US1881713A - Flexible and adjustable anode - Google Patents
Flexible and adjustable anode Download PDFInfo
- Publication number
- US1881713A US1881713A US323390A US32339028A US1881713A US 1881713 A US1881713 A US 1881713A US 323390 A US323390 A US 323390A US 32339028 A US32339028 A US 32339028A US 1881713 A US1881713 A US 1881713A
- Authority
- US
- United States
- Prior art keywords
- anode
- wires
- flexible
- points
- cavities
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 description 24
- 239000011159 matrix material Substances 0.000 description 14
- 238000007747 plating Methods 0.000 description 10
- 238000003780 insertion Methods 0.000 description 6
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 4
- 229910052787 antimony Inorganic materials 0.000 description 4
- 238000010276 construction Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 210000002356 Skeleton Anatomy 0.000 description 2
- 229940035295 Ting Drugs 0.000 description 2
- 230000004075 alteration Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 150000001879 copper Chemical class 0.000 description 2
- 230000000875 corresponding Effects 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 230000004301 light adaptation Effects 0.000 description 2
- 230000001737 promoting Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S204/00—Chemistry: electrical and wave energy
- Y10S204/07—Current distribution within the bath
Description
Oct. 11, 1932. A. K. LAUKEL FLEXIBLE AND ADJUSTABLE ANODE Filed Dec. 3. 1928 ATTORNEY Patented Oct. 11, 1932 PATENT OFFICE K. LAUKEL, DETROIT, MICHIGAN FLEmLE AND ADJUSTABLE ANODE Application filed December 3, 1928. Serial No. 323,390.
In my co-pending application Serial No. 101,070, filed April 10, 1926, I have disclosed a method of electroplating into comparatively deep recesses or cavities of a mold or matrix by means of an anode having ends or fingers which are extended into such recesses. This anode structure constitutes the sub ect matter of this patent.
The importantcharacteristic of this anode, in addition to its function of promoting local electrolytic action in the cavlties, is that it is made of flexible wire which may bebent to bring the points wherever such local action is desired. Accordingly, these anodes 1 are adapted for application to cathodes of various configurations and may be used repeatedly in successive plating operations.
A given anode is applicable to cathodes or matrices of various sizes within a glven range, and several of these anodes may be coupled together for use in connection with a cathode of considerably larger size, when a single anode for that particular purpose is not available. Thus a set of anodes of a few different sizes may be made to meet all requirements.
The invention is fully disclosedby way of example in the following descript on and m the accompanying drawing, in which Figure l is a cross section of a plating taul;
containing a cathode equipped with an anode according to the invention;
Figure 2 is a front elevation of the cathode with the anode applied thereto; and
Figure 3 is a perspective view of the anode.
Reference to these views will now be made by use of like characters which are employed to designate corresponding parts throughout.
In Figure 1 is illustrated a lating tank 1 of conventional construction aving a pair of spaced bars 2 and 3 laid longitudinally upon the same and connected respectively to the positive and negative sides 4 and 5 of a line which supplies the current for plating purposes. A double clamp 6 is secured to the bar 2 and supports a suspended primary anode 7 of the plating material, such as copper for example, by means of a rod 8 secured in the clamp.
A similar double clamp 9 is secured to the negative bar 3 for the purpose of supporting the cathode. This cathode consists of a mold or matrix 10 of plastic material in the faceof which are formed recesses or cavities 11' which are in the nature of impressions of the bodies to be reproduced. are formed by pouring plastic material over the object to be reproduced and treating the impressed surface of the material after set ting to conduct a current of electricity in any manner well known in the art or as disclosed, for example, in my co-pending application Serial No. 101,070 filed April 10, 1926.
Conducting wires 12 are molded in the body of the matrix to make contact with the conduct-ive impressed surface thereof and are brought out through an edge of the matrix for connection to the negative side of the line. A screw 13 is driven into the upper edge of the matrix, and the wires 12 are wound around the screw and the matrix is then suspended from the clamp 9.
The matrix is then ready for plating in the ordinary manner, but in order to assure deposition in the deeper or more difiicultly accessible cavities, I provide a skeleton anode of the type shown more clearly in F igure'3. This member consists of a main strand of wire 14 across which are laid branches 15 of similar wire secured preferably at their mid points in any suitable manner such as soldering. The wires consist of a material which is insoluble in the bath, flexible, and yet of suflicient rigidity to retain the shape into which they may be bent. A suitable material for this purpose is a lead wire containing sufiicient antimony to impart the desired rigidity.
The anode is supported by having the ends of the main member 14 bent at right angles as at 16 and inserted into holes drilled in the face of the cathode. The branches 15 are then bent to bring the ends thereof into the cavity, particularly the deeper cavities.
These ends may be either pointed directly into the cavities, as at 17, or laid somewhat flatly therein as at 18, according to requirements. I used as shown in Figure 2. In all cases the anode must be spaced from the conductive The matrices I Certain of the branches need not be surface of the cathode to avoid short circuiting.
In Figure 1 the branched anode is shown connected by a conductor 19 entirely outside the solution to the clamp 2 in which case it functions as a secondary anode. It causes deposition by local decomposition in the cavities, and the metal deposited out of the solution may be replenished by the addition of copper salts to the solution in any manner well known in the art. The branched anode may however be used without a suspended copper anode in which case deposition occurs entirely at the expense of the solution. It is to be noted that the branched anode is insoluble in the bath, so that it may retain the position into which it is adjusted and does not wear away, although the tips may be withdrawn from the conducting surface of the cathode from time to time as the thickness of the plated metal increases.
Due to the flexible nature of the branched anode, it may be bent and adjusted for adaptation to a variety of cathodes within a given range. For cathodes beyond this range, several anodes may be joined together either lengthwise by their main members 14 or transversely by the branches 15 or in both directions.
In practice a few different sizes of anodes may be kept in stock for use in conjunction with the more common sizes of cathodes, and may be coupled together in the manner described for intermediate and unusually large 1 sizes.
Although a. specific embodiment of the invention has been illustrated and described, it will be understood that various alterations in the'details of construction may be made without departing from the scope of the invention as indicated by the appended claims.
Having thus fully described my invention, what I claim as new and desire to secure by Letters Patent is 1. An anode consisting of a plurality of interconnected conductive flexible wires presenting free ends or points adapted for insertion in cavities to be plated.
2. An anode consisting of a plurality of interconnected conductive flexible wires presenting free ends or points, said wires being composed of a material insoluble by electrolytic action in the bath in which they are to be immersed. 3. An anode consisting of a plurality of interconnected conductive wires presenting free ends or points, said wires being composed of a flexible material having suificient rigidity to retain the shape into which they may be bent.
4. An anode consisting of a plurality of interconnected conductive flexible wires presenting free ends or points, said wires conmony to retain the'shape into which they may be bent.
5. An anode consisting of a plurality of interconnected conductive wires presenting free ends or points, said wires being composed of a flexible material insoluble by electrolytic action in the bath in which they are to be immersed andhaving suflicient rigiditv to retam the shape into which they may be bent.
6. An anode consisting of a main member and a plurality of wires secured across the same and presenting free ends or points, both ends of each wire being spaced from the main member and free for insertion in cavities to be plated.
7. An anode consisting of a main member and a plurality of wires secured across the same, both ends of each wire being spaced from the main member and free for insertion in cavities to be plated and said member and wires bein having su cient rigidit to retain the shap into which they may be ent.
8. An anode consisting of a main member and a plurality of wires secured across the same and presenting free ends or points, said member and wires being composed of a material insoluble by electrolytic action in the bath in which the anode is to be immersed and composed of a flexible material having sufficient rigidity to retain the shape into which they may be bent. I
9. An anode consisting of a main member and a plurality of wires secured across the same and presenting free ends or points, said member and flexible wires being composed of a lead alloyed with sufficient antimony to retain the shape into which they may be bent.'
In witness whereof I have hereunto set my hand.
ARTHUR K. LAUKEL.
sisting of lead alloyed with suflicient anticomposed of a flexible material
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US323390A US1881713A (en) | 1928-12-03 | 1928-12-03 | Flexible and adjustable anode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US323390A US1881713A (en) | 1928-12-03 | 1928-12-03 | Flexible and adjustable anode |
Publications (1)
Publication Number | Publication Date |
---|---|
US1881713A true US1881713A (en) | 1932-10-11 |
Family
ID=23259012
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US323390A Expired - Lifetime US1881713A (en) | 1928-12-03 | 1928-12-03 | Flexible and adjustable anode |
Country Status (1)
Country | Link |
---|---|
US (1) | US1881713A (en) |
Cited By (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3132080A (en) * | 1960-10-26 | 1964-05-05 | Thompson Ramo Wooldridge Inc | Electroplating method and apparatus |
US3652441A (en) * | 1969-05-07 | 1972-03-28 | Peugeot | Electrode for an electrophoresis painting installation |
FR2360688A1 (en) * | 1976-08-04 | 1978-03-03 | Ici Ltd | NEW DIAPHRAGM CELLS |
FR2529911A1 (en) * | 1982-07-08 | 1984-01-13 | Snecma | Process and device for the production of metallic protective coatings |
EP0504939A2 (en) * | 1991-03-21 | 1992-09-23 | Eltech Systems Corporation | Electrolytic cell anode |
WO2000061498A2 (en) * | 1999-04-13 | 2000-10-19 | Semitool, Inc. | System for electrochemically processing a workpiece |
US20010032788A1 (en) * | 1999-04-13 | 2001-10-25 | Woodruff Daniel J. | Adaptable electrochemical processing chamber |
US20020053509A1 (en) * | 1996-07-15 | 2002-05-09 | Hanson Kyle M. | Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces |
US20020125141A1 (en) * | 1999-04-13 | 2002-09-12 | Wilson Gregory J. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
US20030062258A1 (en) * | 1998-07-10 | 2003-04-03 | Woodruff Daniel J. | Electroplating apparatus with segmented anode array |
US6565729B2 (en) | 1998-03-20 | 2003-05-20 | Semitool, Inc. | Method for electrochemically depositing metal on a semiconductor workpiece |
US20030159921A1 (en) * | 2002-02-22 | 2003-08-28 | Randy Harris | Apparatus with processing stations for manually and automatically processing microelectronic workpieces |
US6623609B2 (en) | 1999-07-12 | 2003-09-23 | Semitool, Inc. | Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same |
US20040007467A1 (en) * | 2002-05-29 | 2004-01-15 | Mchugh Paul R. | Method and apparatus for controlling vessel characteristics, including shape and thieving current for processing microfeature workpieces |
US20040049911A1 (en) * | 2002-07-16 | 2004-03-18 | Harris Randy A. | Apparatuses and method for transferring and/or pre-processing microelectronic workpieces |
US6749390B2 (en) | 1997-12-15 | 2004-06-15 | Semitool, Inc. | Integrated tools with transfer devices for handling microelectronic workpieces |
US6749391B2 (en) | 1996-07-15 | 2004-06-15 | Semitool, Inc. | Microelectronic workpiece transfer devices and methods of using such devices in the processing of microelectronic workpieces |
US6752584B2 (en) | 1996-07-15 | 2004-06-22 | Semitool, Inc. | Transfer devices for handling microelectronic workpieces within an environment of a processing machine and methods of manufacturing and using such devices in the processing of microelectronic workpieces |
US20050092611A1 (en) * | 2003-11-03 | 2005-05-05 | Semitool, Inc. | Bath and method for high rate copper deposition |
US6893505B2 (en) | 2002-05-08 | 2005-05-17 | Semitool, Inc. | Apparatus and method for regulating fluid flows, such as flows of electrochemical processing fluids |
US20050194248A1 (en) * | 1999-04-13 | 2005-09-08 | Hanson Kyle M. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
US6991710B2 (en) | 2002-02-22 | 2006-01-31 | Semitool, Inc. | Apparatus for manually and automatically processing microelectronic workpieces |
US7020537B2 (en) | 1999-04-13 | 2006-03-28 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
US7090751B2 (en) | 2001-08-31 | 2006-08-15 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
US7102763B2 (en) | 2000-07-08 | 2006-09-05 | Semitool, Inc. | Methods and apparatus for processing microelectronic workpieces using metrology |
US7189318B2 (en) | 1999-04-13 | 2007-03-13 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
US7351315B2 (en) | 2003-12-05 | 2008-04-01 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
US7351314B2 (en) | 2003-12-05 | 2008-04-01 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
DE102007015641A1 (en) * | 2007-03-31 | 2008-10-02 | Höllmüller Maschinenbau GmbH | Electroplating apparatus for circuit boards has anode which consists of sheet metal and is mounted on adjusting screws, allowing its shape to be changed to provide desired current density between it and boards at different points |
US7438788B2 (en) | 1999-04-13 | 2008-10-21 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
-
1928
- 1928-12-03 US US323390A patent/US1881713A/en not_active Expired - Lifetime
Cited By (52)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3132080A (en) * | 1960-10-26 | 1964-05-05 | Thompson Ramo Wooldridge Inc | Electroplating method and apparatus |
US3652441A (en) * | 1969-05-07 | 1972-03-28 | Peugeot | Electrode for an electrophoresis painting installation |
FR2360688A1 (en) * | 1976-08-04 | 1978-03-03 | Ici Ltd | NEW DIAPHRAGM CELLS |
US4154665A (en) * | 1976-08-04 | 1979-05-15 | Imperial Chemical Industries Limited | Diaphragm cell |
FR2529911A1 (en) * | 1982-07-08 | 1984-01-13 | Snecma | Process and device for the production of metallic protective coatings |
EP0504939A3 (en) * | 1991-03-21 | 1993-03-17 | Eltech Systems Corporation | Electrolytic cell anode |
EP0504939A2 (en) * | 1991-03-21 | 1992-09-23 | Eltech Systems Corporation | Electrolytic cell anode |
US6921467B2 (en) | 1996-07-15 | 2005-07-26 | Semitool, Inc. | Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces |
US6749391B2 (en) | 1996-07-15 | 2004-06-15 | Semitool, Inc. | Microelectronic workpiece transfer devices and methods of using such devices in the processing of microelectronic workpieces |
US6752584B2 (en) | 1996-07-15 | 2004-06-22 | Semitool, Inc. | Transfer devices for handling microelectronic workpieces within an environment of a processing machine and methods of manufacturing and using such devices in the processing of microelectronic workpieces |
US20020053509A1 (en) * | 1996-07-15 | 2002-05-09 | Hanson Kyle M. | Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces |
US20040228719A1 (en) * | 1996-07-15 | 2004-11-18 | Woodruff Daniel J. | Transfer devices for handling microelectronic workpieces within an environment of a processing machine and methods of manufacturing and using such devices in the processing of microelectronic workpieces |
US6749390B2 (en) | 1997-12-15 | 2004-06-15 | Semitool, Inc. | Integrated tools with transfer devices for handling microelectronic workpieces |
US7332066B2 (en) | 1998-03-20 | 2008-02-19 | Semitool, Inc. | Apparatus and method for electrochemically depositing metal on a semiconductor workpiece |
US6565729B2 (en) | 1998-03-20 | 2003-05-20 | Semitool, Inc. | Method for electrochemically depositing metal on a semiconductor workpiece |
US7115196B2 (en) | 1998-03-20 | 2006-10-03 | Semitool, Inc. | Apparatus and method for electrochemically depositing metal on a semiconductor workpiece |
US20030062258A1 (en) * | 1998-07-10 | 2003-04-03 | Woodruff Daniel J. | Electroplating apparatus with segmented anode array |
US7147760B2 (en) | 1998-07-10 | 2006-12-12 | Semitool, Inc. | Electroplating apparatus with segmented anode array |
US7357850B2 (en) | 1998-07-10 | 2008-04-15 | Semitool, Inc. | Electroplating apparatus with segmented anode array |
US6916412B2 (en) | 1999-04-13 | 2005-07-12 | Semitool, Inc. | Adaptable electrochemical processing chamber |
US7160421B2 (en) | 1999-04-13 | 2007-01-09 | Semitool, Inc. | Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
US7566386B2 (en) | 1999-04-13 | 2009-07-28 | Semitool, Inc. | System for electrochemically processing a workpiece |
US6660137B2 (en) | 1999-04-13 | 2003-12-09 | Semitool, Inc. | System for electrochemically processing a workpiece |
US7438788B2 (en) | 1999-04-13 | 2008-10-21 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
US20080217167A9 (en) * | 1999-04-13 | 2008-09-11 | Hanson Kyle M | Apparatus and methods for electrochemical processing of microelectronic workpieces |
WO2000061498A2 (en) * | 1999-04-13 | 2000-10-19 | Semitool, Inc. | System for electrochemically processing a workpiece |
WO2000061498A3 (en) * | 1999-04-13 | 2001-01-25 | Semitool Inc | System for electrochemically processing a workpiece |
US6569297B2 (en) | 1999-04-13 | 2003-05-27 | Semitool, Inc. | Workpiece processor having processing chamber with improved processing fluid flow |
US20050194248A1 (en) * | 1999-04-13 | 2005-09-08 | Hanson Kyle M. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
US7267749B2 (en) | 1999-04-13 | 2007-09-11 | Semitool, Inc. | Workpiece processor having processing chamber with improved processing fluid flow |
US7020537B2 (en) | 1999-04-13 | 2006-03-28 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
US7264698B2 (en) | 1999-04-13 | 2007-09-04 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
US7189318B2 (en) | 1999-04-13 | 2007-03-13 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
US20020125141A1 (en) * | 1999-04-13 | 2002-09-12 | Wilson Gregory J. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
US20010032788A1 (en) * | 1999-04-13 | 2001-10-25 | Woodruff Daniel J. | Adaptable electrochemical processing chamber |
US6623609B2 (en) | 1999-07-12 | 2003-09-23 | Semitool, Inc. | Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same |
US7102763B2 (en) | 2000-07-08 | 2006-09-05 | Semitool, Inc. | Methods and apparatus for processing microelectronic workpieces using metrology |
US7090751B2 (en) | 2001-08-31 | 2006-08-15 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
US20030159921A1 (en) * | 2002-02-22 | 2003-08-28 | Randy Harris | Apparatus with processing stations for manually and automatically processing microelectronic workpieces |
US6991710B2 (en) | 2002-02-22 | 2006-01-31 | Semitool, Inc. | Apparatus for manually and automatically processing microelectronic workpieces |
US6893505B2 (en) | 2002-05-08 | 2005-05-17 | Semitool, Inc. | Apparatus and method for regulating fluid flows, such as flows of electrochemical processing fluids |
US20080011609A1 (en) * | 2002-05-29 | 2008-01-17 | Semitool, Inc. | Method and Apparatus for Controlling Vessel Characteristics, Including Shape and Thieving Current For Processing Microfeature Workpieces |
US7247223B2 (en) | 2002-05-29 | 2007-07-24 | Semitool, Inc. | Method and apparatus for controlling vessel characteristics, including shape and thieving current for processing microfeature workpieces |
US7857958B2 (en) | 2002-05-29 | 2010-12-28 | Semitool, Inc. | Method and apparatus for controlling vessel characteristics, including shape and thieving current for processing microfeature workpieces |
US20040007467A1 (en) * | 2002-05-29 | 2004-01-15 | Mchugh Paul R. | Method and apparatus for controlling vessel characteristics, including shape and thieving current for processing microfeature workpieces |
US7114903B2 (en) | 2002-07-16 | 2006-10-03 | Semitool, Inc. | Apparatuses and method for transferring and/or pre-processing microelectronic workpieces |
US20040049911A1 (en) * | 2002-07-16 | 2004-03-18 | Harris Randy A. | Apparatuses and method for transferring and/or pre-processing microelectronic workpieces |
US20050092611A1 (en) * | 2003-11-03 | 2005-05-05 | Semitool, Inc. | Bath and method for high rate copper deposition |
US7351315B2 (en) | 2003-12-05 | 2008-04-01 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
US7351314B2 (en) | 2003-12-05 | 2008-04-01 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
DE102007015641A1 (en) * | 2007-03-31 | 2008-10-02 | Höllmüller Maschinenbau GmbH | Electroplating apparatus for circuit boards has anode which consists of sheet metal and is mounted on adjusting screws, allowing its shape to be changed to provide desired current density between it and boards at different points |
DE102007015641B4 (en) * | 2007-03-31 | 2011-07-14 | Höllmüller Maschinenbau GmbH, 71083 | Apparatus and method for electroplating articles |
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