KR102498957B1 - 반도체 장치 - Google Patents
반도체 장치 Download PDFInfo
- Publication number
- KR102498957B1 KR102498957B1 KR1020227027427A KR20227027427A KR102498957B1 KR 102498957 B1 KR102498957 B1 KR 102498957B1 KR 1020227027427 A KR1020227027427 A KR 1020227027427A KR 20227027427 A KR20227027427 A KR 20227027427A KR 102498957 B1 KR102498957 B1 KR 102498957B1
- Authority
- KR
- South Korea
- Prior art keywords
- film
- oxide semiconductor
- conductive film
- semiconductor film
- transistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
-
- H01L27/1225—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133345—Insulating layers
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133512—Light shielding layers, e.g. black matrix
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
- G02F1/13394—Gaskets; Spacers; Sealing of cells spacers regularly patterned on the cell subtrate, e.g. walls, pillars
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
-
- H01L27/1233—
-
- H01L27/1251—
-
- H01L29/7869—
-
- H01L29/78696—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
- H10D30/6733—Multi-gate TFTs
- H10D30/6734—Multi-gate TFTs having gate electrodes arranged on both top and bottom sides of the channel, e.g. dual-gate TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6757—Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
- H10D62/213—Channel regions of field-effect devices
- H10D62/221—Channel regions of field-effect devices of FETs
- H10D62/235—Channel regions of field-effect devices of FETs of IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/62—Electrodes ohmically coupled to a semiconductor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
- H10D86/423—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
- H10D86/427—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer having different thicknesses of the semiconductor bodies in different TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/441—Interconnections, e.g. scanning lines
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/471—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having different architectures, e.g. having both top-gate and bottom-gate TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/481—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs integrated with passive devices, e.g. auxiliary capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1216—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Engineering & Computer Science (AREA)
- Geometry (AREA)
- Thin Film Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Electroluminescent Light Sources (AREA)
- Semiconductor Integrated Circuits (AREA)
- Liquid Crystal (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Bipolar Transistors (AREA)
- Noodles (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020237003341A KR102674371B1 (ko) | 2013-12-27 | 2014-12-17 | 반도체 장치 |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013271783 | 2013-12-27 | ||
| JPJP-P-2013-271783 | 2013-12-27 | ||
| PCT/IB2014/066995 WO2015097597A1 (en) | 2013-12-27 | 2014-12-17 | Semiconductor device |
| KR1020227003134A KR102433044B1 (ko) | 2013-12-27 | 2014-12-17 | 반도체 장치 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020227003134A Division KR102433044B1 (ko) | 2013-12-27 | 2014-12-17 | 반도체 장치 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020237003341A Division KR102674371B1 (ko) | 2013-12-27 | 2014-12-17 | 반도체 장치 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20220116349A KR20220116349A (ko) | 2022-08-22 |
| KR102498957B1 true KR102498957B1 (ko) | 2023-02-16 |
Family
ID=53477636
Family Applications (9)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020227027427A Active KR102498957B1 (ko) | 2013-12-27 | 2014-12-17 | 반도체 장치 |
| KR1020217022068A Active KR102358423B1 (ko) | 2013-12-27 | 2014-12-17 | 표시 장치 |
| KR1020167020353A Active KR102239942B1 (ko) | 2013-12-27 | 2014-12-17 | 반도체 장치 |
| KR1020197030265A Active KR102310399B1 (ko) | 2013-12-27 | 2014-12-17 | 반도체 장치 |
| KR1020247042794A Pending KR20250007050A (ko) | 2013-12-27 | 2014-12-17 | 반도체 장치 |
| KR1020197030271A Active KR102279875B1 (ko) | 2013-12-27 | 2014-12-17 | 반도체 장치 |
| KR1020227003134A Active KR102433044B1 (ko) | 2013-12-27 | 2014-12-17 | 반도체 장치 |
| KR1020247018821A Active KR102748400B1 (ko) | 2013-12-27 | 2014-12-17 | 반도체 장치 |
| KR1020237003341A Active KR102674371B1 (ko) | 2013-12-27 | 2014-12-17 | 반도체 장치 |
Family Applications After (8)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020217022068A Active KR102358423B1 (ko) | 2013-12-27 | 2014-12-17 | 표시 장치 |
| KR1020167020353A Active KR102239942B1 (ko) | 2013-12-27 | 2014-12-17 | 반도체 장치 |
| KR1020197030265A Active KR102310399B1 (ko) | 2013-12-27 | 2014-12-17 | 반도체 장치 |
| KR1020247042794A Pending KR20250007050A (ko) | 2013-12-27 | 2014-12-17 | 반도체 장치 |
| KR1020197030271A Active KR102279875B1 (ko) | 2013-12-27 | 2014-12-17 | 반도체 장치 |
| KR1020227003134A Active KR102433044B1 (ko) | 2013-12-27 | 2014-12-17 | 반도체 장치 |
| KR1020247018821A Active KR102748400B1 (ko) | 2013-12-27 | 2014-12-17 | 반도체 장치 |
| KR1020237003341A Active KR102674371B1 (ko) | 2013-12-27 | 2014-12-17 | 반도체 장치 |
Country Status (6)
| Country | Link |
|---|---|
| US (8) | US9356098B2 (enExample) |
| JP (10) | JP6506545B2 (enExample) |
| KR (9) | KR102498957B1 (enExample) |
| CN (5) | CN110600485B (enExample) |
| TW (7) | TWI665502B (enExample) |
| WO (1) | WO2015097597A1 (enExample) |
Families Citing this family (50)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110265482B (zh) * | 2013-12-02 | 2023-08-08 | 株式会社半导体能源研究所 | 显示装置 |
| JP2015188062A (ja) | 2014-02-07 | 2015-10-29 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| CN111081734B (zh) * | 2014-03-17 | 2025-10-03 | 三星显示有限公司 | 薄膜晶体管元件基板及其制造方法、和有机el显示装置 |
| JP2016111104A (ja) * | 2014-12-03 | 2016-06-20 | 株式会社Joled | 薄膜半導体基板の製造方法 |
| JP6736321B2 (ja) | 2015-03-27 | 2020-08-05 | 株式会社半導体エネルギー研究所 | 半導体装置の製造方法 |
| JP6736351B2 (ja) * | 2015-06-19 | 2020-08-05 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| WO2017064590A1 (en) | 2015-10-12 | 2017-04-20 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| JP6821982B2 (ja) * | 2015-10-27 | 2021-01-27 | 天馬微電子有限公司 | 薄膜トランジスタ、表示装置及び薄膜トランジスタの製造方法 |
| US10243010B2 (en) * | 2015-11-30 | 2019-03-26 | Sharp Kabushiki Kaisha | Semiconductor substrate and display device |
| JP6560610B2 (ja) * | 2015-12-18 | 2019-08-14 | 株式会社ジャパンディスプレイ | 表示装置 |
| KR102789164B1 (ko) | 2015-12-29 | 2025-03-28 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 금속 산화물막 및 반도체 장치 |
| JP6941567B2 (ja) | 2016-01-29 | 2021-09-29 | 株式会社半導体エネルギー研究所 | 半導体装置、モジュール及び電子機器 |
| KR102340066B1 (ko) * | 2016-04-07 | 2021-12-15 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 박리 방법 및 플렉시블 디바이스의 제작 방법 |
| CN205621414U (zh) * | 2016-04-26 | 2016-10-05 | 京东方科技集团股份有限公司 | 静电放电电路、阵列基板和显示装置 |
| KR102660292B1 (ko) * | 2016-06-23 | 2024-04-24 | 삼성디스플레이 주식회사 | 박막 트랜지스터 패널 및 그 제조 방법 |
| US10916430B2 (en) * | 2016-07-25 | 2021-02-09 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| CN106125387B (zh) * | 2016-08-23 | 2019-07-30 | 中节能万润股份有限公司 | 一种pdlc显示器和pdlc电子阅读器 |
| TWI875538B (zh) * | 2016-08-29 | 2025-03-01 | 日商半導體能源研究所股份有限公司 | 顯示裝置及控制程式 |
| US20180061867A1 (en) * | 2016-08-31 | 2018-03-01 | Apple Inc. | Methods of protecting semiconductor oxide channel in hybrid tft process flow |
| KR102586938B1 (ko) * | 2016-09-05 | 2023-10-10 | 삼성디스플레이 주식회사 | 박막 트랜지스터 표시판 및 그 제조 방법 |
| WO2018047067A1 (en) * | 2016-09-12 | 2018-03-15 | Semiconductor Energy Laboratory Co., Ltd. | Display device and electronic device |
| JP2018049919A (ja) * | 2016-09-21 | 2018-03-29 | 株式会社ジャパンディスプレイ | 表示装置 |
| KR102471021B1 (ko) * | 2016-09-29 | 2022-11-25 | 삼성디스플레이 주식회사 | 박막 트랜지스터 표시판 및 이의 제조 방법 |
| KR102512925B1 (ko) * | 2016-11-23 | 2023-03-21 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치, 표시 모듈, 및 전자 기기 |
| KR20180076422A (ko) * | 2016-12-27 | 2018-07-06 | 삼성디스플레이 주식회사 | 색 변환 패널 및 이를 포함하는 표시 장치 |
| JP6732713B2 (ja) * | 2017-10-04 | 2020-07-29 | 株式会社Joled | 半導体装置および表示装置 |
| US10249695B2 (en) | 2017-03-24 | 2019-04-02 | Apple Inc. | Displays with silicon and semiconducting-oxide top-gate thin-film transistors |
| CN108039351B (zh) * | 2017-12-04 | 2021-01-26 | 京东方科技集团股份有限公司 | 一种阵列基板及其制备方法、显示装置 |
| WO2019175708A1 (ja) * | 2018-03-16 | 2019-09-19 | 株式会社半導体エネルギー研究所 | 半導体装置、および半導体装置の作製方法 |
| JP6795543B2 (ja) * | 2018-04-27 | 2020-12-02 | 株式会社Joled | 半導体装置の製造方法 |
| JP7410935B2 (ja) | 2018-05-24 | 2024-01-10 | ザ リサーチ ファウンデーション フォー ザ ステイト ユニバーシティー オブ ニューヨーク | 容量性センサ |
| US11600489B2 (en) * | 2018-06-08 | 2023-03-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the semiconductor device |
| KR102614573B1 (ko) * | 2018-10-22 | 2023-12-18 | 삼성디스플레이 주식회사 | 트랜지스터 기판 및 이를 포함하는 표시 장치 |
| CN112216705B (zh) * | 2019-07-11 | 2024-12-24 | 天马日本株式会社 | 薄膜晶体管衬底 |
| GB2610886B (en) | 2019-08-21 | 2023-09-13 | Pragmatic Printing Ltd | Resistor geometry |
| GB2587793B (en) | 2019-08-21 | 2023-03-22 | Pragmatic Printing Ltd | Electronic circuit comprising transistor and resistor |
| KR102885296B1 (ko) * | 2019-08-30 | 2025-11-12 | 삼성디스플레이 주식회사 | 표시 장치 |
| CN110690228B (zh) * | 2019-09-06 | 2022-03-08 | 深圳市华星光电半导体显示技术有限公司 | 阵列基板及显示面板 |
| JP7434818B2 (ja) * | 2019-11-12 | 2024-02-21 | 株式会社レゾナック | 珪素含有酸化物被覆窒化アルミニウム粒子の製造方法および放熱性樹脂組成物の製造方法 |
| US11513085B2 (en) * | 2020-02-20 | 2022-11-29 | Kla Corporation | Measurement and control of wafer tilt for x-ray based metrology |
| KR102730121B1 (ko) * | 2020-10-27 | 2024-11-14 | 엘지디스플레이 주식회사 | 박막 트랜지스터 어레이 기판 및 이를 포함하는 전자장치 |
| TWI753712B (zh) * | 2020-12-21 | 2022-01-21 | 財團法人工業技術研究院 | 微機電紅外光感測裝置 |
| CN112687706A (zh) * | 2020-12-29 | 2021-04-20 | 深圳市华星光电半导体显示技术有限公司 | 一种显示面板及显示面板的制备方法 |
| CN116868350A (zh) * | 2021-02-18 | 2023-10-10 | 株式会社日本显示器 | 半导体器件和半导体器件的制作方法 |
| KR20230064677A (ko) | 2021-11-03 | 2023-05-11 | 삼성디스플레이 주식회사 | 박막트랜지스터, 박막트랜지스터의 제조방법, 박막트랜지스터 어레이 기판 및 박막트랜지스터 어레이 기판의 제조방법 |
| KR102690226B1 (ko) * | 2022-06-16 | 2024-08-05 | 한국생산기술연구원 | 박막 트랜지스터 및 이의 제조 방법 |
| TWI802478B (zh) * | 2022-07-27 | 2023-05-11 | 友達光電股份有限公司 | 主動元件基板 |
| CN116013975B (zh) * | 2023-02-20 | 2025-11-28 | 惠科股份有限公司 | 阵列基板、阵列基板的制作方法、显示面板及显示器 |
| CN119137648A (zh) | 2023-02-24 | 2024-12-13 | 京东方科技集团股份有限公司 | 像素驱动电路及驱动方法、显示基板、显示装置 |
| CN116504815B (zh) * | 2023-06-27 | 2024-02-06 | 南京邮电大学 | 一种高功率a-IGZO薄膜晶体管及其制备方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013002295A (ja) | 2011-06-13 | 2013-01-07 | Daikin Industries Ltd | スクリュー圧縮機 |
Family Cites Families (224)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60198861A (ja) | 1984-03-23 | 1985-10-08 | Fujitsu Ltd | 薄膜トランジスタ |
| JPH0244256B2 (ja) | 1987-01-28 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn2o5deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
| JPH0244260B2 (ja) | 1987-02-24 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn5o8deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
| JPS63210023A (ja) | 1987-02-24 | 1988-08-31 | Natl Inst For Res In Inorg Mater | InGaZn↓4O↓7で示される六方晶系の層状構造を有する化合物およびその製造法 |
| JPH0244258B2 (ja) | 1987-02-24 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn3o6deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
| JPH0244262B2 (ja) | 1987-02-27 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn6o9deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
| JPH0244263B2 (ja) | 1987-04-22 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn7o10deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
| JPH027563A (ja) | 1988-06-27 | 1990-01-11 | Hitachi Ltd | 半導体装置の製造方法 |
| JPH05251705A (ja) | 1992-03-04 | 1993-09-28 | Fuji Xerox Co Ltd | 薄膜トランジスタ |
| JPH08330599A (ja) | 1994-11-29 | 1996-12-13 | Sanyo Electric Co Ltd | 薄膜トランジスタ、その製造方法及び表示装置 |
| JP3479375B2 (ja) | 1995-03-27 | 2003-12-15 | 科学技術振興事業団 | 亜酸化銅等の金属酸化物半導体による薄膜トランジスタとpn接合を形成した金属酸化物半導体装置およびそれらの製造方法 |
| WO1997006554A2 (en) | 1995-08-03 | 1997-02-20 | Philips Electronics N.V. | Semiconductor device provided with transparent switching element |
| JP3625598B2 (ja) | 1995-12-30 | 2005-03-02 | 三星電子株式会社 | 液晶表示装置の製造方法 |
| JP4170454B2 (ja) | 1998-07-24 | 2008-10-22 | Hoya株式会社 | 透明導電性酸化物薄膜を有する物品及びその製造方法 |
| JP2000150861A (ja) | 1998-11-16 | 2000-05-30 | Tdk Corp | 酸化物薄膜 |
| JP3276930B2 (ja) | 1998-11-17 | 2002-04-22 | 科学技術振興事業団 | トランジスタ及び半導体装置 |
| EP1020920B1 (en) | 1999-01-11 | 2010-06-02 | Sel Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having a driver TFT and a pixel TFT on a common substrate |
| JP4558707B2 (ja) | 1999-01-11 | 2010-10-06 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| TW460731B (en) | 1999-09-03 | 2001-10-21 | Ind Tech Res Inst | Electrode structure and production method of wide viewing angle LCD |
| JP4127466B2 (ja) | 2000-07-31 | 2008-07-30 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US6613620B2 (en) | 2000-07-31 | 2003-09-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of manufacturing the same |
| JP4089858B2 (ja) | 2000-09-01 | 2008-05-28 | 国立大学法人東北大学 | 半導体デバイス |
| KR20020038482A (ko) | 2000-11-15 | 2002-05-23 | 모리시타 요이찌 | 박막 트랜지스터 어레이, 그 제조방법 및 그것을 이용한표시패널 |
| JP3997731B2 (ja) | 2001-03-19 | 2007-10-24 | 富士ゼロックス株式会社 | 基材上に結晶性半導体薄膜を形成する方法 |
| JP2002289859A (ja) | 2001-03-23 | 2002-10-04 | Minolta Co Ltd | 薄膜トランジスタ |
| US6952023B2 (en) | 2001-07-17 | 2005-10-04 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device |
| JP4090716B2 (ja) | 2001-09-10 | 2008-05-28 | 雅司 川崎 | 薄膜トランジスタおよびマトリクス表示装置 |
| JP3925839B2 (ja) | 2001-09-10 | 2007-06-06 | シャープ株式会社 | 半導体記憶装置およびその試験方法 |
| JP3600229B2 (ja) * | 2001-10-31 | 2004-12-15 | 株式会社半導体エネルギー研究所 | 電界効果型トランジスタの製造方法 |
| US6737302B2 (en) | 2001-10-31 | 2004-05-18 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method for field-effect transistor |
| JP4164562B2 (ja) | 2002-09-11 | 2008-10-15 | 独立行政法人科学技術振興機構 | ホモロガス薄膜を活性層として用いる透明薄膜電界効果型トランジスタ |
| US7061014B2 (en) | 2001-11-05 | 2006-06-13 | Japan Science And Technology Agency | Natural-superlattice homologous single crystal thin film, method for preparation thereof, and device using said single crystal thin film |
| JP4083486B2 (ja) | 2002-02-21 | 2008-04-30 | 独立行政法人科学技術振興機構 | LnCuO(S,Se,Te)単結晶薄膜の製造方法 |
| US7049190B2 (en) | 2002-03-15 | 2006-05-23 | Sanyo Electric Co., Ltd. | Method for forming ZnO film, method for forming ZnO semiconductor layer, method for fabricating semiconductor device, and semiconductor device |
| JP3933591B2 (ja) | 2002-03-26 | 2007-06-20 | 淳二 城戸 | 有機エレクトロルミネッセント素子 |
| US7339187B2 (en) | 2002-05-21 | 2008-03-04 | State Of Oregon Acting By And Through The Oregon State Board Of Higher Education On Behalf Of Oregon State University | Transistor structures |
| CN1229682C (zh) | 2002-05-21 | 2005-11-30 | 精工爱普生株式会社 | 电光装置和电子设备 |
| JP3873814B2 (ja) | 2002-05-21 | 2007-01-31 | セイコーエプソン株式会社 | 電気光学装置及び電子機器 |
| JP2004022625A (ja) | 2002-06-13 | 2004-01-22 | Murata Mfg Co Ltd | 半導体デバイス及び該半導体デバイスの製造方法 |
| US7105868B2 (en) | 2002-06-24 | 2006-09-12 | Cermet, Inc. | High-electron mobility transistor with zinc oxide |
| US7067843B2 (en) | 2002-10-11 | 2006-06-27 | E. I. Du Pont De Nemours And Company | Transparent oxide semiconductor thin film transistors |
| JP4166105B2 (ja) | 2003-03-06 | 2008-10-15 | シャープ株式会社 | 半導体装置およびその製造方法 |
| JP2004273732A (ja) | 2003-03-07 | 2004-09-30 | Sharp Corp | アクティブマトリクス基板およびその製造方法 |
| JP4108633B2 (ja) | 2003-06-20 | 2008-06-25 | シャープ株式会社 | 薄膜トランジスタおよびその製造方法ならびに電子デバイス |
| US7262463B2 (en) | 2003-07-25 | 2007-08-28 | Hewlett-Packard Development Company, L.P. | Transistor including a deposited channel region having a doped portion |
| US7282782B2 (en) | 2004-03-12 | 2007-10-16 | Hewlett-Packard Development Company, L.P. | Combined binary oxide semiconductor device |
| US7145174B2 (en) | 2004-03-12 | 2006-12-05 | Hewlett-Packard Development Company, Lp. | Semiconductor device |
| KR101019337B1 (ko) | 2004-03-12 | 2011-03-07 | 도꾸리쯔교세이호징 가가꾸 기쥬쯔 신꼬 기꼬 | 아몰퍼스 산화물 및 박막 트랜지스터 |
| US7297977B2 (en) | 2004-03-12 | 2007-11-20 | Hewlett-Packard Development Company, L.P. | Semiconductor device |
| US7211825B2 (en) | 2004-06-14 | 2007-05-01 | Yi-Chi Shih | Indium oxide-based thin film transistors and circuits |
| JP2006100760A (ja) | 2004-09-02 | 2006-04-13 | Casio Comput Co Ltd | 薄膜トランジスタおよびその製造方法 |
| US7285501B2 (en) | 2004-09-17 | 2007-10-23 | Hewlett-Packard Development Company, L.P. | Method of forming a solution processed device |
| US7298084B2 (en) | 2004-11-02 | 2007-11-20 | 3M Innovative Properties Company | Methods and displays utilizing integrated zinc oxide row and column drivers in conjunction with organic light emitting diodes |
| US7453065B2 (en) | 2004-11-10 | 2008-11-18 | Canon Kabushiki Kaisha | Sensor and image pickup device |
| US7863611B2 (en) | 2004-11-10 | 2011-01-04 | Canon Kabushiki Kaisha | Integrated circuits utilizing amorphous oxides |
| US7829444B2 (en) | 2004-11-10 | 2010-11-09 | Canon Kabushiki Kaisha | Field effect transistor manufacturing method |
| US7791072B2 (en) | 2004-11-10 | 2010-09-07 | Canon Kabushiki Kaisha | Display |
| CN101057338B (zh) | 2004-11-10 | 2011-03-16 | 佳能株式会社 | 采用无定形氧化物的场效应晶体管 |
| CN101057333B (zh) | 2004-11-10 | 2011-11-16 | 佳能株式会社 | 发光器件 |
| JP5138163B2 (ja) | 2004-11-10 | 2013-02-06 | キヤノン株式会社 | 電界効果型トランジスタ |
| CA2585190A1 (en) | 2004-11-10 | 2006-05-18 | Canon Kabushiki Kaisha | Amorphous oxide and field effect transistor |
| US7579224B2 (en) | 2005-01-21 | 2009-08-25 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing a thin film semiconductor device |
| TWI569441B (zh) | 2005-01-28 | 2017-02-01 | 半導體能源研究所股份有限公司 | 半導體裝置,電子裝置,和半導體裝置的製造方法 |
| TWI472037B (zh) | 2005-01-28 | 2015-02-01 | 半導體能源研究所股份有限公司 | 半導體裝置,電子裝置,和半導體裝置的製造方法 |
| US7858451B2 (en) | 2005-02-03 | 2010-12-28 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device, semiconductor device and manufacturing method thereof |
| US7948171B2 (en) | 2005-02-18 | 2011-05-24 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device |
| US20060197092A1 (en) | 2005-03-03 | 2006-09-07 | Randy Hoffman | System and method for forming conductive material on a substrate |
| US8681077B2 (en) | 2005-03-18 | 2014-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, and display device, driving method and electronic apparatus thereof |
| WO2006105077A2 (en) | 2005-03-28 | 2006-10-05 | Massachusetts Institute Of Technology | Low voltage thin film transistor with high-k dielectric material |
| US7645478B2 (en) | 2005-03-31 | 2010-01-12 | 3M Innovative Properties Company | Methods of making displays |
| US8300031B2 (en) | 2005-04-20 | 2012-10-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device comprising transistor having gate and drain connected through a current-voltage conversion element |
| JP2006344849A (ja) | 2005-06-10 | 2006-12-21 | Casio Comput Co Ltd | 薄膜トランジスタ |
| US7402506B2 (en) | 2005-06-16 | 2008-07-22 | Eastman Kodak Company | Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby |
| US7691666B2 (en) | 2005-06-16 | 2010-04-06 | Eastman Kodak Company | Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby |
| US7507618B2 (en) | 2005-06-27 | 2009-03-24 | 3M Innovative Properties Company | Method for making electronic devices using metal oxide nanoparticles |
| KR100711890B1 (ko) | 2005-07-28 | 2007-04-25 | 삼성에스디아이 주식회사 | 유기 발광표시장치 및 그의 제조방법 |
| JP2007059128A (ja) | 2005-08-23 | 2007-03-08 | Canon Inc | 有機el表示装置およびその製造方法 |
| JP4850457B2 (ja) | 2005-09-06 | 2012-01-11 | キヤノン株式会社 | 薄膜トランジスタ及び薄膜ダイオード |
| JP5116225B2 (ja) | 2005-09-06 | 2013-01-09 | キヤノン株式会社 | 酸化物半導体デバイスの製造方法 |
| JP2007073705A (ja) | 2005-09-06 | 2007-03-22 | Canon Inc | 酸化物半導体チャネル薄膜トランジスタおよびその製造方法 |
| JP4280736B2 (ja) | 2005-09-06 | 2009-06-17 | キヤノン株式会社 | 半導体素子 |
| EP1998374A3 (en) | 2005-09-29 | 2012-01-18 | Semiconductor Energy Laboratory Co, Ltd. | Semiconductor device having oxide semiconductor layer and manufacturing method thereof |
| JP5037808B2 (ja) | 2005-10-20 | 2012-10-03 | キヤノン株式会社 | アモルファス酸化物を用いた電界効果型トランジスタ、及び該トランジスタを用いた表示装置 |
| KR101358954B1 (ko) | 2005-11-15 | 2014-02-06 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 다이오드 및 액티브 매트릭스 표시장치 |
| TWI292281B (en) | 2005-12-29 | 2008-01-01 | Ind Tech Res Inst | Pixel structure of active organic light emitting diode and method of fabricating the same |
| US7867636B2 (en) | 2006-01-11 | 2011-01-11 | Murata Manufacturing Co., Ltd. | Transparent conductive film and method for manufacturing the same |
| JP4977478B2 (ja) | 2006-01-21 | 2012-07-18 | 三星電子株式会社 | ZnOフィルム及びこれを用いたTFTの製造方法 |
| US7576394B2 (en) | 2006-02-02 | 2009-08-18 | Kochi Industrial Promotion Center | Thin film transistor including low resistance conductive thin films and manufacturing method thereof |
| US7977169B2 (en) | 2006-02-15 | 2011-07-12 | Kochi Industrial Promotion Center | Semiconductor device including active layer made of zinc oxide with controlled orientations and manufacturing method thereof |
| JP5015470B2 (ja) * | 2006-02-15 | 2012-08-29 | 財団法人高知県産業振興センター | 薄膜トランジスタ及びその製法 |
| KR20070101595A (ko) | 2006-04-11 | 2007-10-17 | 삼성전자주식회사 | ZnO TFT |
| US20070252928A1 (en) | 2006-04-28 | 2007-11-01 | Toppan Printing Co., Ltd. | Structure, transmission type liquid crystal display, reflection type display and manufacturing method thereof |
| US7557498B2 (en) * | 2006-05-17 | 2009-07-07 | Tpo Displays Corp. | System for displaying images including electroluminescent device and method for fabricating the same |
| JP5028033B2 (ja) | 2006-06-13 | 2012-09-19 | キヤノン株式会社 | 酸化物半導体膜のドライエッチング方法 |
| JP4609797B2 (ja) | 2006-08-09 | 2011-01-12 | Nec液晶テクノロジー株式会社 | 薄膜デバイス及びその製造方法 |
| JP4999400B2 (ja) | 2006-08-09 | 2012-08-15 | キヤノン株式会社 | 酸化物半導体膜のドライエッチング方法 |
| JP4332545B2 (ja) | 2006-09-15 | 2009-09-16 | キヤノン株式会社 | 電界効果型トランジスタ及びその製造方法 |
| JP4274219B2 (ja) | 2006-09-27 | 2009-06-03 | セイコーエプソン株式会社 | 電子デバイス、有機エレクトロルミネッセンス装置、有機薄膜半導体装置 |
| JP5164357B2 (ja) | 2006-09-27 | 2013-03-21 | キヤノン株式会社 | 半導体装置及び半導体装置の製造方法 |
| US7622371B2 (en) | 2006-10-10 | 2009-11-24 | Hewlett-Packard Development Company, L.P. | Fused nanocrystal thin film semiconductor and method |
| JP5090708B2 (ja) | 2006-10-20 | 2012-12-05 | 株式会社ジャパンディスプレイイースト | 画像表示装置とその製造方法 |
| JP2008129314A (ja) | 2006-11-21 | 2008-06-05 | Hitachi Displays Ltd | 画像表示装置およびその製造方法 |
| US7772021B2 (en) | 2006-11-29 | 2010-08-10 | Samsung Electronics Co., Ltd. | Flat panel displays comprising a thin-film transistor having a semiconductive oxide in its channel and methods of fabricating the same for use in flat panel displays |
| JP2008140684A (ja) | 2006-12-04 | 2008-06-19 | Toppan Printing Co Ltd | カラーelディスプレイおよびその製造方法 |
| KR101303578B1 (ko) | 2007-01-05 | 2013-09-09 | 삼성전자주식회사 | 박막 식각 방법 |
| US8207063B2 (en) | 2007-01-26 | 2012-06-26 | Eastman Kodak Company | Process for atomic layer deposition |
| KR100851215B1 (ko) | 2007-03-14 | 2008-08-07 | 삼성에스디아이 주식회사 | 박막 트랜지스터 및 이를 이용한 유기 전계 발광표시장치 |
| WO2008126879A1 (en) | 2007-04-09 | 2008-10-23 | Canon Kabushiki Kaisha | Light-emitting apparatus and production method thereof |
| JP5197058B2 (ja) * | 2007-04-09 | 2013-05-15 | キヤノン株式会社 | 発光装置とその作製方法 |
| US7795613B2 (en) | 2007-04-17 | 2010-09-14 | Toppan Printing Co., Ltd. | Structure with transistor |
| KR101325053B1 (ko) | 2007-04-18 | 2013-11-05 | 삼성디스플레이 주식회사 | 박막 트랜지스터 기판 및 이의 제조 방법 |
| KR20080094300A (ko) | 2007-04-19 | 2008-10-23 | 삼성전자주식회사 | 박막 트랜지스터 및 그 제조 방법과 박막 트랜지스터를포함하는 평판 디스플레이 |
| KR101334181B1 (ko) | 2007-04-20 | 2013-11-28 | 삼성전자주식회사 | 선택적으로 결정화된 채널층을 갖는 박막 트랜지스터 및 그제조 방법 |
| WO2008133345A1 (en) | 2007-04-25 | 2008-11-06 | Canon Kabushiki Kaisha | Oxynitride semiconductor |
| KR101345376B1 (ko) | 2007-05-29 | 2013-12-24 | 삼성전자주식회사 | ZnO 계 박막 트랜지스터 및 그 제조방법 |
| TWI354377B (en) * | 2007-05-30 | 2011-12-11 | Au Optronics Corp | Pixel structure of lcd and fabrication method ther |
| KR101375831B1 (ko) | 2007-12-03 | 2014-04-02 | 삼성전자주식회사 | 산화물 반도체 박막 트랜지스터를 이용한 디스플레이 장치 |
| CN103258857B (zh) | 2007-12-13 | 2016-05-11 | 出光兴产株式会社 | 使用了氧化物半导体的场效应晶体管及其制造方法 |
| US8202365B2 (en) | 2007-12-17 | 2012-06-19 | Fujifilm Corporation | Process for producing oriented inorganic crystalline film, and semiconductor device using the oriented inorganic crystalline film |
| JP5704790B2 (ja) | 2008-05-07 | 2015-04-22 | キヤノン株式会社 | 薄膜トランジスタ、および、表示装置 |
| KR101496148B1 (ko) * | 2008-05-15 | 2015-02-27 | 삼성전자주식회사 | 반도체소자 및 그 제조방법 |
| TWI424506B (zh) | 2008-08-08 | 2014-01-21 | Semiconductor Energy Lab | 半導體裝置的製造方法 |
| JP4623179B2 (ja) | 2008-09-18 | 2011-02-02 | ソニー株式会社 | 薄膜トランジスタおよびその製造方法 |
| KR102426826B1 (ko) | 2008-09-19 | 2022-08-01 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR101579050B1 (ko) * | 2008-10-03 | 2015-12-23 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시장치 |
| JP5451280B2 (ja) | 2008-10-09 | 2014-03-26 | キヤノン株式会社 | ウルツ鉱型結晶成長用基板およびその製造方法ならびに半導体装置 |
| US8106400B2 (en) | 2008-10-24 | 2012-01-31 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| KR20180137606A (ko) | 2008-10-24 | 2018-12-27 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제조 방법 |
| KR102556313B1 (ko) | 2008-11-21 | 2023-07-18 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 |
| JP5491833B2 (ja) | 2008-12-05 | 2014-05-14 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US20100224880A1 (en) | 2009-03-05 | 2010-09-09 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| TWI529942B (zh) * | 2009-03-27 | 2016-04-11 | 半導體能源研究所股份有限公司 | 半導體裝置 |
| TWI535023B (zh) | 2009-04-16 | 2016-05-21 | 半導體能源研究所股份有限公司 | 半導體裝置和其製造方法 |
| KR101782176B1 (ko) * | 2009-07-18 | 2017-09-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 제조 방법 |
| CN103489871B (zh) | 2009-07-31 | 2016-03-23 | 株式会社半导体能源研究所 | 半导体装置及其制造方法 |
| KR101073542B1 (ko) | 2009-09-03 | 2011-10-17 | 삼성모바일디스플레이주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
| WO2011027656A1 (en) * | 2009-09-04 | 2011-03-10 | Semiconductor Energy Laboratory Co., Ltd. | Transistor and display device |
| KR101746198B1 (ko) * | 2009-09-04 | 2017-06-12 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시장치 및 전자기기 |
| KR102221207B1 (ko) | 2009-09-04 | 2021-03-03 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치 및 발광 장치를 제작하기 위한 방법 |
| WO2011027702A1 (en) * | 2009-09-04 | 2011-03-10 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and method for manufacturing the same |
| WO2011027664A1 (en) * | 2009-09-04 | 2011-03-10 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device and method for manufacturing the same |
| KR20110037220A (ko) * | 2009-10-06 | 2011-04-13 | 삼성모바일디스플레이주식회사 | 박막 트랜지스터, 그의 제조 방법 및 박막 트랜지스터를 구비하는 유기전계발광 표시 장치 |
| KR20170085148A (ko) | 2009-10-09 | 2017-07-21 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| JP2011091110A (ja) | 2009-10-20 | 2011-05-06 | Canon Inc | 酸化物半導体素子を用いた回路及びその製造方法、並びに表示装置 |
| CN105702688B (zh) | 2009-10-21 | 2020-09-08 | 株式会社半导体能源研究所 | 液晶显示器件及包括该液晶显示器件的电子设备 |
| KR102019239B1 (ko) | 2009-10-30 | 2019-09-06 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR20230172618A (ko) | 2009-11-27 | 2023-12-22 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 제작방법 |
| CN103746001B (zh) | 2009-12-04 | 2017-05-03 | 株式会社半导体能源研究所 | 显示装置 |
| KR101804589B1 (ko) * | 2009-12-11 | 2018-01-10 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제조 방법 |
| WO2011096153A1 (en) | 2010-02-05 | 2011-08-11 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| KR101403409B1 (ko) * | 2010-04-28 | 2014-06-03 | 한국전자통신연구원 | 반도체 장치 및 그 제조 방법 |
| KR101229712B1 (ko) | 2010-05-24 | 2013-02-04 | 샤프 가부시키가이샤 | 박막 트랜지스터 기판 및 그 제조방법 |
| JP2012015491A (ja) * | 2010-06-04 | 2012-01-19 | Semiconductor Energy Lab Co Ltd | 光電変換装置 |
| US8623681B2 (en) | 2010-07-09 | 2014-01-07 | Sharp Kabushiki Kaisha | Thin film transistor substrate, method for manufacturing the same, and liquid crystal display panel |
| US8537600B2 (en) * | 2010-08-04 | 2013-09-17 | Semiconductor Energy Laboratory Co., Ltd. | Low off-state leakage current semiconductor memory device |
| JP5275523B2 (ja) | 2010-11-04 | 2013-08-28 | シャープ株式会社 | 表示装置、ならびに半導体装置および表示装置の製造方法 |
| JP2012104566A (ja) | 2010-11-08 | 2012-05-31 | Toshiba Mobile Display Co Ltd | 薄膜トランジスタ回路基板及びその製造方法 |
| US9443984B2 (en) | 2010-12-28 | 2016-09-13 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| TWI570809B (zh) | 2011-01-12 | 2017-02-11 | 半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
| TWI535032B (zh) | 2011-01-12 | 2016-05-21 | 半導體能源研究所股份有限公司 | 半導體裝置的製造方法 |
| TW202320146A (zh) * | 2011-01-26 | 2023-05-16 | 日商半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
| JP2012160679A (ja) | 2011-02-03 | 2012-08-23 | Sony Corp | 薄膜トランジスタ、表示装置および電子機器 |
| US9023684B2 (en) | 2011-03-04 | 2015-05-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| JP2012191025A (ja) * | 2011-03-11 | 2012-10-04 | Dainippon Printing Co Ltd | 薄膜トランジスタアレー基板、薄膜集積回路装置及びそれらの製造方法 |
| JP5717546B2 (ja) | 2011-06-01 | 2015-05-13 | 三菱電機株式会社 | 薄膜トランジスタ基板およびその製造方法 |
| JP6005401B2 (ja) | 2011-06-10 | 2016-10-12 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US9112036B2 (en) | 2011-06-10 | 2015-08-18 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device |
| KR101860859B1 (ko) | 2011-06-13 | 2018-05-25 | 삼성디스플레이 주식회사 | 박막트랜지스터의 제조 방법, 상기 방법에 의해 제조된 박막트랜지스터, 유기발광표시장치의 제조방법, 및 상기 방법에 의해 제조된 유기발광표시장치 |
| KR20130007426A (ko) * | 2011-06-17 | 2013-01-18 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제작 방법 |
| US9214474B2 (en) | 2011-07-08 | 2015-12-15 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
| US8643008B2 (en) | 2011-07-22 | 2014-02-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US8716073B2 (en) | 2011-07-22 | 2014-05-06 | Semiconductor Energy Laboratory Co., Ltd. | Method for processing oxide semiconductor film and method for manufacturing semiconductor device |
| US8994019B2 (en) | 2011-08-05 | 2015-03-31 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP6026839B2 (ja) | 2011-10-13 | 2016-11-16 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| KR20130040706A (ko) * | 2011-10-14 | 2013-04-24 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 제작 방법 |
| TWI567985B (zh) * | 2011-10-21 | 2017-01-21 | 半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
| JP6226518B2 (ja) | 2011-10-24 | 2017-11-08 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| KR20130055521A (ko) | 2011-11-18 | 2013-05-28 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 소자, 및 반도체 소자의 제작 방법, 및 반도체 소자를 포함하는 반도체 장치 |
| US8981367B2 (en) * | 2011-12-01 | 2015-03-17 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| WO2013089115A1 (en) | 2011-12-15 | 2013-06-20 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| JP6111398B2 (ja) | 2011-12-20 | 2017-04-12 | 株式会社Joled | 表示装置および電子機器 |
| KR102100425B1 (ko) | 2011-12-27 | 2020-04-13 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 제작 방법 |
| KR102101167B1 (ko) * | 2012-02-03 | 2020-04-16 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| US8916424B2 (en) * | 2012-02-07 | 2014-12-23 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| JP6148024B2 (ja) | 2012-02-09 | 2017-06-14 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US20130221345A1 (en) | 2012-02-28 | 2013-08-29 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| JP6142136B2 (ja) | 2012-02-28 | 2017-06-07 | 株式会社Joled | トランジスタの製造方法、表示装置の製造方法および電子機器の製造方法 |
| TW201338173A (zh) | 2012-02-28 | 2013-09-16 | Sony Corp | 電晶體、製造電晶體之方法、顯示裝置及電子機器 |
| US9553200B2 (en) | 2012-02-29 | 2017-01-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| JP6168795B2 (ja) | 2012-03-14 | 2017-07-26 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP6139187B2 (ja) | 2012-03-29 | 2017-05-31 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US8941113B2 (en) | 2012-03-30 | 2015-01-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor element, semiconductor device, and manufacturing method of semiconductor element |
| US8999773B2 (en) | 2012-04-05 | 2015-04-07 | Semiconductor Energy Laboratory Co., Ltd. | Processing method of stacked-layer film and manufacturing method of semiconductor device |
| JP6139952B2 (ja) | 2012-04-13 | 2017-05-31 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP6035195B2 (ja) | 2012-05-01 | 2016-11-30 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP2013235935A (ja) | 2012-05-08 | 2013-11-21 | Canon Inc | 検出装置の製造方法、その検出装置及び検出システム |
| JP5942574B2 (ja) | 2012-05-10 | 2016-06-29 | セイコーエプソン株式会社 | 力検出素子、力検出モジュール、力検出ユニットおよびロボット |
| TWI595502B (zh) * | 2012-05-18 | 2017-08-11 | 半導體能源研究所股份有限公司 | 記憶體裝置和用於驅動記憶體裝置的方法 |
| JP6016455B2 (ja) * | 2012-05-23 | 2016-10-26 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| KR20130136063A (ko) | 2012-06-04 | 2013-12-12 | 삼성디스플레이 주식회사 | 박막 트랜지스터, 이를 포함하는 박막 트랜지스터 표시판 및 그 제조 방법 |
| US9508758B2 (en) | 2012-06-15 | 2016-11-29 | Sony Corporation | Display device, semiconductor device, and method of manufacturing display device |
| US20140014948A1 (en) | 2012-07-12 | 2014-01-16 | Semiconductor Energy Laboratory Co. Ltd. | Semiconductor device |
| DE112013007566B3 (de) | 2012-08-03 | 2018-02-22 | Semiconductor Energy Laboratory Co., Ltd. | Halbleitervorrichtung |
| US8937307B2 (en) | 2012-08-10 | 2015-01-20 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP2014199899A (ja) | 2012-08-10 | 2014-10-23 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| DE102013216824B4 (de) | 2012-08-28 | 2024-10-17 | Semiconductor Energy Laboratory Co., Ltd. | Halbleitervorrichtung |
| TWI575663B (zh) | 2012-08-31 | 2017-03-21 | 半導體能源研究所股份有限公司 | 半導體裝置 |
| US9018624B2 (en) | 2012-09-13 | 2015-04-28 | Semiconductor Energy Laboratory Co., Ltd. | Display device and electronic appliance |
| US8981372B2 (en) | 2012-09-13 | 2015-03-17 | Semiconductor Energy Laboratory Co., Ltd. | Display device and electronic appliance |
| US8927985B2 (en) | 2012-09-20 | 2015-01-06 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| KR20220145922A (ko) | 2012-12-25 | 2022-10-31 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR102770182B1 (ko) | 2012-12-28 | 2025-02-18 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치, 및 반도체 장치의 제작 방법 |
| TWI607510B (zh) | 2012-12-28 | 2017-12-01 | 半導體能源研究所股份有限公司 | 半導體裝置及半導體裝置的製造方法 |
| US9915848B2 (en) | 2013-04-19 | 2018-03-13 | Semiconductor Energy Laboratory Co., Ltd. | Display device and electronic device |
| JP6456598B2 (ja) | 2013-04-19 | 2019-01-23 | 株式会社半導体エネルギー研究所 | 表示装置 |
| US9231002B2 (en) | 2013-05-03 | 2016-01-05 | Semiconductor Energy Laboratory Co., Ltd. | Display device and electronic device |
| US9704894B2 (en) | 2013-05-10 | 2017-07-11 | Semiconductor Energy Laboratory Co., Ltd. | Display device including pixel electrode including oxide |
| JP2015179247A (ja) | 2013-10-22 | 2015-10-08 | 株式会社半導体エネルギー研究所 | 表示装置 |
| JP6625796B2 (ja) | 2013-10-25 | 2019-12-25 | 株式会社半導体エネルギー研究所 | 表示装置 |
| JP2016001712A (ja) | 2013-11-29 | 2016-01-07 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US9577110B2 (en) | 2013-12-27 | 2017-02-21 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device including an oxide semiconductor and the display device including the semiconductor device |
| CN105849796B (zh) | 2013-12-27 | 2020-02-07 | 株式会社半导体能源研究所 | 发光装置 |
| TWI685116B (zh) | 2014-02-07 | 2020-02-11 | 日商半導體能源研究所股份有限公司 | 半導體裝置 |
| JP2015188062A (ja) | 2014-02-07 | 2015-10-29 | 株式会社半導体エネルギー研究所 | 半導体装置 |
-
2014
- 2014-12-10 JP JP2014249834A patent/JP6506545B2/ja active Active
- 2014-12-17 KR KR1020227027427A patent/KR102498957B1/ko active Active
- 2014-12-17 KR KR1020217022068A patent/KR102358423B1/ko active Active
- 2014-12-17 CN CN201910839846.7A patent/CN110600485B/zh active Active
- 2014-12-17 KR KR1020167020353A patent/KR102239942B1/ko active Active
- 2014-12-17 KR KR1020197030265A patent/KR102310399B1/ko active Active
- 2014-12-17 KR KR1020247042794A patent/KR20250007050A/ko active Pending
- 2014-12-17 CN CN201480071297.9A patent/CN105849913B/zh active Active
- 2014-12-17 KR KR1020197030271A patent/KR102279875B1/ko active Active
- 2014-12-17 WO PCT/IB2014/066995 patent/WO2015097597A1/en not_active Ceased
- 2014-12-17 CN CN201911299399.7A patent/CN111446259B/zh active Active
- 2014-12-17 CN CN201910937461.4A patent/CN110676324B/zh active Active
- 2014-12-17 KR KR1020227003134A patent/KR102433044B1/ko active Active
- 2014-12-17 KR KR1020247018821A patent/KR102748400B1/ko active Active
- 2014-12-17 CN CN201910929577.3A patent/CN110690230B/zh active Active
- 2014-12-17 KR KR1020237003341A patent/KR102674371B1/ko active Active
- 2014-12-18 US US14/574,424 patent/US9356098B2/en active Active
- 2014-12-22 TW TW103144801A patent/TWI665502B/zh active
- 2014-12-22 TW TW112128555A patent/TW202425343A/zh unknown
- 2014-12-22 TW TW111110633A patent/TWI814293B/zh active
- 2014-12-22 TW TW109144755A patent/TWI764443B/zh active
- 2014-12-22 TW TW108113528A patent/TWI724411B/zh active
- 2014-12-22 TW TW108136274A patent/TWI727452B/zh active
- 2014-12-22 TW TW108136275A patent/TWI727453B/zh active
-
2016
- 2016-05-23 US US15/161,329 patent/US9831347B2/en active Active
-
2017
- 2017-11-27 US US15/822,648 patent/US10128378B2/en active Active
-
2018
- 2018-11-06 US US16/182,075 patent/US10818795B2/en active Active
-
2019
- 2019-03-29 JP JP2019066590A patent/JP2019114814A/ja not_active Withdrawn
- 2019-03-29 JP JP2019066595A patent/JP6592631B2/ja active Active
- 2019-06-26 JP JP2019118669A patent/JP2019197901A/ja not_active Withdrawn
- 2019-09-20 JP JP2019171981A patent/JP2020031218A/ja not_active Withdrawn
- 2019-09-20 JP JP2019171978A patent/JP2020031217A/ja not_active Withdrawn
- 2019-09-25 US US16/582,225 patent/US11380795B2/en active Active
-
2020
- 2020-03-20 JP JP2020050341A patent/JP6870133B2/ja active Active
- 2020-06-08 JP JP2020099396A patent/JP7118111B2/ja active Active
-
2022
- 2022-06-02 US US17/830,376 patent/US11757041B2/en active Active
- 2022-08-02 JP JP2022123330A patent/JP2022169558A/ja not_active Withdrawn
-
2023
- 2023-08-31 US US18/240,775 patent/US12142688B2/en active Active
-
2024
- 2024-02-05 JP JP2024015437A patent/JP2024045414A/ja not_active Withdrawn
- 2024-10-28 US US18/928,429 patent/US20250056837A1/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013002295A (ja) | 2011-06-13 | 2013-01-07 | Daikin Industries Ltd | スクリュー圧縮機 |
Also Published As
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US12142688B2 (en) | Semiconductor device | |
| JP7782080B2 (ja) | 表示装置 | |
| JP2025183352A (ja) | 半導体装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A107 | Divisional application of patent | ||
| PA0104 | Divisional application for international application |
St.27 status event code: A-0-1-A10-A16-div-PA0104 St.27 status event code: A-0-1-A10-A18-div-PA0104 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| A107 | Divisional application of patent | ||
| PA0104 | Divisional application for international application |
St.27 status event code: A-0-1-A10-A16-div-PA0104 St.27 status event code: A-0-1-A10-A18-div-PA0104 |
|
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
Fee payment year number: 1 St.27 status event code: A-2-2-U10-U12-oth-PR1002 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |