TWI715200B - Conductive sheet and electrical connection component containing conductive sheet - Google Patents

Abstract

A conductive sheet and an electrical connection assembly containing a conductive sheet. The conductive sheet is provided with a plurality of conductive units on its insulating substrate. The base of the conductive unit is provided with a plurality of slits to form a flexure, and each flexure is provided with a conductor , The electrical connection assembly is provided with a conductive film under the conductive sheet, and the conductive unit of the conductive sheet can provide a medium for electrical connection through the conductive component corresponding to the conductive film, thereby providing electrical connection between the semiconductor component under test and the circuit carrier of the test system It uses the conductive body of the flexure to remove the oxide film on the contact surface of the semiconductor component to be tested, and can provide a short-distance electrical conduction path suitable for high-frequency testing, and the conductive sheet blocks the oxide film residue Attach to conductive film.

Description

Conductive sheet and electrical connection component containing conductive sheet

The present invention relates to a conductive sheet and an electrical connection component containing the conductive sheet, especially as an electrical connection medium, which can be used in a semiconductor component tester (test socket) to provide electrical connection between a semiconductor component and a circuit carrier of a test system Sexual connection purpose.

At present, it is used in various inspection fixtures such as semiconductor component inspection devices, mainly using probe assemblies or conductive films as electrical connection components to provide a signal transmission medium during the inspection of semiconductor components under test.

In the foregoing, in addition to the flexibility of each probe, the probe assembly also uses the spike structure at the tip of the probe. When the probe contacts the contact of the semiconductor device under test, the spike structure can pass through the contact. Oxide film on the surface. The probe can achieve a good electrical contact relationship with the contact point of the semiconductor component to be tested, ensuring the testing quality of the semiconductor component. However, due to the small size of each probe and the flexible structure of the probe assembly, the electrical signal conduction path of the probe is too long, which is difficult to meet the short-distance electrical signal conduction path requirements for high-frequency testing.

When the conductive film is used as an electrical connection component, because the conductive film includes an elastic rubber body and a large number of conductive parts dispersed in the elastic rubber body, the conductive film has compression deformation and recovery due to the elasticity of the elastic rubber body The flexibility allows the contacts of the semiconductor components to be tested to electrically contact the conductive parts in the conductive film to connect to the testing system for testing. The short-distance electrical signal transmission path structure can meet the needs of high-frequency testing. However, when the contact of the semiconductor component to be tested electrically contacts the conductive component in the conductive film, it is easy for the conductive component to pass through the stacked oxide film formed on the contact of the semiconductor component to be tested, resulting in the contact between the conductive film and the semiconductor component to be tested It is difficult to achieve a better electrical contact state between them, which easily affects the test quality of the semiconductor device. And the semiconductor component under test is under test The sloughed oxide film debris is easy to stick to the surface of the conductive film, and it is difficult to remove the oxide film debris from the conductive film.

The purpose of the present invention is to provide a conductive sheet and an electrical connection assembly including the conductive sheet, which solves the problem that the existing conductive film is difficult to achieve a good electrical contact state due to the oxide film on the contact surface of the semiconductor element to be tested, and the oxide film residue It is easy to remain on the surface of the conductive film and is difficult to remove.

In order to achieve the foregoing objective, the conductive sheet provided by the present invention includes: an insulating substrate; and a plurality of conductive units are arranged in the insulating substrate at intervals, and each conductive unit includes a base and a plurality of conductive bodies, The periphery of the base portion is connected to the insulating substrate, and a plurality of slits are provided in the base portion, and there is a flexure between adjacent slits, and a plurality of the conductors are distributed on the base portion. The flexure, the conductor has a contact end protruding from the upper surface of the base.

In order to achieve the foregoing objective, the electrical connection assembly provided by the present invention includes: a conductive sheet as described above; and a conductive film having elasticity to deform and recover under pressure. The conductive film is disposed under the conductive sheet, and The conductive film includes an elastic rubber body and a plurality of conductive parts dispersed in the elastic rubber body. Each conductive part extends from the upper surface to the lower surface of the elastic rubber body, and makes each conductive body in the conductive sheet and the conductive The conductive parts corresponding to the positions in the film are electrically connected.

Through the combination of the conductive sheet and the conductive film and the invention of the electrical connection assembly, when it is used in a semiconductor device tester as an electrical connection medium between the semiconductor device under test and the circuit carrier of the test system, it can be used The conductive sheet is arranged on the upper surface of the flexure of each conductive unit. The conductive body can rub and remove the oxide film on the contact surface of the semiconductor element to be tested, and use the flexible flexure combined with the elasticity provided by the conductive film to make the convex The conductor energy of the flexure is comparable to that of the semiconductor component under test The contacts reach a good electrical contact state, and can be applied to high-frequency semiconductor device testing operations through short-distance electrical signal conduction paths.

On the other hand, when the oxide film on the contact surface of the semiconductor component to be tested is rubbed by the conductive body provided on the upper surface of the flexure of each conductive unit, it can effectively prevent the oxide film from adhering to the conductive film. The surface, and the conductive sheet can be simplified by its surface structure, and the oxide film remaining on the surface of the conductive sheet after the test can be easily removed and reused.

1: Electrical connection components

10: Conductive sheet

11: Insulating substrate

12: Conductive unit

13: Base

130: middle hole

131: Cut Seam

132: Deflection

14A, 14B: Conductor

141A, 141B: contact end

20: conductive film

21: Elastic rubber body

22A, 22B, 22C: conductive parts

30: Circuit carrier board

40: Ball grid array semiconductor components

41: spherical contact

Fig. 1 is a perspective schematic view of a preferred embodiment of the conductive sheet of the present invention.

Fig. 2 is a perspective exploded schematic view of a preferred embodiment of the electrical connection assembly of the present invention.

FIG. 3 is a perspective schematic diagram of the preferred embodiment of the electrical connection assembly shown in FIG. 2 after being assembled.

Fig. 4 is a perspective schematic view of another preferred embodiment of the electrical connection assembly of the present invention.

5 is a schematic plan view of a preferred embodiment of the electrical connection assembly of the present invention mounted on the circuit carrier of the test system.

6 is a schematic plan view of another preferred embodiment of the electrical connection assembly of the present invention mounted on the circuit carrier of the test system.

FIG. 7 is a schematic plan view of another preferred embodiment of the electrical connection assembly of the present invention mounted on the circuit carrier of the test system.

FIG. 8 is a schematic diagram of the semiconducting element to be tested electrically connected to the circuit carrier via the electrical connection component.

According to the foregoing description of the content of the invention, the present invention includes a conductive sheet and an electrical connection component. The following respectively describes the preferred embodiments of the conductive sheet and the electrical connection component disclosed in the drawings.

As shown in FIG. 1, it discloses a preferred embodiment of the conductive sheet 10 of the present invention. The conductive sheet 10 can be used as an electrical connection medium alone, or the conductive sheet 10 combined with a conductive film can be used as an electrical connection medium. Is limited.

As can be seen from FIG. 1, the conductive sheet 10 includes an insulating substrate 11 and a plurality of conductive units 12. The insulating substrate 11 is a sheet-like membrane made of insulating material. The upper and lower sides of the insulating substrate 11 are respectively an upper surface and a lower surface, and a plurality of the conductive units 12 are arranged at intervals. In the insulating substrate 11, each of the conductive units 12 extends from the upper surface to the lower surface of the insulating substrate 11 to provide a medium for electrical connection.

As shown in FIG. 1, each conductive unit 12 includes a base 13 and a plurality of conductors 14A. The periphery of the base 13 is connected to the insulating substrate 11, and the base 13 is provided with a plurality of slits 131. A flexure 132 is respectively adjacent to the slit 131.

In the foregoing, the plurality of slits 131 in the base 13 are independent and not connected, and the flexure 132 has moderate flexibility through the slits 131; or, the plurality of slits in the base 13 The slit 131 extends from the center to the periphery, and the base 13 is divided into a plurality of flexible flexures 132 by a plurality of slits 131, that is, one end of the slits 131 extends to the base 13 The central position of each flexure 132 is connected to the central position of the base 13 so that one end of each flexure 132 at the central position of the base 13 is a swingable free end. A plurality of the conductors 14A are distributed in the base 13 and can be flexed along with When the curved portion 132 swings, each of the conductors 14A has a contact end portion 141A protruding from the upper surface of the base portion 13. As shown in FIG. 1, a central hole 130 can be added to the center of each base 13, and a plurality of slits 131 extend from the periphery of the central hole 130 to the surroundings.

In the foregoing, at least the conductor 14A in each conductive unit 12 is formed of a conductive material, wherein the base 13 in each conductive unit 12 can be selected as an insulating material and formed integrally with the insulating substrate 11 (not shown) , Or, the base 13 of each conductive unit 12 can also be a conductive material and The conductor 14A is integrally formed. The number and the distribution position and the quantity of the plurality of conductive units 12 of the conductive sheet 10 are determined according to the number and distribution positions of the contacts of the object to be electrically connected.

When the base 13 of each conductive unit 12 is made of insulating material and is integrally formed with an insulating substrate (not shown), the conductor 14A extends from the upper surface of the base 13 to the lower surface of the base 13. As shown in FIG. 1, when the base 13 of each conductive unit 12 is made of conductive material and is integrally formed with the conductor 14A, the conductor 14A is formed on the base 13, and the conductor 14A combines with the conductive base 13 to form an electrical conduction path. In the preferred embodiment shown in FIG. 1, the base 13 of each conductive unit 12 is made of conductive material and is integrally formed with the conductor 14A.

In the preferred embodiment of the conductive sheet 10 shown in FIGS. 1 and 2, it is disclosed that each of the flexures in each conductive unit 12 has a conductive body, and the conductive body 14A protrudes The contact end 141A of the upper surface of the base 13 is a conical block whose size decreases upward. As shown in FIG. 4, each of the flexures 132 of each conductive unit has two conductors 14B. The contact end 141B of the conductor 14B protruding from the upper surface of the base 13 may be a triangular block. , And the top end of the triangular block-shaped contact end 141B forms a circular arc curved surface. However, the shape and quantity of the conductors 14A and 14B provided on the flexure 132 are not limited to the aforementioned preferred embodiments.

As shown in FIG. 2 and FIG. 3, a preferred embodiment of the electrical connection assembly 1 of the present invention is disclosed. As can be seen from the drawings, the electrical connection assembly 1 includes a conductive sheet 10 and a conductive film 20. Wherein, the structure of the conductive sheet is as described above, and will not be repeated here.

As shown in Figures 2 and 3, the conductive film 20 is a member with the characteristics of elasticity, deformation and recovery under pressure, and electrical connection. The conductive film 20 is arranged under the conductive sheet 10 and is electrically connected A plurality of conductive units 12 of the conductive sheet 10. As shown in FIGS. 5 to 7, the conductive film 20 includes an elastic rubber body 21 and a plurality of conductive members 22A, 22B, 22C dispersed in the elastic rubber body 21, and each conductive member 22A, 22B, 22C is The upper surface of the elastic rubber body 21 extends to the lower surface, and each conductor 14A in the conductive sheet 10 corresponds to a position in the conductive film 20 The conductive components 22A, 22B, and 22C are electrically connected, and the conductive film 20 has the elasticity of deformation and recovery under compression by the elasticity of the elastic rubber body 21.

As shown in FIGS. 5-7, each conductive member 22A, 22B, 22C of the conductive film 20 can be a wire, a conductive block, or a plurality of conductive particles arranged in series up and down to provide electrical properties. Connected parts.

The conductive sheet of the present invention can be used as an electrical connection medium alone or combined with a conductive film as an electrical connection medium. The electrical connection assembly of the present invention includes a combination of a conductive sheet and a conductive film. In order to facilitate the description of the present invention, the following uses the electrical connection assembly of the present invention in the field of testing connectors of semiconductor components as an example of the electrical connection medium between the semiconductor component under test and the circuit carrier of the testing system.

As shown in Figures 7 and 8, the electrical connection assembly is applied to the test connector of the ball grid array (BGA) semiconductor device. The conductive unit of the electrical connection assembly 1 of the present invention corresponds to the ball grid array to be tested. The spherical contact 41 of the BGA semiconductor element 40, the electrical connection assembly 1 is installed in the base of the test connector (not shown), and is assembled with the base on the circuit carrier 30 of the test system. Each conductive unit 12 of the conductive sheet 10 is electrically connected to the corresponding contact point of the circuit carrier 30 through the conductive component 22 corresponding to the position in the conductive film 20 respectively.

As shown in Figure 8, when the ball grid array (BGA) semiconductor component to be tested is moved to the electrical connection assembly 1 located in the test connector, the ball grid array (BGA) semiconductor component 40 has many ball contacts at the bottom 41 are in one-to-one corresponding contact with the plurality of conductive units 12 of the conductive sheet of the electrical connection assembly 1, and when the ball grid array (BGA) semiconductor element 40 to be tested is subjected to the following pressure, it passes through each ball The point 41 presses down the conductive unit 12 at its corresponding position, wherein the electrical connection assembly 1 uses the conductor 14A protruding on the upper surface of the flexure 132 to remove the oxide film on the surface of the spherical contact 41 by friction, and use the The curved flexure 132 combines with the elasticity provided by the conductive film 20, so that the conductor 14A protruding from the flexure 132 and the ball contact 41 of the ball grid array (BGA) semiconductor device 40 under test can achieve good electrical performance. In the state of sexual contact, the testing system performs functional testing of the ball grid array (BGA) semiconductor element 40 under test through the circuit carrier 30 and the electrical connection assembly 1.

From the foregoing description, it can be known that the combination of the conductive sheet and the conductive film and the invention of the electrical connection assembly, when applied to a semiconductor device tester, serve as the electrical connection between the semiconductor device under test and the circuit carrier of the test system When the medium is used, the conductive body protruding on the flexure can achieve good electrical contact with the contact of the semiconductor device under test, and it can be used for high-frequency semiconductor device testing operations through a short-distance electrical signal conduction path. On the other hand, when the oxide film on the contact surface of the semiconductor element to be tested can be removed by the conductive sheet provided on the upper surface of the flexure of each conductive unit, it can effectively prevent the oxide film from adhering to The surface of the conductive film, and the conductive film can be simplified by its surface structure, and the oxide film remaining on the surface of the conductive film after the test can be easily removed and reused.

1: Electrical connection components

10: Conductive sheet

11: Insulating substrate

12: Conductive unit

13: Base

130: middle hole

131: Cut Seam

132: Deflection

14A: Conductor

20: conductive film

Claims (8)

A conductive sheet includes: an insulating substrate, a diaphragm made of an insulating material; and a plurality of conductive units are arranged in the insulating substrate at intervals, and each conductive unit includes a base and a plurality of conductive elements. Body, the base is made of insulating material and is integrally formed with the insulating substrate, and a plurality of slits are provided in the base, and there is a flexure between adjacent slits, and a plurality of conductive The body is distributed on the flexure of the base and extends to the lower surface of the base, and the conductor has a contact end protruding from the upper surface of the base. The conductive sheet according to claim 1, wherein the plurality of slits in the base portion are independent and not connected. The conductive sheet according to claim 1, wherein a plurality of the slits extend to the center of the base to be connected. The conductive sheet according to claim 1, wherein a central hole is provided at the center of each of the bases, and the plurality of slits respectively extend from the periphery of the central hole to the circumference. The conductive sheet according to any one of claims 1 to 4, wherein the contact end of the conductor protruding from the upper surface of the insulating substrate is a conical block with an upwardly decreasing size. The conductive sheet according to any one of claims 1 to 4, wherein the contact end of the conductor protruding from the upper surface of the insulating substrate is in a triangular block shape, and the contact end of the triangular block The top end forms a circular arc surface. An electrical connection assembly, comprising: a conductive sheet as described in any one of claims 1 to 6; and a conductive film having elasticity to deform and recover under pressure, and the conductive film is arranged under the conductive sheet , The conductive film includes an elastic rubber body and a plurality of Conductive components, each conductive component extends from the upper surface to the lower surface of the elastic rubber body, and electrically connects each conductor in the conductive sheet with the conductive component corresponding to the position in the conductive film. The electrical connection assembly according to claim 7, wherein each of the conductive components is a wire, a conductive block, or a component composed of a plurality of conductive particles arranged in series up and down.

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