. No. 4,295,700 to Rad; Cherian et al. U.S. Pat. No. 4,161,346 and U.S. Pat. No. 4.199,2 No. 09 and U.S. Pat. No. 4,209,841 to Casiro et al. mutually by elastic conductors arranged in a matrix containing foam or elastomer. It is also known to get connections. Others include U.S. Pat. No. 4,449,7 to Takashi et al. No. 74, U.S. Pat. No. 4,008,300 to Bonn and Soviet Union to Copterin. Conductive particles, fibers or drawn elements as shown in Patent No. 544,028 We are proposing a conductor made of elastic material filled with Bonnefoy U.S. Patent No. 4, No. 445,735, within the housing, the length of the housing a conductor seat supported on elastically deformable rolls extending in the direction It has also been proposed to use a connecting device consisting of two lines.

The object of the present invention is to provide the following characteristics: total resistance between interconnected pairs of contact pads; reduction in contact stress consistency during repeated connector compression/decompression cycles, design simplicity of the process, predictability of the effects of temperature and time on performance, and A connector device having an improvement in one or more of the following: Including offering.

Disclosure of invention The present invention provides a plurality of second contacts having a large first contact area on a first printed circuit board surface. An area array connector device for providing electrical interconnections to pads. child connector devices are located between these mutually facing circuit board surfaces. a non-conductive support member comprising a first A similar compound located in an area of the support member that generally corresponds to the alignment of the second contact pad. A support member formed through a molded aperture and a support. A conductive metal interconnect member extending through the elastomeric material in the region of the member. Contains.

According to the invention, the connector device is characterized in that the metal interconnection members are made of elastomeric material. extending through and directly with the first and second mutually facing pairs of contact pads; having exposed first and second end surfaces for making metal-to-metal conductive contact; The interconnection member has a first contact pad to a second contact pad on the order of less than about 25 milliohms. each dimensioned and configured to provide a total resistance to the It is a sign. These interconnect members have their exposed end surfaces exposed to contact pressure. and at least partially due to the recovery effect of the elastomeric material. is configured to recover upon release of the contact pressure in the direction of the first position; However, areal array connector devices are compatible with each other in various swiss. The circuit board is configured to provide continuous electrical interconnection between facing circuit board surfaces.

In a preferred embodiment, the support member includes a resilient elastomeric material. and a support surface facing the surface of the second circuit board, respectively; is compressed by energizing them together. Each metal interconnect The material extends through the thickness of the resilient support member and is applied in the direction of the thickness of the support member. their initial engagement with the first and second contact nodes ξ, which are arranged at an initial acute angle to At the point where each pad of the circuit board protrudes through the pair of pad-engaging surfaces. a pair of pad-engaging surfaces arranged to engage the respective contact pads; generally rotatable electrically conductive interconnect elements. The connector is further , the support member is in a compressed, reduced thickness condition, and the interconnection member is generally rotated. This includes means for holding the circuit boards together in a clamped relationship when Otherwise, a line protruding through the engagement surface should be The body of the support member is placed at an acute angle to the direction of the locally deforming and returning the interconnecting element to its original position, i.e., engagement with the pad. elastically biased toward the matching state. The circuit board also corresponds to the configuration of the circuits on the circuit board. supports a number of aligned contact pads in a predetermined e-turn, and A member contains a corresponding number of mutual elements, and these elements each rotates and compresses as a whole in response to the circuit boards being squeezed together. The support member is locally deformed and the support member is applied to each contact pad. is elastically biased. The support member has a plurality of patterns corresponding to the pattern of the knots. Preferably, it is in the form of a sheet into which a number of interconnecting elements are inserted.

The support member has air acting locally to permit global rotation of the interconnecting element. Including the distribution of holes, the support member has a diameter of about 25 to 95 inches, preferably 60 to 7 inches. A layer of cells having a total pore size in the range of 5 cm is preferred. Elasto Materials include silicone, urethane, natural rubber, butadiene-styrene, butadiene-a Acrylonitrile, butadiene-imbutylene copolymer, chlorophrene polymer, Polysulfide polymers, plasticized vinyl chloride and acetate polymers and copolymers chosen by the body. The support member is approximately 2 per square inch at 25 percent compression. Or 5 oyt? Compressive force deflection in the range of Compression permanent deflection after 22 hours under 158-cent compression is approximately 10% have less than The interconnection element extends generally through the thickness of the support member. each of the bodies in the direction in which it rests on the extending body and its respective contact pad. The interconnection element is generally It is preferably S-shaped, and the line of protrusion at the end is the thickness of the support member. are placed in a common plane perpendicular to the direction of .

The support members are further arranged generally parallel to the mutually facing plate surfaces. It includes a sheet-like layer consisting entirely of non-intumescent material.

In yet another preferred embodiment, the interconnect elements are encapsulated in an elastomeric material. This filament contains at least two conductive metal filaments that are the first and second exposed end faces extend in generally parallel relationship between the first and second exposed end faces; . The surface of the support member defining the aperture is It is preferable that the surface has a different configuration from that of the other surfaces, so that mutual Providing a localized area of pressure between the connecting element and the support, the Anomo chair It is more preferred to have an irregular diameter. Metal encapsulated in elastomer material The filaments are in electrically conductive contact. The support member is made of an elastomeric material, e.g. Consisting of air bubbles, the interconnecting members are angularly shaped by the application of contact pressure. oriented in such a way that it causes a certain amount of deflection. Interconnection members include copper The exposed end face is gold plated. Aperture is preferably Formed by removing material by punching or punching.

According to another aspect of the invention, a second contact pad opposite the first contact pad on the surface of the first circuit board is provided. electrical interconnection between the corresponding second contact on the facing side of the circuit board) ξrad The connector device for providing the Holds rotatable conductive interconnect elements and circuit boards in a clamped relationship together. Contains the means to maintain The support member is arranged on the surfaces of the first and second circuit boards. and having supporting surfaces facing each other and disposed between the circuit boards. The housing is configured to be compressed by urging the housing and the circuit board together.

The interconnection element extends through the thickness of the resilient support member and is connected to the support member. that with the first and second contact pads being placed at an initial acute angle to the thickness direction of the a line protruding through the pair of pad-engaging surfaces at the time of initial engagement of the pads. a pair of pad engagements arranged to engage respective contact pads of the road plate; It has a surface. The circuit board is placed in a compressed and reduced thickness state with supporting members The interconnecting members are held together in a generally rotated, clamped relationship; However, the line protruding through the engagement surface is the initial angle) due to the thickness of the support member. at an acute angle to the direction of the support member, the body of the support member is locally and return the interconnecting element to its original position or engagement with the pad. It biases elastically.

The interconnection device of the invention thus has a very high density and small diameter. enables accurate and precise interconnection of circuit boards with a large number of contact parameters. All properties of planar and non-planar surfaces can be measured using this device. , for example, but not limited to, ceramic versus printed circuit boards, printed circuit boards, etc. It is possible to provide interconnections between circuit boards to printed circuit boards or ceramic to ceramics. can.

The interconnect elements of the present invention also provide low compression resistance and connection system Low total resistance, e.g., less than about 25 milliohms and as low as 5 to 10 milliohms. resistance is achieved. This device thus combines a filled elastomer and a conventional mutual Gives very low contact resistance compared to connected devices.

Other features and advantages of the invention will emerge from the following description of preferred embodiments of the invention. This can be understood from the scope of the request.

BEST MODE FOR CARRYING OUT THE INVENTION Referring to FIG. 1, electrical circuit 10 includes first and second electrical circuit boards 14.16. It consists of a connector device 2 placed between the two. Fix the circuit on the matching post 20 A clamping frame 18 is provided for assembly.

The areal array connector device 12 is approximately 25% to 95%, preferably or approximately 60 to 75 centimeters of air c vs. Te, about 6s 1bs, #t, 3 (1,04gm/cm3) real density approximately 2 to 501 bs/ft3 (Q, 0.32 to 0.8 gm ), preferably about 15 to 251 bs/ft (0.24 to 2.40 gm/c comprising an elastic non-conductive elastomeric material in the form of open cells with a density in the range of rrL3) , uncompressed thickness A1, e.g., approximately Q, O25 infC0,64 in) to 0.500 in (12.7 inches), preferably about 0.125 inches (3.18M). It consists of a sheet-type support member 13 with an expanded surface.

The support member has a diameter of 2 to 501 bs per inch at 25 percent compression (0, It has a characteristic compressive force deflection ((, FD)) in the range of 14 to 3,45 atm) and The compression set tested according to ASTM Test Standard D 3574 is 50 inches. Has a half-hour recovery of less than 10% after standing at 158”F (70°C) for 22 hours. The foam material of the holding member 13 is preferably made of urethane, silicone or natural rubber. The specific materials used are less demanding than the physical properties listed above and may be compatible with other suitable materials. , for example, butadiene-styrene, butadiene-acrylonitrile, butadiene - Isobutene copolymer, chloroprene polymer, HoIJ sulfide copolymer , plasticized vinyl chloride and vinyl acetate polymers and copolymers can also be used. Ru. When the elastomeric foam material is urethane, the average pore size is approximately 125 microns. It's on the stand.

The areal array connector 12 is also disposed on the support member 13 and is connected to the connector array. Consisting of a number of interconnecting elements 22 selectively placed in a plane, the An element body 24 extends through the support member and has a contact pad engagement surface 26.2. 8 are exposed adjacent the connector array surface 30,32. Relative engagement surface The location is relative to the location of the contact pads on the opposite circuit board side when assembled. determined accordingly. Referring to FIG. 1a, in the preferred embodiment The generally S-shaped interconnect element 22 is made of a conductive material, such as copper or other of metal or metal-coated resin (correctly, the volume of metal is equal to the desired level of conductance) Usually less than 1 ohm for high voltage applications and 25 million ohms for low voltage applications. Consisting of a body 24 and a tab 27.29 (sufficient for less than Ru. When placed on the assembled and uncompressed support member, the body -24, preferably with respect to the direction of the thickness of the support member (normal between surfaces 30.32) angle B is about 0 to 70°, preferably about 20° to 40' , optimally about 300. at the time of their initial engagement with the contact pads. The angle M between the line protruding through the retaining surface and the thickness direction is It is a little larger if it is said to be generally parallel to the placed contact surface. Element The point 22 is selected so that the contact point ξ is in the range of 10 to 90 degrees. width W, in the range of about 10 to 100 degrees of the interconnect element width, preferably about 0.250 inch (6,351 m) to 0.003 to 0.005 inch (0, Between 076 and 0.127 ran), if o, o o i inch (0, 025 mm) and the surface 30.3 in the uncompressed state. a length selected to extend generally at an angle B through the support member between 20 It has L. In the preferred embodiment shown, W is approximately 0.040 inches ( 1,02 inches), T is approximately 0.010 inch (0,25 wren), and L is approximately 0 ．． For example, the radius R1 is approximately 0.012 inches ( 0,305wn). Contact exposed above tab The pad-engaging surface 26.28 has an area of CXW, e.g., approximately 0.030 inches (0. 76 mm) Xo, has an area of 040 inches (1.02 wm).

Disposed above and below the areal array connector device 12 are connectors, respectively. A circuit board 14.16 having a board surface 15.17 facing the array surface 30.32. It is. Above these plate surfaces, approximately 0.001 inches (0.001 in. ,025mm) and above the center of o,ioo inches (2,54m+n) A contact pad 34.36 with a diameter of 0050 inches (1,27 mm) is placed on the has been done.

When assembled (FIG. 3), each contact pad 34 of plate 14 connects to an interconnection element. 220 is placed in conductive contact with the facing contact pad engagement surface 26, and the element The pad 22 extends through the support member 13 and thereby faces the contact pad engagement surface 28. conductive contact with contact pads 36 of circuit board 16. element 22 The pairs of contact pads connected by As shown in the figure and as discussed in more detail later, the compressive forces face the plates. is configured to move generally within the support member when applied to the support member. .

Referring to FIG. 5, the circuit IO is shown assembled and Area array connector 12 is shown disposed between circuit boards 14.160. There is. Interconnecting element 22 extends through support member 13 and has tab 27 ．． The contact pad engaging surface 26.28 of 29 is in contact with the contact pad 34.36. It is located in The centers of contact pads facing each other that are electrically interconnected are , distance D, for example, offset from each other by about 0.120 inches (3.05 rJ). The underside of the tabs 27 and 29 rests on the respective planes 30 and 32 of the support member 13. placed throughout.

Referring to Figure 5a, the compressive forces represented by arrows P When applied to plates, the gap between the plate surfaces 15.17 ranges from about 100% of W to about 6 The uncompacted thickness of the support member work 3 is reduced to a distance G equal to 0 g, e.g. In the example case, G is approximately 0.100 inches (2.54 m). interconnection element structure of the element 22, its relationship to the material of the support member matrix surrounding the element; , and the interconnect elements at the time of their initial engagement with the contact pad surface. The combination of angles of the lines protruding through the contact pad engagement surfaces of the For example, the connection element may be formed at a large acute angle about the axis X above the support member centerline. The rotation of M' moves the whole inside the support member, and the mutual elements are It never bends. Due to the continuous nature of the bubbles in the support member 13, the support member , can elastically yield to the movement of the elastomeric material into the pores, and yet The position of adjacent interconnection elements of the enclosure is not particularly adversely affected.

When the interconnect element rotates, the contact pad engagement surface also rotates as indicated by arrow S. contact surfaces to obtain improved conductive contact along opposite sides of the contact pads over a distance E while performing a wiping action to remove oxides, dust particles, etc. Moving.

(If angle B is about 30°, length E is typically about 0.016 inches (0.41 m) As mentioned above, the interconnecting elements can be rotated without any bending or reverse deformation. Ru. As a result, when the pressure P is removed, the conductor The resiliency of returning the element to substantially its original position is due entirely to the resiliency of the support member. given.

In another embodiment, the connector devices shown in FIGS. 6 and 6a are arranged facing each other. tabs 26', 28 extending outwardly in opposite directions parallel to the plane of the plate; ′, the body 2 is placed generally perpendicular to the mutually facing plate surfaces; 4', a single isolated interconnect element 22'. interconnection element The line F connecting the points on the engagement surface of the member extends in the direction of the thickness of the support member. is placed at an initial acute angle M with respect to Plates 14.16 facing each other shown in FIG. 6a When a compressive force P is applied to the connector element 22', the aperture 4 1 in the area adjacent to Shitano and under the tab. The support member 13 is compressed to a reduced thickness and the mutual contact at the surface of the contact pad is The rotational movement of the connecting element creates a length E, e.g. , 64 mm), the final gap thickness G is Compression of the support member to a reduced thickness approximately equal to the compressed thickness of the connector element It is constructed so that the overall area is close to . ) interconnection elements in support members; The position of the ment is predetermined and the aperture is e.g. is formed in the correct position. These elements are also in place The supporting member may be cast to provide an aperture at the desired location. It is cast in such a way that it appears. In order to closely match the rectangular shape of the element, With the holding member in tension, an aperture is formed, for example by drilling, and then By loosening the support member, an oval or uniform select aperture can be installed. can be set.

Other embodiments are within the scope of the following claims. For example, is the support member open-celled? or have other structures that provide the desired porosity or as shown in FIGS. 6 and 6a. As shown, the support member includes a full support member disposed along a centerline between the surfaces of the support member. Physically non-intumescent materials, such as mylar or fiberglass in the illustrated embodiments A sheet-type layer 40 of woven mat is included in the sheet-shaped layer 40 to which a compressive force is applied. further minimizes the expansion of the support member material in the plane of the material, thereby allowing the displacement of the interconnection elements from the desired position. this mylar A film can also be placed on the support member surface 30.32, this film The elastic modulus of the material allows higher can apply high compression forces and adjust the coefficient of thermal expansion of the connector device. You can also do that.

The interconnection element may also be a sheet-type member (122 in FIGS. 7 and 7a) or or round or rectangular pins without tabs (222 in Figure 8, 322 in Figure 9). in which case the body of the interconnecting element is contact pad engaging surfaces are located at each end.

Referring to Figure 7a, when a compressive force P is applied to circuit boards facing each other, , interconnecting elm) 122 is generally rotated to a larger acute angle, and the engagement surface is Wipe the contact pad surface for improved conductivity. Also in Figures 8 and 9. As shown, the interconnection element includes a support member engagement ring (FIG. 8). 42) or a protrusion (44 in Fig. 9), which allows the support member to The pin arrangement within the support member can be maintained and these elements Can be dosed by insertion.

In another embodiment, as shown in FIGS. 1O, 10a, and job The connecting element can be bent three-dimensionally, which allows for the protrusion of the The lines can be placed in different planes perpendicular to the direction of the thickness of the supporting member, which The support members are generally can be twisted when rotated, thus making the contact facing each other Diagonal or rotational wiping of the engagement surface on the pad surface can be performed. 10th The figure shows a side view of one possible three-dimensional interconnection element; Figures 81oa and 1ob show alternative back views of such interconnect element configurations. The figure shows.

Another implementation for the controlled impedance connection shown in FIGS. 11 and 11a In examples, the support member may also be made of a non-conductive elastomer, which is also typically a cell, e.g. It may include a conductive layer 52 of air bubbles disposed between two layers of material 54,56. This forms a ground plane. The body 58 of the interconnection element is first It is coated with a layer of dielectric material and then with a metal outer layer 64. protruding tab ( 66) of FIG. 11a, the conductive foam layer 52 and the metal outer layer of the interconnection element. Ensure connection with.

In yet another embodiment of the invention, interconnect device 10' (FIG. 12) has a thickness of For example, about 0.015 to O.S inch (0.38 to 12.7 mm), Preferably from about 0.035-0.040 to 0.133 inches (0.9-1.0 to 1.0 inches) to 3.5 t+tyn), the compressed volume range in 25 inch compression is approximately 11'b /in,” to 601bs /in,” (0.07 to 4.1 atm) range, preferably about 6 to 451 bs/in, (0.4 to 3.1 bs/in) atm), with a density of approximately 2 to 501 bs/ft3 (0.03 to 0.8 6 m 7 cm”), preferably about 15 to 301 bs/ft3 (0,24 to 0.48 gm/cm3) Non-conductive support member 2 made of cellular elastomer matrix It consists of 4′. An aperture 26' is defined within member 24'. The apertures 26' are connected to corresponding contacts on printed circuit board surfaces facing each other. Preferably the connectors are placed in the exact locations desired to provide electrical interconnections between the pads. An interconnecting element 28' is disposed within the punitor positioning 26' and Element 28' is made of a solid elastomeric material, for example approximately 30 durometer silicone. The interconnection element consists of colum 30' made of soft rubber or foam of similar softness. A metal interconnection element 28' is provided through which the metal interconnection is made. Member 32', e.g. a conductive highly plexiple thin wire element 34', e.g., of copper, typically each about 0.00f to 0.002 inch ( 0.025 to 0.050 tra) in diameter (only a few are shown). wires run through it, the majority of these wires extending from the end face 36' of the element. End face 38' extends over the entire length of the hecorom. (These wires are e.g. , by removing the elastomeric material by friction or mechanical stripping. This wire protrusion allows the pad to protrude from the end of the element. can increase electrical contact with When pressed against the pad, the wire This is because it bends. ) the exposed end of the interconnect element containing this wire , and the exposed ends of the above-mentioned more rigid interconnection elements are Unless made of non-corrosive material, plated with gold or other corrosion-resistant material. It is normal to

This elastic material, which extends between the individual filaments of the wire, A substantially interpersonal support column of elastic material is formed around the ment; Otherwise, separate it from adjacent filaments to the extent possible. but However, in the case of multi-filament elements, wire thread D6 or braiding is performed. For example, this allows you to connect the This allows the elements to be of smaller dimensions. Ma Additionally, when twisted wire is used, the wire filament is usually electrically conductive. One or more of the filaments at one end of the element are in contact with each other. The conductance with the pad at the other end of the element is Just make sure. In both of the above examples, these filaments are are parallel to each other.

The diameter of the colom is such that at the bottom end there is no viable conductor to obtain adequate conductivity. limited by the amount of The maximum diameter is the conductance when pressure is applied. contact, with an interference space between the coloms to allow for expansion, and the required spacing between the e-rads. Therefore, it is limited. 0.005 inch to 0.200 inch (0.13 to 5. A diameter of 1 mm) is preferred. The diameter of the aperture is close to the diameter of the colum. must be small, for example, approximately +0.010 to 10.030 inches ( +0.25 to -0,75), preferably ÷0.007 to -0,01 The range is 9 inches (+0.18 to -0.48 mm). The height of Korom is The thickness of the support member, e.g., from about 0.015 inches (in 0.38 order), preferably It can vary up to about 0.005 inches (0.13 questions), and this The end face of the component may extend beyond the plane of the surface of the support member, and In other words, the relative pressure of the IJ gas (bubble mass of the support member when compared with the compressibility of Colom) In configurations where additional pressure is required to achieve adequate electrical contact due to compressibility, this It can be flush with or below these surfaces as desired. Wear.

Also, if desired, formed apertures for receiving interconnect elements are provided. The non-conductive support member defining Glass reinforcement commercially available from Rogers Corporation, Rogers, CT. It can be made substantially hard by phenol or the like.

These apertures apply pressure to interconnecting elements to tighten the assembly. In order to hold it straight and in the center of the aperture, and increase its elasticity, each aperture is It is formed with a protrusion extending radially and inwardly from the defining surface. this side may extend radially and inwardly at some points of the circumferential gyre. Preferably, the aperture has a diameter less than the diameter of the interconnecting element. For example, an aperture is preferably Preferably it tapers axially with an inward taper to a smaller diameter. This way By design, the connector wire contact is controlled and applied in the direction of the pressure pad. Then, a predetermined pressure line, spot or ring is inserted into the molded body of the support member. By having the side of the aperture raised due to the displacement of the elastomer A fine and controlled pressure can be applied depending on the area of the surface, and therefore the system center of the aperture. These interconnect The element is therefore shaped so as to give lateral relief to the material of the element. (1) The element can be placed within the perture, and (1) the element is (2) the elastomeric material elastically flows in a predetermined area; This provides stability and the ability to position the entire system. give. When pressure is applied to the assembly, this elastomer experiences axial compression. and must therefore move horizontally. The shape of the molded object is controlled It is shaped to give a lateral movement, thus applying precise contact pressure to the system. give.

Brief description of the drawing We first briefly discuss the following aspects.

FIG. 1 is a perspective exploded view of a circuit including a preferred embodiment of the connector device of the present invention. Ru.

FIG. 1a shows a preferred implementation of the interconnection elements in the connector arrangement of FIG. FIG. 3 is an enlarged perspective view of an example.

Figures 2, 3 and 4 show the disassembled, assembled and compressed states respectively. 2 is a slightly schematic side cross-sectional view of the circuit of FIG. 1 showing the circuit in a state where the circuit is in a state where

Figures 5 and 5a show the three interconnecting elements in assembled and compressed states. FIG. 2 is an enlarged side cross-sectional view of the circuit of FIG. 1 showing the component segments;

Figures 6 and 6a illustrate the interconnection elements in assembled and compressed states. 7 is a side cross-sectional view of an alternative embodiment showing a ment segment, as opposed to FIGS. FIG. 7a shows the interconnection members FIGS. 8 and 9 are side sectional views, and FIGS. and FIG. 10a are side and rear cross-sectional views of yet another alternative embodiment of the interelement. Figure 101) is a mutual connection having a front view when looking at Figure 10. FIG. 6 is a rear side view of another alternative embodiment of a connecting element;

FIG. 11 shows an alternative embodiment of the connector arrangement of FIG. 1 for low impedance connections. FIG. 11a is a side cross-sectional view of an interconnection element of the device of FIG. FIG. FIG. 12 is a side sectional view of still another embodiment of the present invention. .

FIG+2 Procedural amendment (formality) Relationship to the incident: Applicant international search report

Claims (27)

[Claims] 1. a second facing mark from a large plurality of first contact pads on a first printed circuit board surface; electrical connection to a plurality of corresponding large second contact pads of the second contact pad on the printed circuit board surface; An areal array connector device for providing interconnection, comprising: a non-conductive support member disposed between the opposing circuit board surfaces; overall alignment of corresponding facing pairs of first and second contact pads on the surface of the plate; a plurality of similar preformed apertures arranged in corresponding areas of said support member; a non-conductive support member having a surface therethrough, and said region of said support member; conductive metal interconnection member extending through the elastomeric material in the area an areal array connector device comprising: an area array connector device in which the metal interconnection member is connected to the area array connector device; the first and second mutually facing pairs of contacts extending through the last material; first and second end surfaces exposed for making direct metal-to-metal conductive contact to the touch pad; has The interconnection member has a first to a second contact pad on the order of less than about 25 milliohms. each sized and configured to provide a total resistance to the contact pad. and the interconnection member is such that the exposed end surface of the interconnection member is under contact pressure. can be deflected from the first position under the recovering, at least in part, upon release of said contact pressure in the direction of said first position; It is configured to allow This allows the area array connector device described above to be configured to provide continuous electrical interconnection between circuit board surfaces facing each other An areal array connector device characterized by: 2. the support member includes a resilient elastomer material, and the support member includes a resilient elastomeric material, and and having support surfaces facing each other and biasing the circuit boards together. Therefore, it is configured to be compressed, and each said metal interconnection member extending through the thickness of said resilient support member; Each contact pad of the circuit board is initially aligned relative to the thickness of the support member. upon their initial engagement with said first and second contact pads being placed at an acute angle; , a pair of pads arranged to engage a line protruding through the pair of pad-engaging surfaces. a generally rotatable conductive interconnect element having a pad-engaging surface of The connector further includes a hand for holding the circuit board together in a clamped relationship. a step, the support member being in a compressed reduced thickness state and having the mutual contact. The connecting member rotates in its entirety, thereby causing the line protruding through the engagement surface. , placed at an acute angle to the direction of the thickness of the support member that is greater than the initial angle; the body of the support member is locally deformed by the interconnection element; resiliently biasing said interconnecting element into its original position, i.e. into engagement with said pad; An areal array connector device according to claim 1. 3. The circuit board has a plurality of polygons in a predetermined pattern corresponding to the configuration of the circuits on the board. a corresponding number of matching contact pads, and the supporting member supports a corresponding number of matching contact pads; includes interconnecting elements; Each of the above elements responds to the joint relationship of the circuit board to provide an overall circuit, thereby locally deforming the compression support member and causing the compression support member to wherein the contact pad is elastically biased against the respective contact pad. An areal array connector device according to scope 2. 4. The support member has a plurality of tops in a pattern corresponding to the pattern of the pads. claim characterized in that it is in the form of a sheet into which the interconnecting elements are inserted; The areal array connector device of claim 3 in scope 3. 5. The support member is further arranged generally parallel to the mutually facing plate surfaces. characterized by comprising a sheet-like layer of entirely non-intumescent material disposed 5. An areal array connector device according to claim 4. 6. The support member locally allows global rotation of the interconnection element. The area aperture according to claim 2, characterized in that it includes a distribution of pores that acts as follows. Ray connector device. 7. Claim 1, wherein the support member includes a layer of elastomeric foam. 7. The areal array connector device according to clause 6. 8. the elastomeric cells have a total pore volume in the range of about 25 to 95%; 8. An areal array connector device according to claim 7, characterized in that: 9. The elastomeric cells have a pore volume in the range of about 60 to 75%. 9. An areal array connector device as claimed in claim 8. 10. The above elastomers include silicone, urethane, natural rubber, and ptadiene-styrene. copolymer of putadiene-isobutylene, putadiene-acrylonitrile, Roloprene polymers, polysulfide polymers, plasticized vinyl chloride polymers and copolymer selected from polymers, and plasticized acetate polymers and copolymers. 8. An areal array connector device according to claim 7. 11. The support member is about 2 to 5 per square inch at 25 percent compression. Claim No. 1 having a compressive force deflection (CFD) in the range of 0 lbs. 2. The areal array connector device according to clause 2. 12. The support member is 158T at 50 percent compression with half hour recovery. characterized by having a compression set of less than about 10 percent after 22 hours at An areal array connector device according to claim 2. 13. The interconnecting element extends generally through the thickness of the support member. the said body in the direction in which it rests on the body and its respective contact pad. a terminus projecting from each end of the claim; The areal array connector device according to clause 2. 14. Claim characterized in that said interconnecting element is generally S-shaped. 14. The areal array connector device of claim 13. 15. The line of protrusion of the terminal end is perpendicular to the thickness direction of the support member. The area array according to claim 13, characterized in that the area array is located in a common plane. connector device. 16. at least two interconnecting elements encapsulated within the elastomeric material; a metal interconnection member as described above including two electrically conductive metal filaments; a point extending in generally parallel relationship between the first and second exposed end surfaces. An areal array connector device according to claim 1, characterized in that: 17. A surface of the support member defining the aperture is connected to the interconnection element. The configuration differs from that of the corresponding surface of the A claim characterized in that a localized area of pressure is applied between the element and the support. 17. The areal array connector device of claim 16. 18. Claims characterized in that the aperture has an irregular left diameter. 18. An areal array connector device according to clause 17. 19. The metal filament encapsulated in the elastomer material is in conductive contact. An areal array connector device according to claim 1, characterized in that: . 20. Claims characterized in that the support member is made of an elastomer material. 2. The areal array connector device of claim 1. 21. Claims characterized in that the elastomer material is elastomer foam. The areal array connector device according to clause 1. 22. said interconnecting member causes angular strain in said member by application of said contact pressure; Claim 1, characterized in that it is oriented in such a state that it causes area array connector device. 23. Claim 1, wherein the metal interconnection member includes copper. 2. The areal array connector device according to clause 1. 24. The exposed terminal surfaces of said metal interconnection members are gold plated. An areal array connector device according to claim 1, characterized in that: 25. The aperture is formed by removing material. An area array interconnect device according to claim 1. 26. Particularly, the aperture is formed by punching or drilling. 26. An area array interconnect device according to claim 25, characterized in that 27. a first contact pad on a surface of a first circuit board and a second facing circuit board; a connector assembly for providing electrical interconnection between corresponding second contact pads on the surface; a non-conductive support disposed between the circuit boards and comprising a resilient elastomeric material; a support surface facing each of the first and second circuit board surfaces; and configured to be compressed by urging the circuit boards together. a support member extending through the thickness of the resilient support member and extending through the thickness of the support member; the first and second contact pads being placed at an initial acute angle to the thickness direction; At the time of their initial engagement, a line protruding through the pair of pad engagement surfaces is a pair of pads arranged to engage respective contact pads of the printed circuit board; a generally rotatable conductive interconnect element having an engaging surface, which brings said circuit board together; held in a tightened relationship so that the support member is in a compressed and reduced thickness state. and said interconnecting member generally rotates thereby protruding through said engagement surface. The drawn line is in the direction of the thickness of the supporting member that is greater than the initial angle. means for locating at an acute angle; the body of the support member is locally deformed by the interconnection element; resiliently biasing said interconnecting element into its original position, i.e. into engagement with said pad; A connector device characterized by being squeezed.