KR100707121B1 - 마이크로전자 피가공물을 전기화학적으로 처리하기 위한 장치 및 마이크로전자 피가공물 상에 재료를 전기도금하기 위한 방법 - Google Patents
마이크로전자 피가공물을 전기화학적으로 처리하기 위한 장치 및 마이크로전자 피가공물 상에 재료를 전기도금하기 위한 방법 Download PDFInfo
- Publication number
- KR100707121B1 KR100707121B1 KR1020017013081A KR20017013081A KR100707121B1 KR 100707121 B1 KR100707121 B1 KR 100707121B1 KR 1020017013081 A KR1020017013081 A KR 1020017013081A KR 20017013081 A KR20017013081 A KR 20017013081A KR 100707121 B1 KR100707121 B1 KR 100707121B1
- Authority
- KR
- South Korea
- Prior art keywords
- anode
- workpiece
- anodes
- microelectronic
- microelectronic workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004377 microelectronic Methods 0.000 title claims abstract description 141
- 238000011282 treatment Methods 0.000 title claims abstract description 57
- 238000000034 method Methods 0.000 title claims abstract description 49
- 238000009713 electroplating Methods 0.000 title claims description 95
- 239000000463 material Substances 0.000 title claims description 30
- 238000012545 processing Methods 0.000 claims abstract description 92
- 239000012530 fluid Substances 0.000 claims abstract description 83
- 230000005684 electric field Effects 0.000 claims description 18
- 230000008569 process Effects 0.000 claims description 16
- 230000009471 action Effects 0.000 claims description 3
- 239000003989 dielectric material Substances 0.000 claims description 2
- 230000001939 inductive effect Effects 0.000 claims 1
- 239000007921 spray Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 abstract description 11
- 235000012431 wafers Nutrition 0.000 abstract description 11
- 238000007747 plating Methods 0.000 description 28
- 229910052751 metal Inorganic materials 0.000 description 15
- 239000002184 metal Substances 0.000 description 15
- 238000009792 diffusion process Methods 0.000 description 13
- 239000007789 gas Substances 0.000 description 13
- 230000000694 effects Effects 0.000 description 12
- 230000008859 change Effects 0.000 description 8
- 238000012546 transfer Methods 0.000 description 8
- 230000008901 benefit Effects 0.000 description 7
- 238000013461 design Methods 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 7
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000005094 computer simulation Methods 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 239000003792 electrolyte Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 230000032258 transport Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 244000273618 Sphenoclea zeylanica Species 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 238000002048 anodisation reaction Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000003487 electrochemical reaction Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000004807 localization Effects 0.000 description 2
- 230000005499 meniscus Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- -1 platinum ions Chemical class 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 238000009827 uniform distribution Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000012993 chemical processing Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000012636 effector Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000002848 electrochemical method Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 241000894007 species Species 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S204/00—Chemistry: electrical and wave energy
- Y10S204/07—Current distribution within the bath
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12905599P | 1999-04-13 | 1999-04-13 | |
| US60/129,055 | 1999-04-13 | ||
| US14376999P | 1999-07-12 | 1999-07-12 | |
| US60/143,769 | 1999-07-12 | ||
| US18216000P | 2000-02-14 | 2000-02-14 | |
| US60/182,160 | 2000-02-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20020016772A KR20020016772A (ko) | 2002-03-06 |
| KR100707121B1 true KR100707121B1 (ko) | 2007-04-16 |
Family
ID=27383837
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020017013081A Expired - Lifetime KR100707121B1 (ko) | 1999-04-13 | 2000-04-13 | 마이크로전자 피가공물을 전기화학적으로 처리하기 위한 장치 및 마이크로전자 피가공물 상에 재료를 전기도금하기 위한 방법 |
| KR1020017013072A Expired - Lifetime KR100695660B1 (ko) | 1999-04-13 | 2000-04-13 | 개선된 처리 유체 유동을 갖는 처리 챔버를 구비하는가공편 프로세서 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020017013072A Expired - Lifetime KR100695660B1 (ko) | 1999-04-13 | 2000-04-13 | 개선된 처리 유체 유동을 갖는 처리 챔버를 구비하는가공편 프로세서 |
Country Status (7)
| Country | Link |
|---|---|
| US (10) | US6660137B2 (enExample) |
| EP (2) | EP1192298A4 (enExample) |
| JP (2) | JP4219562B2 (enExample) |
| KR (2) | KR100707121B1 (enExample) |
| CN (2) | CN1296524C (enExample) |
| TW (2) | TWI226387B (enExample) |
| WO (2) | WO2000061498A2 (enExample) |
Cited By (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010144330A3 (en) * | 2009-06-09 | 2011-03-03 | Novellus Systems, Inc. | Method and apparatus for electroplating |
| US7967969B2 (en) | 2000-05-10 | 2011-06-28 | Novellus Systems, Inc. | Method of electroplating using a high resistance ionic current source |
| US8308931B2 (en) | 2006-08-16 | 2012-11-13 | Novellus Systems, Inc. | Method and apparatus for electroplating |
| US8475637B2 (en) | 2008-12-17 | 2013-07-02 | Novellus Systems, Inc. | Electroplating apparatus with vented electrolyte manifold |
| US8540857B1 (en) | 2008-12-19 | 2013-09-24 | Novellus Systems, Inc. | Plating method and apparatus with multiple internally irrigated chambers |
| US8623193B1 (en) | 2004-06-16 | 2014-01-07 | Novellus Systems, Inc. | Method of electroplating using a high resistance ionic current source |
| US8795480B2 (en) | 2010-07-02 | 2014-08-05 | Novellus Systems, Inc. | Control of electrolyte hydrodynamics for efficient mass transfer during electroplating |
| US8858774B2 (en) | 2008-11-07 | 2014-10-14 | Novellus Systems, Inc. | Electroplating apparatus for tailored uniformity profile |
| US9449808B2 (en) | 2013-05-29 | 2016-09-20 | Novellus Systems, Inc. | Apparatus for advanced packaging applications |
| US9523155B2 (en) | 2012-12-12 | 2016-12-20 | Novellus Systems, Inc. | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating |
| US9567685B2 (en) | 2015-01-22 | 2017-02-14 | Lam Research Corporation | Apparatus and method for dynamic control of plated uniformity with the use of remote electric current |
| US9624592B2 (en) | 2010-07-02 | 2017-04-18 | Novellus Systems, Inc. | Cross flow manifold for electroplating apparatus |
| US9670588B2 (en) | 2013-05-01 | 2017-06-06 | Lam Research Corporation | Anisotropic high resistance ionic current source (AHRICS) |
| US9752248B2 (en) | 2014-12-19 | 2017-09-05 | Lam Research Corporation | Methods and apparatuses for dynamically tunable wafer-edge electroplating |
| US9816194B2 (en) | 2015-03-19 | 2017-11-14 | Lam Research Corporation | Control of electrolyte flow dynamics for uniform electroplating |
| US9822461B2 (en) | 2006-08-16 | 2017-11-21 | Novellus Systems, Inc. | Dynamic current distribution control apparatus and method for wafer electroplating |
| US9909228B2 (en) | 2012-11-27 | 2018-03-06 | Lam Research Corporation | Method and apparatus for dynamic current distribution control during electroplating |
| US9988733B2 (en) | 2015-06-09 | 2018-06-05 | Lam Research Corporation | Apparatus and method for modulating azimuthal uniformity in electroplating |
| US10014170B2 (en) | 2015-05-14 | 2018-07-03 | Lam Research Corporation | Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity |
| US10094034B2 (en) | 2015-08-28 | 2018-10-09 | Lam Research Corporation | Edge flow element for electroplating apparatus |
| US10233556B2 (en) | 2010-07-02 | 2019-03-19 | Lam Research Corporation | Dynamic modulation of cross flow manifold during electroplating |
| US10364505B2 (en) | 2016-05-24 | 2019-07-30 | Lam Research Corporation | Dynamic modulation of cross flow manifold during elecroplating |
| US10480094B2 (en) | 2016-07-13 | 2019-11-19 | Iontra LLC | Electrochemical methods, devices and compositions |
| US10781527B2 (en) | 2017-09-18 | 2020-09-22 | Lam Research Corporation | Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating |
| US11001934B2 (en) | 2017-08-21 | 2021-05-11 | Lam Research Corporation | Methods and apparatus for flow isolation and focusing during electroplating |
Families Citing this family (115)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3942977A1 (de) * | 1989-12-23 | 1991-06-27 | Standard Elektrik Lorenz Ag | Verfahren zum wiederherstellen der richtigen zellfolge, insbesondere in einer atm-vermittlungsstelle, sowie ausgangseinheit hierfuer |
| US6752584B2 (en) | 1996-07-15 | 2004-06-22 | Semitool, Inc. | Transfer devices for handling microelectronic workpieces within an environment of a processing machine and methods of manufacturing and using such devices in the processing of microelectronic workpieces |
| US6921467B2 (en) | 1996-07-15 | 2005-07-26 | Semitool, Inc. | Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces |
| WO2000061498A2 (en) * | 1999-04-13 | 2000-10-19 | Semitool, Inc. | System for electrochemically processing a workpiece |
| US6749390B2 (en) | 1997-12-15 | 2004-06-15 | Semitool, Inc. | Integrated tools with transfer devices for handling microelectronic workpieces |
| US6749391B2 (en) | 1996-07-15 | 2004-06-15 | Semitool, Inc. | Microelectronic workpiece transfer devices and methods of using such devices in the processing of microelectronic workpieces |
| US7244677B2 (en) | 1998-02-04 | 2007-07-17 | Semitool. Inc. | Method for filling recessed micro-structures with metallization in the production of a microelectronic device |
| US6565729B2 (en) | 1998-03-20 | 2003-05-20 | Semitool, Inc. | Method for electrochemically depositing metal on a semiconductor workpiece |
| TW593731B (en) * | 1998-03-20 | 2004-06-21 | Semitool Inc | Apparatus for applying a metal structure to a workpiece |
| US6497801B1 (en) * | 1998-07-10 | 2002-12-24 | Semitool Inc | Electroplating apparatus with segmented anode array |
| US6402923B1 (en) * | 2000-03-27 | 2002-06-11 | Novellus Systems Inc | Method and apparatus for uniform electroplating of integrated circuits using a variable field shaping element |
| US6258220B1 (en) * | 1998-11-30 | 2001-07-10 | Applied Materials, Inc. | Electro-chemical deposition system |
| US6585876B2 (en) * | 1999-04-08 | 2003-07-01 | Applied Materials Inc. | Flow diffuser to be used in electro-chemical plating system and method |
| US7264698B2 (en) | 1999-04-13 | 2007-09-04 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
| US7585398B2 (en) | 1999-04-13 | 2009-09-08 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
| US7189318B2 (en) | 1999-04-13 | 2007-03-13 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| US7351315B2 (en) | 2003-12-05 | 2008-04-01 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
| US7438788B2 (en) | 1999-04-13 | 2008-10-21 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
| US8852417B2 (en) | 1999-04-13 | 2014-10-07 | Applied Materials, Inc. | Electrolytic process using anion permeable barrier |
| US8236159B2 (en) | 1999-04-13 | 2012-08-07 | Applied Materials Inc. | Electrolytic process using cation permeable barrier |
| US6368475B1 (en) * | 2000-03-21 | 2002-04-09 | Semitool, Inc. | Apparatus for electrochemically processing a microelectronic workpiece |
| US20060157355A1 (en) * | 2000-03-21 | 2006-07-20 | Semitool, Inc. | Electrolytic process using anion permeable barrier |
| US6916412B2 (en) | 1999-04-13 | 2005-07-12 | Semitool, Inc. | Adaptable electrochemical processing chamber |
| US7020537B2 (en) | 1999-04-13 | 2006-03-28 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| US7351314B2 (en) | 2003-12-05 | 2008-04-01 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
| US7160421B2 (en) | 1999-04-13 | 2007-01-09 | Semitool, Inc. | Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| US6623609B2 (en) | 1999-07-12 | 2003-09-23 | Semitool, Inc. | Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same |
| US6547937B1 (en) * | 2000-01-03 | 2003-04-15 | Semitool, Inc. | Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece |
| US6780374B2 (en) | 2000-12-08 | 2004-08-24 | Semitool, Inc. | Method and apparatus for processing a microelectronic workpiece at an elevated temperature |
| US6471913B1 (en) * | 2000-02-09 | 2002-10-29 | Semitool, Inc. | Method and apparatus for processing a microelectronic workpiece including an apparatus and method for executing a processing step at an elevated temperature |
| US20060189129A1 (en) * | 2000-03-21 | 2006-08-24 | Semitool, Inc. | Method for applying metal features onto barrier layers using ion permeable barriers |
| US20050183959A1 (en) * | 2000-04-13 | 2005-08-25 | Wilson Gregory J. | Tuning electrodes used in a reactor for electrochemically processing a microelectric workpiece |
| AU2001259504A1 (en) * | 2000-05-24 | 2001-12-03 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| US7273535B2 (en) * | 2003-09-17 | 2007-09-25 | Applied Materials, Inc. | Insoluble anode with an auxiliary electrode |
| US20050284751A1 (en) * | 2004-06-28 | 2005-12-29 | Nicolay Kovarsky | Electrochemical plating cell with a counter electrode in an isolated anolyte compartment |
| WO2002004887A1 (en) | 2000-07-08 | 2002-01-17 | Semitool, Inc. | Methods and apparatus for processing microelectronic workpieces using metrology |
| EP1335038A4 (en) * | 2000-10-26 | 2008-05-14 | Ebara Corp | DEVICE AND METHOD FOR ELECTRO-PLATING |
| KR100798437B1 (ko) | 2000-12-04 | 2008-01-28 | 가부시키가이샤 에바라 세이사꾸쇼 | 기판처리방법 |
| US7628898B2 (en) * | 2001-03-12 | 2009-12-08 | Semitool, Inc. | Method and system for idle state operation |
| US20050061676A1 (en) * | 2001-03-12 | 2005-03-24 | Wilson Gregory J. | System for electrochemically processing a workpiece |
| US7281741B2 (en) * | 2001-07-13 | 2007-10-16 | Semitool, Inc. | End-effectors for handling microelectronic workpieces |
| US7334826B2 (en) * | 2001-07-13 | 2008-02-26 | Semitool, Inc. | End-effectors for handling microelectronic wafers |
| US6884724B2 (en) * | 2001-08-24 | 2005-04-26 | Applied Materials, Inc. | Method for dishing reduction and feature passivation in polishing processes |
| WO2003018874A2 (en) | 2001-08-31 | 2003-03-06 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
| US20030159921A1 (en) * | 2002-02-22 | 2003-08-28 | Randy Harris | Apparatus with processing stations for manually and automatically processing microelectronic workpieces |
| US6991710B2 (en) | 2002-02-22 | 2006-01-31 | Semitool, Inc. | Apparatus for manually and automatically processing microelectronic workpieces |
| EP1358851B1 (en) * | 2002-05-03 | 2005-08-10 | Lina Medical ApS | Haemostatic device for an open blood vessel |
| US6893505B2 (en) | 2002-05-08 | 2005-05-17 | Semitool, Inc. | Apparatus and method for regulating fluid flows, such as flows of electrochemical processing fluids |
| US7247223B2 (en) | 2002-05-29 | 2007-07-24 | Semitool, Inc. | Method and apparatus for controlling vessel characteristics, including shape and thieving current for processing microfeature workpieces |
| US20060043750A1 (en) * | 2004-07-09 | 2006-03-02 | Paul Wirth | End-effectors for handling microfeature workpieces |
| US20070014656A1 (en) * | 2002-07-11 | 2007-01-18 | Harris Randy A | End-effectors and associated control and guidance systems and methods |
| US7114903B2 (en) | 2002-07-16 | 2006-10-03 | Semitool, Inc. | Apparatuses and method for transferring and/or pre-processing microelectronic workpieces |
| US7128823B2 (en) | 2002-07-24 | 2006-10-31 | Applied Materials, Inc. | Anolyte for copper plating |
| JP2004068151A (ja) * | 2002-07-25 | 2004-03-04 | Matsushita Electric Ind Co Ltd | 基板のメッキ方法及びメッキ装置 |
| US20040108212A1 (en) * | 2002-12-06 | 2004-06-10 | Lyndon Graham | Apparatus and methods for transferring heat during chemical processing of microelectronic workpieces |
| TWI229367B (en) | 2002-12-26 | 2005-03-11 | Canon Kk | Chemical treatment apparatus and chemical treatment method |
| US7704367B2 (en) * | 2004-06-28 | 2010-04-27 | Lam Research Corporation | Method and apparatus for plating semiconductor wafers |
| US7332062B1 (en) * | 2003-06-02 | 2008-02-19 | Lsi Logic Corporation | Electroplating tool for semiconductor manufacture having electric field control |
| US20050063798A1 (en) * | 2003-06-06 | 2005-03-24 | Davis Jeffry Alan | Interchangeable workpiece handling apparatus and associated tool for processing microfeature workpieces |
| US7390383B2 (en) * | 2003-07-01 | 2008-06-24 | Semitool, Inc. | Paddles and enclosures for enhancing mass transfer during processing of microfeature workpieces |
| US20050050767A1 (en) * | 2003-06-06 | 2005-03-10 | Hanson Kyle M. | Wet chemical processing chambers for processing microfeature workpieces |
| US7313462B2 (en) * | 2003-06-06 | 2007-12-25 | Semitool, Inc. | Integrated tool with automated calibration system and interchangeable wet processing components for processing microfeature workpieces |
| US7393439B2 (en) * | 2003-06-06 | 2008-07-01 | Semitool, Inc. | Integrated microfeature workpiece processing tools with registration systems for paddle reactors |
| DE10327578A1 (de) * | 2003-06-18 | 2005-01-13 | Micronas Gmbh | Verfahren und Vorrichtung zur Filterung eines Signals |
| US20070144912A1 (en) * | 2003-07-01 | 2007-06-28 | Woodruff Daniel J | Linearly translating agitators for processing microfeature workpieces, and associated methods |
| US20050092601A1 (en) * | 2003-10-29 | 2005-05-05 | Harald Herchen | Electrochemical plating cell having a diffusion member |
| US20050092611A1 (en) * | 2003-11-03 | 2005-05-05 | Semitool, Inc. | Bath and method for high rate copper deposition |
| US7372682B2 (en) * | 2004-02-12 | 2008-05-13 | Power-One, Inc. | System and method for managing fault in a power system |
| US8082932B2 (en) * | 2004-03-12 | 2011-12-27 | Applied Materials, Inc. | Single side workpiece processing |
| US7938942B2 (en) * | 2004-03-12 | 2011-05-10 | Applied Materials, Inc. | Single side workpiece processing |
| US20070110895A1 (en) * | 2005-03-08 | 2007-05-17 | Jason Rye | Single side workpiece processing |
| US7214297B2 (en) | 2004-06-28 | 2007-05-08 | Applied Materials, Inc. | Substrate support element for an electrochemical plating cell |
| US20060045666A1 (en) * | 2004-07-09 | 2006-03-02 | Harris Randy A | Modular tool unit for processing of microfeature workpieces |
| US7531060B2 (en) * | 2004-07-09 | 2009-05-12 | Semitool, Inc. | Integrated tool assemblies with intermediate processing modules for processing of microfeature workpieces |
| US20070020080A1 (en) * | 2004-07-09 | 2007-01-25 | Paul Wirth | Transfer devices and methods for handling microfeature workpieces within an environment of a processing machine |
| US7165768B2 (en) * | 2005-04-06 | 2007-01-23 | Chih-Chung Fang | Variable three-dimensional labyrinth |
| TWI414639B (zh) * | 2005-05-25 | 2013-11-11 | Applied Materials Inc | 具有一陽極陣列的電鍍裝置 |
| US20070043474A1 (en) * | 2005-08-17 | 2007-02-22 | Semitool, Inc. | Systems and methods for predicting process characteristics of an electrochemical treatment process |
| WO2007062114A2 (en) | 2005-11-23 | 2007-05-31 | Semitool, Inc. | Apparatus and method for agitating liquids in wet chemical processing of microfeature workpieces |
| US7520286B2 (en) | 2005-12-05 | 2009-04-21 | Semitool, Inc. | Apparatus and method for cleaning and drying a container for semiconductor workpieces |
| US8104488B2 (en) * | 2006-02-22 | 2012-01-31 | Applied Materials, Inc. | Single side workpiece processing |
| US7655126B2 (en) | 2006-03-27 | 2010-02-02 | Federal Mogul World Wide, Inc. | Fabrication of topical stopper on MLS gasket by active matrix electrochemical deposition |
| GB2440139A (en) * | 2006-07-20 | 2008-01-23 | John Bostock | Electrocoagulation unit for the removal of contaminants from a fluid |
| US8291921B2 (en) * | 2008-08-19 | 2012-10-23 | Lam Research Corporation | Removing bubbles from a fluid flowing down through a plenum |
| US7842173B2 (en) * | 2007-01-29 | 2010-11-30 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microfeature wafers |
| US20080178460A1 (en) * | 2007-01-29 | 2008-07-31 | Woodruff Daniel J | Protected magnets and magnet shielding for processing microfeature workpieces, and associated systems and methods |
| US8069750B2 (en) | 2007-08-09 | 2011-12-06 | Ksr Technologies Co. | Compact pedal assembly with improved noise control |
| DE102008045256A1 (de) * | 2008-09-01 | 2010-03-04 | Rena Gmbh | Vorrichtung und Verfahren zur Nassbehandlung von unterschiedlichen Substraten |
| WO2010099264A2 (en) * | 2009-02-25 | 2010-09-02 | Corning Incorporated | Cell culture system with manifold |
| CN101864587B (zh) * | 2009-04-20 | 2013-08-21 | 鸿富锦精密工业(深圳)有限公司 | 纳米级金属粒子/金属复合镀层的形成装置及形成方法 |
| CN101775637B (zh) * | 2010-03-09 | 2012-03-21 | 北京中冶设备研究设计总院有限公司 | 静压式水平电镀槽 |
| US9017528B2 (en) | 2011-04-14 | 2015-04-28 | Tel Nexx, Inc. | Electro chemical deposition and replenishment apparatus |
| US9005409B2 (en) | 2011-04-14 | 2015-04-14 | Tel Nexx, Inc. | Electro chemical deposition and replenishment apparatus |
| US8496789B2 (en) | 2011-05-18 | 2013-07-30 | Applied Materials, Inc. | Electrochemical processor |
| US8496790B2 (en) * | 2011-05-18 | 2013-07-30 | Applied Materials, Inc. | Electrochemical processor |
| US9245719B2 (en) * | 2011-07-20 | 2016-01-26 | Lam Research Corporation | Dual phase cleaning chambers and assemblies comprising the same |
| US8900425B2 (en) | 2011-11-29 | 2014-12-02 | Applied Materials, Inc. | Contact ring for an electrochemical processor |
| US8968531B2 (en) | 2011-12-07 | 2015-03-03 | Applied Materials, Inc. | Electro processor with shielded contact ring |
| US9393658B2 (en) | 2012-06-14 | 2016-07-19 | Black & Decker Inc. | Portable power tool |
| CN202925123U (zh) * | 2012-08-28 | 2013-05-08 | 南通市申海工业技术科技有限公司 | 核反应堆内真空阀镀铜镀镍镜面工艺装置 |
| US9598788B2 (en) * | 2012-09-27 | 2017-03-21 | Applied Materials, Inc. | Electroplating apparatus with contact ring deplating |
| US9945044B2 (en) * | 2013-11-06 | 2018-04-17 | Lam Research Corporation | Method for uniform flow behavior in an electroplating cell |
| US9303329B2 (en) | 2013-11-11 | 2016-04-05 | Tel Nexx, Inc. | Electrochemical deposition apparatus with remote catholyte fluid management |
| CN104947172B (zh) * | 2014-03-28 | 2018-05-29 | 通用电气公司 | 电镀工具及使用该电镀工具的方法 |
| US9689084B2 (en) | 2014-05-22 | 2017-06-27 | Globalfounries Inc. | Electrodeposition systems and methods that minimize anode and/or plating solution degradation |
| US9469911B2 (en) * | 2015-01-21 | 2016-10-18 | Applied Materials, Inc. | Electroplating apparatus with membrane tube shield |
| CN105463537B (zh) * | 2016-01-14 | 2017-11-21 | 深圳市启沛实业有限公司 | 一种单面电镀方法 |
| GB201701166D0 (en) * | 2017-01-24 | 2017-03-08 | Picofluidics Ltd | An apparatus for electrochemically processing semiconductor substrates |
| US11142840B2 (en) | 2018-10-31 | 2021-10-12 | Unison Industries, Llc | Electroforming system and method |
| TWI728668B (zh) * | 2019-01-31 | 2021-05-21 | 日商Almex Pe股份有限公司 | 工件保持治具及表面處理裝置 |
| JP7150768B2 (ja) * | 2020-01-30 | 2022-10-11 | Jx金属株式会社 | 電解装置及び電解方法 |
| CN111501080B (zh) * | 2020-05-26 | 2021-08-06 | 青岛维轮智能装备有限公司 | 一种基于电场变换的无序电子镀覆设备 |
| US11618951B2 (en) | 2020-05-27 | 2023-04-04 | Global Circuit Innovations Incorporated | Chemical evaporation control system |
| CN114284176B (zh) * | 2021-12-21 | 2025-09-16 | 北京北方华创微电子装备有限公司 | 工艺腔室及半导体加工设备 |
| CN114421318B (zh) * | 2022-01-13 | 2023-10-03 | 湖南程微电力科技有限公司 | 一种用于户外的翻盖式安全型低压电缆分支箱 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5000827A (en) * | 1990-01-02 | 1991-03-19 | Motorola, Inc. | Method and apparatus for adjusting plating solution flow characteristics at substrate cathode periphery to minimize edge effect |
| US5256274A (en) * | 1990-08-01 | 1993-10-26 | Jaime Poris | Selective metal electrodeposition process |
Family Cites Families (504)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA873651A (en) | 1971-06-22 | Beloit Corporation | Web pickup | |
| US2003A (en) * | 1841-03-12 | Improvement in horizontal windivhlls | ||
| US2004A (en) * | 1841-03-12 | Improvement in the manner of constructing and propelling steam-vessels | ||
| US2002A (en) * | 1841-03-12 | Tor and planter for plowing | ||
| US2001A (en) * | 1841-03-12 | Sawmill | ||
| US640892A (en) * | 1899-01-21 | 1900-01-09 | Samuel Mawhinney | Upright-piano action. |
| US1255395A (en) * | 1916-05-05 | 1918-02-05 | Arthur E Duram | Liquid-separator and the like. |
| US1526644A (en) * | 1922-10-25 | 1925-02-17 | Williams Brothers Mfg Company | Process of electroplating and apparatus therefor |
| US1881713A (en) * | 1928-12-03 | 1932-10-11 | Arthur K Laukel | Flexible and adjustable anode |
| US2256274A (en) | 1938-06-30 | 1941-09-16 | Firm J D Riedel E De Haen A G | Salicylic acid sulphonyl sulphanilamides |
| US3309263A (en) | 1964-12-03 | 1967-03-14 | Kimberly Clark Co | Web pickup and transfer for a papermaking machine |
| US3616284A (en) | 1968-08-21 | 1971-10-26 | Bell Telephone Labor Inc | Processing arrays of junction devices |
| US3664933A (en) | 1969-06-19 | 1972-05-23 | Udylite Corp | Process for acid copper plating of zinc |
| US3727620A (en) | 1970-03-18 | 1973-04-17 | Fluoroware Of California Inc | Rinsing and drying device |
| US3930693A (en) * | 1970-05-22 | 1976-01-06 | The Torrington Company | Full complement bearing having preloaded hollow rollers |
| US3716462A (en) | 1970-10-05 | 1973-02-13 | D Jensen | Copper plating on zinc and its alloys |
| US3706651A (en) | 1970-12-30 | 1972-12-19 | Us Navy | Apparatus for electroplating a curved surface |
| US3798033A (en) | 1971-05-11 | 1974-03-19 | Spectral Data Corp | Isoluminous additive color multispectral display |
| US3930963A (en) | 1971-07-29 | 1976-01-06 | Photocircuits Division Of Kollmorgen Corporation | Method for the production of radiant energy imaged printed circuit boards |
| BE791401A (fr) | 1971-11-15 | 1973-05-14 | Monsanto Co | Compositions et procedes electrochimiques |
| US3798003A (en) | 1972-02-14 | 1974-03-19 | E Ensley | Differential microcalorimeter |
| DE2244434C3 (de) | 1972-09-06 | 1982-02-25 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Wäßriges Bad zur galvanischen Abscheidung von Gold und Goldlegierungen |
| JPS5212576Y2 (enExample) | 1973-01-20 | 1977-03-19 | ||
| US4022679A (en) | 1973-05-10 | 1977-05-10 | C. Conradty | Coated titanium anode for amalgam heavy duty cells |
| US3968885A (en) | 1973-06-29 | 1976-07-13 | International Business Machines Corporation | Method and apparatus for handling workpieces |
| US3880725A (en) * | 1974-04-10 | 1975-04-29 | Rca Corp | Predetermined thickness profiles through electroplating |
| US4001094A (en) | 1974-09-19 | 1977-01-04 | Jumer John F | Method for incremental electro-processing of large areas |
| US4072557A (en) | 1974-12-23 | 1978-02-07 | J. M. Voith Gmbh | Method and apparatus for shrinking a travelling web of fibrous material |
| US4000046A (en) | 1974-12-23 | 1976-12-28 | P. R. Mallory & Co., Inc. | Method of electroplating a conductive layer over an electrolytic capacitor |
| US3953265A (en) | 1975-04-28 | 1976-04-27 | International Business Machines Corporation | Meniscus-contained method of handling fluids in the manufacture of semiconductor wafers |
| US4046105A (en) * | 1975-06-16 | 1977-09-06 | Xerox Corporation | Laminar deep wave generator |
| US4032422A (en) | 1975-10-03 | 1977-06-28 | National Semiconductor Corporation | Apparatus for plating semiconductor chip headers |
| US4030015A (en) | 1975-10-20 | 1977-06-14 | International Business Machines Corporation | Pulse width modulated voltage regulator-converter/power converter having push-push regulator-converter means |
| US4165252A (en) | 1976-08-30 | 1979-08-21 | Burroughs Corporation | Method for chemically treating a single side of a workpiece |
| US4137867A (en) | 1977-09-12 | 1979-02-06 | Seiichiro Aigo | Apparatus for bump-plating semiconductor wafers |
| US4134802A (en) | 1977-10-03 | 1979-01-16 | Oxy Metal Industries Corporation | Electrolyte and method for electrodepositing bright metal deposits |
| US4132567A (en) | 1977-10-13 | 1979-01-02 | Fsi Corporation | Apparatus for and method of cleaning and removing static charges from substrates |
| US4170959A (en) | 1978-04-04 | 1979-10-16 | Seiichiro Aigo | Apparatus for bump-plating semiconductor wafers |
| US4341629A (en) | 1978-08-28 | 1982-07-27 | Sand And Sea Industries, Inc. | Means for desalination of water through reverse osmosis |
| US4246088A (en) | 1979-01-24 | 1981-01-20 | Metal Box Limited | Method and apparatus for electrolytic treatment of containers |
| US4276855A (en) | 1979-05-02 | 1981-07-07 | Optical Coating Laboratory, Inc. | Coating apparatus |
| US4222834A (en) | 1979-06-06 | 1980-09-16 | Western Electric Company, Inc. | Selectively treating an article |
| SU921124A1 (ru) | 1979-06-19 | 1982-04-15 | Институт Физико-Химических Основ Переработки Минерального Сырья Со Ан Ссср | Способ металлизации отверстий печатных плат |
| US4286541A (en) | 1979-07-26 | 1981-09-01 | Fsi Corporation | Applying photoresist onto silicon wafers |
| JPS56102590A (en) | 1979-08-09 | 1981-08-17 | Koichi Shimamura | Method and device for plating of microarea |
| US4422915A (en) | 1979-09-04 | 1983-12-27 | Battelle Memorial Institute | Preparation of colored polymeric film-like coating |
| US4238310A (en) | 1979-10-03 | 1980-12-09 | United Technologies Corporation | Apparatus for electrolytic etching |
| US4259166A (en) | 1980-03-31 | 1981-03-31 | Rca Corporation | Shield for plating substrate |
| US4437943A (en) | 1980-07-09 | 1984-03-20 | Olin Corporation | Method and apparatus for bonding metal wire to a base metal substrate |
| EP0047132B1 (en) | 1980-09-02 | 1985-07-03 | Heraeus Quarzschmelze Gmbh | Method of and apparatus for transferring semiconductor wafers between carrier members |
| US4323433A (en) | 1980-09-22 | 1982-04-06 | The Boeing Company | Anodizing process employing adjustable shield for suspended cathode |
| US4443117A (en) | 1980-09-26 | 1984-04-17 | Terumo Corporation | Measuring apparatus, method of manufacture thereof, and method of writing data into same |
| US4304641A (en) | 1980-11-24 | 1981-12-08 | International Business Machines Corporation | Rotary electroplating cell with controlled current distribution |
| SE8101046L (sv) | 1981-02-16 | 1982-08-17 | Europafilm | Anordning vid anleggningar, serskilt for matrisering av grammofonskivor och dylikt |
| US4360410A (en) | 1981-03-06 | 1982-11-23 | Western Electric Company, Inc. | Electroplating processes and equipment utilizing a foam electrolyte |
| JPS57198315U (enExample) | 1981-06-12 | 1982-12-16 | ||
| JPS584382A (ja) | 1981-06-26 | 1983-01-11 | ファナック株式会社 | 工業用ロボツトの制御方式 |
| US4378283A (en) | 1981-07-30 | 1983-03-29 | National Semiconductor Corporation | Consumable-anode selective plating apparatus |
| US4384930A (en) | 1981-08-21 | 1983-05-24 | Mcgean-Rohco, Inc. | Electroplating baths, additives therefor and methods for the electrodeposition of metals |
| US4463503A (en) | 1981-09-29 | 1984-08-07 | Driall, Inc. | Grain drier and method of drying grain |
| JPS58154842A (ja) | 1982-02-03 | 1983-09-14 | Konishiroku Photo Ind Co Ltd | ハロゲン化銀カラ−写真感光材料 |
| LU83954A1 (de) * | 1982-02-17 | 1983-09-02 | Arbed | Verfahren zum erhoehen der kuehlstoffsaetze beim herstellen von stahl durch sauerstoffaufblasen |
| JPS58149189A (ja) | 1982-03-01 | 1983-09-05 | セイコーインスツルメンツ株式会社 | 工業用ロボツトの旋回昇降機構 |
| US4440597A (en) | 1982-03-15 | 1984-04-03 | The Procter & Gamble Company | Wet-microcontracted paper and concomitant process |
| US4475823A (en) | 1982-04-09 | 1984-10-09 | Piezo Electric Products, Inc. | Self-calibrating thermometer |
| US4449885A (en) | 1982-05-24 | 1984-05-22 | Varian Associates, Inc. | Wafer transfer system |
| US4451197A (en) | 1982-07-26 | 1984-05-29 | Advanced Semiconductor Materials Die Bonding, Inc. | Object detection apparatus and method |
| US4838289A (en) | 1982-08-03 | 1989-06-13 | Texas Instruments Incorporated | Apparatus and method for edge cleaning |
| US4439243A (en) | 1982-08-03 | 1984-03-27 | Texas Instruments Incorporated | Apparatus and method of material removal with fluid flow within a slot |
| US4439244A (en) | 1982-08-03 | 1984-03-27 | Texas Instruments Incorporated | Apparatus and method of material removal having a fluid filled slot |
| US4514269A (en) | 1982-08-06 | 1985-04-30 | Alcan International Limited | Metal production by electrolysis of a molten electrolyte |
| US4585539A (en) | 1982-08-17 | 1986-04-29 | Technic, Inc. | Electrolytic reactor |
| DE3233069A1 (de) | 1982-09-06 | 1984-03-08 | Siemens AG, 1000 Berlin und 8000 München | Kapazitiver hochfrequenzdurchlaufofen |
| US4541895A (en) | 1982-10-29 | 1985-09-17 | Scapa Inc. | Papermakers fabric of nonwoven layers in a laminated construction |
| DE3240330A1 (de) * | 1982-10-30 | 1984-05-03 | Eberhard Hoesch & Söhne Metall und Kunststoffwerk GmbH & Co, 5166 Kreuzau | Badebecken mit wirbelduesen |
| JPS59150094A (ja) | 1983-02-14 | 1984-08-28 | Teichiku Kk | 円盤状回転式メツキ装置 |
| JPS59150094U (ja) | 1983-03-25 | 1984-10-06 | 株式会社クボタ | 真空断熱パイプの接続部構造 |
| JPS59208831A (ja) | 1983-05-13 | 1984-11-27 | Hitachi Tokyo Electronics Co Ltd | 塗布装置 |
| US4982753A (en) | 1983-07-26 | 1991-01-08 | National Semiconductor Corporation | Wafer etching, cleaning and stripping apparatus |
| US4529480A (en) | 1983-08-23 | 1985-07-16 | The Procter & Gamble Company | Tissue paper |
| US4469566A (en) | 1983-08-29 | 1984-09-04 | Dynamic Disk, Inc. | Method and apparatus for producing electroplated magnetic memory disk, and the like |
| US4864239A (en) | 1983-12-05 | 1989-09-05 | General Electric Company | Cylindrical bearing inspection |
| US4466864A (en) | 1983-12-16 | 1984-08-21 | At&T Technologies, Inc. | Methods of and apparatus for electroplating preselected surface regions of electrical articles |
| JPS60137016U (ja) | 1984-02-23 | 1985-09-11 | タニタ伸銅株式会社 | 一文字葺用屋根材 |
| US4500394A (en) | 1984-05-16 | 1985-02-19 | At&T Technologies, Inc. | Contacting a surface for plating thereon |
| US4634503A (en) * | 1984-06-27 | 1987-01-06 | Daniel Nogavich | Immersion electroplating system |
| US4544446A (en) | 1984-07-24 | 1985-10-01 | J. T. Baker Chemical Co. | VLSI chemical reactor |
| DE8430403U1 (de) | 1984-10-16 | 1985-04-25 | Gebr. Steimel, 5202 Hennef | Zentrifugiervorrichtung |
| US4639028A (en) | 1984-11-13 | 1987-01-27 | Economic Development Corporation | High temperature and acid resistant wafer pick up device |
| DE3500005A1 (de) | 1985-01-02 | 1986-07-10 | ESB Elektrostatische Sprüh- und Beschichtungsanlagen G.F. Vöhringer GmbH, 7758 Meersburg | Beschichtungskabine zum ueberziehen der oberflaeche von werkstuecken mit beschichtungspulver |
| US4600463A (en) * | 1985-01-04 | 1986-07-15 | Seiichiro Aigo | Treatment basin for semiconductor material |
| JPS61196534A (ja) | 1985-02-26 | 1986-08-30 | Nec Corp | フオトレジスト塗布装置 |
| US4604178A (en) | 1985-03-01 | 1986-08-05 | The Dow Chemical Company | Anode |
| US4685414A (en) | 1985-04-03 | 1987-08-11 | Dirico Mark A | Coating printed sheets |
| US4576685A (en) | 1985-04-23 | 1986-03-18 | Schering Ag | Process and apparatus for plating onto articles |
| JPS61178187U (enExample) | 1985-04-26 | 1986-11-06 | ||
| US4648944A (en) | 1985-07-18 | 1987-03-10 | Martin Marietta Corporation | Apparatus and method for controlling plating induced stress in electroforming and electroplating processes |
| US4664133A (en) | 1985-07-26 | 1987-05-12 | Fsi Corporation | Wafer processing machine |
| US4760671A (en) | 1985-08-19 | 1988-08-02 | Owens-Illinois Television Products Inc. | Method of and apparatus for automatically grinding cathode ray tube faceplates |
| FR2587915B1 (fr) | 1985-09-27 | 1987-11-27 | Omya Sa | Dispositif pour la mise en contact de fluides se presentant sous la forme de phases differentes |
| JPH0444216Y2 (enExample) | 1985-10-07 | 1992-10-19 | ||
| US4949671A (en) | 1985-10-24 | 1990-08-21 | Texas Instruments Incorporated | Processing apparatus and method |
| JPH088723B2 (ja) | 1985-11-02 | 1996-01-29 | 日立機電工業株式会社 | リニアモ−タを用いた搬送装置 |
| US4715934A (en) | 1985-11-18 | 1987-12-29 | Lth Associates | Process and apparatus for separating metals from solutions |
| US4761214A (en) | 1985-11-27 | 1988-08-02 | Airfoil Textron Inc. | ECM machine with mechanisms for venting and clamping a workpart shroud |
| US4687552A (en) | 1985-12-02 | 1987-08-18 | Tektronix, Inc. | Rhodium capped gold IC metallization |
| US4849054A (en) | 1985-12-04 | 1989-07-18 | James River-Norwalk, Inc. | High bulk, embossed fiber sheet material and apparatus and method of manufacturing the same |
| HU208556B (en) | 1985-12-24 | 1993-11-29 | Gould Inc | Process and apparatjus for galvanizing copper-folia |
| US4696729A (en) | 1986-02-28 | 1987-09-29 | International Business Machines | Electroplating cell |
| JPS62166515U (enExample) | 1986-04-08 | 1987-10-22 | ||
| US4670126A (en) | 1986-04-28 | 1987-06-02 | Varian Associates, Inc. | Sputter module for modular wafer processing system |
| US4770590A (en) | 1986-05-16 | 1988-09-13 | Silicon Valley Group, Inc. | Method and apparatus for transferring wafers between cassettes and a boat |
| US4924890A (en) | 1986-05-16 | 1990-05-15 | Eastman Kodak Company | Method and apparatus for cleaning semiconductor wafers |
| GB8617675D0 (en) | 1986-07-19 | 1986-08-28 | Ae Plc | Deposition of bearing alloys |
| US4732785A (en) | 1986-09-26 | 1988-03-22 | Motorola, Inc. | Edge bead removal process for spin on films |
| JPH0768639B2 (ja) * | 1986-12-10 | 1995-07-26 | トヨタ自動車株式会社 | 電着塗装方法 |
| US4951601A (en) | 1986-12-19 | 1990-08-28 | Applied Materials, Inc. | Multi-chamber integrated process system |
| JPH0815582B2 (ja) * | 1987-02-28 | 1996-02-21 | 本田技研工業株式会社 | 車体の表面処理方法 |
| US4773436A (en) * | 1987-03-09 | 1988-09-27 | Cantrell Industries, Inc. | Pot and pan washing machines |
| US5117769A (en) | 1987-03-31 | 1992-06-02 | Epsilon Technology, Inc. | Drive shaft apparatus for a susceptor |
| US5024746A (en) | 1987-04-13 | 1991-06-18 | Texas Instruments Incorporated | Fixture and a method for plating contact bumps for integrated circuits |
| JPS63274794A (ja) | 1987-05-01 | 1988-11-11 | Oki Electric Ind Co Ltd | 誘電体コアの電解メツキ方法 |
| DD260260A1 (de) | 1987-05-04 | 1988-09-21 | Polygraph Leipzig | Rotationshefteinrichtung mit separat angetriebenem heftkopf |
| JPH0641058Y2 (ja) | 1987-05-22 | 1994-10-26 | 株式会社東芝 | 空気調和機 |
| JPH0521332Y2 (enExample) | 1987-06-04 | 1993-06-01 | ||
| DE3719952A1 (de) | 1987-06-15 | 1988-12-29 | Convac Gmbh | Einrichtung zur behandlung von wafern bei der herstellung von halbleiterelementen |
| US5138973A (en) | 1987-07-16 | 1992-08-18 | Texas Instruments Incorporated | Wafer processing apparatus having independently controllable energy sources |
| US6139708A (en) * | 1987-08-08 | 2000-10-31 | Nissan Motor Co., Ltd. | Dip surface-treatment system and method of dip surface-treatment using same |
| JP2624703B2 (ja) | 1987-09-24 | 1997-06-25 | 株式会社東芝 | バンプの形成方法及びその装置 |
| US4781800A (en) * | 1987-09-29 | 1988-11-01 | President And Fellows Of Harvard College | Deposition of metal or alloy film |
| DE3735449A1 (de) | 1987-10-20 | 1989-05-03 | Convac Gmbh | Fertigungssystem fuer halbleitersubstrate |
| JPH01120023A (ja) | 1987-11-02 | 1989-05-12 | Seiko Epson Corp | スピン現像装置 |
| JP2508540B2 (ja) | 1987-11-02 | 1996-06-19 | 三菱マテリアル株式会社 | ウェ―ハの位置検出装置 |
| AT389959B (de) | 1987-11-09 | 1990-02-26 | Sez Semiconduct Equip Zubehoer | Vorrichtung zum aetzen von scheibenfoermigen gegenstaenden, insbesondere von siliziumscheiben |
| JPH01125821A (ja) | 1987-11-10 | 1989-05-18 | Matsushita Electric Ind Co Ltd | 気相成長装置 |
| KR970003907B1 (ko) | 1988-02-12 | 1997-03-22 | 도오교오 에레구토론 가부시끼 가이샤 | 기판처리 장치 및 기판처리 방법 |
| US5125784A (en) | 1988-03-11 | 1992-06-30 | Tel Sagami Limited | Wafers transfer device |
| US4828654A (en) * | 1988-03-23 | 1989-05-09 | Protocad, Inc. | Variable size segmented anode array for electroplating |
| JP2559617B2 (ja) | 1988-03-24 | 1996-12-04 | キヤノン株式会社 | 基板処理装置 |
| US4868992A (en) | 1988-04-22 | 1989-09-26 | Intel Corporation | Anode cathode parallelism gap gauge |
| US4902398A (en) | 1988-04-27 | 1990-02-20 | American Thim Film Laboratories, Inc. | Computer program for vacuum coating systems |
| JPH01283845A (ja) | 1988-05-10 | 1989-11-15 | Matsushita Electron Corp | 半導体基板の真空搬送装置 |
| US5048589A (en) | 1988-05-18 | 1991-09-17 | Kimberly-Clark Corporation | Non-creped hand or wiper towel |
| US5235995A (en) | 1989-03-27 | 1993-08-17 | Semitool, Inc. | Semiconductor processor apparatus with dynamic wafer vapor treatment and particulate volatilization |
| US5224504A (en) | 1988-05-25 | 1993-07-06 | Semitool, Inc. | Single wafer processor |
| US5168886A (en) | 1988-05-25 | 1992-12-08 | Semitool, Inc. | Single wafer processor |
| US5168887A (en) | 1990-05-18 | 1992-12-08 | Semitool, Inc. | Single wafer processor apparatus |
| US5431421A (en) | 1988-05-25 | 1995-07-11 | Semitool, Inc. | Semiconductor processor wafer holder |
| US4988533A (en) | 1988-05-27 | 1991-01-29 | Texas Instruments Incorporated | Method for deposition of silicon oxide on a wafer |
| DE3818757A1 (de) | 1988-05-31 | 1989-12-07 | Mannesmann Ag | Portal eines industrieroboters |
| US4959278A (en) | 1988-06-16 | 1990-09-25 | Nippon Mining Co., Ltd. | Tin whisker-free tin or tin alloy plated article and coating technique thereof |
| WO1990000476A1 (en) | 1988-07-12 | 1990-01-25 | The Regents Of The University Of California | Planarized interconnect etchback |
| US5054988A (en) | 1988-07-13 | 1991-10-08 | Tel Sagami Limited | Apparatus for transferring semiconductor wafers |
| US5128912A (en) | 1988-07-14 | 1992-07-07 | Cygnet Systems Incorporated | Apparatus including dual carriages for storing and retrieving information containing discs, and method |
| US5393624A (en) | 1988-07-29 | 1995-02-28 | Tokyo Electron Limited | Method and apparatus for manufacturing a semiconductor device |
| JPH06103687B2 (ja) | 1988-08-12 | 1994-12-14 | 大日本スクリーン製造株式会社 | 回転式表面処理方法および回転式表面処理における処理終点検出方法、ならびに回転式表面処理装置 |
| JPH0264646A (ja) | 1988-08-31 | 1990-03-05 | Toshiba Corp | レジストパターンの現像方法及びこの方法に使用する現像装置 |
| JPH0513322Y2 (enExample) | 1988-09-06 | 1993-04-08 | ||
| EP0358443B1 (en) | 1988-09-06 | 1997-11-26 | Canon Kabushiki Kaisha | Mask cassette loading device |
| US5061144A (en) | 1988-11-30 | 1991-10-29 | Tokyo Electron Limited | Resist process apparatus |
| US5146136A (en) | 1988-12-19 | 1992-09-08 | Hitachi, Ltd. | Magnetron having identically shaped strap rings separated by a gap and connecting alternate anode vane groups |
| US5238500A (en) | 1990-05-15 | 1993-08-24 | Semitool, Inc. | Aqueous hydrofluoric and hydrochloric acid vapor processing of semiconductor wafers |
| US5110248A (en) | 1989-07-17 | 1992-05-05 | Tokyo Electron Sagami Limited | Vertical heat-treatment apparatus having a wafer transfer mechanism |
| JPH03136232A (ja) | 1989-08-31 | 1991-06-11 | Dainippon Screen Mfg Co Ltd | 基板の表面処理装置 |
| WO1991004213A1 (en) | 1989-09-12 | 1991-04-04 | Rapro Technology, Inc. | Automated wafer transport system |
| JPH03125453A (ja) | 1989-10-09 | 1991-05-28 | Toshiba Corp | 半導体ウエハ移送装置 |
| US5172803A (en) | 1989-11-01 | 1992-12-22 | Lewin Heinz Ulrich | Conveyor belt with built-in magnetic-motor linear drive |
| US5155336A (en) | 1990-01-19 | 1992-10-13 | Applied Materials, Inc. | Rapid thermal heating apparatus and method |
| US5169408A (en) | 1990-01-26 | 1992-12-08 | Fsi International, Inc. | Apparatus for wafer processing with in situ rinse |
| US5186594A (en) | 1990-04-19 | 1993-02-16 | Applied Materials, Inc. | Dual cassette load lock |
| US5332445A (en) | 1990-05-15 | 1994-07-26 | Semitool, Inc. | Aqueous hydrofluoric acid vapor processing of semiconductor wafers |
| US5370741A (en) | 1990-05-15 | 1994-12-06 | Semitool, Inc. | Dynamic semiconductor wafer processing using homogeneous chemical vapors |
| US5232511A (en) | 1990-05-15 | 1993-08-03 | Semitool, Inc. | Dynamic semiconductor wafer processing using homogeneous mixed acid vapors |
| US5658387A (en) | 1991-03-06 | 1997-08-19 | Semitool, Inc. | Semiconductor processing spray coating apparatus |
| US5156174A (en) | 1990-05-18 | 1992-10-20 | Semitool, Inc. | Single wafer processor with a bowl |
| US5222310A (en) | 1990-05-18 | 1993-06-29 | Semitool, Inc. | Single wafer processor with a frame |
| US5431803A (en) | 1990-05-30 | 1995-07-11 | Gould Electronics Inc. | Electrodeposited copper foil and process for making same |
| US5230371A (en) | 1990-06-06 | 1993-07-27 | Asten Group, Inc. | Papermakers fabric having diverse flat machine direction yarn surfaces |
| KR0153250B1 (ko) | 1990-06-28 | 1998-12-01 | 카자마 겐쥬 | 종형 열처리 장치 |
| US5098522A (en) | 1990-06-29 | 1992-03-24 | The Procter & Gamble Company | Papermaking belt and method of making the same using a textured casting surface |
| US5252807A (en) | 1990-07-02 | 1993-10-12 | George Chizinsky | Heated plate rapid thermal processor |
| US5368711A (en) | 1990-08-01 | 1994-11-29 | Poris; Jaime | Selective metal electrodeposition process and apparatus |
| US5069548A (en) | 1990-08-08 | 1991-12-03 | Industrial Technology Institute | Field shift moire system |
| JPH0497856A (ja) | 1990-08-14 | 1992-03-30 | Canon Inc | インクジェット記録装置および文書処理装置 |
| JP2892476B2 (ja) | 1990-09-14 | 1999-05-17 | 東京エレクトロン株式会社 | 帯状液体ノズル及び液処理装置及び液処理方法 |
| US5115430A (en) | 1990-09-24 | 1992-05-19 | At&T Bell Laboratories | Fair access of multi-priority traffic to distributed-queue dual-bus networks |
| US5151168A (en) | 1990-09-24 | 1992-09-29 | Micron Technology, Inc. | Process for metallizing integrated circuits with electrolytically-deposited copper |
| US5135636A (en) | 1990-10-12 | 1992-08-04 | Microelectronics And Computer Technology Corporation | Electroplating method |
| US5078852A (en) | 1990-10-12 | 1992-01-07 | Microelectronics And Computer Technology Corporation | Plating rack |
| US5096550A (en) | 1990-10-15 | 1992-03-17 | The United States Of America As Represented By The United States Department Of Energy | Method and apparatus for spatially uniform electropolishing and electrolytic etching |
| JPH0645302B2 (ja) | 1990-10-26 | 1994-06-15 | 車体工業株式会社 | 車体の同一側面に複数の摺動ドアを設けた車両 |
| JP2595132B2 (ja) | 1990-11-26 | 1997-03-26 | 株式会社日立製作所 | 真空処理装置 |
| US5326455A (en) | 1990-12-19 | 1994-07-05 | Nikko Gould Foil Co., Ltd. | Method of producing electrolytic copper foil and apparatus for producing same |
| JPH081469Y2 (ja) | 1990-12-27 | 1996-01-17 | 株式会社小松製作所 | 圧力測定用ゲージの保持装置 |
| US5270222A (en) | 1990-12-31 | 1993-12-14 | Texas Instruments Incorporated | Method and apparatus for semiconductor device fabrication diagnosis and prognosis |
| JP2737416B2 (ja) | 1991-01-31 | 1998-04-08 | 日本電気株式会社 | めっき処理装置 |
| SE467976B (sv) | 1991-02-20 | 1992-10-12 | Dcm Innovation Ab | Anordning foer elektroplaetering, vid framstaellning av matriser foer tillverkning av t ex cd-skivor samt foerfarande foer tillverkning av matriser medelst anordningen |
| US5271953A (en) | 1991-02-25 | 1993-12-21 | Delco Electronics Corporation | System for performing work on workpieces |
| US5055036A (en) | 1991-02-26 | 1991-10-08 | Tokyo Electron Sagami Limited | Method of loading and unloading wafer boat |
| DE69220519T2 (de) | 1991-03-04 | 1998-02-19 | Toda Kogyo Corp | Verfahren zur Plattierung eines Verbundmagneten sowie Verbundmagnet mit einem Metallüberzug |
| EP1120817B8 (en) | 1991-03-26 | 2007-10-10 | Ngk Insulators, Ltd. | Use of a corrosion-resistant member |
| JP3241058B2 (ja) | 1991-03-28 | 2001-12-25 | 大日本スクリーン製造株式会社 | 回転式塗布装置及び回転式塗布方法 |
| US5178512A (en) | 1991-04-01 | 1993-01-12 | Equipe Technologies | Precision robot apparatus |
| GB9107149D0 (en) | 1991-04-05 | 1991-05-22 | Scapa Group Plc | Edge jointing of fabrics |
| GB9107166D0 (en) | 1991-04-05 | 1991-05-22 | Scapa Group Plc | Papermachine clothing |
| JPH04311591A (ja) | 1991-04-08 | 1992-11-04 | Sumitomo Metal Ind Ltd | めっき装置及びめっき方法 |
| DE4114427C2 (de) | 1991-05-03 | 1995-01-26 | Forschungszentrum Juelich Gmbh | Probentransfermechanismus |
| US5174045A (en) | 1991-05-17 | 1992-12-29 | Semitool, Inc. | Semiconductor processor with extendible receiver for handling multiple discrete wafers without wafer carriers |
| US5156730A (en) | 1991-06-25 | 1992-10-20 | International Business Machines | Electrode array and use thereof |
| JPH0536809A (ja) | 1991-07-31 | 1993-02-12 | Mitsubishi Electric Corp | 半導体基板処理装置に於ける半導体基板搬送アーム |
| US5209817A (en) | 1991-08-22 | 1993-05-11 | International Business Machines Corporation | Selective plating method for forming integral via and wiring layers |
| US5399564A (en) | 1991-09-03 | 1995-03-21 | Dowelanco | N-(4-pyridyl or 4-quinolinyl) arylacetamide and 4-(aralkoxy or aralkylamino) pyridine pesticides |
| US5332271A (en) | 1991-10-02 | 1994-07-26 | Grant Robert W | High temperature ceramic nut |
| JP2622046B2 (ja) | 1991-11-26 | 1997-06-18 | 大日本スクリーン製造株式会社 | 基板搬送装置 |
| WO1993011301A1 (en) | 1991-11-27 | 1993-06-10 | The Procter & Gamble Company | Cellulosic fibrous structures having pressure differential induced protuberances and a process of making such cellulosic fibrous structures |
| JP2734269B2 (ja) | 1991-12-26 | 1998-03-30 | 日本電気株式会社 | 半導体製造装置 |
| JPH05190475A (ja) * | 1992-01-08 | 1993-07-30 | Nec Corp | シリコン酸化膜成長装置 |
| JP2888001B2 (ja) * | 1992-01-09 | 1999-05-10 | 日本電気株式会社 | 金属メッキ装置 |
| US5217586A (en) * | 1992-01-09 | 1993-06-08 | International Business Machines Corporation | Electrochemical tool for uniform metal removal during electropolishing |
| DE4202194C2 (de) | 1992-01-28 | 1996-09-19 | Fairchild Convac Gmbh Geraete | Verfahren und Vorrichtung zum partiellen Entfernen von dünnen Schichten von einem Substrat |
| JP2867194B2 (ja) | 1992-02-05 | 1999-03-08 | 東京エレクトロン株式会社 | 処理装置及び処理方法 |
| US5301700A (en) | 1992-03-05 | 1994-04-12 | Tokyo Electron Limited | Washing system |
| US5228232A (en) | 1992-03-16 | 1993-07-20 | Rodney Miles | Sport fishing tackle box |
| US5501768A (en) | 1992-04-17 | 1996-03-26 | Kimberly-Clark Corporation | Method of treating papermaking fibers for making tissue |
| US5348620A (en) | 1992-04-17 | 1994-09-20 | Kimberly-Clark Corporation | Method of treating papermaking fibers for making tissue |
| US5256262A (en) | 1992-05-08 | 1993-10-26 | Blomsterberg Karl Ingemar | System and method for electrolytic deburring |
| JPH05326483A (ja) | 1992-05-15 | 1993-12-10 | Sony Corp | ウエハ処理装置およびウエハ一貫処理装置 |
| US5366786A (en) | 1992-05-15 | 1994-11-22 | Kimberly-Clark Corporation | Garment of durable nonwoven fabric |
| JP3200468B2 (ja) | 1992-05-21 | 2001-08-20 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | ウエーハ用めっき装置 |
| JP2654314B2 (ja) | 1992-06-04 | 1997-09-17 | 東京応化工業株式会社 | 裏面洗浄装置 |
| US5227041A (en) | 1992-06-12 | 1993-07-13 | Digital Equipment Corporation | Dry contact electroplating apparatus |
| US5224503A (en) | 1992-06-15 | 1993-07-06 | Semitool, Inc. | Centrifugal wafer carrier cleaning apparatus |
| JPH0625899A (ja) | 1992-07-10 | 1994-02-01 | Nec Corp | 電解メッキ装置 |
| ATE129361T1 (de) | 1992-08-04 | 1995-11-15 | Ibm | Fertigungsstrasse architektur mit vollautomatisierten und rechnergesteuerten fördereinrichtungen geeignet für abdichtbaren tragbaren unter druck stehenden behältern. |
| US5271972A (en) | 1992-08-17 | 1993-12-21 | Applied Materials, Inc. | Method for depositing ozone/TEOS silicon oxide films of reduced surface sensitivity |
| JPH0627768U (ja) | 1992-09-17 | 1994-04-12 | セイコー精機株式会社 | 搬送装置 |
| US5474807A (en) | 1992-09-30 | 1995-12-12 | Hoya Corporation | Method for applying or removing coatings at a confined peripheral region of a substrate |
| JP2877216B2 (ja) | 1992-10-02 | 1999-03-31 | 東京エレクトロン株式会社 | 洗浄装置 |
| US5567267A (en) | 1992-11-20 | 1996-10-22 | Tokyo Electron Limited | Method of controlling temperature of susceptor |
| KR970011065B1 (ko) | 1992-12-21 | 1997-07-05 | 다이닛뽕 스크린 세이조오 가부시키가이샤 | 기판처리장치와 기판처리장치에 있어서 기판교환장치 및 기판교환방법 |
| US5372848A (en) | 1992-12-24 | 1994-12-13 | International Business Machines Corporation | Process for creating organic polymeric substrate with copper |
| JP3258748B2 (ja) | 1993-02-08 | 2002-02-18 | 東京エレクトロン株式会社 | 熱処理装置 |
| JPH06244095A (ja) | 1993-02-12 | 1994-09-02 | Dainippon Screen Mfg Co Ltd | 基板冷却装置 |
| US5421893A (en) | 1993-02-26 | 1995-06-06 | Applied Materials, Inc. | Susceptor drive and wafer displacement mechanism |
| US5527390A (en) | 1993-03-19 | 1996-06-18 | Tokyo Electron Kabushiki | Treatment system including a plurality of treatment apparatus |
| KR100284556B1 (ko) | 1993-03-25 | 2001-04-02 | 다카시마 히로시 | 도포막 형성방법 및 그를 위한 장치 |
| US5340456A (en) | 1993-03-26 | 1994-08-23 | Mehler Vern A | Anode basket |
| JP3308333B2 (ja) | 1993-03-30 | 2002-07-29 | 三菱電機株式会社 | 電解メッキ装置,及び電解メッキ処理方法 |
| KR100248565B1 (ko) | 1993-03-30 | 2000-05-01 | 다카시마 히로시 | 레지스트 처리방법 및 레지스트 처리장치 |
| US5316642A (en) | 1993-04-22 | 1994-05-31 | Digital Equipment Corporation | Oscillation device for plating system |
| US5324683A (en) | 1993-06-02 | 1994-06-28 | Motorola, Inc. | Method of forming a semiconductor structure having an air region |
| US5607551A (en) | 1993-06-24 | 1997-03-04 | Kimberly-Clark Corporation | Soft tissue |
| US5684713A (en) | 1993-06-30 | 1997-11-04 | Massachusetts Institute Of Technology | Method and apparatus for the recursive design of physical structures |
| TW262566B (enExample) | 1993-07-02 | 1995-11-11 | Tokyo Electron Co Ltd | |
| EP0634699A1 (en) | 1993-07-16 | 1995-01-18 | Semiconductor Systems, Inc. | Clustered photolithography system |
| US5363171A (en) | 1993-07-29 | 1994-11-08 | The United States Of America As Represented By The Director, National Security Agency | Photolithography exposure tool and method for in situ photoresist measurments and exposure control |
| US5489341A (en) | 1993-08-23 | 1996-02-06 | Semitool, Inc. | Semiconductor processing with non-jetting fluid stream discharge array |
| US5658183A (en) | 1993-08-25 | 1997-08-19 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing including optical monitoring |
| US5700180A (en) | 1993-08-25 | 1997-12-23 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing |
| US5472502A (en) | 1993-08-30 | 1995-12-05 | Semiconductor Systems, Inc. | Apparatus and method for spin coating wafers and the like |
| US5421987A (en) | 1993-08-30 | 1995-06-06 | Tzanavaras; George | Precision high rate electroplating cell and method |
| US5391517A (en) | 1993-09-13 | 1995-02-21 | Motorola Inc. | Process for forming copper interconnect structure |
| JP3194823B2 (ja) | 1993-09-17 | 2001-08-06 | 富士通株式会社 | Cadライブラリモデルの作成装置 |
| EP0646842A1 (en) | 1993-09-30 | 1995-04-05 | Eastman Kodak Company | Photographic element containing an azopyrazolone masking coupler exhibiting improved keeping |
| US5513594A (en) | 1993-10-20 | 1996-05-07 | Mcclanahan; Adolphus E. | Clamp with wafer release for semiconductor wafer processing equipment |
| US5650082A (en) | 1993-10-29 | 1997-07-22 | Applied Materials, Inc. | Profiled substrate heating |
| EP0653512B1 (en) | 1993-11-16 | 1998-02-25 | Scapa Group Plc | Papermachine clothing |
| US5863348A (en) | 1993-12-22 | 1999-01-26 | International Business Machines Corporation | Programmable method for cleaning semiconductor elements |
| JP3289459B2 (ja) | 1993-12-29 | 2002-06-04 | カシオ計算機株式会社 | メッキ方法及びメッキ装置 |
| WO1995020064A1 (en) | 1994-01-24 | 1995-07-27 | Berg N Edward | Uniform electroplating of printed circuit boards |
| JP3377849B2 (ja) | 1994-02-02 | 2003-02-17 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | ウエーハ用メッキ装置 |
| US5391285A (en) | 1994-02-25 | 1995-02-21 | Motorola, Inc. | Adjustable plating cell for uniform bump plating of semiconductor wafers |
| DE9404771U1 (de) | 1994-03-21 | 1994-06-30 | Helmut Lehmer GmbH Stahl- und Maschinenbau, 92436 Bruck | Verriegelungsvorrichtung |
| JP3388628B2 (ja) | 1994-03-24 | 2003-03-24 | 東京応化工業株式会社 | 回転式薬液処理装置 |
| JP3146841B2 (ja) * | 1994-03-28 | 2001-03-19 | 信越半導体株式会社 | ウエーハのリンス装置 |
| KR100284559B1 (ko) | 1994-04-04 | 2001-04-02 | 다카시마 히로시 | 처리방법 및 처리장치 |
| KR0164007B1 (ko) | 1994-04-06 | 1999-02-01 | 이시다 아키라 | 미세 패턴화된 레지스트막을 가지는 기판의 건조처리방법 및 장치 |
| JPH07283077A (ja) | 1994-04-11 | 1995-10-27 | Ngk Spark Plug Co Ltd | 薄膜コンデンサ |
| CA2142805C (en) | 1994-04-12 | 1999-06-01 | Greg Arthur Wendt | Method of making soft tissue products |
| US5429686A (en) | 1994-04-12 | 1995-07-04 | Lindsay Wire, Inc. | Apparatus for making soft tissue products |
| US5405518A (en) | 1994-04-26 | 1995-04-11 | Industrial Technology Research Institute | Workpiece holder apparatus |
| US5544421A (en) | 1994-04-28 | 1996-08-13 | Semitool, Inc. | Semiconductor wafer processing system |
| US5664337A (en) | 1996-03-26 | 1997-09-09 | Semitool, Inc. | Automated semiconductor processing systems |
| US5454405A (en) | 1994-06-02 | 1995-10-03 | Albany International Corp. | Triple layer papermaking fabric including top and bottom weft yarns interwoven with a warp yarn system |
| JP3621151B2 (ja) | 1994-06-02 | 2005-02-16 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US5514258A (en) | 1994-08-18 | 1996-05-07 | Brinket; Oscar J. | Substrate plating device having laminar flow |
| US5512319A (en) | 1994-08-22 | 1996-04-30 | Basf Corporation | Polyurethane foam composite |
| JP3099054B2 (ja) | 1994-09-09 | 2000-10-16 | 東京エレクトロン株式会社 | 塗布装置及びその方法 |
| US5684654A (en) | 1994-09-21 | 1997-11-04 | Advanced Digital Information System | Device and method for storing and retrieving data |
| JP3143770B2 (ja) | 1994-10-07 | 2001-03-07 | 東京エレクトロン株式会社 | 基板搬送装置 |
| US5590996A (en) | 1994-10-13 | 1997-01-07 | Semitherm | Wafer transfer apparatus |
| US5660472A (en) | 1994-12-19 | 1997-08-26 | Applied Materials, Inc. | Method and apparatus for measuring substrate temperatures |
| US5676337A (en) | 1995-01-06 | 1997-10-14 | Union Switch & Signal Inc. | Railway car retarder system |
| US5625233A (en) | 1995-01-13 | 1997-04-29 | Ibm Corporation | Thin film multi-layer oxygen diffusion barrier consisting of refractory metal, refractory metal aluminide, and aluminum oxide |
| US5593545A (en) | 1995-02-06 | 1997-01-14 | Kimberly-Clark Corporation | Method for making uncreped throughdried tissue products without an open draw |
| JP3521587B2 (ja) | 1995-02-07 | 2004-04-19 | セイコーエプソン株式会社 | 基板周縁の不要物除去方法及び装置並びにそれを用いた塗布方法 |
| US5551986A (en) | 1995-02-15 | 1996-09-03 | Taxas Instruments Incorporated | Mechanical scrubbing for particle removal |
| JPH08238463A (ja) | 1995-03-03 | 1996-09-17 | Ebara Corp | 洗浄方法及び洗浄装置 |
| US5964643A (en) | 1995-03-28 | 1999-10-12 | Applied Materials, Inc. | Apparatus and method for in-situ monitoring of chemical mechanical polishing operations |
| DE19525666A1 (de) | 1995-03-31 | 1996-10-02 | Agfa Gevaert Ag | Farbfotografisches Aufzeichnungsmaterial mit einem neuen Magentakuppler vom Typ 2-Äquivalentanilinopyrazolon |
| AT405225B (de) | 1995-05-02 | 1999-06-25 | Sez Semiconduct Equip Zubehoer | Vorrichtung zum behandeln annähernd runder oder kreisscheibenförmiger gegenstände, insbesondere siliziumwafer |
| US5549808A (en) | 1995-05-12 | 1996-08-27 | International Business Machines Corporation | Method for forming capped copper electrical interconnects |
| US5516412A (en) | 1995-05-16 | 1996-05-14 | International Business Machines Corporation | Vertical paddle plating cell |
| US5522975A (en) | 1995-05-16 | 1996-06-04 | International Business Machines Corporation | Electroplating workpiece fixture |
| TW386235B (en) | 1995-05-23 | 2000-04-01 | Tokyo Electron Ltd | Method for spin rinsing |
| US6042712A (en) * | 1995-05-26 | 2000-03-28 | Formfactor, Inc. | Apparatus for controlling plating over a face of a substrate |
| TW309503B (enExample) | 1995-06-27 | 1997-07-01 | Tokyo Electron Co Ltd | |
| US5765444A (en) | 1995-07-10 | 1998-06-16 | Kensington Laboratories, Inc. | Dual end effector, multiple link robot arm system with corner reacharound and extended reach capabilities |
| US5670034A (en) | 1995-07-11 | 1997-09-23 | American Plating Systems | Reciprocating anode electrolytic plating apparatus and method |
| KR100432975B1 (ko) | 1995-07-27 | 2004-10-22 | 닛토덴코 가부시키가이샤 | 반도체웨이퍼의수납·인출장치및이것에이용되는반도체웨이퍼의운반용기 |
| US5741435A (en) | 1995-08-08 | 1998-04-21 | Nano Systems, Inc. | Magnetic memory having shape anisotropic magnetic elements |
| US5762751A (en) | 1995-08-17 | 1998-06-09 | Semitool, Inc. | Semiconductor processor with wafer face protection |
| US6086680A (en) | 1995-08-22 | 2000-07-11 | Asm America, Inc. | Low-mass susceptor |
| US6194628B1 (en) | 1995-09-25 | 2001-02-27 | Applied Materials, Inc. | Method and apparatus for cleaning a vacuum line in a CVD system |
| US6045618A (en) | 1995-09-25 | 2000-04-04 | Applied Materials, Inc. | Microwave apparatus for in-situ vacuum line cleaning for substrate processing equipment |
| US6187072B1 (en) | 1995-09-25 | 2001-02-13 | Applied Materials, Inc. | Method and apparatus for reducing perfluorocompound gases from substrate processing equipment emissions |
| US6193802B1 (en) | 1995-09-25 | 2001-02-27 | Applied Materials, Inc. | Parallel plate apparatus for in-situ vacuum line cleaning for substrate processing equipment |
| US5807469A (en) | 1995-09-27 | 1998-09-15 | Intel Corporation | Flexible continuous cathode contact circuit for electrolytic plating of C4, tab microbumps, and ultra large scale interconnects |
| US5677118A (en) | 1995-10-05 | 1997-10-14 | Eastman Kodak Company | Photographic element containing a recrystallizable 5-pyrazolone photographic coupler |
| US6481956B1 (en) | 1995-10-27 | 2002-11-19 | Brooks Automation Inc. | Method of transferring substrates with two different substrate holding end effectors |
| KR0182006B1 (ko) | 1995-11-10 | 1999-04-15 | 김광호 | 반도체 패키지 장치 및 몰딩물질에 의해 발생하는 기생용량의 산출방법 |
| US5597460A (en) | 1995-11-13 | 1997-01-28 | Reynolds Tech Fabricators, Inc. | Plating cell having laminar flow sparger |
| US5877829A (en) * | 1995-11-14 | 1999-03-02 | Sharp Kabushiki Kaisha | Liquid crystal display apparatus having adjustable viewing angle characteristics |
| JP3005461B2 (ja) | 1995-11-24 | 2000-01-31 | 日本電気株式会社 | 静電チャック |
| US5620581A (en) | 1995-11-29 | 1997-04-15 | Aiwa Research And Development, Inc. | Apparatus for electroplating metal films including a cathode ring, insulator ring and thief ring |
| US5860640A (en) | 1995-11-29 | 1999-01-19 | Applied Materials, Inc. | Semiconductor wafer alignment member and clamp ring |
| JPH09157846A (ja) | 1995-12-01 | 1997-06-17 | Teisan Kk | 温度調節装置 |
| US5616069A (en) | 1995-12-19 | 1997-04-01 | Micron Technology, Inc. | Directional spray pad scrubber |
| US5681392A (en) * | 1995-12-21 | 1997-10-28 | Xerox Corporation | Fluid reservoir containing panels for reducing rate of fluid flow |
| TW321192U (en) | 1995-12-23 | 1997-11-21 | Samsung Electronics Co Ltd | A arm of robot for transporting semiconductor wafer |
| JPH09181026A (ja) | 1995-12-25 | 1997-07-11 | Toshiba Corp | 半導体装置の製造装置 |
| US6709562B1 (en) | 1995-12-29 | 2004-03-23 | International Business Machines Corporation | Method of making electroplated interconnection structures on integrated circuit chips |
| US5746565A (en) | 1996-01-22 | 1998-05-05 | Integrated Solutions, Inc. | Robotic wafer handler |
| US5952050A (en) | 1996-02-27 | 1999-09-14 | Micron Technology, Inc. | Chemical dispensing system for semiconductor wafer processing |
| US6279724B1 (en) | 1997-12-19 | 2001-08-28 | Semitoll Inc. | Automated semiconductor processing system |
| US5871805A (en) | 1996-04-08 | 1999-02-16 | Lemelson; Jerome | Computer controlled vapor deposition processes |
| US6051284A (en) | 1996-05-08 | 2000-04-18 | Applied Materials, Inc. | Chamber monitoring and adjustment by plasma RF metrology |
| US6162488A (en) | 1996-05-14 | 2000-12-19 | Boston University | Method for closed loop control of chemical vapor deposition process |
| JP3537269B2 (ja) | 1996-05-21 | 2004-06-14 | アネルバ株式会社 | マルチチャンバースパッタリング装置 |
| US5662788A (en) | 1996-06-03 | 1997-09-02 | Micron Technology, Inc. | Method for forming a metallization layer |
| US6072160A (en) | 1996-06-03 | 2000-06-06 | Applied Materials, Inc. | Method and apparatus for enhancing the efficiency of radiant energy sources used in rapid thermal processing of substrates by energy reflection |
| TW359854B (en) | 1996-06-21 | 1999-06-01 | Tokyo Electron Ltd | Processing apparatus and processing method |
| US5937142A (en) | 1996-07-11 | 1999-08-10 | Cvc Products, Inc. | Multi-zone illuminator for rapid thermal processing |
| US6091498A (en) | 1996-07-15 | 2000-07-18 | Semitool, Inc. | Semiconductor processing apparatus having lift and tilt mechanism |
| WO2000061498A2 (en) | 1999-04-13 | 2000-10-19 | Semitool, Inc. | System for electrochemically processing a workpiece |
| US6672820B1 (en) | 1996-07-15 | 2004-01-06 | Semitool, Inc. | Semiconductor processing apparatus having linear conveyer system |
| US6921467B2 (en) * | 1996-07-15 | 2005-07-26 | Semitool, Inc. | Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces |
| US6264752B1 (en) | 1998-03-13 | 2001-07-24 | Gary L. Curtis | Reactor for processing a microelectronic workpiece |
| US6168695B1 (en) | 1999-07-12 | 2001-01-02 | Daniel J. Woodruff | Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same |
| US6350319B1 (en) | 1998-03-13 | 2002-02-26 | Semitool, Inc. | Micro-environment reactor for processing a workpiece |
| US5731678A (en) | 1996-07-15 | 1998-03-24 | Semitool, Inc. | Processing head for semiconductor processing machines |
| US5980706A (en) | 1996-07-15 | 1999-11-09 | Semitool, Inc. | Electrode semiconductor workpiece holder |
| US6413436B1 (en) | 1999-01-27 | 2002-07-02 | Semitool, Inc. | Selective treatment of the surface of a microelectronic workpiece |
| US6099712A (en) | 1997-09-30 | 2000-08-08 | Semitool, Inc. | Semiconductor plating bowl and method using anode shield |
| US6752584B2 (en) | 1996-07-15 | 2004-06-22 | Semitool, Inc. | Transfer devices for handling microelectronic workpieces within an environment of a processing machine and methods of manufacturing and using such devices in the processing of microelectronic workpieces |
| US6004828A (en) | 1997-09-30 | 1999-12-21 | Semitool, Inc, | Semiconductor processing workpiece support with sensory subsystem for detection of wafers or other semiconductor workpieces |
| US6599412B1 (en) | 1997-09-30 | 2003-07-29 | Semitool, Inc. | In-situ cleaning processes for semiconductor electroplating electrodes |
| US6749390B2 (en) | 1997-12-15 | 2004-06-15 | Semitool, Inc. | Integrated tools with transfer devices for handling microelectronic workpieces |
| US6318951B1 (en) | 1999-07-09 | 2001-11-20 | Semitool, Inc. | Robots for microelectronic workpiece handling |
| US5872633A (en) | 1996-07-26 | 1999-02-16 | Speedfam Corporation | Methods and apparatus for detecting removal of thin film layers during planarization |
| US5948203A (en) | 1996-07-29 | 1999-09-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Optical dielectric thickness monitor for chemical-mechanical polishing process monitoring |
| WO1998005060A1 (en) | 1996-07-31 | 1998-02-05 | The Board Of Trustees Of The Leland Stanford Junior University | Multizone bake/chill thermal cycling module |
| JP2953395B2 (ja) | 1996-09-05 | 1999-09-27 | 日本電気株式会社 | スパッタリング装置 |
| AU3670797A (en) | 1996-09-06 | 1998-03-26 | Kimberly-Clark Worldwide, Inc. | Process for producing high-bulk tissue webs using nonwoven substrates |
| US5829791A (en) | 1996-09-20 | 1998-11-03 | Bruker Instruments, Inc. | Insulated double bayonet coupler for fluid recirculation apparatus |
| US5747098A (en) | 1996-09-24 | 1998-05-05 | Macdermid, Incorporated | Process for the manufacture of printed circuit boards |
| TW357406B (en) | 1996-10-07 | 1999-05-01 | Tokyo Electron Ltd | Method and apparatus for cleaning and drying a substrate |
| KR100277522B1 (ko) | 1996-10-08 | 2001-01-15 | 이시다 아키라 | 기판처리장치 |
| US5683564A (en) | 1996-10-15 | 1997-11-04 | Reynolds Tech Fabricators Inc. | Plating cell and plating method with fluid wiper |
| US5904827A (en) | 1996-10-15 | 1999-05-18 | Reynolds Tech Fabricators, Inc. | Plating cell with rotary wiper and megasonic transducer |
| US5776327A (en) | 1996-10-16 | 1998-07-07 | Mitsubishi Semiconuctor Americe, Inc. | Method and apparatus using an anode basket for electroplating a workpiece |
| US5788829A (en) | 1996-10-16 | 1998-08-04 | Mitsubishi Semiconductor America, Inc. | Method and apparatus for controlling plating thickness of a workpiece |
| US5989397A (en) | 1996-11-12 | 1999-11-23 | The United States Of America As Represented By The Secretary Of The Air Force | Gradient multilayer film generation process control |
| US5785826A (en) | 1996-12-26 | 1998-07-28 | Digital Matrix | Apparatus for electroforming |
| US5843296A (en) | 1996-12-26 | 1998-12-01 | Digital Matrix | Method for electroforming an optical disk stamper |
| AUPO473297A0 (en) | 1997-01-22 | 1997-02-20 | Industrial Automation Services Pty Ltd | Coating thickness control |
| US5755948A (en) | 1997-01-23 | 1998-05-26 | Hardwood Line Manufacturing Co. | Electroplating system and process |
| DE69703798T2 (de) | 1997-02-03 | 2001-08-02 | Okuno Chemical Industries Co., Ltd. | Verfahren zum elektrobeschichten nichtleitender materialien |
| US5924058A (en) | 1997-02-14 | 1999-07-13 | Applied Materials, Inc. | Permanently mounted reference sample for a substrate measurement tool |
| TW383414B (en) | 1997-03-05 | 2000-03-01 | Tokyo Electron Ltd | Photoresist agent processing method and photoresist agent processing system and evaluation method and processing apparatus for photoresist agent film |
| JP3405517B2 (ja) * | 1997-03-31 | 2003-05-12 | ティーディーケイ株式会社 | 電気めっき方法及び装置 |
| US6090260A (en) * | 1997-03-31 | 2000-07-18 | Tdk Corporation | Electroplating method |
| JPH10303106A (ja) | 1997-04-30 | 1998-11-13 | Toshiba Corp | 現像処理装置およびその処理方法 |
| JP3641733B2 (ja) | 1997-05-06 | 2005-04-27 | コニカミノルタホールディングス株式会社 | ハロゲン化銀カラー写真感光材料 |
| US6174425B1 (en) * | 1997-05-14 | 2001-01-16 | Motorola, Inc. | Process for depositing a layer of material over a substrate |
| DE19821781C2 (de) | 1997-05-15 | 2002-07-18 | Toyoda Gosei Kk | Beschichtungsverfahren und Beschichtungsgerät zur Herstellung dreidimensionaler Metallgegenstände |
| US6157106A (en) | 1997-05-16 | 2000-12-05 | Applied Materials, Inc. | Magnetically-levitated rotor system for an RTP chamber |
| US6149729A (en) | 1997-05-22 | 2000-11-21 | Tokyo Electron Limited | Film forming apparatus and method |
| US6069068A (en) | 1997-05-30 | 2000-05-30 | International Business Machines Corporation | Sub-quarter-micron copper interconnections with improved electromigration resistance and reduced defect sensitivity |
| US6001235A (en) | 1997-06-23 | 1999-12-14 | International Business Machines Corporation | Rotary plater with radially distributed plating solution |
| JP3223850B2 (ja) | 1997-07-18 | 2001-10-29 | 日本電気株式会社 | 噴流めっき装置 |
| US6017437A (en) | 1997-08-22 | 2000-01-25 | Cutek Research, Inc. | Process chamber and method for depositing and/or removing material on a substrate |
| US5999886A (en) | 1997-09-05 | 1999-12-07 | Advanced Micro Devices, Inc. | Measurement system for detecting chemical species within a semiconductor processing device chamber |
| US6053687A (en) | 1997-09-05 | 2000-04-25 | Applied Materials, Inc. | Cost effective modular-linear wafer processing |
| JPH1180993A (ja) | 1997-09-10 | 1999-03-26 | Ebara Corp | 半導体ウエハメッキ装置 |
| US6004440A (en) | 1997-09-18 | 1999-12-21 | Semitool, Inc. | Cathode current control system for a wafer electroplating apparatus |
| WO1999016936A1 (en) | 1997-09-30 | 1999-04-08 | Semitool, Inc. | Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations |
| US6921468B2 (en) | 1997-09-30 | 2005-07-26 | Semitool, Inc. | Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations |
| US5882498A (en) | 1997-10-16 | 1999-03-16 | Advanced Micro Devices, Inc. | Method for reducing oxidation of electroplating chamber contacts and improving uniform electroplating of a substrate |
| US6399505B2 (en) | 1997-10-20 | 2002-06-04 | Advanced Micro Devices, Inc. | Method and system for copper interconnect formation |
| US6110011A (en) | 1997-11-10 | 2000-08-29 | Applied Materials, Inc. | Integrated electrodeposition and chemical-mechanical polishing tool |
| US6156167A (en) | 1997-11-13 | 2000-12-05 | Novellus Systems, Inc. | Clamshell apparatus for electrochemically treating semiconductor wafers |
| US6027631A (en) | 1997-11-13 | 2000-02-22 | Novellus Systems, Inc. | Electroplating system with shields for varying thickness profile of deposited layer |
| US6179983B1 (en) | 1997-11-13 | 2001-01-30 | Novellus Systems, Inc. | Method and apparatus for treating surface including virtual anode |
| US6159354A (en) | 1997-11-13 | 2000-12-12 | Novellus Systems, Inc. | Electric potential shaping method for electroplating |
| US5897379A (en) | 1997-12-19 | 1999-04-27 | Sharp Microelectronics Technology, Inc. | Low temperature system and method for CVD copper removal |
| US6107192A (en) | 1997-12-30 | 2000-08-22 | Applied Materials, Inc. | Reactive preclean prior to metallization for sub-quarter micron application |
| US6251528B1 (en) | 1998-01-09 | 2001-06-26 | International Business Machines Corporation | Method to plate C4 to copper stud |
| TW444275B (en) | 1998-01-13 | 2001-07-01 | Toshiba Corp | Processing device, laser annealing device, laser annealing method, manufacturing device and substrate manufacturing device for panel display |
| US6140234A (en) | 1998-01-20 | 2000-10-31 | International Business Machines Corporation | Method to selectively fill recesses with conductive metal |
| US6168693B1 (en) | 1998-01-22 | 2001-01-02 | International Business Machines Corporation | Apparatus for controlling the uniformity of an electroplated workpiece |
| JP3501937B2 (ja) | 1998-01-30 | 2004-03-02 | 富士通株式会社 | 半導体装置の製造方法 |
| US7244677B2 (en) | 1998-02-04 | 2007-07-17 | Semitool. Inc. | Method for filling recessed micro-structures with metallization in the production of a microelectronic device |
| EP1019954B1 (en) | 1998-02-04 | 2013-05-15 | Applied Materials, Inc. | Method and apparatus for low-temperature annealing of electroplated copper micro-structures in the production of a microelectronic device |
| US5900663A (en) | 1998-02-07 | 1999-05-04 | Xemod, Inc. | Quasi-mesh gate structure for lateral RF MOS devices |
| US5932077A (en) | 1998-02-09 | 1999-08-03 | Reynolds Tech Fabricators, Inc. | Plating cell with horizontal product load mechanism |
| AU2233399A (en) | 1998-02-12 | 1999-08-30 | Acm Research, Inc. | Plating apparatus and method |
| US6151532A (en) | 1998-03-03 | 2000-11-21 | Lam Research Corporation | Method and apparatus for predicting plasma-process surface profiles |
| US6072163A (en) | 1998-03-05 | 2000-06-06 | Fsi International Inc. | Combination bake/chill apparatus incorporating low thermal mass, thermally conductive bakeplate |
| US6318385B1 (en) | 1998-03-13 | 2001-11-20 | Semitool, Inc. | Micro-environment chamber and system for rinsing and drying a semiconductor workpiece |
| US6423642B1 (en) | 1998-03-13 | 2002-07-23 | Semitool, Inc. | Reactor for processing a semiconductor wafer |
| TW593731B (en) | 1998-03-20 | 2004-06-21 | Semitool Inc | Apparatus for applying a metal structure to a workpiece |
| US6197181B1 (en) | 1998-03-20 | 2001-03-06 | Semitool, Inc. | Apparatus and method for electrolytically depositing a metal on a microelectronic workpiece |
| US6565729B2 (en) | 1998-03-20 | 2003-05-20 | Semitool, Inc. | Method for electrochemically depositing metal on a semiconductor workpiece |
| US6208751B1 (en) | 1998-03-24 | 2001-03-27 | Applied Materials, Inc. | Cluster tool |
| US6132289A (en) | 1998-03-31 | 2000-10-17 | Lam Research Corporation | Apparatus and method for film thickness measurement integrated into a wafer load/unload unit |
| US6280183B1 (en) | 1998-04-01 | 2001-08-28 | Applied Materials, Inc. | Substrate support for a thermal processing chamber |
| WO1999054527A2 (en) | 1998-04-21 | 1999-10-28 | Applied Materials, Inc. | Electro-chemical deposition system and method of electroplating on substrates |
| JPH11300663A (ja) | 1998-04-24 | 1999-11-02 | Mecs Corp | 薄型基板搬送装置 |
| US6268289B1 (en) | 1998-05-18 | 2001-07-31 | Motorola Inc. | Method for protecting the edge exclusion of a semiconductor wafer from copper plating through use of an edge exclusion masking layer |
| US6080288A (en) | 1998-05-29 | 2000-06-27 | Schwartz; Vladimir | System for forming nickel stampers utilized in optical disc production |
| US6025600A (en) | 1998-05-29 | 2000-02-15 | International Business Machines Corporation | Method for astigmatism correction in charged particle beam systems |
| US6099702A (en) | 1998-06-10 | 2000-08-08 | Novellus Systems, Inc. | Electroplating chamber with rotatable wafer holder and pre-wetting and rinsing capability |
| US6143155A (en) | 1998-06-11 | 2000-11-07 | Speedfam Ipec Corp. | Method for simultaneous non-contact electrochemical plating and planarizing of semiconductor wafers using a bipiolar electrode assembly |
| US6228232B1 (en) | 1998-07-09 | 2001-05-08 | Semitool, Inc. | Reactor vessel having improved cup anode and conductor assembly |
| US6303010B1 (en) | 1999-07-12 | 2001-10-16 | Semitool, Inc. | Methods and apparatus for processing the surface of a microelectronic workpiece |
| US6497801B1 (en) | 1998-07-10 | 2002-12-24 | Semitool Inc | Electroplating apparatus with segmented anode array |
| WO2000003072A1 (en) | 1998-07-10 | 2000-01-20 | Semitool, Inc. | Method and apparatus for copper plating using electroless plating and electroplating |
| US6080291A (en) | 1998-07-10 | 2000-06-27 | Semitool, Inc. | Apparatus for electrochemically processing a workpiece including an electrical contact assembly having a seal member |
| KR20010074695A (ko) | 1998-07-11 | 2001-08-09 | 세미툴 인코포레이티드 | 마이크로일렉트릭 제품 취급용 로봇 |
| US6017820A (en) | 1998-07-17 | 2000-01-25 | Cutek Research, Inc. | Integrated vacuum and plating cluster system |
| US6074544A (en) | 1998-07-22 | 2000-06-13 | Novellus Systems, Inc. | Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer |
| US6297154B1 (en) | 1998-08-28 | 2001-10-02 | Agere System Guardian Corp. | Process for semiconductor device fabrication having copper interconnects |
| DE19840109A1 (de) | 1998-09-03 | 2000-03-09 | Agfa Gevaert Ag | Farbfotografisches Silberhalogenidmaterial |
| US6108937A (en) | 1998-09-10 | 2000-08-29 | Asm America, Inc. | Method of cooling wafers |
| US6122046A (en) | 1998-10-02 | 2000-09-19 | Applied Materials, Inc. | Dual resolution combined laser spot scanning and area imaging inspection |
| US5957836A (en) | 1998-10-16 | 1999-09-28 | Johnson; Lanny L. | Rotatable retractor |
| US6132587A (en) * | 1998-10-19 | 2000-10-17 | Jorne; Jacob | Uniform electroplating of wafers |
| US6402923B1 (en) | 2000-03-27 | 2002-06-11 | Novellus Systems Inc | Method and apparatus for uniform electroplating of integrated circuits using a variable field shaping element |
| US6773571B1 (en) | 2001-06-28 | 2004-08-10 | Novellus Systems, Inc. | Method and apparatus for uniform electroplating of thin metal seeded wafers using multiple segmented virtual anode sources |
| US6143147A (en) | 1998-10-30 | 2000-11-07 | Tokyo Electron Limited | Wafer holding assembly and wafer processing apparatus having said assembly |
| US6159073A (en) | 1998-11-02 | 2000-12-12 | Applied Materials, Inc. | Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing |
| US6201240B1 (en) | 1998-11-04 | 2001-03-13 | Applied Materials, Inc. | SEM image enhancement using narrow band detection and color assignment |
| DE19854743A1 (de) | 1998-11-27 | 2000-06-08 | Sez Semiconduct Equip Zubehoer | Vorrichtung zum Naßätzen einer Kante einer Halbleiterscheibe |
| WO2000032835A2 (en) | 1998-11-30 | 2000-06-08 | Applied Materials, Inc. | Electro-chemical deposition system |
| US6290865B1 (en) | 1998-11-30 | 2001-09-18 | Applied Materials, Inc. | Spin-rinse-drying process for electroplated semiconductor wafers |
| US6258220B1 (en) | 1998-11-30 | 2001-07-10 | Applied Materials, Inc. | Electro-chemical deposition system |
| US6103085A (en) | 1998-12-04 | 2000-08-15 | Advanced Micro Devices, Inc. | Electroplating uniformity by diffuser design |
| US6309520B1 (en) | 1998-12-07 | 2001-10-30 | Semitool, Inc. | Methods and apparatus for processing the surface of a microelectronic workpiece |
| US6247998B1 (en) | 1999-01-25 | 2001-06-19 | Applied Materials, Inc. | Method and apparatus for determining substrate layer thickness during chemical mechanical polishing |
| US6190234B1 (en) | 1999-01-25 | 2001-02-20 | Applied Materials, Inc. | Endpoint detection with light beams of different wavelengths |
| US6136163A (en) | 1999-03-05 | 2000-10-24 | Applied Materials, Inc. | Apparatus for electro-chemical deposition with thermal anneal chamber |
| JP3395696B2 (ja) | 1999-03-15 | 2003-04-14 | 日本電気株式会社 | ウェハ処理装置およびウェハ処理方法 |
| US6244931B1 (en) | 1999-04-02 | 2001-06-12 | Applied Materials, Inc. | Buffer station on CMP system |
| US6916412B2 (en) | 1999-04-13 | 2005-07-12 | Semitool, Inc. | Adaptable electrochemical processing chamber |
| US7020537B2 (en) | 1999-04-13 | 2006-03-28 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| US7189318B2 (en) | 1999-04-13 | 2007-03-13 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| US7264698B2 (en) | 1999-04-13 | 2007-09-04 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
| US20030038035A1 (en) | 2001-05-30 | 2003-02-27 | Wilson Gregory J. | Methods and systems for controlling current in electrochemical processing of microelectronic workpieces |
| US7351315B2 (en) * | 2003-12-05 | 2008-04-01 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
| US7160421B2 (en) * | 1999-04-13 | 2007-01-09 | Semitool, Inc. | Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| US6130415A (en) | 1999-04-22 | 2000-10-10 | Applied Materials, Inc. | Low temperature control of rapid thermal processes |
| US6277607B1 (en) | 1999-05-24 | 2001-08-21 | Sanjay Tyagi | High specificity primers, amplification methods and kits |
| JP3387852B2 (ja) | 1999-05-28 | 2003-03-17 | 株式会社ソフト99コーポレーション | 撥水性付与クロス用処理剤及び撥水性付与クロス |
| US6238539B1 (en) | 1999-06-25 | 2001-05-29 | Hughes Electronics Corporation | Method of in-situ displacement/stress control in electroplating |
| US6197182B1 (en) | 1999-07-07 | 2001-03-06 | Technic Inc. | Apparatus and method for plating wafers, substrates and other articles |
| US6623609B2 (en) | 1999-07-12 | 2003-09-23 | Semitool, Inc. | Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same |
| US6254742B1 (en) | 1999-07-12 | 2001-07-03 | Semitool, Inc. | Diffuser with spiral opening pattern for an electroplating reactor vessel |
| EP1069213A3 (en) | 1999-07-12 | 2004-01-28 | Applied Materials, Inc. | Optimal anneal technology for micro-voiding control and self-annealing management of electroplated copper |
| JP3437498B2 (ja) | 1999-07-22 | 2003-08-18 | パナソニック コミュニケーションズ株式会社 | 画像入出力装置およびステータス情報通知方法 |
| US6255222B1 (en) | 1999-08-24 | 2001-07-03 | Applied Materials, Inc. | Method for removing residue from substrate processing chamber exhaust line for silicon-oxygen-carbon deposition process |
| US6309981B1 (en) | 1999-10-01 | 2001-10-30 | Novellus Systems, Inc. | Edge bevel removal of copper from silicon wafers |
| US6333275B1 (en) | 1999-10-01 | 2001-12-25 | Novellus Systems, Inc. | Etchant mixing system for edge bevel removal of copper from silicon wafers |
| US6277194B1 (en) | 1999-10-21 | 2001-08-21 | Applied Materials, Inc. | Method for in-situ cleaning of surfaces in a substrate processing chamber |
| US6270634B1 (en) | 1999-10-29 | 2001-08-07 | Applied Materials, Inc. | Method for plasma etching at a high etch rate |
| US6278089B1 (en) | 1999-11-02 | 2001-08-21 | Applied Materials, Inc. | Heater for use in substrate processing |
| US6444101B1 (en) | 1999-11-12 | 2002-09-03 | Applied Materials, Inc. | Conductive biasing member for metal layering |
| US6404438B1 (en) | 1999-12-21 | 2002-06-11 | Electronic Arts, Inc. | Behavioral learning for a visual representation in a communication environment |
| US6231743B1 (en) | 2000-01-03 | 2001-05-15 | Motorola, Inc. | Method for forming a semiconductor device |
| US6780374B2 (en) | 2000-12-08 | 2004-08-24 | Semitool, Inc. | Method and apparatus for processing a microelectronic workpiece at an elevated temperature |
| US6471913B1 (en) | 2000-02-09 | 2002-10-29 | Semitool, Inc. | Method and apparatus for processing a microelectronic workpiece including an apparatus and method for executing a processing step at an elevated temperature |
| JP4144150B2 (ja) | 2000-02-16 | 2008-09-03 | 松下電器産業株式会社 | 陰極線管 |
| US6491806B1 (en) | 2000-04-27 | 2002-12-10 | Intel Corporation | Electroplating bath composition |
| AU2001259504A1 (en) | 2000-05-24 | 2001-12-03 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| JP2004501666A (ja) | 2000-06-30 | 2004-01-22 | エピゲノミクス アーゲー | 薬理ゲノミクスのメチル化状態分析のための方法及び核酸 |
| US6747734B1 (en) | 2000-07-08 | 2004-06-08 | Semitool, Inc. | Apparatus and method for processing a microelectronic workpiece using metrology |
| WO2002004887A1 (en) | 2000-07-08 | 2002-01-17 | Semitool, Inc. | Methods and apparatus for processing microelectronic workpieces using metrology |
| US6428673B1 (en) | 2000-07-08 | 2002-08-06 | Semitool, Inc. | Apparatus and method for electrochemical processing of a microelectronic workpiece, capable of modifying processing based on metrology |
| WO2002017203A1 (en) | 2000-08-25 | 2002-02-28 | Sabre Inc. | Method and apparatus for determining and presenting lodging alternatives |
| KR100745543B1 (ko) | 2000-08-31 | 2007-08-03 | 다이니뽄 잉끼 가가꾸 고오교오 가부시끼가이샤 | 액정 표시 소자 |
| US6322112B1 (en) | 2000-09-14 | 2001-11-27 | Franklin R. Duncan | Knot tying methods and apparatus |
| US6632334B2 (en) | 2001-06-05 | 2003-10-14 | Semitool, Inc. | Distributed power supplies for microelectronic workpiece processing tools |
| WO2003018874A2 (en) | 2001-08-31 | 2003-03-06 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
| US6678055B2 (en) | 2001-11-26 | 2004-01-13 | Tevet Process Control Technologies Ltd. | Method and apparatus for measuring stress in semiconductor wafers |
-
2000
- 2000-04-13 WO PCT/US2000/010120 patent/WO2000061498A2/en not_active Ceased
- 2000-04-13 CN CNB008082359A patent/CN1296524C/zh not_active Expired - Lifetime
- 2000-04-13 JP JP2000610779A patent/JP4219562B2/ja not_active Expired - Fee Related
- 2000-04-13 KR KR1020017013081A patent/KR100707121B1/ko not_active Expired - Lifetime
- 2000-04-13 KR KR1020017013072A patent/KR100695660B1/ko not_active Expired - Lifetime
- 2000-04-13 JP JP2000610882A patent/JP4288010B2/ja not_active Expired - Fee Related
- 2000-04-13 CN CN008081913A patent/CN1217034C/zh not_active Expired - Fee Related
- 2000-04-13 TW TW089107055A patent/TWI226387B/zh not_active IP Right Cessation
- 2000-04-13 WO PCT/US2000/010210 patent/WO2000061837A1/en not_active Ceased
- 2000-04-13 EP EP00922221A patent/EP1192298A4/en not_active Withdrawn
- 2000-04-13 EP EP00922257A patent/EP1194613A4/en not_active Withdrawn
- 2000-04-13 TW TW089107056A patent/TW527444B/zh not_active IP Right Cessation
-
2001
- 2001-03-12 US US09/804,697 patent/US6660137B2/en not_active Expired - Lifetime
- 2001-03-12 US US09/804,696 patent/US6569297B2/en not_active Expired - Lifetime
-
2003
- 2003-03-26 US US10/400,186 patent/US7267749B2/en not_active Expired - Lifetime
- 2003-11-18 US US10/715,700 patent/US20040099533A1/en not_active Abandoned
-
2004
- 2004-10-28 US US10/975,154 patent/US7566386B2/en not_active Expired - Lifetime
- 2004-10-28 US US10/975,266 patent/US20050224340A1/en not_active Abandoned
- 2004-10-28 US US10/975,202 patent/US20050109633A1/en not_active Abandoned
- 2004-10-28 US US10/975,738 patent/US20050109625A1/en not_active Abandoned
- 2004-10-28 US US10/975,551 patent/US20050167265A1/en not_active Abandoned
- 2004-10-28 US US10/975,843 patent/US20050109629A1/en not_active Abandoned
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5000827A (en) * | 1990-01-02 | 1991-03-19 | Motorola, Inc. | Method and apparatus for adjusting plating solution flow characteristics at substrate cathode periphery to minimize edge effect |
| US5256274A (en) * | 1990-08-01 | 1993-10-26 | Jaime Poris | Selective metal electrodeposition process |
Cited By (44)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7967969B2 (en) | 2000-05-10 | 2011-06-28 | Novellus Systems, Inc. | Method of electroplating using a high resistance ionic current source |
| US8623193B1 (en) | 2004-06-16 | 2014-01-07 | Novellus Systems, Inc. | Method of electroplating using a high resistance ionic current source |
| US10023970B2 (en) | 2006-08-16 | 2018-07-17 | Novellus Systems, Inc. | Dynamic current distribution control apparatus and method for wafer electroplating |
| US8308931B2 (en) | 2006-08-16 | 2012-11-13 | Novellus Systems, Inc. | Method and apparatus for electroplating |
| US9822461B2 (en) | 2006-08-16 | 2017-11-21 | Novellus Systems, Inc. | Dynamic current distribution control apparatus and method for wafer electroplating |
| US9260793B2 (en) | 2008-11-07 | 2016-02-16 | Novellus Systems, Inc. | Electroplating apparatus for tailored uniformity profile |
| US10920335B2 (en) | 2008-11-07 | 2021-02-16 | Novellus Systems, Inc. | Electroplating apparatus for tailored uniformity profile |
| US8858774B2 (en) | 2008-11-07 | 2014-10-14 | Novellus Systems, Inc. | Electroplating apparatus for tailored uniformity profile |
| US9309604B2 (en) | 2008-11-07 | 2016-04-12 | Novellus Systems, Inc. | Method and apparatus for electroplating |
| US8475636B2 (en) | 2008-11-07 | 2013-07-02 | Novellus Systems, Inc. | Method and apparatus for electroplating |
| US11549192B2 (en) | 2008-11-07 | 2023-01-10 | Novellus Systems, Inc. | Electroplating apparatus for tailored uniformity profile |
| US10017869B2 (en) | 2008-11-07 | 2018-07-10 | Novellus Systems, Inc. | Electroplating apparatus for tailored uniformity profile |
| US8475637B2 (en) | 2008-12-17 | 2013-07-02 | Novellus Systems, Inc. | Electroplating apparatus with vented electrolyte manifold |
| US8540857B1 (en) | 2008-12-19 | 2013-09-24 | Novellus Systems, Inc. | Plating method and apparatus with multiple internally irrigated chambers |
| CN102459717A (zh) * | 2009-06-09 | 2012-05-16 | 诺发系统有限公司 | 用于电镀的方法及设备 |
| CN102459717B (zh) * | 2009-06-09 | 2014-12-10 | 诺发系统有限公司 | 用于电镀的方法及设备 |
| WO2010144330A3 (en) * | 2009-06-09 | 2011-03-03 | Novellus Systems, Inc. | Method and apparatus for electroplating |
| US10233556B2 (en) | 2010-07-02 | 2019-03-19 | Lam Research Corporation | Dynamic modulation of cross flow manifold during electroplating |
| US9624592B2 (en) | 2010-07-02 | 2017-04-18 | Novellus Systems, Inc. | Cross flow manifold for electroplating apparatus |
| US9464361B2 (en) | 2010-07-02 | 2016-10-11 | Novellus Systems, Inc. | Control of electrolyte hydrodynamics for efficient mass transfer during electroplating |
| US9394620B2 (en) | 2010-07-02 | 2016-07-19 | Novellus Systems, Inc. | Control of electrolyte hydrodynamics for efficient mass transfer during electroplating |
| US10190230B2 (en) | 2010-07-02 | 2019-01-29 | Novellus Systems, Inc. | Cross flow manifold for electroplating apparatus |
| US8795480B2 (en) | 2010-07-02 | 2014-08-05 | Novellus Systems, Inc. | Control of electrolyte hydrodynamics for efficient mass transfer during electroplating |
| US9909228B2 (en) | 2012-11-27 | 2018-03-06 | Lam Research Corporation | Method and apparatus for dynamic current distribution control during electroplating |
| US10662545B2 (en) | 2012-12-12 | 2020-05-26 | Novellus Systems, Inc. | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating |
| US9523155B2 (en) | 2012-12-12 | 2016-12-20 | Novellus Systems, Inc. | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating |
| US9834852B2 (en) | 2012-12-12 | 2017-12-05 | Novellus Systems, Inc. | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating |
| US10301739B2 (en) | 2013-05-01 | 2019-05-28 | Lam Research Corporation | Anisotropic high resistance ionic current source (AHRICS) |
| US9670588B2 (en) | 2013-05-01 | 2017-06-06 | Lam Research Corporation | Anisotropic high resistance ionic current source (AHRICS) |
| US9449808B2 (en) | 2013-05-29 | 2016-09-20 | Novellus Systems, Inc. | Apparatus for advanced packaging applications |
| US9899230B2 (en) | 2013-05-29 | 2018-02-20 | Novellus Systems, Inc. | Apparatus for advanced packaging applications |
| US9752248B2 (en) | 2014-12-19 | 2017-09-05 | Lam Research Corporation | Methods and apparatuses for dynamically tunable wafer-edge electroplating |
| US9567685B2 (en) | 2015-01-22 | 2017-02-14 | Lam Research Corporation | Apparatus and method for dynamic control of plated uniformity with the use of remote electric current |
| US9816194B2 (en) | 2015-03-19 | 2017-11-14 | Lam Research Corporation | Control of electrolyte flow dynamics for uniform electroplating |
| US10923340B2 (en) | 2015-05-14 | 2021-02-16 | Lam Research Corporation | Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity |
| US10014170B2 (en) | 2015-05-14 | 2018-07-03 | Lam Research Corporation | Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity |
| US9988733B2 (en) | 2015-06-09 | 2018-06-05 | Lam Research Corporation | Apparatus and method for modulating azimuthal uniformity in electroplating |
| US10094034B2 (en) | 2015-08-28 | 2018-10-09 | Lam Research Corporation | Edge flow element for electroplating apparatus |
| US10364505B2 (en) | 2016-05-24 | 2019-07-30 | Lam Research Corporation | Dynamic modulation of cross flow manifold during elecroplating |
| US11047059B2 (en) | 2016-05-24 | 2021-06-29 | Lam Research Corporation | Dynamic modulation of cross flow manifold during elecroplating |
| US10480094B2 (en) | 2016-07-13 | 2019-11-19 | Iontra LLC | Electrochemical methods, devices and compositions |
| US10697083B2 (en) | 2016-07-13 | 2020-06-30 | Ionta LLC | Electrochemical methods, devices and compositions |
| US11001934B2 (en) | 2017-08-21 | 2021-05-11 | Lam Research Corporation | Methods and apparatus for flow isolation and focusing during electroplating |
| US10781527B2 (en) | 2017-09-18 | 2020-09-22 | Lam Research Corporation | Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating |
Also Published As
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100707121B1 (ko) | 마이크로전자 피가공물을 전기화학적으로 처리하기 위한 장치 및 마이크로전자 피가공물 상에 재료를 전기도금하기 위한 방법 | |
| US6916412B2 (en) | Adaptable electrochemical processing chamber | |
| US7857958B2 (en) | Method and apparatus for controlling vessel characteristics, including shape and thieving current for processing microfeature workpieces | |
| US20050205409A1 (en) | Apparatus and methods for electrochemical processing of microelectronic workpieces | |
| US20050000818A1 (en) | Method, chemistry, and apparatus for noble metal electroplating on a microelectronic workpiece | |
| US20070131542A1 (en) | Apparatus and methods for electrochemical processing of microelectronic workpieces | |
| US20050061676A1 (en) | System for electrochemically processing a workpiece |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20011013 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20050411 Comment text: Request for Examination of Application |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20060714 Patent event code: PE09021S01D |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20070109 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20070406 Patent event code: PR07011E01D |
|
| PR1002 | Payment of registration fee |
Payment date: 20070409 End annual number: 3 Start annual number: 1 |
|
| PG1601 | Publication of registration | ||
| PR1001 | Payment of annual fee |
Payment date: 20100331 Start annual number: 4 End annual number: 4 |
|
| PR1001 | Payment of annual fee |
Payment date: 20110325 Start annual number: 5 End annual number: 5 |
|
| FPAY | Annual fee payment | ||
| PR1001 | Payment of annual fee |
Payment date: 20120329 Start annual number: 6 End annual number: 6 |
|
| FPAY | Annual fee payment | ||
| PR1001 | Payment of annual fee |
Payment date: 20130329 Start annual number: 7 End annual number: 7 |
|
| PR1001 | Payment of annual fee |
Payment date: 20140328 Start annual number: 8 End annual number: 8 |
|
| PR1001 | Payment of annual fee |
Payment date: 20150330 Start annual number: 9 End annual number: 9 |
|
| FPAY | Annual fee payment |
Payment date: 20160330 Year of fee payment: 10 |
|
| PR1001 | Payment of annual fee |
Payment date: 20160330 Start annual number: 10 End annual number: 10 |
|
| FPAY | Annual fee payment |
Payment date: 20170330 Year of fee payment: 11 |
|
| PR1001 | Payment of annual fee |
Payment date: 20170330 Start annual number: 11 End annual number: 11 |
|
| PR1001 | Payment of annual fee |
Payment date: 20180402 Start annual number: 12 End annual number: 12 |
|
| FPAY | Annual fee payment |
Payment date: 20190401 Year of fee payment: 13 |
|
| PR1001 | Payment of annual fee |
Payment date: 20190401 Start annual number: 13 End annual number: 13 |
|
| PR1001 | Payment of annual fee |
Payment date: 20200401 Start annual number: 14 End annual number: 14 |
|
| PC1801 | Expiration of term |