ATE186795T1 - Halbleiteranordnung mit einer packung - Google Patents

Halbleiteranordnung mit einer packung

Info

Publication number
ATE186795T1
ATE186795T1 AT91112124T AT91112124T ATE186795T1 AT E186795 T1 ATE186795 T1 AT E186795T1 AT 91112124 T AT91112124 T AT 91112124T AT 91112124 T AT91112124 T AT 91112124T AT E186795 T1 ATE186795 T1 AT E186795T1
Authority
AT
Austria
Prior art keywords
semiconductor arrangement
package semiconductor
package
semiconductor device
package construction
Prior art date
Application number
AT91112124T
Other languages
English (en)
Inventor
Shigeru Katayama
Nagaura Gou
Kaoru Tominaga
Junichi Yoshitake
Original Assignee
Mitsui Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP19361790A external-priority patent/JP3080236B2/ja
Priority claimed from JP3142056A external-priority patent/JP2539111B2/ja
Application filed by Mitsui Chemicals Inc filed Critical Mitsui Chemicals Inc
Application granted granted Critical
Publication of ATE186795T1 publication Critical patent/ATE186795T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/564—Details not otherwise provided for, e.g. protection against moisture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12033—Gunn diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
AT91112124T 1990-07-21 1991-07-19 Halbleiteranordnung mit einer packung ATE186795T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP19361790A JP3080236B2 (ja) 1990-07-21 1990-07-21 耐湿性および放熱性の改良された半導体装置およびその製造方法
JP2710691 1991-02-21
JP3142056A JP2539111B2 (ja) 1991-02-21 1991-06-13 耐湿性の改良された半導体装置およびその製造方法

Publications (1)

Publication Number Publication Date
ATE186795T1 true ATE186795T1 (de) 1999-12-15

Family

ID=27285663

Family Applications (1)

Application Number Title Priority Date Filing Date
AT91112124T ATE186795T1 (de) 1990-07-21 1991-07-19 Halbleiteranordnung mit einer packung

Country Status (6)

Country Link
US (2) US5343076A (de)
EP (1) EP0468379B1 (de)
KR (1) KR100250969B1 (de)
AT (1) ATE186795T1 (de)
CA (1) CA2047486C (de)
DE (1) DE69131784T2 (de)

Families Citing this family (190)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW332348B (en) * 1992-06-23 1998-05-21 Sony Co Ltd Manufacturing method for solid state motion picture device provides a highly accurate and low cost solid state motion picture device by use of empty package made of resin.
TW238419B (de) * 1992-08-21 1995-01-11 Olin Corp
JP3192507B2 (ja) * 1992-12-18 2001-07-30 三菱電機株式会社 樹脂シール中空型半導体装置の製造方法
JPH0737706A (ja) * 1993-07-19 1995-02-07 Murata Mfg Co Ltd 半導体セラミック素子
US5477009A (en) * 1994-03-21 1995-12-19 Motorola, Inc. Resealable multichip module and method therefore
JP3233535B2 (ja) * 1994-08-15 2001-11-26 株式会社東芝 半導体装置及びその製造方法
KR0148733B1 (ko) * 1995-04-27 1998-08-01 문정환 고체 촬상 소자용 패키지 및 그 제조방법
JPH0964240A (ja) 1995-08-25 1997-03-07 Toshiba Corp 半導体装置および半導体装置の製造方法
JP3435925B2 (ja) 1995-08-25 2003-08-11 ソニー株式会社 半導体装置
JP3292798B2 (ja) * 1995-10-04 2002-06-17 三菱電機株式会社 半導体装置
JPH09307051A (ja) * 1996-05-15 1997-11-28 Toshiba Corp 樹脂封止型半導体装置及びその製造方法
US6159764A (en) * 1997-07-02 2000-12-12 Micron Technology, Inc. Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages
US6531334B2 (en) * 1997-07-10 2003-03-11 Sony Corporation Method for fabricating hollow package with a solid-state image device
JPH1174403A (ja) * 1997-08-28 1999-03-16 Mitsubishi Electric Corp 半導体装置
KR100246366B1 (ko) * 1997-12-04 2000-03-15 김영환 에리어 어레이형 반도체 패키지 및 그 제조방법
US7270867B1 (en) 1998-06-10 2007-09-18 Asat Ltd. Leadless plastic chip carrier
US6229200B1 (en) 1998-06-10 2001-05-08 Asat Limited Saw-singulated leadless plastic chip carrier
US8330270B1 (en) 1998-06-10 2012-12-11 Utac Hong Kong Limited Integrated circuit package having a plurality of spaced apart pad portions
US7005326B1 (en) 1998-06-24 2006-02-28 Amkor Technology, Inc. Method of making an integrated circuit package
US7332375B1 (en) 1998-06-24 2008-02-19 Amkor Technology, Inc. Method of making an integrated circuit package
US7030474B1 (en) 1998-06-24 2006-04-18 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US7112474B1 (en) 1998-06-24 2006-09-26 Amkor Technology, Inc. Method of making an integrated circuit package
US7071541B1 (en) 1998-06-24 2006-07-04 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US6893900B1 (en) 1998-06-24 2005-05-17 Amkor Technology, Inc. Method of making an integrated circuit package
US6143981A (en) 1998-06-24 2000-11-07 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US6281568B1 (en) 1998-10-21 2001-08-28 Amkor Technology, Inc. Plastic integrated circuit device package and leadframe having partially undercut leads and die pad
US6753922B1 (en) 1998-10-13 2004-06-22 Intel Corporation Image sensor mounted by mass reflow
US6448633B1 (en) 1998-11-20 2002-09-10 Amkor Technology, Inc. Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant
DE19983826T1 (de) * 1998-12-21 2002-03-07 Intel Corp Mit einem Fenster versehenes nicht-keramisches Gehäuse mit einem eingebetteten Rahmen
US6258630B1 (en) * 1999-02-04 2001-07-10 Nec Corporation Resin-sealed semiconductor device having island for mounting semiconductor element coupled to heat spreader
US6214152B1 (en) * 1999-03-22 2001-04-10 Rjr Polymers, Inc. Lead frame moisture barrier for molded plastic electronic packages
US6448629B2 (en) * 1999-07-29 2002-09-10 International Business Machines Corporation Semiconductor device and method of making same
KR100379089B1 (ko) 1999-10-15 2003-04-08 앰코 테크놀로지 코리아 주식회사 리드프레임 및 이를 이용한 반도체패키지
KR100403142B1 (ko) * 1999-10-15 2003-10-30 앰코 테크놀로지 코리아 주식회사 반도체패키지
KR100526844B1 (ko) * 1999-10-15 2005-11-08 앰코 테크놀로지 코리아 주식회사 반도체패키지 및 그 제조방법
KR20010037247A (ko) 1999-10-15 2001-05-07 마이클 디. 오브라이언 반도체패키지
JP2001196488A (ja) * 1999-10-26 2001-07-19 Nec Corp 電子部品装置及びその製造方法
JP3430204B2 (ja) * 1999-10-27 2003-07-28 エヌ・アール・エス・テクノロジー株式会社 中空モールドパッケージ装置
US6580159B1 (en) 1999-11-05 2003-06-17 Amkor Technology, Inc. Integrated circuit device packages and substrates for making the packages
US20070176287A1 (en) * 1999-11-05 2007-08-02 Crowley Sean T Thin integrated circuit device packages for improved radio frequency performance
US6847103B1 (en) 1999-11-09 2005-01-25 Amkor Technology, Inc. Semiconductor package with exposed die pad and body-locking leadframe
US6476478B1 (en) 1999-11-12 2002-11-05 Amkor Technology, Inc. Cavity semiconductor package with exposed leads and die pad
US6329220B1 (en) * 1999-11-23 2001-12-11 Micron Technology, Inc. Packages for semiconductor die
US6639308B1 (en) * 1999-12-16 2003-10-28 Amkor Technology, Inc. Near chip size semiconductor package
KR100421774B1 (ko) 1999-12-16 2004-03-10 앰코 테크놀로지 코리아 주식회사 반도체패키지 및 그 제조 방법
JP3406270B2 (ja) * 2000-02-17 2003-05-12 沖電気工業株式会社 半導体装置及びその製造方法
US6384472B1 (en) * 2000-03-24 2002-05-07 Siliconware Precision Industries Co., Ltd Leadless image sensor package structure and method for making the same
KR100583494B1 (ko) * 2000-03-25 2006-05-24 앰코 테크놀로지 코리아 주식회사 반도체패키지
KR100559664B1 (ko) 2000-03-25 2006-03-10 앰코 테크놀로지 코리아 주식회사 반도체패키지
US6525405B1 (en) * 2000-03-30 2003-02-25 Alphatec Holding Company Limited Leadless semiconductor product packaging apparatus having a window lid and method for packaging
US7042068B2 (en) 2000-04-27 2006-05-09 Amkor Technology, Inc. Leadframe and semiconductor package made using the leadframe
US6643919B1 (en) * 2000-05-19 2003-11-11 Siliconware Precision Industries Co., Ltd. Method of fabricating a semiconductor device package having a core-hollowed portion without causing resin flash on lead frame
US6559537B1 (en) * 2000-08-31 2003-05-06 Micron Technology, Inc. Ball grid array packages with thermally conductive containers
JP3418373B2 (ja) * 2000-10-24 2003-06-23 エヌ・アール・エス・テクノロジー株式会社 弾性表面波装置及びその製造方法
KR20020058209A (ko) * 2000-12-29 2002-07-12 마이클 디. 오브라이언 반도체패키지
KR100731007B1 (ko) * 2001-01-15 2007-06-22 앰코 테크놀로지 코리아 주식회사 적층형 반도체 패키지
KR100394030B1 (ko) * 2001-01-15 2003-08-06 앰코 테크놀로지 코리아 주식회사 적층형 반도체 패키지
US6605865B2 (en) 2001-03-19 2003-08-12 Amkor Technology, Inc. Semiconductor package with optimized leadframe bonding strength
US6967395B1 (en) 2001-03-20 2005-11-22 Amkor Technology, Inc. Mounting for a package containing a chip
US6545345B1 (en) 2001-03-20 2003-04-08 Amkor Technology, Inc. Mounting for a package containing a chip
EP1246235A1 (de) * 2001-03-26 2002-10-02 European Semiconductor Assembly (Eurasem) B.V. Verfahren zum Einkapseln eines Chips mit empfindlicher Oberfläche
KR100393448B1 (ko) 2001-03-27 2003-08-02 앰코 테크놀로지 코리아 주식회사 반도체 패키지 및 그 제조 방법
KR100369393B1 (ko) * 2001-03-27 2003-02-05 앰코 테크놀로지 코리아 주식회사 리드프레임 및 이를 이용한 반도체패키지와 그 제조 방법
US7045883B1 (en) 2001-04-04 2006-05-16 Amkor Technology, Inc. Thermally enhanced chip scale lead on chip semiconductor package and method of making same
US7064009B1 (en) 2001-04-04 2006-06-20 Amkor Technology, Inc. Thermally enhanced chip scale lead on chip semiconductor package and method of making same
US6756658B1 (en) 2001-04-06 2004-06-29 Amkor Technology, Inc. Making two lead surface mounting high power microleadframe semiconductor packages
US6900527B1 (en) 2001-09-19 2005-05-31 Amkor Technology, Inc. Lead-frame method and assembly for interconnecting circuits within a circuit module
US7485952B1 (en) 2001-09-19 2009-02-03 Amkor Technology, Inc. Drop resistant bumpers for fully molded memory cards
US6611047B2 (en) 2001-10-12 2003-08-26 Amkor Technology, Inc. Semiconductor package with singulation crease
US6703700B2 (en) * 2001-10-12 2004-03-09 Cheng-Ho Hsu Semiconductor packaging structure
US6633005B2 (en) 2001-10-22 2003-10-14 Micro Mobio Corporation Multilayer RF amplifier module
US6630726B1 (en) 2001-11-07 2003-10-07 Amkor Technology, Inc. Power semiconductor package with strap
US6798046B1 (en) 2002-01-22 2004-09-28 Amkor Technology, Inc. Semiconductor package including ring structure connected to leads with vertically downset inner ends
US6885086B1 (en) 2002-03-05 2005-04-26 Amkor Technology, Inc. Reduced copper lead frame for saw-singulated chip package
US6608366B1 (en) 2002-04-15 2003-08-19 Harry J. Fogelson Lead frame with plated end leads
US6627977B1 (en) 2002-05-09 2003-09-30 Amkor Technology, Inc. Semiconductor package including isolated ring structure
US6906403B2 (en) * 2002-06-04 2005-06-14 Micron Technology, Inc. Sealed electronic device packages with transparent coverings
US6841414B1 (en) 2002-06-19 2005-01-11 Amkor Technology, Inc. Saw and etch singulation method for a chip package
US6867071B1 (en) 2002-07-12 2005-03-15 Amkor Technology, Inc. Leadframe including corner leads and semiconductor package using same
US7732914B1 (en) 2002-09-03 2010-06-08 Mclellan Neil Cavity-type integrated circuit package
US6818973B1 (en) 2002-09-09 2004-11-16 Amkor Technology, Inc. Exposed lead QFP package fabricated through the use of a partial saw process
US6919620B1 (en) 2002-09-17 2005-07-19 Amkor Technology, Inc. Compact flash memory card with clamshell leadframe
US7723210B2 (en) 2002-11-08 2010-05-25 Amkor Technology, Inc. Direct-write wafer level chip scale package
US7190062B1 (en) 2004-06-15 2007-03-13 Amkor Technology, Inc. Embedded leadframe semiconductor package
US6905914B1 (en) 2002-11-08 2005-06-14 Amkor Technology, Inc. Wafer level package and fabrication method
US7361533B1 (en) 2002-11-08 2008-04-22 Amkor Technology, Inc. Stacked embedded leadframe
ITMI20022467A1 (it) * 2002-11-20 2004-05-21 St Microelectronics Srl Processo per realizzare un transistore di selezione di byte per
US6798047B1 (en) 2002-12-26 2004-09-28 Amkor Technology, Inc. Pre-molded leadframe
SG157957A1 (en) * 2003-01-29 2010-01-29 Interplex Qlp Inc Package for integrated circuit die
US6847099B1 (en) 2003-02-05 2005-01-25 Amkor Technology Inc. Offset etched corner leads for semiconductor package
US6750545B1 (en) 2003-02-28 2004-06-15 Amkor Technology, Inc. Semiconductor package capable of die stacking
US6927483B1 (en) 2003-03-07 2005-08-09 Amkor Technology, Inc. Semiconductor package exhibiting efficient lead placement
US7001799B1 (en) 2003-03-13 2006-02-21 Amkor Technology, Inc. Method of making a leadframe for semiconductor devices
US6794740B1 (en) 2003-03-13 2004-09-21 Amkor Technology, Inc. Leadframe package for semiconductor devices
US7095103B1 (en) 2003-05-01 2006-08-22 Amkor Technology, Inc. Leadframe based memory card
US6879034B1 (en) 2003-05-01 2005-04-12 Amkor Technology, Inc. Semiconductor package including low temperature co-fired ceramic substrate
US7008825B1 (en) 2003-05-27 2006-03-07 Amkor Technology, Inc. Leadframe strip having enhanced testability
US6897550B1 (en) 2003-06-11 2005-05-24 Amkor Technology, Inc. Fully-molded leadframe stand-off feature
US7033517B1 (en) 2003-09-15 2006-04-25 Asat Ltd. Method of fabricating a leadless plastic chip carrier
US7245007B1 (en) 2003-09-18 2007-07-17 Amkor Technology, Inc. Exposed lead interposer leadframe package
US6921967B2 (en) * 2003-09-24 2005-07-26 Amkor Technology, Inc. Reinforced die pad support structure
US7138707B1 (en) 2003-10-21 2006-11-21 Amkor Technology, Inc. Semiconductor package including leads and conductive posts for providing increased functionality
US7144517B1 (en) 2003-11-07 2006-12-05 Amkor Technology, Inc. Manufacturing method for leadframe and for semiconductor package using the leadframe
US7211879B1 (en) 2003-11-12 2007-05-01 Amkor Technology, Inc. Semiconductor package with chamfered corners and method of manufacturing the same
US7057268B1 (en) 2004-01-27 2006-06-06 Amkor Technology, Inc. Cavity case with clip/plug for use on multi-media card
US7091594B1 (en) 2004-01-28 2006-08-15 Amkor Technology, Inc. Leadframe type semiconductor package having reduced inductance and its manufacturing method
US20080003722A1 (en) * 2004-04-15 2008-01-03 Chun David D Transfer mold solution for molded multi-media card
US7411289B1 (en) 2004-06-14 2008-08-12 Asat Ltd. Integrated circuit package with partially exposed contact pads and process for fabricating the same
US7091581B1 (en) 2004-06-14 2006-08-15 Asat Limited Integrated circuit package and process for fabricating the same
US7202554B1 (en) 2004-08-19 2007-04-10 Amkor Technology, Inc. Semiconductor package and its manufacturing method
US7595225B1 (en) 2004-10-05 2009-09-29 Chun Ho Fan Leadless plastic chip carrier with contact standoff
US7217991B1 (en) 2004-10-22 2007-05-15 Amkor Technology, Inc. Fan-in leadframe semiconductor package
US20060131709A1 (en) * 2004-12-21 2006-06-22 Caron Michael R Semiconductor die positioning system and a method of bonding a semiconductor die to a substrate
US7358119B2 (en) * 2005-01-12 2008-04-15 Asat Ltd. Thin array plastic package without die attach pad and process for fabricating the same
CN100517738C (zh) * 2005-07-15 2009-07-22 鸿富锦精密工业（深圳）有限公司 影像感测芯片的封装结构
US7348663B1 (en) 2005-07-15 2008-03-25 Asat Ltd. Integrated circuit package and method for fabricating same
US7410830B1 (en) 2005-09-26 2008-08-12 Asat Ltd Leadless plastic chip carrier and method of fabricating same
US7507603B1 (en) 2005-12-02 2009-03-24 Amkor Technology, Inc. Etch singulated semiconductor package
US7572681B1 (en) 2005-12-08 2009-08-11 Amkor Technology, Inc. Embedded electronic component package
US7282786B2 (en) * 2006-01-17 2007-10-16 Advanced Semiconductor Engineering Inc. Semiconductor package and process for making the same
US7449369B2 (en) * 2006-01-23 2008-11-11 Stats Chippac Ltd. Integrated circuit package system with multiple molding
US8629537B2 (en) * 2006-01-23 2014-01-14 Stats Chippac Ltd. Padless die support integrated circuit package system
EP1983567B1 (de) * 2006-02-03 2018-08-15 Mtex Matsumura Corporation Aus harz hergestellte hohle kapselung und herstellungsverfahren dafür
US7902660B1 (en) 2006-05-24 2011-03-08 Amkor Technology, Inc. Substrate for semiconductor device and manufacturing method thereof
KR101496066B1 (ko) 2006-06-02 2015-03-02 히타치가세이가부시끼가이샤 광반도체소자 탑재용 패키지 및 이것을 이용한 광반도체장치
US7968998B1 (en) 2006-06-21 2011-06-28 Amkor Technology, Inc. Side leaded, bottom exposed pad and bottom exposed lead fusion quad flat semiconductor package
CN101589454B (zh) * 2006-12-12 2012-05-16 怡得乐Qlp公司 电子元件的塑料封装体
US9761435B1 (en) 2006-12-14 2017-09-12 Utac Thai Limited Flip chip cavity package
US9082607B1 (en) 2006-12-14 2015-07-14 Utac Thai Limited Molded leadframe substrate semiconductor package
US7687893B2 (en) 2006-12-27 2010-03-30 Amkor Technology, Inc. Semiconductor package having leadframe with exposed anchor pads
US7829990B1 (en) 2007-01-18 2010-11-09 Amkor Technology, Inc. Stackable semiconductor package including laminate interposer
US7982297B1 (en) 2007-03-06 2011-07-19 Amkor Technology, Inc. Stackable semiconductor package having partially exposed semiconductor die and method of fabricating the same
US7977774B2 (en) 2007-07-10 2011-07-12 Amkor Technology, Inc. Fusion quad flat semiconductor package
US7687899B1 (en) 2007-08-07 2010-03-30 Amkor Technology, Inc. Dual laminate package structure with embedded elements
US7777351B1 (en) 2007-10-01 2010-08-17 Amkor Technology, Inc. Thin stacked interposer package
US8089159B1 (en) 2007-10-03 2012-01-03 Amkor Technology, Inc. Semiconductor package with increased I/O density and method of making the same
US7847386B1 (en) 2007-11-05 2010-12-07 Amkor Technology, Inc. Reduced size stacked semiconductor package and method of making the same
US7790512B1 (en) 2007-11-06 2010-09-07 Utac Thai Limited Molded leadframe substrate semiconductor package
US7956453B1 (en) 2008-01-16 2011-06-07 Amkor Technology, Inc. Semiconductor package with patterning layer and method of making same
US7723852B1 (en) 2008-01-21 2010-05-25 Amkor Technology, Inc. Stacked semiconductor package and method of making same
US8067821B1 (en) 2008-04-10 2011-11-29 Amkor Technology, Inc. Flat semiconductor package with half package molding
US7768135B1 (en) 2008-04-17 2010-08-03 Amkor Technology, Inc. Semiconductor package with fast power-up cycle and method of making same
US7808084B1 (en) 2008-05-06 2010-10-05 Amkor Technology, Inc. Semiconductor package with half-etched locking features
US8125064B1 (en) 2008-07-28 2012-02-28 Amkor Technology, Inc. Increased I/O semiconductor package and method of making same
US8184453B1 (en) 2008-07-31 2012-05-22 Amkor Technology, Inc. Increased capacity semiconductor package
US9947605B2 (en) 2008-09-04 2018-04-17 UTAC Headquarters Pte. Ltd. Flip chip cavity package
US7847392B1 (en) 2008-09-30 2010-12-07 Amkor Technology, Inc. Semiconductor device including leadframe with increased I/O
US7989933B1 (en) 2008-10-06 2011-08-02 Amkor Technology, Inc. Increased I/O leadframe and semiconductor device including same
US8008758B1 (en) 2008-10-27 2011-08-30 Amkor Technology, Inc. Semiconductor device with increased I/O leadframe
US8089145B1 (en) 2008-11-17 2012-01-03 Amkor Technology, Inc. Semiconductor device including increased capacity leadframe
US8072050B1 (en) 2008-11-18 2011-12-06 Amkor Technology, Inc. Semiconductor device with increased I/O leadframe including passive device
US7875963B1 (en) 2008-11-21 2011-01-25 Amkor Technology, Inc. Semiconductor device including leadframe having power bars and increased I/O
US7982298B1 (en) 2008-12-03 2011-07-19 Amkor Technology, Inc. Package in package semiconductor device
US8487420B1 (en) 2008-12-08 2013-07-16 Amkor Technology, Inc. Package in package semiconductor device with film over wire
US20170117214A1 (en) 2009-01-05 2017-04-27 Amkor Technology, Inc. Semiconductor device with through-mold via
US8680656B1 (en) 2009-01-05 2014-03-25 Amkor Technology, Inc. Leadframe structure for concentrated photovoltaic receiver package
US8058715B1 (en) 2009-01-09 2011-11-15 Amkor Technology, Inc. Package in package device for RF transceiver module
US8026589B1 (en) 2009-02-23 2011-09-27 Amkor Technology, Inc. Reduced profile stackable semiconductor package
US7960818B1 (en) 2009-03-04 2011-06-14 Amkor Technology, Inc. Conformal shield on punch QFN semiconductor package
US8575742B1 (en) 2009-04-06 2013-11-05 Amkor Technology, Inc. Semiconductor device with increased I/O leadframe including power bars
JP2010267954A (ja) * 2009-04-15 2010-11-25 Panasonic Corp 電子機器
EP2453724A4 (de) * 2009-07-06 2014-11-05 Fujikura Ltd Durchführungsplatte und verfahren zu ihrer herstellung
US8796561B1 (en) 2009-10-05 2014-08-05 Amkor Technology, Inc. Fan out build up substrate stackable package and method
US8937381B1 (en) 2009-12-03 2015-01-20 Amkor Technology, Inc. Thin stackable package and method
US9691734B1 (en) 2009-12-07 2017-06-27 Amkor Technology, Inc. Method of forming a plurality of electronic component packages
US8575732B2 (en) 2010-03-11 2013-11-05 Utac Thai Limited Leadframe based multi terminal IC package
US8324511B1 (en) 2010-04-06 2012-12-04 Amkor Technology, Inc. Through via nub reveal method and structure
US8294276B1 (en) 2010-05-27 2012-10-23 Amkor Technology, Inc. Semiconductor device and fabricating method thereof
US8440554B1 (en) 2010-08-02 2013-05-14 Amkor Technology, Inc. Through via connected backside embedded circuit features structure and method
US8487445B1 (en) 2010-10-05 2013-07-16 Amkor Technology, Inc. Semiconductor device having through electrodes protruding from dielectric layer
US8791501B1 (en) 2010-12-03 2014-07-29 Amkor Technology, Inc. Integrated passive device structure and method
US8674485B1 (en) 2010-12-08 2014-03-18 Amkor Technology, Inc. Semiconductor device including leadframe with downsets
US8390130B1 (en) 2011-01-06 2013-03-05 Amkor Technology, Inc. Through via recessed reveal structure and method
TWI557183B (zh) 2015-12-16 2016-11-11 財團法人工業技術研究院 矽氧烷組成物、以及包含其之光電裝置
US8648450B1 (en) 2011-01-27 2014-02-11 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands
US10636735B2 (en) * 2011-10-14 2020-04-28 Cyntec Co., Ltd. Package structure and the method to fabricate thereof
US8552548B1 (en) 2011-11-29 2013-10-08 Amkor Technology, Inc. Conductive pad on protruding through electrode semiconductor device
US9704725B1 (en) 2012-03-06 2017-07-11 Amkor Technology, Inc. Semiconductor device with leadframe configured to facilitate reduced burr formation
US9129943B1 (en) 2012-03-29 2015-09-08 Amkor Technology, Inc. Embedded component package and fabrication method
US9048298B1 (en) 2012-03-29 2015-06-02 Amkor Technology, Inc. Backside warpage control structure and fabrication method
KR101486790B1 (ko) 2013-05-02 2015-01-28 앰코 테크놀로지 코리아 주식회사 강성보강부를 갖는 마이크로 리드프레임
US9478473B2 (en) * 2013-05-21 2016-10-25 Globalfoundries Inc. Fabricating a microelectronics lid using sol-gel processing
US20140377915A1 (en) * 2013-06-20 2014-12-25 Infineon Technologies Ag Pre-mold for a magnet semiconductor assembly group and method of producing the same
KR101563911B1 (ko) 2013-10-24 2015-10-28 앰코 테크놀로지 코리아 주식회사 반도체 패키지
MY184608A (en) * 2013-12-10 2021-04-07 Carsem M Sdn Bhd Pre-molded integrated circuit packages
US9673122B2 (en) 2014-05-02 2017-06-06 Amkor Technology, Inc. Micro lead frame structure having reinforcing portions and method
US10504736B2 (en) * 2015-09-30 2019-12-10 Texas Instruments Incorporated Plating interconnect for silicon chip
CN109427698B (zh) * 2017-09-04 2023-08-29 恩智浦美国有限公司 组装qfp型半导体器件的方法
US11945714B2 (en) 2020-07-30 2024-04-02 Stmicroelectronics S.R.L. Electronic device and corresponding method
CN115312549A (zh) * 2021-05-05 2022-11-08 胜丽国际股份有限公司 传感器封装结构

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3762039A (en) * 1971-09-10 1973-10-02 Mos Technology Inc Plastic encapsulation of microcircuits
US3981074A (en) * 1974-08-23 1976-09-21 Nitto Electric Industrial Co., Ltd. Method for producing plastic base caps for split cavity type package semi-conductor units
US3930114A (en) * 1975-03-17 1975-12-30 Nat Semiconductor Corp Integrated circuit package utilizing novel heat sink structure
JPS51138165A (en) * 1975-05-23 1976-11-29 Mitsubishi Electric Corp Package stracture for thermal resistance and shield
JPS529502A (en) * 1975-07-11 1977-01-25 Teijin Ltd Method of making printing plate
JPS5869174A (ja) * 1981-10-21 1983-04-25 Hitachi Ltd 固体撮像装置
JPS58106840A (ja) * 1981-12-18 1983-06-25 Hitachi Ltd 半導体装置およびその製造方法
JPS58148440A (ja) * 1982-02-27 1983-09-03 Toshiba Chem Corp プラスチツクｉｃチツプパツケ−ジ
JPS59172253A (ja) * 1983-03-18 1984-09-28 Mitsubishi Electric Corp 半導体装置
JPS59155160A (ja) * 1984-01-23 1984-09-04 Hitachi Ltd 樹脂封止型電子装置
JPH0812887B2 (ja) * 1985-04-13 1996-02-07 富士通株式会社 高速集積回路パツケ−ジ
JPS61252652A (ja) * 1985-05-02 1986-11-10 Matsushita Electronics Corp 樹脂封止型半導体装置
JPH061797B2 (ja) * 1986-02-19 1994-01-05 住友金属鉱山株式会社 リードフレームの製造方法
JPH0746709B2 (ja) * 1986-08-11 1995-05-17 イビデン株式会社 電子部品搭載用基板
JPS6354756A (ja) * 1986-08-25 1988-03-09 Ibiden Co Ltd 電子部品搭載用基板
JPS63116462A (ja) * 1986-11-05 1988-05-20 Tomoegawa Paper Co Ltd 固体撮像装置のシ−リング方法
JPS63152159A (ja) * 1986-12-17 1988-06-24 Kyocera Corp 半導体パツケ−ジの製法
US4961106A (en) * 1987-03-27 1990-10-02 Olin Corporation Metal packages having improved thermal dissipation
JPS63250846A (ja) * 1987-04-08 1988-10-18 Hitachi Ltd 面付実装用ｌｓｉプラスチツクパツケ−ジとその製造方法
JPS63308355A (ja) * 1987-06-10 1988-12-15 Mitsubishi Electric Corp 樹脂封止型半導体装置
CA1303248C (en) * 1987-06-30 1992-06-09 Hitoyuki Sakanoue Semiconductor heat dissipating apparatus
JP2600689B2 (ja) * 1987-07-06 1997-04-16 ソニー株式会社 半導体装置用中空パッケージ
US4953002A (en) * 1988-03-31 1990-08-28 Honeywell Inc. Semiconductor device housing with magnetic field protection
IT1221258B (it) * 1988-06-22 1990-06-27 Sgs Thomson Microelectronics Contenitore plastico a cavita' per dispositivi semiconduttore
US4994895A (en) * 1988-07-11 1991-02-19 Fujitsu Limited Hybrid integrated circuit package structure
JP2660295B2 (ja) * 1988-08-24 1997-10-08 イビデン株式会社 電子部品搭載用基板
JPH02105545A (ja) * 1988-10-14 1990-04-18 Nec Corp 樹脂封止型半導体装置の製造方法
JPH02105542A (ja) * 1988-10-14 1990-04-18 Nec Corp 樹脂封止型半導体装置の製造方法
JP2585771B2 (ja) * 1988-12-16 1997-02-26 三菱電機株式会社 半導体装置の製造方法
JP2778107B2 (ja) * 1989-02-14 1998-07-23 三菱電機株式会社 集積回路のシールド構造
JPH0350758A (ja) * 1989-07-18 1991-03-05 Toshiba Corp 樹脂封止型半導体装置
US4975761A (en) * 1989-09-05 1990-12-04 Advanced Micro Devices, Inc. High performance plastic encapsulated package for integrated circuit die
JPH03108744A (ja) * 1989-09-22 1991-05-08 Toshiba Corp 樹脂封止型半導体装置
JPH0760837B2 (ja) * 1990-03-13 1995-06-28 株式会社東芝 樹脂封止型半導体装置
JP2568752B2 (ja) * 1990-11-14 1997-01-08 松下電子工業株式会社 半導体装置
JPH06344745A (ja) * 1993-06-14 1994-12-20 Aisin Seiki Co Ltd サスペンション制御系の脱調検出装置

Also Published As

Publication number Publication date
CA2047486A1 (en) 1992-01-22
DE69131784D1 (de) 1999-12-23
EP0468379A3 (en) 1993-12-22
KR920003484A (ko) 1992-02-29
KR100250969B1 (ko) 2000-04-15
US5343076A (en) 1994-08-30
EP0468379A2 (de) 1992-01-29
DE69131784T2 (de) 2000-05-18
US6048754A (en) 2000-04-11
CA2047486C (en) 2002-03-05
EP0468379B1 (de) 1999-11-17

Similar Documents

Publication Publication Date Title
ATE186795T1 (de) Halbleiteranordnung mit einer packung
DE69118066D1 (de) Oberflächenemittierender Halbleiterlaser
DE69113069D1 (de) Silikondichtungsmasse mit niedrigem Modul.
FR2707102B1 (fr) Dispositif d'amortissement d'oscillations.
FR2670856B1 (fr) Dispositif d'amortissement d'oscillations.
DE69231409D1 (de) Oberflächenmontierbare Halbleiterpackung
BR9107196A (pt) Embalagem substancialmente retangular compreendida de um material que e reciciavel,componivel ou biodegradavel
ATE206877T1 (de) Fluorierte kasein-mizellen
ATE25194T1 (de) Damenbinde.
SE9100751D0 (sv) Tallrik
IT1207832B (it) Procedimento per la generazione elettronica di una immagine termica e dispositivo per l'esecuzione del procedimento.
DE69222084D1 (de) Oberflächenmontierbare Halbleiterpackung
DE69115799D1 (de) Herstellung von Halbleiterpackungen
DE3751681D1 (de) Lichtempfindliches Element
NO912811D0 (no) Underlagsplate.
IT1223258B (it) Dispositivo per l'essiccazione di scatole, ovvero pacchetti, incollati
ATE87817T1 (de) Monatsbinde.
ES512615A0 (es) "una disposicion de circuito que comprende un circuito integrado de semiconductores".
DE58906823D1 (de) Implantat.
ATE117772T1 (de) Montageelement.
ATE128929T1 (de) Behälterelement.
SE8404351L (sv) Begare
DK0610976T3 (da) Fugtabsorberende struktur
DE59104508D1 (de) Monolithisch integrierte halbleiteranordnung mit einer deckelektrode.
IT9083415A0 (it) Dispositivo di regolazione della conicita' di confezioni tessili.