KR20100031781A - 프린트 배선판 및 그 제조 방법 - Google Patents
프린트 배선판 및 그 제조 방법 Download PDFInfo
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- KR20100031781A KR20100031781A KR1020107004245A KR20107004245A KR20100031781A KR 20100031781 A KR20100031781 A KR 20100031781A KR 1020107004245 A KR1020107004245 A KR 1020107004245A KR 20107004245 A KR20107004245 A KR 20107004245A KR 20100031781 A KR20100031781 A KR 20100031781A
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09827—Tapered, e.g. tapered hole, via or groove
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09836—Oblique hole, via or bump
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
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- Optics & Photonics (AREA)
- Physics & Mathematics (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
도 2 는 스루홀의 네크부의 접합 단면을 나타내는 개략도이다.
도 3 은 인접하는 스루홀의 중심 위치가 상이한 예를 나타내는 개략도이다.
도 4(a) ∼ 도 4(d) 는 본 발명의 일 실시예에 관한 프린트 배선판을 제조하는 공정의 일부를 나타내는 도면이다.
도 5(a) ∼ 도 5(d) 는 본 발명의 일 실시예에 관한 프린트 배선판을 제조하는 공정의 일부를 나타내는 도면이다.
도 6(a) ∼ 도 6(d) 는 본 발명의 일 실시예에 관한 프린트 배선판을 제조하는 공정의 일부를 나타내는 도면이다.
도 7(a) ∼ 도 7(b) 는 스루홀의 중심 위치의 어긋남 양이 큰 경우의 기형상 (奇形狀) 을 설명하기 위한 개략도이다.
도 8 은 관통공의 내벽에 스루홀 도체를 형성하고, 추가로 스루홀 도체로 둘러싸인 공극에 충전재를 충전하여 이루어지는 스루홀을 나타내는 개략도이다.
도 9(a) ∼ 도 9(d) 는 종래 기술에 관한 프린트 배선판의 제조 공정을 나타내는 도면이다.
도 10(a) ∼ 도 10(b) 는 종래 기술에 관한 다른 프린트 배선판의 스루홀 형상을 설명하기 위한 도면이다.
Claims (6)
- 절연성 수지 기재에 형성한 관통공 내에 도금 충전하여 이루어지는 스루홀을 갖는 프린트 배선판으로서,
상기 절연성 수지 기재의 표면 및 이면으로부터 노출되는 각 스루홀의 중심축의 위치가 서로 어긋나 있음과 함께, 상기 스루홀은 네크부를 갖는 형상이고, 인접하는 스루홀에 있어서, 각각의 네크부를 이은 선으로 둘러싸이는 평면 영역의 중심 위치가, 상기 절연성 수지 기재의 단면 방향에서 서로 어긋나 있는 것을 특징으로 하는 프린트 배선판. - 절연성 수지 기재에 형성한 관통공 내에 도금 충전하여 이루어지는 스루홀을 갖고, 또한 그 스루홀에 의해 전기적으로 접속되는 내층의 도체 회로를 상기 절연성 수지 기재의 표면 및 이면에 갖는 코어 기판과, 그 코어 기판 상에 수지 절연층과 외층의 도체 회로를 교대로 형성하여 이루어지는 프린트 배선판으로서,
상기 절연성 수지 기재의 표면 및 이면으로부터 노출되는 각 스루홀의 중심축의 위치가 서로 어긋나 있음과 함께, 상기 스루홀은 네크부를 갖는 형상이고, 인접하는 스루홀에 있어서, 각각의 네크부를 이은 선으로 둘러싸이는 평면 영역의 중심 위치가, 상기 절연성 수지 기재의 단면 방향에서 서로 어긋나 있는 것을 특징으로 하는 프린트 배선판. - 제 1 항 또는 제 2 항에 있어서,
상기 어긋남 양은 5 ㎛ ∼ 30 ㎛ 인 것을 특징으로 하는 프린트 배선판. - 제 1 항 또는 제 2 항에 있어서,
상기 절연성 수지 기재의 두께는 100 ㎛ ∼ 500 ㎛ 인 것을 특징으로 하는 프린트 배선판. - 제 1 항 또는 제 2 항에 있어서,
상기 스루홀은, 상기 절연성 수지 기재의 표면 및 이면으로부터 각각 내부를 향함에 따라 직경이 감소되어 이루어지는 네크부를 갖는 형상으로서, 상기 절연성 수지 기재의 표면 및 이면 측에 각각 노출되는 개구의 직경이 75 ㎛ ∼ 300 ㎛ 이고, 상기 절연성 수지 기재의 내부의 네크부의 직경이 50 ㎛ ∼ 250 ㎛ 인 것을 특징으로 하는 프린트 배선판. - 제 1 항 또는 제 2 항에 있어서,
인접하는 스루홀 사이의 피치는 100 ㎛ ∼ 400 ㎛ 인 것을 특징으로 하는 프린트 배선판.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JPJP-P-2006-044968 | 2006-02-22 | ||
JP2006044968A JP5021216B2 (ja) | 2006-02-22 | 2006-02-22 | プリント配線板およびその製造方法 |
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KR1020087006576A Division KR20080037096A (ko) | 2006-02-22 | 2007-02-20 | 프린트 배선판 및 그 제조 방법 |
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KR20100031781A true KR20100031781A (ko) | 2010-03-24 |
KR101008239B1 KR101008239B1 (ko) | 2011-01-17 |
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KR1020107004245A KR101008239B1 (ko) | 2006-02-22 | 2007-02-20 | 프린트 배선판 및 그 제조 방법 |
KR1020107028885A KR101153761B1 (ko) | 2006-02-22 | 2007-02-20 | 프린트 배선판 및 그 제조 방법 |
KR1020117012456A KR101516851B1 (ko) | 2006-02-22 | 2007-02-20 | 프린트 배선판 및 그 제조 방법 |
KR1020107004243A KR20100029858A (ko) | 2006-02-22 | 2007-02-20 | 프린트 배선판 및 그 제조 방법 |
KR1020107004246A KR101039547B1 (ko) | 2006-02-22 | 2007-02-20 | 프린트 배선판 및 그 제조 방법 |
KR1020087006576A KR20080037096A (ko) | 2006-02-22 | 2007-02-20 | 프린트 배선판 및 그 제조 방법 |
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KR1020107028885A KR101153761B1 (ko) | 2006-02-22 | 2007-02-20 | 프린트 배선판 및 그 제조 방법 |
KR1020117012456A KR101516851B1 (ko) | 2006-02-22 | 2007-02-20 | 프린트 배선판 및 그 제조 방법 |
KR1020107004243A KR20100029858A (ko) | 2006-02-22 | 2007-02-20 | 프린트 배선판 및 그 제조 방법 |
KR1020107004246A KR101039547B1 (ko) | 2006-02-22 | 2007-02-20 | 프린트 배선판 및 그 제조 방법 |
KR1020087006576A KR20080037096A (ko) | 2006-02-22 | 2007-02-20 | 프린트 배선판 및 그 제조 방법 |
Country Status (7)
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US (6) | US7786390B2 (ko) |
EP (1) | EP1988758A4 (ko) |
JP (1) | JP5021216B2 (ko) |
KR (6) | KR101008239B1 (ko) |
CN (6) | CN101888742B (ko) |
TW (5) | TWI383719B (ko) |
WO (1) | WO2007097440A1 (ko) |
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