SG157957A1 - Package for integrated circuit die - Google Patents

Package for integrated circuit die

Info

Publication number
SG157957A1
SG157957A1 SG200604978-7A SG2006049787A SG157957A1 SG 157957 A1 SG157957 A1 SG 157957A1 SG 2006049787 A SG2006049787 A SG 2006049787A SG 157957 A1 SG157957 A1 SG 157957A1
Authority
SG
Singapore
Prior art keywords
frame
flange
leads
integrated circuit
cte
Prior art date
Application number
SG200604978-7A
Other languages
English (en)
Inventor
Michael Zimmerman
Original Assignee
Interplex Qlp Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Interplex Qlp Inc filed Critical Interplex Qlp Inc
Publication of SG157957A1 publication Critical patent/SG157957A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4817—Conductive parts for containers, e.g. caps
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    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
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    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
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    • Y10T428/24132—Structurally defined web or sheet [e.g., overall dimension, etc.] including grain, strips, or filamentary elements in different layers or components parallel

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
SG200604978-7A 2003-01-29 2004-01-28 Package for integrated circuit die SG157957A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US44347003P 2003-01-29 2003-01-29

Publications (1)

Publication Number Publication Date
SG157957A1 true SG157957A1 (en) 2010-01-29

Family

ID=32825334

Family Applications (4)

Application Number Title Priority Date Filing Date
SG200604978-7A SG157957A1 (en) 2003-01-29 2004-01-28 Package for integrated circuit die
SG200604979A SG160192A1 (en) 2003-01-29 2004-01-29 Package for integrated circuit die
SG200604976-1A SG158738A1 (en) 2003-01-29 2004-01-29 Package for integrated circuit die
SG200604977-9A SG157956A1 (en) 2003-01-29 2004-01-29 Package for integrated circuit die

Family Applications After (3)

Application Number Title Priority Date Filing Date
SG200604979A SG160192A1 (en) 2003-01-29 2004-01-29 Package for integrated circuit die
SG200604976-1A SG158738A1 (en) 2003-01-29 2004-01-29 Package for integrated circuit die
SG200604977-9A SG157956A1 (en) 2003-01-29 2004-01-29 Package for integrated circuit die

Country Status (8)

Country Link
US (6) US6867367B2 (fr)
EP (1) EP1627419A4 (fr)
JP (3) JP4780718B2 (fr)
KR (1) KR101025079B1 (fr)
CN (4) CN101434737B (fr)
CA (1) CA2514515C (fr)
SG (4) SG157957A1 (fr)
WO (1) WO2004068558A2 (fr)

Families Citing this family (95)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1548905A4 (fr) * 2002-09-30 2006-08-09 Sanyo Electric Co Element electroluminescent
US7298046B2 (en) * 2003-01-10 2007-11-20 Kyocera America, Inc. Semiconductor package having non-ceramic based window frame
SG157957A1 (en) * 2003-01-29 2010-01-29 Interplex Qlp Inc Package for integrated circuit die
US20070164424A1 (en) * 2003-04-02 2007-07-19 Nancy Dean Thermal interconnect and interface systems, methods of production and uses thereof
EP1636839A2 (fr) * 2003-06-06 2006-03-22 Honeywell International Inc. Systemes d'interconnexion thermiques, procedes de production et utilisations associees
JP2005129735A (ja) * 2003-10-23 2005-05-19 Fujitsu Media Device Kk 電子部品
US7259460B1 (en) * 2004-06-18 2007-08-21 National Semiconductor Corporation Wire bonding on thinned portions of a lead-frame configured for use in a micro-array integrated circuit package
US20060145317A1 (en) * 2004-12-31 2006-07-06 Brennan John M Leadframe designs for plastic cavity transistor packages
DE102005006281B4 (de) * 2005-02-10 2014-07-17 Infineon Technologies Ag Hochfrequenzleistungsbauteil mit Goldbeschichtungen und Verfahren zur Herstellung desselben
WO2007050101A2 (fr) * 2005-03-02 2007-05-03 Georgia Tech Research Corporation Systemes d'encapsulation incorporant un polymere a cristaux liquides (pcl) en couches minces et leurs procedes de fabrication
US7280181B2 (en) * 2005-06-30 2007-10-09 Intel Corporation Liquid crystal polymer optical filter carrier
JP4797621B2 (ja) * 2005-06-30 2011-10-19 日亜化学工業株式会社 半導体装置およびその製造方法
US8944822B2 (en) * 2005-07-22 2015-02-03 Appareo Systems, Llc Synchronized video and synthetic visualization system and method
US7848698B2 (en) 2005-07-22 2010-12-07 Appareo Systems Llc Flight training and synthetic flight simulation system and method
US7336491B2 (en) * 2005-09-06 2008-02-26 Lear Corporation Heat sink
US8120153B1 (en) * 2005-09-16 2012-02-21 University Of Central Florida Research Foundation, Inc. High-temperature, wirebondless, injection-molded, ultra-compact hybrid power module
US7446411B2 (en) * 2005-10-24 2008-11-04 Freescale Semiconductor, Inc. Semiconductor structure and method of assembly
US7429790B2 (en) * 2005-10-24 2008-09-30 Freescale Semiconductor, Inc. Semiconductor structure and method of manufacture
US20070175660A1 (en) * 2006-01-27 2007-08-02 Yeung Betty H Warpage-reducing packaging design
US8565943B2 (en) * 2006-09-25 2013-10-22 Appereo Systems, LLC Fleet operations quality management system
US9047717B2 (en) 2006-09-25 2015-06-02 Appareo Systems, Llc Fleet operations quality management system and automatic multi-generational data caching and recovery
US8116922B2 (en) * 2006-09-25 2012-02-14 Appareo Systems, Llc Method for resolving ground level errors in simulations
US9202318B2 (en) 2006-09-25 2015-12-01 Appareo Systems, Llc Ground fleet operations quality management system
US7616449B2 (en) * 2006-09-25 2009-11-10 Appareo Systems, Llc Crash-hardened memory device and method of creating the same
US9172481B2 (en) 2012-07-20 2015-10-27 Appareo Systems, Llc Automatic multi-generational data caching and recovery
EP2089914A2 (fr) * 2006-11-09 2009-08-19 Quantum Leap Packaging, Inc. Boitier reflechissant a del
CN101641785B (zh) 2006-11-09 2011-07-13 怡得乐Qlp公司 具有延展层的微电路封装体
WO2008073485A2 (fr) * 2006-12-12 2008-06-19 Quantum Leap Packaging, Inc. Boîte en plastique pour composant électronique
US7608482B1 (en) 2006-12-21 2009-10-27 National Semiconductor Corporation Integrated circuit package with molded insulation
US7874846B2 (en) * 2007-06-22 2011-01-25 Seagate Technology Llc Hermetically sealed liquid crystal polymer interconnect
US7715211B2 (en) * 2007-07-17 2010-05-11 Tellabs Operations, Inc. Configurable printed circuit board
US8014167B2 (en) * 2007-09-07 2011-09-06 Seagate Technology Llc Liquid crystal material sealed housing
US20090309199A1 (en) * 2008-06-12 2009-12-17 Keith Richard Barkley Chip package for semiconductor devices
KR100951888B1 (ko) * 2008-06-18 2010-04-12 주식회사 다윈전자 반도체 패키지 구조체
US20100012354A1 (en) * 2008-07-14 2010-01-21 Logan Brook Hedin Thermally conductive polymer based printed circuit board
US20100092790A1 (en) * 2008-10-14 2010-04-15 Gm Global Technology Operations, Inc. Molded or extruded combinations of light metal alloys and high-temperature polymers
US8288845B2 (en) * 2008-11-14 2012-10-16 Triquint Semiconductor, Inc. Package including proximately-positioned lead frame
US8124447B2 (en) * 2009-04-10 2012-02-28 Advanced Semiconductor Engineering, Inc. Manufacturing method of advanced quad flat non-leaded package
US8110445B2 (en) * 2009-05-06 2012-02-07 Infineon Technologies Ag High power ceramic on copper package
JP5707404B2 (ja) * 2009-08-20 2015-04-30 アイキューエルピー，リミティッドライアビリティ カンパニー 超高温プラスチック・チップパッケージ及びその製造方法
TWI468446B (zh) * 2009-08-21 2015-01-11 Iqlp Llc 超高溫塑膠封裝及製造方法
US8853843B2 (en) 2009-10-14 2014-10-07 Stmicroelectronics, Inc. Modular low stress package technology
US8560104B2 (en) * 2009-10-14 2013-10-15 Stmicroelectronics, Inc. Modular low stress package technology
US8597984B2 (en) 2009-10-14 2013-12-03 Stmicroelectronics, Inc. Modular low stress package technology
US8314487B2 (en) * 2009-12-18 2012-11-20 Infineon Technologies Ag Flange for semiconductor die
US9728868B1 (en) * 2010-05-05 2017-08-08 Cree Fayetteville, Inc. Apparatus having self healing liquid phase power connects and method thereof
US9888558B2 (en) * 2010-06-03 2018-02-06 Yazaki Corporation Wiring substrate and manufacturing method thereof
WO2011155317A1 (fr) * 2010-06-09 2011-12-15 シャープ株式会社 Structure de dissipation thermique pour dispositif électronique
JP5679561B2 (ja) * 2011-02-23 2015-03-04 矢崎総業株式会社 樹脂成形品
DE102011004694A1 (de) * 2011-02-24 2012-08-30 Robert Bosch Gmbh Schaltungsanordnung, insbesondere ein Getriebesteuergerät, mit mindestens einem Deckel zur Kapselung eines Schaltungsträgers
CN102756456B (zh) * 2011-04-27 2015-04-22 无锡华润安盛科技有限公司 用于预塑封引线框的模具以及封装结构
CN103988381B (zh) * 2011-06-27 2016-11-23 雷比诺有限责任公司 接地断路器仪表板电学模块和用于将该模块接地的方法
US9142502B2 (en) 2011-08-31 2015-09-22 Zhiwei Gong Semiconductor device packaging having pre-encapsulation through via formation using drop-in signal conduits
US8916421B2 (en) * 2011-08-31 2014-12-23 Freescale Semiconductor, Inc. Semiconductor device packaging having pre-encapsulation through via formation using lead frames with attached signal conduits
MX2014003726A (es) 2011-09-30 2014-07-09 Saint Gobain Performance Plast Articulo de fluoropolimero procesado por fusion y metodo para procesar por fusion fluoropolimeros.
US8597983B2 (en) 2011-11-18 2013-12-03 Freescale Semiconductor, Inc. Semiconductor device packaging having substrate with pre-encapsulation through via formation
US8698291B2 (en) * 2011-12-15 2014-04-15 Freescale Semiconductor, Inc. Packaged leadless semiconductor device
US8824151B2 (en) * 2012-02-13 2014-09-02 Ford Global Technologies, Llc Mounting system for an electronic control module housing in a vehicle
EP2832798B1 (fr) * 2012-03-27 2019-07-24 Sekisui Chemical Co., Ltd. Matière composite de résine
US8906747B2 (en) 2012-05-23 2014-12-09 Freescale Semiconductor, Inc. Cavity-type semiconductor package and method of packaging same
US8803302B2 (en) 2012-05-31 2014-08-12 Freescale Semiconductor, Inc. System, method and apparatus for leadless surface mounted semiconductor package
DE102012022960B4 (de) * 2012-11-23 2021-12-30 Schott Ag Gehäusebauteil, insbesondere für ein Elektronikgehäuse, und Verfahren zur Herstellung eines Gehäusebauteils
EP2854162B1 (fr) * 2013-09-26 2019-11-27 Ampleon Netherlands B.V. Structure de dispositif semi-conducteur
EP2854161B1 (fr) 2013-09-26 2019-12-04 Ampleon Netherlands B.V. Structure de dispositif semi-conducteur
CN104797075B (zh) * 2014-01-17 2019-02-26 中兴通讯股份有限公司 拱形pcb及其设计方法
JP6305778B2 (ja) * 2014-01-30 2018-04-04 ローム株式会社 パワーモジュールおよびその製造方法
EP3118895B1 (fr) * 2014-03-13 2020-04-01 Kyocera Corporation Boîtier pour loger un composant électronique et dispositif électronique comprenant le boîtier
JP6375584B2 (ja) * 2014-03-31 2018-08-22 住友電工デバイス・イノベーション株式会社 電子部品搭載用パッケージ
JP2017518640A (ja) * 2014-05-23 2017-07-06 マテリオン コーポレイション エアキャビティパッケージ
CN103978348A (zh) * 2014-05-28 2014-08-13 福清泳贸塑胶有限公司 一种电脑显示器背板左侧基板的加工方法及其结构
CN105990271B (zh) * 2015-02-26 2020-06-05 恩智浦美国有限公司 具有非水平管芯垫及相应引线框的ic封装
CN107534023B (zh) * 2015-05-20 2020-11-06 京瓷株式会社 半导体元件封装件、半导体装置以及安装构造体
CN106486426A (zh) * 2015-08-26 2017-03-08 比亚迪股份有限公司 用于焊接芯片的金属-陶瓷板和在其上焊接芯片的方法
JP6617490B2 (ja) * 2015-09-15 2019-12-11 富士電機株式会社 半導体装置
WO2017091567A1 (fr) * 2015-11-24 2017-06-01 Iqlp Llc Article en polymère à cristaux liquides pour processus semi-conducteur haute température
DE102016107958A1 (de) * 2016-04-28 2017-11-02 Herrmann Ultraschalltechnik Gmbh & Co. Kg Stanz-Siegeleinheit und Ultraschallbearbeitungsvorrichtung mit einer solchen
US10163743B2 (en) * 2016-05-20 2018-12-25 Materion Corporation Copper flanged air cavity packages for high frequency devices
KR101663558B1 (ko) 2016-05-23 2016-10-07 제엠제코(주) 패키지 파괴 방지 구조를 갖는 반도체 칩 패키지
JP6612723B2 (ja) * 2016-12-07 2019-11-27 株式会社東芝 基板装置
US10199303B1 (en) 2017-08-07 2019-02-05 Nxp Usa, Inc. Molded air cavity packages and methods for the production thereof
WO2019034988A1 (fr) * 2017-08-15 2019-02-21 Rjr Technologies, Inc. Boîtier de cavité d'air ayant une conductivité thermique améliorée
WO2019049213A1 (fr) * 2017-09-05 2019-03-14 新電元工業株式会社 Dispositif à semi-conducteur
US10629518B2 (en) 2018-08-29 2020-04-21 Nxp Usa, Inc. Internally-shielded microelectronic packages and methods for the fabrication thereof
US10899474B1 (en) * 2018-09-04 2021-01-26 Dynamic Autonomous Vehicle Technology LLC Portable fleet management system for autonomous aerial vehicles
CN113169074A (zh) * 2018-09-11 2021-07-23 Rjr技术公司 具有改善的部件之间连接的气腔封装
US10674647B1 (en) * 2018-12-10 2020-06-02 Microsoft Technology Licensing, Llc Device structural assemblies
NL2022759B1 (en) * 2019-03-18 2020-09-25 Ampleon Netherlands Bv Electronic package, electronic device, and lead frame
WO2020261731A1 (fr) * 2019-06-25 2020-12-30 Ｎｇｋエレクトロデバイス株式会社 Boîtier et procédé permettant de fabriquer un module à semi-conducteur de puissance
CN111961913B (zh) * 2020-08-28 2022-01-07 河北临泰电子科技有限公司 一种键合引线及其加工工艺
US11574859B2 (en) * 2020-09-28 2023-02-07 Wolfspeed, Inc. Power module having an elevated power plane with an integrated signal board and process of implementing the same
DE102021107319A1 (de) 2021-03-24 2022-09-29 Nidec Motors & Actuators (Germany) Gmbh Abdichtung von elektrischen Durchführungen einer Motoranordnung
DE102021107318A1 (de) 2021-03-24 2022-09-29 Nidec Motors & Actuators (Germany) Gmbh Motoranordnung mit Nut-Zungen-Deckel-Dichtung
DE102021107317A1 (de) 2021-03-24 2022-09-29 Nidec Motors & Actuators (Germany) Gmbh Motoranordnung mit abgedichtetem Gehäusedeckel
TW202407894A (zh) * 2021-08-30 2024-02-16 美商愛玻索立克公司 封裝基板、半導體封裝、封裝基板製備方法以及半導體封裝製備方法
CN115547939B (zh) * 2022-12-02 2023-03-17 合肥圣达电子科技实业有限公司 一种小体积大电流功率型陶瓷一体化外壳及制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19618631A1 (de) * 1996-05-09 1997-11-13 Teves Gmbh Alfred Vorrichtung zur Messung von Dreh- oder Winkelbewegungen und ein Verfahren zur Herstellung dieser Vorrichtung
US5749746A (en) * 1995-09-26 1998-05-12 Hon Hai Precision Ind. Co., Ltd. Cable connector structure

Family Cites Families (117)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3698074A (en) * 1970-06-29 1972-10-17 Motorola Inc Contact bonding and packaging of integrated circuits
US4305897A (en) * 1978-12-28 1981-12-15 Hitachi Chemical Company, Ltd. Packaging process for semiconductors
JPS5826381B2 (ja) * 1979-04-28 1983-06-02 信越ポリマ−株式会社 電磁気シ−ルドガスケットおよびその製造方法
US4291815B1 (en) * 1980-02-19 1998-09-29 Semiconductor Packaging Materi Ceramic lid assembly for hermetic sealing of a semiconductor chip
US4343376A (en) * 1980-03-18 1982-08-10 Pioneer Electronic Corporation Vibratory elements for audio equipment
JPS5910244A (ja) * 1982-07-09 1984-01-19 Hitachi Ltd 樹脂封止半導体装置
US4736236A (en) * 1984-03-08 1988-04-05 Olin Corporation Tape bonding material and structure for electronic circuit fabrication
US4607276A (en) * 1984-03-08 1986-08-19 Olin Corporation Tape packages
JPS6132452A (ja) * 1984-07-25 1986-02-15 Hitachi Ltd リ−ドフレ−ムとそれを用いた電子装置
US4862246A (en) * 1984-09-26 1989-08-29 Hitachi, Ltd. Semiconductor device lead frame with etched through holes
US4791472A (en) * 1985-09-23 1988-12-13 Hitachi, Ltd. Lead frame and semiconductor device using the same
US4767049A (en) * 1986-05-19 1988-08-30 Olin Corporation Special surfaces for wire bonding
US4814943A (en) * 1986-06-04 1989-03-21 Oki Electric Industry Co., Ltd. Printed circuit devices using thermoplastic resin cover plate
US4942452A (en) * 1987-02-25 1990-07-17 Hitachi, Ltd. Lead frame and semiconductor device
US4820568A (en) * 1987-08-03 1989-04-11 Allied-Signal Inc. Composite and article using short length fibers
US4888449A (en) * 1988-01-04 1989-12-19 Olin Corporation Semiconductor package
US4880591A (en) * 1988-04-05 1989-11-14 Mitsubishi Denki Kabushiki Kaisha Method for manufacturing speaker vibration member
US5151149A (en) * 1988-07-28 1992-09-29 The Entwistle Corporation Apparatus for bonding or melt fusing plastic and plastic matrix composite materials
MY104152A (en) * 1988-08-12 1994-02-28 Mitsui Chemicals Inc Processes for producing semiconductor devices.
US4916523A (en) * 1988-09-19 1990-04-10 Advanced Micro Devices, Inc. Electrical connections via unidirectional conductive elastomer for pin carrier outside lead bond
US4888499A (en) * 1988-10-19 1989-12-19 Ncr Corporation Three input exclusive OR-NOR gate circuit
US5001299A (en) * 1989-04-17 1991-03-19 Explosive Fabricators, Inc. Explosively formed electronic packages
DE4021871C2 (de) * 1990-07-09 1994-07-28 Lsi Logic Products Gmbh Hochintegriertes elektronisches Bauteil
ATE186795T1 (de) * 1990-07-21 1999-12-15 Mitsui Chemicals Inc Halbleiteranordnung mit einer packung
US5238638A (en) * 1990-08-16 1993-08-24 The University Of Akron Process for preparing a self-reinforced thermoplastic composite laminate
JP2971637B2 (ja) * 1991-06-17 1999-11-08 富士通株式会社 半導体装置
US5213748A (en) * 1991-06-27 1993-05-25 At&T Bell Laboratories Method of molding a thermoplastic ring onto a leadframe
DE69233801D1 (de) * 1991-07-24 2011-02-17 Denki Kagaku Kogyo Kk Verfahren zur Herstellung eines Schaltungssubstrates mit einem montierten Halbleiterelement
US5343073A (en) * 1992-01-17 1994-08-30 Olin Corporation Lead frames having a chromium and zinc alloy coating
DE69329542T2 (de) * 1992-06-05 2001-02-08 Mitsui Chemicals Inc Dreidimensionale leiterplatte, elektronische bauelementanordnung unter verwendung dieser leiterplatte und herstellungsverfahren zu dieser leiterplatte
TW332348B (en) * 1992-06-23 1998-05-21 Sony Co Ltd Manufacturing method for solid state motion picture device provides a highly accurate and low cost solid state motion picture device by use of empty package made of resin.
KR0128251Y1 (ko) * 1992-08-21 1998-10-15 문정환 리드 노출형 반도체 조립장치
US5389739A (en) * 1992-12-15 1995-02-14 Hewlett-Packard Company Electronic device packaging assembly
US5436793A (en) * 1993-03-31 1995-07-25 Ncr Corporation Apparatus for containing and cooling an integrated circuit device having a thermally insulative positioning member
JPH0714962A (ja) * 1993-04-28 1995-01-17 Mitsubishi Shindoh Co Ltd リードフレーム材およびリードフレーム
TW270213B (fr) * 1993-12-08 1996-02-11 Matsushita Electric Ind Co Ltd
US5830940A (en) * 1993-12-28 1998-11-03 Toray Industries, Inc. Shaped article of liquid crystalline polymer
JP2936987B2 (ja) * 1993-12-28 1999-08-23 株式会社日立製作所 半導体装置とその製造方法並びに半導体素子搭載用金属支持板及び放熱板
US5461774A (en) * 1994-03-25 1995-10-31 Motorola, Inc. Apparatus and method of elastically bowing a base plate
US5700724A (en) * 1994-08-02 1997-12-23 Philips Electronic North America Corporation Hermetically sealed package for a high power hybrid circuit
JPH0878605A (ja) * 1994-09-01 1996-03-22 Hitachi Ltd リードフレームおよびそれを用いた半導体集積回路装置
US6320257B1 (en) * 1994-09-27 2001-11-20 Foster-Miller, Inc. Chip packaging technique
US5808354A (en) * 1994-11-21 1998-09-15 Samsung Electronics Co., Ltd. Lead frame for a semiconductor device comprising inner leads having a locking means for preventing the movement of molding compound against the inner lead surface
US5586214A (en) * 1994-12-29 1996-12-17 Energy Convertors, Inc. Immersion heating element with electric resistance heating material and polymeric layer disposed thereon
US5708295A (en) * 1995-04-28 1998-01-13 Matsushita Electronics Corporation Lead frame and method of manufacturing the same, and resin sealed semiconductor device and method of manufacturing the same
JPH0922969A (ja) * 1995-05-02 1997-01-21 Nippon Petrochem Co Ltd 電子部品封止材
US5691689A (en) * 1995-08-11 1997-11-25 Eaton Corporation Electrical circuit protection devices comprising PTC conductive liquid crystal polymer compositions
JP3435925B2 (ja) * 1995-08-25 2003-08-11 ソニー株式会社 半導体装置
JPH09107059A (ja) * 1995-10-11 1997-04-22 Toshiba Corp 半導体装置及びその製造方法
FR2741191B1 (fr) * 1995-11-14 1998-01-09 Sgs Thomson Microelectronics Procede de fabrication d'un micromodule, notamment pour cartes a puces
JP2842355B2 (ja) * 1996-02-01 1999-01-06 日本電気株式会社 パッケージ
US5731542A (en) * 1996-05-23 1998-03-24 Motorola, Inc. Apparatus and method for mounting an electronic component to a substrate and method for spray-cooling an electronic component mounted to a substrate
US5792984A (en) * 1996-07-01 1998-08-11 Cts Corporation Molded aluminum nitride packages
US5886397A (en) * 1996-09-05 1999-03-23 International Rectifier Corporation Crushable bead on lead finger side surface to improve moldability
US5736432A (en) * 1996-09-20 1998-04-07 National Semiconductor Corporation Lead frame with lead finger locking feature and method for making same
JP2933036B2 (ja) * 1996-11-29 1999-08-09 日本電気株式会社 中空パッケージ
JP3036450B2 (ja) 1997-01-13 2000-04-24 東レ株式会社 液晶ポリエステル樹脂組成物
FR2764115B1 (fr) * 1997-06-02 2001-06-08 Sgs Thomson Microelectronics Dispositif semiconducteur et procede de connexion des fils internes de masse d'un tel dispositif
US6078125A (en) * 1997-07-22 2000-06-20 Branson Ultrasonics Corp. Ultrasonic apparatus
US5980656A (en) * 1997-07-22 1999-11-09 Olin Corporation Copper alloy with magnesium addition
EP0895287A3 (fr) * 1997-07-31 2006-04-05 Matsushita Electric Industrial Co., Ltd. Dispositif semiconducteur et cadre conducteur pour celui-ci
JP4058172B2 (ja) * 1997-12-02 2008-03-05 株式会社住友金属エレクトロデバイス 光半導体素子収納用パッケージ
US6211463B1 (en) * 1998-01-26 2001-04-03 Saint-Gobain Industrial Ceramics, Inc. Electronic circuit package with diamond film heat conductor
JP3285815B2 (ja) * 1998-03-12 2002-05-27 松下電器産業株式会社 リードフレーム，樹脂封止型半導体装置及びその製造方法
US6181006B1 (en) * 1998-05-28 2001-01-30 Ericsson Inc. Thermally conductive mounting arrangement for securing an integrated circuit package to a heat sink
JP2000007797A (ja) 1998-06-23 2000-01-11 Tsutsunaka Plast Ind Co Ltd 軟質ポリ塩化ビニル系防水シート
US6143981A (en) * 1998-06-24 2000-11-07 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US6239480B1 (en) * 1998-07-06 2001-05-29 Clear Logic, Inc. Modified lead frame for improved parallelism of a die to package
JP3051376B2 (ja) * 1998-08-24 2000-06-12 松下電子工業株式会社 リードフレーム及びその製造方法並びにリードフレームを用いた半導体装置
US6281568B1 (en) * 1998-10-21 2001-08-28 Amkor Technology, Inc. Plastic integrated circuit device package and leadframe having partially undercut leads and die pad
US6521989B2 (en) * 1998-10-08 2003-02-18 Honeywell Inc. Methods and apparatus for hermetically sealing electronic packages
US6448633B1 (en) * 1998-11-20 2002-09-10 Amkor Technology, Inc. Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant
US6204448B1 (en) * 1998-12-04 2001-03-20 Kyocera America, Inc. High frequency microwave packaging having a dielectric gap
US6379795B1 (en) * 1999-01-19 2002-04-30 E. I. Du Pont De Nemours And Company Injection moldable conductive aromatic thermoplastic liquid crystalline polymeric compositions
US6214152B1 (en) 1999-03-22 2001-04-10 Rjr Polymers, Inc. Lead frame moisture barrier for molded plastic electronic packages
US6462413B1 (en) 1999-07-22 2002-10-08 Polese Company, Inc. LDMOS transistor heatsink package assembly and manufacturing method
US7394661B2 (en) * 2004-06-30 2008-07-01 Super Talent Electronics, Inc. System and method for providing a flash memory assembly
KR100403142B1 (ko) * 1999-10-15 2003-10-30 앰코 테크놀로지 코리아 주식회사 반도체패키지
DE29921937U1 (de) * 1999-12-15 2000-03-09 Danfoss Silicon Power Gmbh Leistungshalbleitermodul
US7173336B2 (en) * 2000-01-31 2007-02-06 Sanyo Electric Co., Ltd. Hybrid integrated circuit device
JP2001237349A (ja) * 2000-02-24 2001-08-31 Matsushita Electric Works Ltd 半導体素子収納用パッケージ
JP3429246B2 (ja) * 2000-03-21 2003-07-22 株式会社三井ハイテック リードフレームパターン及びこれを用いた半導体装置の製造方法
US7042068B2 (en) * 2000-04-27 2006-05-09 Amkor Technology, Inc. Leadframe and semiconductor package made using the leadframe
US6424031B1 (en) * 2000-05-08 2002-07-23 Amkor Technology, Inc. Stackable package with heat sink
JP4494587B2 (ja) * 2000-05-11 2010-06-30 古河電気工業株式会社 光半導体素子用パッケージおよび前記パッケージを用いた光半導体素子モジュール
US6353257B1 (en) * 2000-05-19 2002-03-05 Siliconware Precision Industries Co., Ltd. Semiconductor package configuration based on lead frame having recessed and shouldered portions for flash prevention
US6483178B1 (en) * 2000-07-14 2002-11-19 Siliconware Precision Industries Co., Ltd. Semiconductor device package structure
TW521555B (en) * 2000-08-25 2003-02-21 Hitachi Aic Inc Electronic device sealing electronic element therein and manufacturing method thereof, and printed wiring board suitable for such electronic device
JP3533159B2 (ja) * 2000-08-31 2004-05-31 Ｎｅｃ化合物デバイス株式会社 半導体装置及びその製造方法
JP3602453B2 (ja) * 2000-08-31 2004-12-15 Ｎｅｃエレクトロニクス株式会社 半導体装置
JP2002076170A (ja) * 2000-09-01 2002-03-15 Kyocera Corp 半導体素子収納用パッケージおよびその製造方法
JP3418373B2 (ja) * 2000-10-24 2003-06-23 エヌ・アール・エス・テクノロジー株式会社 弾性表面波装置及びその製造方法
US6661083B2 (en) * 2001-02-27 2003-12-09 Chippac, Inc Plastic semiconductor package
US6663946B2 (en) * 2001-02-28 2003-12-16 Kyocera Corporation Multi-layer wiring substrate
JP3436253B2 (ja) * 2001-03-01 2003-08-11 松下電器産業株式会社 樹脂封止型半導体装置およびその製造方法
JP3436254B2 (ja) * 2001-03-01 2003-08-11 松下電器産業株式会社 リードフレームおよびその製造方法
KR100369393B1 (ko) * 2001-03-27 2003-02-05 앰코 테크놀로지 코리아 주식회사 리드프레임 및 이를 이용한 반도체패키지와 그 제조 방법
JP2002314030A (ja) * 2001-04-12 2002-10-25 Mitsubishi Electric Corp 半導体装置
US7034382B2 (en) * 2001-04-16 2006-04-25 M/A-Com, Inc. Leadframe-based chip scale package
US20020180018A1 (en) * 2001-05-29 2002-12-05 Shermer Charles A. Leadframe locking structures and method therefor
FR2825515B1 (fr) * 2001-05-31 2003-12-12 St Microelectronics Sa Boitier semi-conducteur a grille evidee et grille evidee
WO2003032957A2 (fr) * 2001-06-28 2003-04-24 Microchips, Inc. Procede de fermeture hermetique de dispositifs a puits contenant des microplaquettes
US6511866B1 (en) 2001-07-12 2003-01-28 Rjr Polymers, Inc. Use of diverse materials in air-cavity packaging of electronic devices
US6657298B1 (en) * 2001-07-18 2003-12-02 Amkor Technology, Inc. Integrated circuit chip package having an internal lead
ITMI20011965A1 (it) * 2001-09-21 2003-03-21 St Microelectronics Srl Conduttori di un contenitore del tipo no-lead di un dispositivo semiconduttore
US20030178718A1 (en) * 2001-11-05 2003-09-25 Ehly Jonathan P. Hermetically enhanced plastic package for microelectronics and manufacturing process
US6630726B1 (en) * 2001-11-07 2003-10-07 Amkor Technology, Inc. Power semiconductor package with strap
DE10158770B4 (de) * 2001-11-29 2006-08-03 Infineon Technologies Ag Leiterrahmen und Bauelement mit einem Leiterrahmen
JP2003204027A (ja) * 2002-01-09 2003-07-18 Matsushita Electric Ind Co Ltd リードフレーム及びその製造方法、樹脂封止型半導体装置及びその製造方法
US6955941B2 (en) * 2002-03-07 2005-10-18 Micron Technology, Inc. Methods and apparatus for packaging semiconductor devices
JP2004059702A (ja) * 2002-07-26 2004-02-26 Matsushita Electric Works Ltd 高周波用熱可塑性樹脂組成物及び成形品
US6794738B2 (en) * 2002-09-23 2004-09-21 Texas Instruments Incorporated Leadframe-to-plastic lock for IC package
JP3896324B2 (ja) * 2002-11-28 2007-03-22 ジャパンゴアテックス株式会社 液晶ポリマーブレンドフィルム
JP2004179584A (ja) * 2002-11-29 2004-06-24 Toyo Jushi Kk トランジスタパッケージ及びその製造方法
US7091602B2 (en) * 2002-12-13 2006-08-15 Freescale Semiconductor, Inc. Miniature moldlocks for heatsink or flag for an overmolded plastic package
US20040124505A1 (en) * 2002-12-27 2004-07-01 Mahle Richard L. Semiconductor device package with leadframe-to-plastic lock
SG157957A1 (en) * 2003-01-29 2010-01-29 Interplex Qlp Inc Package for integrated circuit die

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5749746A (en) * 1995-09-26 1998-05-12 Hon Hai Precision Ind. Co., Ltd. Cable connector structure
DE19618631A1 (de) * 1996-05-09 1997-11-13 Teves Gmbh Alfred Vorrichtung zur Messung von Dreh- oder Winkelbewegungen und ein Verfahren zur Herstellung dieser Vorrichtung

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US6867367B2 (en) 2005-03-15
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