KR101970469B1 - 반도체 장치 - Google Patents
반도체 장치 Download PDFInfo
- Publication number
- KR101970469B1 KR101970469B1 KR1020187018410A KR20187018410A KR101970469B1 KR 101970469 B1 KR101970469 B1 KR 101970469B1 KR 1020187018410 A KR1020187018410 A KR 1020187018410A KR 20187018410 A KR20187018410 A KR 20187018410A KR 101970469 B1 KR101970469 B1 KR 101970469B1
- Authority
- KR
- South Korea
- Prior art keywords
- transistor
- potential
- signal line
- charge storage
- charge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/803—Pixels having integrated switching, control, storage or amplification elements
- H10F39/8037—Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor
- H10F39/80377—Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor characterised by the channel of the transistor, e.g. channel having a doping gradient
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- H01L27/14643—
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- H01L27/14603—
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- H01L27/14616—
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- H01L27/14632—
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- H01L27/14636—
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- H01L29/7869—
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- H01L31/1055—
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
- H04N25/63—Noise processing, e.g. detecting, correcting, reducing or removing noise applied to dark current
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
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- H04N5/361—
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F30/00—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
- H10F30/20—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
- H10F30/21—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation
- H10F30/22—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes
- H10F30/223—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes the potential barrier being a PIN barrier
- H10F30/2235—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes the potential barrier being a PIN barrier the devices comprising Group IV amorphous materials
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/802—Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/811—Interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
- H10F39/026—Wafer-level processing
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Thin Film Transistor (AREA)
- Light Receiving Elements (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010050486 | 2010-03-08 | ||
| JPJP-P-2010-050486 | 2010-03-08 | ||
| PCT/JP2011/054211 WO2011111549A1 (en) | 2010-03-08 | 2011-02-18 | Semiconductor device and manufacturing method thereof |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020177027316A Division KR101874784B1 (ko) | 2010-03-08 | 2011-02-18 | 반도체 장치 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20180078332A KR20180078332A (ko) | 2018-07-09 |
| KR101970469B1 true KR101970469B1 (ko) | 2019-04-19 |
Family
ID=44530519
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020187018410A Active KR101970469B1 (ko) | 2010-03-08 | 2011-02-18 | 반도체 장치 |
| KR1020127026146A Expired - Fee Related KR101784676B1 (ko) | 2010-03-08 | 2011-02-18 | 반도체 장치 및 그 제조방법 |
| KR1020177027316A Active KR101874784B1 (ko) | 2010-03-08 | 2011-02-18 | 반도체 장치 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020127026146A Expired - Fee Related KR101784676B1 (ko) | 2010-03-08 | 2011-02-18 | 반도체 장치 및 그 제조방법 |
| KR1020177027316A Active KR101874784B1 (ko) | 2010-03-08 | 2011-02-18 | 반도체 장치 |
Country Status (7)
| Country | Link |
|---|---|
| US (9) | US8654231B2 (enExample) |
| JP (6) | JP5017468B2 (enExample) |
| KR (3) | KR101970469B1 (enExample) |
| CN (2) | CN104979369B (enExample) |
| DE (1) | DE112011100842T5 (enExample) |
| TW (2) | TWI557886B (enExample) |
| WO (1) | WO2011111549A1 (enExample) |
Families Citing this family (61)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104979369B (zh) * | 2010-03-08 | 2018-04-06 | 株式会社半导体能源研究所 | 半导体器件及其制造方法 |
| JP5823740B2 (ja) | 2010-06-16 | 2015-11-25 | 株式会社半導体エネルギー研究所 | 入出力装置 |
| JP5766519B2 (ja) | 2010-06-16 | 2015-08-19 | 株式会社半導体エネルギー研究所 | 入出力装置 |
| JP5925475B2 (ja) | 2010-12-09 | 2016-05-25 | 株式会社半導体エネルギー研究所 | 光検出回路 |
| US8836626B2 (en) | 2011-07-15 | 2014-09-16 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for driving the same |
| JP6151530B2 (ja) | 2012-02-29 | 2017-06-21 | 株式会社半導体エネルギー研究所 | イメージセンサ、カメラ、及び監視システム |
| CN104160295B (zh) * | 2012-03-09 | 2017-09-15 | 株式会社半导体能源研究所 | 半导体装置的驱动方法 |
| US9541386B2 (en) * | 2012-03-21 | 2017-01-10 | Semiconductor Energy Laboratory Co., Ltd. | Distance measurement device and distance measurement system |
| CN102709301B (zh) * | 2012-05-28 | 2016-03-30 | 格科微电子(上海)有限公司 | 图像传感器以及图像传感器的应用方法 |
| JP6077786B2 (ja) * | 2012-08-22 | 2017-02-08 | キヤノン株式会社 | 撮像装置 |
| US8872120B2 (en) * | 2012-08-23 | 2014-10-28 | Semiconductor Energy Laboratory Co., Ltd. | Imaging device and method for driving the same |
| KR102069683B1 (ko) | 2012-08-24 | 2020-01-23 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 방사선 검출 패널, 방사선 촬상 장치, 및 화상 진단 장치 |
| DE102013217278B4 (de) | 2012-09-12 | 2017-03-30 | Semiconductor Energy Laboratory Co., Ltd. | Photodetektorschaltung, Bildgebungsvorrichtung und Verfahren zum Ansteuern einer Photodetektorschaltung |
| JP2014130336A (ja) * | 2012-11-30 | 2014-07-10 | Semiconductor Energy Lab Co Ltd | 表示装置 |
| TWI612321B (zh) * | 2013-02-27 | 2018-01-21 | 半導體能源研究所股份有限公司 | 成像裝置 |
| US9368059B2 (en) | 2013-03-01 | 2016-06-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and driving method thereof |
| US20140263952A1 (en) * | 2013-03-14 | 2014-09-18 | Perkinelmer Holdings, Inc. | High performance digital imaging system |
| JP6132283B2 (ja) * | 2013-05-17 | 2017-05-24 | Nltテクノロジー株式会社 | 増幅回路および増幅回路を用いたイメージセンサ |
| KR102083776B1 (ko) | 2013-09-03 | 2020-04-16 | 삼성전자 주식회사 | 조도 변화에 따라 다른 전압을 픽셀들로 공급할 수 있는 이미지 센서, 이의 동작 방법, 및 상기 이미지 센서를 포함하는 장치 |
| US9401432B2 (en) * | 2014-01-16 | 2016-07-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and electronic device |
| KR102160805B1 (ko) | 2014-01-21 | 2020-09-28 | 삼성전자주식회사 | 이미지 센서의 출력 데이터 보정 방법 |
| KR102128579B1 (ko) | 2014-01-21 | 2020-07-01 | 삼성디스플레이 주식회사 | 게이트 구동 회로 및 이를 구비한 표시 장치 |
| KR20150091900A (ko) * | 2014-02-04 | 2015-08-12 | 주식회사 레이언스 | 이미지센서 및 이의 제조방법 |
| KR102450562B1 (ko) * | 2014-03-13 | 2022-10-07 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 촬상 장치 |
| TWI656631B (zh) * | 2014-03-28 | 2019-04-11 | 日商半導體能源研究所股份有限公司 | 攝像裝置 |
| US9674470B2 (en) * | 2014-04-11 | 2017-06-06 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, method for driving semiconductor device, and method for driving electronic device |
| KR102380829B1 (ko) * | 2014-04-23 | 2022-03-31 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 촬상 장치 |
| JP6443667B2 (ja) | 2014-05-23 | 2018-12-26 | パナソニックIpマネジメント株式会社 | 撮像装置 |
| JP6260787B2 (ja) | 2014-05-23 | 2018-01-17 | パナソニックIpマネジメント株式会社 | 撮像装置 |
| US10157952B2 (en) | 2014-05-23 | 2018-12-18 | Panasonic Intellectual Property Management Co., Ltd. | Imaging device including semiconductor substrate and unit pixel cell |
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| KR102422059B1 (ko) | 2014-07-18 | 2022-07-15 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치, 촬상 장치, 및 전자 기기 |
| KR102388997B1 (ko) * | 2014-08-29 | 2022-04-22 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 촬상 장치 및 전자 기기 |
| JP6570417B2 (ja) | 2014-10-24 | 2019-09-04 | 株式会社半導体エネルギー研究所 | 撮像装置および電子機器 |
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| JP6683503B2 (ja) | 2015-03-03 | 2020-04-22 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US9685476B2 (en) * | 2015-04-03 | 2017-06-20 | Semiconductor Energy Laboratory Co., Ltd. | Imaging device and electronic device |
| TWI713367B (zh) | 2015-07-07 | 2020-12-11 | 日商半導體能源研究所股份有限公司 | 成像裝置及其運作方法 |
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| JP6700731B2 (ja) * | 2015-11-13 | 2020-05-27 | キヤノン株式会社 | 投影装置および投影システム |
| US20170186782A1 (en) * | 2015-12-24 | 2017-06-29 | Innolux Corporation | Pixel circuit of active-matrix light-emitting diode and display panel having the same |
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| JP6904730B2 (ja) | 2016-03-08 | 2021-07-21 | 株式会社半導体エネルギー研究所 | 撮像装置 |
| US10771719B2 (en) * | 2016-07-28 | 2020-09-08 | Sony Semiconductor Solutions Corporation | Imaging element |
| WO2018197987A1 (en) | 2017-04-28 | 2018-11-01 | Semiconductor Energy Laboratory Co., Ltd. | Imaging display device and electronic device |
| TWI636668B (zh) * | 2017-04-28 | 2018-09-21 | 友達光電股份有限公司 | 自動電壓放大裝置及自動電壓放大方法 |
| CN111108743B (zh) | 2017-09-20 | 2021-07-20 | 富士胶片株式会社 | 摄像控制装置、摄像装置、摄像控制方法及记录介质 |
| CN112868223B (zh) * | 2018-10-27 | 2022-06-10 | 华为技术有限公司 | 传感器和显示设备 |
| WO2020261029A1 (ja) * | 2019-06-28 | 2020-12-30 | 株式会社半導体エネルギー研究所 | 表示装置 |
| WO2021223108A1 (zh) * | 2020-05-06 | 2021-11-11 | 深圳市汇顶科技股份有限公司 | 像素、图像传感器及电子装置 |
| KR20230008496A (ko) | 2021-07-07 | 2023-01-16 | 삼성전자주식회사 | 이미지 센서 및 이미지 센서의 동작 방법 |
| TWI771179B (zh) * | 2021-09-07 | 2022-07-11 | 友達光電股份有限公司 | 用於光感測及顯示驅動之控制電路及控制方法 |
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