JPS63206671A - Inspection apparatus - Google Patents

Abstract

PURPOSE:To inspect a semiconductor element having many electrodes at a minute pitch with high reliability, by holding the elasticity of a probe needle, which is constituted of a plurality of the conductive wirings in parallel by patterning, by a spring material. CONSTITUTION:A spring material 12 having elasticity is mounted on the under surface of a mount plate 11. The part protruding from the end part of the mount plate 11 in the right direction of the spring material 12 is properly bent in a downward direction and further bent in a projecting curved form at the contact part 13 in the vicinity of the leading end part thereof in the direction of the electrodes 15 of an object to be inspected, for example, a semiconductor element 14. Further, an insulating film 17 having conductive wirings 16 used as the probe needle composed of a copper foil formed by patterning is fixed to the entire under surface of the spring material 12 by an adhesive. Then, the electrical characteristic of the semiconductor element is inspected by bringing the electrodes 15 into contact with the contact part 13. The contact pressure of the contact part 13 and the electrodes 15 can be secured by the spring material 12 and, since the contact part 13 is curved to become the surface contact with the electrodes 15, contact inferiority is hard to generate.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to an inspection apparatus, and particularly to an inspection apparatus suitable for inspecting a semiconductor element having multiple electrodes at a fine pitch.

(Prior Art) In general, a probe needle 3 that contacts an electrode pad 2 provided on a semiconductor element 1 is used as an inspection apparatus for inspecting the electrical characteristics of a semiconductor element such as an IC or LSI, as shown in FIG.
A device with a large number of is used.

However, as the number of electrode pads on semiconductor devices increases and becomes smaller due to higher integration of ICs, LSIs, etc., the probe needles that come into contact with these electrode pads must also be made smaller and denser. However, there are problems such as difficulty in manufacturing and adjusting the probe needle and low reliability.

In particular, when attempting to inspect a substrate having multiple electrodes at a fine pitch, such as a substrate such as a liquid crystal television screen, it is extremely difficult to do so with a conventional inspection apparatus using a probe needle.

As a technique that takes the above circumstances into consideration, for example, JP-A-61-
There are techniques disclosed in Japanese Patent Publication No. 2338, Japanese Patent Publication No. 61-14659, etc.

The former has a configuration in which the probe needle is made by patterning and wiring multiple conductive metal films such as aluminum or copper in parallel on the surface of an elastic insulating film made of soft plastic, etc. A microstrip line is provided protruding from the end and is used as a probe needle.

(Problems to be Solved by the Invention) However, the above disclosed technology has the following problems.

In other words, in the former case, the contact pressure between the electrode pad of the semiconductor element and the contact part on the insulating film uses the elastic force of the insulating film itself, so if the insulating film is soft, the contact pressure is weak, and if the insulating film is hard, the contact pressure is weak. The pressure is strong, but it breaks easily.

On the other hand, in the latter case, the contact pressure is maintained by a cushioning material, so the microstrip line does not require elastic force, but there is a concern that it may easily break because it is bent at the edge of the substrate every time it is inspected.

The present invention has been made in response to the above-mentioned circumstances, and aims to provide an inspection device with high precision, good contact, and excellent reliability.

[Structure of the invention]

(Means for Solving the Problems) That is, the present invention provides an inspection device for testing an object by bringing a plurality of probe needles into contact with the electrodes of the object to be inspected, which includes: probe needles made of conductive wiring formed on an insulating film; The probe needle is provided with a spring material that imparts elasticity, and the contact portion of the probe needle that contacts the electrode of the object to be inspected is configured to have a convex curved shape in the direction of the electrode of the object to be inspected. do.

(Function) In the inspection device of the present invention, the probe needle is composed of a plurality of conductive wirings patterned in parallel on an insulating film, and the elasticity of the probe needle is maintained by a spring material. , it is possible to arrange a large number of probe needles with high precision, has good contact with electrode pads, is difficult to break, and is highly reliable.

(Example) Hereinafter, an example of the inspection apparatus of the present invention will be described with reference to the drawings.

=3- In FIG. 1, a resilient member such as a spring material 12 such as a thin steel plate is attached to the lower surface of a mounting plate 11 such as a glass epoxy board. Mounting plate 1 for this spring material 12
A portion protruding rightward from one end is moderately bent downward, and a contact portion 13 near the tip thereof is bent into a curved shape convex in the direction of the electrode 15 of the object to be inspected, for example, a semiconductor element 14. .

Further, over the entire lower surface of the spring material 12, an insulating film 17 made of patterned copper foil or the like and having conductive wiring 16 used as a probe needle, such as F, P, etc.
C is fixed by adhesive or other means.

Then, the electrode 15 provided on the semiconductor element 14, which is the object to be inspected, is brought into contact with the tip contact portion 13 of the conductive wiring 16, and the electrical characteristics are inspected.

At this time, since the tip portion 13 of the conductive wiring 16 is patterned by photolithography or the like, the dimensional position is very accurate. Therefore, the relative alignment between the contact portion 13 and the electrode 15 is determined by the conductive wiring J6.
This can be done easily and with high precision without having to worry about the amount of time required.

In addition, sufficient contact pressure between the contact portion 13 and the electrode 15 can be ensured by the spring material 12, and since the contact portion 13 is curved, it makes surface contact with the electrode 15, so that poor contact is unlikely to occur.

Furthermore, since the insulating film 17 has no limitations in terms of elasticity and can be used even if it is highly flexible, high reliability can be obtained.

In addition, as another example, as shown in FIG.
The conductive wiring 26 formed on the insulating film 27 is attached to the lower surface of the mounting plate 21 so as to maintain insulation from the mounting plate 21, with the conductive wiring 26 formed on the insulating film 27 facing upward, and the insulating film 27 is attached to the spring material 22, e.g. Even if the contact portion 23 and the electrode 25 are brought into contact with each other by surrounding rubber or the like, the same effect as in the above embodiment can be obtained.

It should be noted that the shape of the probe needle is not limited to the above embodiment, and it goes without saying that it may be modified to suit the object to be inspected, and may be arranged in various ways without departing from the spirit of the present invention. Good too.

〔Effect of the invention〕

As described above, according to the present invention, even semiconductor devices having multiple electrodes at fine pitches can be easily and highly reliably tested.

[Brief explanation of the drawing]

FIG. 1 is an explanatory perspective view of one embodiment of the present invention, FIG. 2 is an explanatory perspective view of another embodiment shown in FIG. 1, and FIG. 3 is an explanatory diagram of a conventional example. 11.21... Mounting plate, 12.22... Spring material, 13.23... Contact part, 14... Half port board, 15.25... Electrode, 16.26...
- Conductive wiring, 17.27... Insulating film. Patent applicant Tokyo Electron Ltd. Figure 2 Figure 3

Claims (1)

[Scope of Claims] An inspection device that tests by bringing a plurality of probe needles into contact with electrodes of an object to be inspected, the probe needles being made of conductive wiring formed on an insulating film, and the probe needles having elasticity. An inspection device comprising: a spring member, wherein a contact portion of the probe needle that contacts an electrode of the object to be inspected is configured in a curved shape convex toward the electrode of the object to be inspected.