ITMI20022467A1 - Processo per realizzare un transistore di selezione di byte per - Google Patents
Processo per realizzare un transistore di selezione di byte perInfo
- Publication number
- ITMI20022467A1 ITMI20022467A1 IT002467A ITMI20022467A ITMI20022467A1 IT MI20022467 A1 ITMI20022467 A1 IT MI20022467A1 IT 002467 A IT002467 A IT 002467A IT MI20022467 A ITMI20022467 A IT MI20022467A IT MI20022467 A1 ITMI20022467 A1 IT MI20022467A1
- Authority
- IT
- Italy
- Prior art keywords
- realizing
- selection transistor
- byte selection
- byte
- transistor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
- H10B41/35—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region with a cell select transistor, e.g. NAND
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0408—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors
- G11C16/0433—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors comprising cells containing a single floating gate transistor and one or more separate select transistors
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT002467A ITMI20022467A1 (it) | 2002-11-20 | 2002-11-20 | Processo per realizzare un transistore di selezione di byte per |
US10/715,887 US6972454B2 (en) | 2002-11-20 | 2003-11-18 | Process for manufacturing a byte selection transistor for a matrix of non volatile memory cells and corresponding structure |
US11/258,675 US7456467B2 (en) | 2002-11-20 | 2005-10-25 | Process for manufacturing a byte selection transistor for a matrix of non volatile memory cells and corresponding structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT002467A ITMI20022467A1 (it) | 2002-11-20 | 2002-11-20 | Processo per realizzare un transistore di selezione di byte per |
Publications (1)
Publication Number | Publication Date |
---|---|
ITMI20022467A1 true ITMI20022467A1 (it) | 2004-05-21 |
Family
ID=32750473
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT002467A ITMI20022467A1 (it) | 2002-11-20 | 2002-11-20 | Processo per realizzare un transistore di selezione di byte per |
Country Status (2)
Country | Link |
---|---|
US (2) | US6972454B2 (it) |
IT (1) | ITMI20022467A1 (it) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4521366B2 (ja) * | 2006-02-22 | 2010-08-11 | 株式会社東芝 | 不揮発性半導体記憶装置及び不揮発性半導体記憶装置の製造方法 |
US9129856B2 (en) * | 2011-07-08 | 2015-09-08 | Broadcom Corporation | Method for efficiently fabricating memory cells with logic FETs and related structure |
Family Cites Families (40)
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US4960732A (en) * | 1987-02-19 | 1990-10-02 | Advanced Micro Devices, Inc. | Contact plug and interconnect employing a barrier lining and a backfilled conductor material |
DE68911420T2 (de) * | 1988-08-18 | 1994-05-11 | Seiko Epson Corp | Festkörper-Bildaufnahmevorrichtung. |
US5264393A (en) * | 1988-11-25 | 1993-11-23 | Fuji Photo Film Co., Ltd. | Solid state image pickup device and method of manufacturing the same |
JPH0821638B2 (ja) * | 1989-12-15 | 1996-03-04 | 株式会社東芝 | 不揮発性半導体記憶装置およびその製造方法 |
ATE186795T1 (de) * | 1990-07-21 | 1999-12-15 | Mitsui Chemicals Inc | Halbleiteranordnung mit einer packung |
DE69312676T2 (de) * | 1993-02-17 | 1997-12-04 | Sgs Thomson Microelectronics | Prozess zur Herstellung von integrierten Bauelementen einschliesslich nichtvolatiler Speicher und Transistoren mit Tunneloxidschutz |
US5958100A (en) * | 1993-06-03 | 1999-09-28 | Micron Technology, Inc. | Process of making a glass semiconductor package |
US5458716A (en) * | 1994-05-25 | 1995-10-17 | Texas Instruments Incorporated | Methods for manufacturing a thermally enhanced molded cavity package having a parallel lid |
US5865935A (en) * | 1995-02-02 | 1999-02-02 | Eastman Kodak Company | Method of packaging image sensors |
KR0148733B1 (ko) * | 1995-04-27 | 1998-08-01 | 문정환 | 고체 촬상 소자용 패키지 및 그 제조방법 |
US6028351A (en) * | 1996-10-09 | 2000-02-22 | Texas Instruments Incorporated | Gasket sealed integrated circuit package |
US6117705A (en) * | 1997-04-18 | 2000-09-12 | Amkor Technology, Inc. | Method of making integrated circuit package having adhesive bead supporting planar lid above planar substrate |
DE69734278D1 (de) * | 1997-07-03 | 2006-02-09 | St Microelectronics Srl | Herstellungsverfahren eines nichtflüchtigen Halbleiterspeicherbauelementes mit abgeschirmtem Einpolysiliziumgate-Speicherabschnitt |
US5811799A (en) * | 1997-07-31 | 1998-09-22 | Wu; Liang-Chung | Image sensor package having a wall with a sealed cover |
US6028773A (en) * | 1997-11-14 | 2000-02-22 | Stmicroelectronics, Inc. | Packaging for silicon sensors |
US6037655A (en) * | 1998-01-12 | 2000-03-14 | Eastman Kodak Company | Linear image sensor package assembly |
US6130448A (en) * | 1998-08-21 | 2000-10-10 | Gentex Corporation | Optical sensor package and method of making same |
US6753922B1 (en) * | 1998-10-13 | 2004-06-22 | Intel Corporation | Image sensor mounted by mass reflow |
DE69826471D1 (de) * | 1998-10-15 | 2004-10-28 | St Microelectronics Srl | Verfahren zum Herstellen von nicht selbstausgerichteten, FLOTOX-EEPROM-speicherzellen |
EP0996162A1 (en) * | 1998-10-21 | 2000-04-26 | STMicroelectronics S.r.l. | Low resistance contact structure for a select transistor of EEPROM memory cells |
IT1303281B1 (it) * | 1998-10-30 | 2000-11-06 | St Microelectronics Srl | Cella di memoria di tipo eeprom con soglia regolata mediante impiantoe procedimento per la sua fabbricazione. |
US6297540B1 (en) * | 1999-06-03 | 2001-10-02 | Intel Corporation | Microlens for surface mount products |
US6147389A (en) * | 1999-06-04 | 2000-11-14 | Silicon Film Technologies, Inc. | Image sensor package with image plane reference |
US6117193A (en) * | 1999-10-20 | 2000-09-12 | Amkor Technology, Inc. | Optical sensor array mounting and alignment |
US6266197B1 (en) * | 1999-12-08 | 2001-07-24 | Amkor Technology, Inc. | Molded window array for image sensor packages |
US6384472B1 (en) * | 2000-03-24 | 2002-05-07 | Siliconware Precision Industries Co., Ltd | Leadless image sensor package structure and method for making the same |
US6285064B1 (en) * | 2000-03-28 | 2001-09-04 | Omnivision Technologies, Inc. | Chip scale packaging technique for optical image sensing integrated circuits |
JP4926337B2 (ja) * | 2000-06-28 | 2012-05-09 | アバゴ・テクノロジーズ・ジェネラル・アイピー(シンガポール)プライベート・リミテッド | 光源 |
US6432752B1 (en) * | 2000-08-17 | 2002-08-13 | Micron Technology, Inc. | Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages |
US6614103B1 (en) * | 2000-09-01 | 2003-09-02 | General Electric Company | Plastic packaging of LED arrays |
TW458377U (en) * | 2000-11-23 | 2001-10-01 | Siliconware Precision Industries Co Ltd | Sensor structure of quad flat package without external leads |
US6414384B1 (en) * | 2000-12-22 | 2002-07-02 | Silicon Precision Industries Co., Ltd. | Package structure stacking chips on front surface and back surface of substrate |
US20020089025A1 (en) * | 2001-01-05 | 2002-07-11 | Li-Kun Chou | Package structure for image IC |
TW473951B (en) * | 2001-01-17 | 2002-01-21 | Siliconware Precision Industries Co Ltd | Non-leaded quad flat image sensor package |
US6737720B2 (en) * | 2001-01-23 | 2004-05-18 | Mon Nan Ho | Packaging structure of image sensor and method for packaging the same |
US6559539B2 (en) * | 2001-01-24 | 2003-05-06 | Hsiu Wen Tu | Stacked package structure of image sensor |
KR20010044277A (ko) * | 2001-01-31 | 2001-06-05 | 김영선 | 방열지붕이 몰딩된 플라스틱 패캐지(피피엠시) |
US6639360B2 (en) * | 2001-01-31 | 2003-10-28 | Gentex Corporation | High power radiation emitter device and heat dissipating package for electronic components |
US6569709B2 (en) * | 2001-10-15 | 2003-05-27 | Micron Technology, Inc. | Assemblies including stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween, packages including the assemblies, and methods |
US20040038442A1 (en) * | 2002-08-26 | 2004-02-26 | Kinsman Larry D. | Optically interactive device packages and methods of assembly |
-
2002
- 2002-11-20 IT IT002467A patent/ITMI20022467A1/it unknown
-
2003
- 2003-11-18 US US10/715,887 patent/US6972454B2/en not_active Expired - Fee Related
-
2005
- 2005-10-25 US US11/258,675 patent/US7456467B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20040152267A1 (en) | 2004-08-05 |
US6972454B2 (en) | 2005-12-06 |
US7456467B2 (en) | 2008-11-25 |
US20060043461A1 (en) | 2006-03-02 |
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