TWI456019B - 黏著膠帶及使用其之太陽能電池模組 - Google Patents
黏著膠帶及使用其之太陽能電池模組 Download PDFInfo
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- TWI456019B TWI456019B TW100130428A TW100130428A TWI456019B TW I456019 B TWI456019 B TW I456019B TW 100130428 A TW100130428 A TW 100130428A TW 100130428 A TW100130428 A TW 100130428A TW I456019 B TWI456019 B TW I456019B
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- 239000002390 adhesive tape Substances 0.000 title claims 13
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims 13
- 239000000853 adhesive Substances 0.000 claims 12
- 230000001070 adhesive effect Effects 0.000 claims 12
- 239000011888 foil Substances 0.000 claims 7
- 239000002245 particle Substances 0.000 claims 7
- 229910052751 metal Inorganic materials 0.000 claims 6
- 239000002184 metal Substances 0.000 claims 6
- 229920005989 resin Polymers 0.000 claims 6
- 239000011347 resin Substances 0.000 claims 6
- 229920001187 thermosetting polymer Polymers 0.000 claims 6
- 239000003795 chemical substances by application Substances 0.000 claims 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 4
- 150000001875 compounds Chemical class 0.000 claims 4
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims 4
- 239000012790 adhesive layer Substances 0.000 claims 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims 3
- 239000000463 material Substances 0.000 claims 3
- 229920005992 thermoplastic resin Polymers 0.000 claims 3
- 229910019142 PO4 Inorganic materials 0.000 claims 2
- KPSSIOMAKSHJJG-UHFFFAOYSA-N neopentyl alcohol Chemical compound CC(C)(C)CO KPSSIOMAKSHJJG-UHFFFAOYSA-N 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- 229920006287 phenoxy resin Polymers 0.000 claims 2
- 239000013034 phenoxy resin Substances 0.000 claims 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims 2
- 239000010452 phosphate Substances 0.000 claims 2
- 229920000768 polyamine Polymers 0.000 claims 2
- 229920000728 polyester Polymers 0.000 claims 2
- 239000007870 radical polymerization initiator Substances 0.000 claims 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims 1
- 150000000703 Cerium Chemical class 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 claims 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims 1
- 239000002202 Polyethylene glycol Substances 0.000 claims 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 150000001412 amines Chemical class 0.000 claims 1
- -1 azo compound Chemical class 0.000 claims 1
- 230000001588 bifunctional effect Effects 0.000 claims 1
- 229910052796 boron Inorganic materials 0.000 claims 1
- 239000011889 copper foil Substances 0.000 claims 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims 1
- 150000002009 diols Chemical class 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 229910052746 lanthanum Inorganic materials 0.000 claims 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 claims 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 claims 1
- 150000002978 peroxides Chemical group 0.000 claims 1
- 239000004033 plastic Substances 0.000 claims 1
- 229920003023 plastic Polymers 0.000 claims 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims 1
- 229920001281 polyalkylene Polymers 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 229920000570 polyether Polymers 0.000 claims 1
- 229920001223 polyethylene glycol Polymers 0.000 claims 1
- 229920000193 polymethacrylate Polymers 0.000 claims 1
- 229920002635 polyurethane Polymers 0.000 claims 1
- 239000004814 polyurethane Substances 0.000 claims 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims 1
- 150000004060 quinone imines Chemical class 0.000 claims 1
- 150000003839 salts Chemical class 0.000 claims 1
- 150000003573 thiols Chemical class 0.000 claims 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0512—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module made of a particular material or composition of materials
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2804—Next to metal
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Inorganic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Photovoltaic Devices (AREA)
- Adhesive Tapes (AREA)
- Non-Insulated Conductors (AREA)
- Conductive Materials (AREA)
Claims (11)
- 一種黏著膠帶,其係電性連接複數之太陽能電池單元用的黏著膠帶,其特徵係具備:金屬箔及設置於該金屬箔之至少一面上之由含有絕緣性黏著劑組成物之黏著劑所構成之黏著劑層,前述絕緣性黏著劑組成物含有薄膜形成材、熱硬化性樹脂及熱硬化性樹脂用硬化劑,其中前述熱硬化性樹脂為環氧樹脂,前述熱硬化性樹脂之含有量,相對於前述絕緣性黏著劑組成物之全量,為10~80質量%,前述熱硬化性樹脂用硬化劑之含有量,相對於前述絕緣性黏著劑組成物之全量,為2~10質量%,前述薄膜形成材為重量平均分子量10000~10000000的苯氧樹脂,前述薄膜形成材之含有量,相對於前述絕緣性黏著劑組成物之全量,為2~80質量%。
- 如申請專利範圍第1項之黏著膠帶,其中前述熱硬化性樹脂用硬化劑為咪唑系硬化劑、醯肼系硬化劑、三氟化硼-胺錯合物、鋶鹽、胺醯亞胺、聚胺之鹽或二氰二胺。
- 一種黏著膠帶,其係電性連接複數之太陽能電池單元用的黏著膠帶,其特徵係具備:金屬箔及設置於該金屬箔之至少一面上之由含有絕緣性黏著劑組成物之黏著劑所構成之黏著劑層, 前述絕緣性黏著劑組成物含有熱可塑性樹脂、自由基聚合性化合物及自由基聚合起始劑,前述熱可塑性樹脂為聚醯胺類、苯氧樹脂類、聚(甲基)丙烯酸酯類、聚醯亞胺類、聚胺基甲酸酯類、聚酯類或聚乙烯醇縮丁醛類,前述熱可塑性樹脂之重量平均分子量為5000~150000,前述自由基聚合性化合物是具有(甲基)丙烯醯基的化合物,前述自由基聚合起始劑為過氧化物或偶氮化合物。
- 如申請專利範圍第3項之黏著膠帶,其中前述自由基聚合性化合物是選自環氧(甲基)丙烯酸酯寡聚物、胺基甲酸酯(甲基)丙烯酸酯寡聚物、聚醚(甲基)丙烯酸酯寡聚物、聚酯(甲基)丙烯酸酯寡聚物、三羥甲基丙烷三(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、聚烷撐二醇二(甲基)丙烯酸酯、二環戊烯基(甲基)丙烯酸酯、二環戊烯氧基乙基(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、二新戊四醇六(甲基)丙烯酸酯、異三聚氰酸改質2官能(甲基)丙烯酸酯、異三聚氰酸改質3官能(甲基)丙烯酸酯、2,2’-二(甲基)丙烯醯氧基二乙基磷酸酯、以及2-(甲基)丙烯醯氧基乙基酸式磷酸酯之族群中的一種或兩種以上。
- 如申請專利範圍第1~4項中任一項之黏著膠帶,其中前述黏著劑更包括導電性粒子。
- 如申請專利範圍第5項之黏著膠帶,其中前述導電性粒子之平均粒徑為2~20μm。
- 如申請專利範圍第5項之黏著膠帶,其中前述導電性粒子為帶刺之栗子狀(bur)或球狀。
- 如申請專利範圍第5項之黏著膠帶,其中前述導電性粒子為鍍金的鎳粒子或鍍金/鎳的塑料粒子。
- 如申請專利範圍第1~4項中任一項之黏著膠帶,其中前述金屬箔為銅箔或鋁箔。
- 如申請專利範圍第1~4項中任一項之黏著膠帶,其中前述黏著劑層被設置於前述金屬箔之兩面。
- 一種太陽能電池模組,其特徵係具有複數之太陽能電池單元,前述複數之太陽能電池單元藉由連接構件以電性連接,前述連接構件為使用申請專利範圍第1~10項中任一項之黏著膠帶所形成者。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2006121930 | 2006-04-26 |
Publications (2)
Publication Number | Publication Date |
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TW201213490A TW201213490A (en) | 2012-04-01 |
TWI456019B true TWI456019B (zh) | 2014-10-11 |
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Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
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TW100130428A TWI456019B (zh) | 2006-04-26 | 2007-04-26 | 黏著膠帶及使用其之太陽能電池模組 |
TW096114828A TWI408201B (zh) | 2006-04-26 | 2007-04-26 | Adhesive tape and the use of its solar module |
TW100130429A TWI456020B (zh) | 2006-04-26 | 2007-04-26 | 黏著膠帶及使用其之太陽能電池模組 |
TW103129873A TW201446934A (zh) | 2006-04-26 | 2007-04-26 | 黏著膠帶及使用其之太陽能電池模組 |
Family Applications After (3)
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TW096114828A TWI408201B (zh) | 2006-04-26 | 2007-04-26 | Adhesive tape and the use of its solar module |
TW100130429A TWI456020B (zh) | 2006-04-26 | 2007-04-26 | 黏著膠帶及使用其之太陽能電池模組 |
TW103129873A TW201446934A (zh) | 2006-04-26 | 2007-04-26 | 黏著膠帶及使用其之太陽能電池模組 |
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US (4) | US20090235972A1 (zh) |
EP (4) | EP2674986B1 (zh) |
JP (5) | JPWO2007125903A1 (zh) |
KR (5) | KR20110011755A (zh) |
CN (9) | CN101427384B (zh) |
CA (1) | CA2650545A1 (zh) |
TW (4) | TWI456019B (zh) |
WO (1) | WO2007125903A1 (zh) |
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JP5116363B2 (ja) * | 2007-05-29 | 2013-01-09 | デクセリアルズ株式会社 | 導体線の製造方法 |
CN101861656B (zh) | 2007-11-15 | 2012-07-11 | 日立化成工业株式会社 | 太阳能电池单体 |
US8212522B2 (en) * | 2008-02-12 | 2012-07-03 | Leah M. Piatkowski, legal representative | Energy storage module |
TWI438915B (zh) * | 2008-02-21 | 2014-05-21 | Sanyo Electric Co | 太陽能電池模組 |
JP5183257B2 (ja) * | 2008-03-10 | 2013-04-17 | 三洋電機株式会社 | 太陽電池モジュール |
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