JP6979963B2 - 正確な3次元印刷 - Google Patents
正確な3次元印刷 Download PDFInfo
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- JP6979963B2 JP6979963B2 JP2018543340A JP2018543340A JP6979963B2 JP 6979963 B2 JP6979963 B2 JP 6979963B2 JP 2018543340 A JP2018543340 A JP 2018543340A JP 2018543340 A JP2018543340 A JP 2018543340A JP 6979963 B2 JP6979963 B2 JP 6979963B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/386—Data acquisition or data processing for additive manufacturing
- B29C64/393—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
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- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
- B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/30—Process control
- B22F10/36—Process control of energy beam parameters
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
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- B22F12/90—Means for process control, e.g. cameras or sensors
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- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K15/00—Electron-beam welding or cutting
- B23K15/0013—Positioning or observing workpieces, e.g. with respect to the impact; Aligning, aiming or focusing electronbeams
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K15/00—Electron-beam welding or cutting
- B23K15/02—Control circuits therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K26/034—Observing the temperature of the workpiece
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
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- B23K26/342—Build-up welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- B28B1/00—Producing shaped prefabricated articles from the material
- B28B1/001—Rapid manufacturing of 3D objects by additive depositing, agglomerating or laminating of material
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- B28—WORKING CEMENT, CLAY, OR STONE
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- B28B17/00—Details of, or accessories for, apparatus for shaping the material; Auxiliary measures taken in connection with such shaping
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- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
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- B29C64/141—Processes of additive manufacturing using only solid materials
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Description
本出願は、2016年2月18日出願の米国仮特許出願第62/297,067号、2016年4月8日出願の第62/320,334号、および2016年4月20日出願の第62/325,402号(3つ全て「METHODS, SYSTEMS, APPARATUSES, AND SOFTWARE FOR ACCURATE THREE−DIMENSIONAL PRINTING」と題された)、および2016年9月29日出願の62/401,534号および2017円1月9日出願の62/444,069号(後者2つの仮特許出願は「ACCURATE THREE−DIMENSIONAL PRINTING」と題された)の優先権を主張する(5つの仮特許出願全ては、参照により全体が本出願に組み込まれる)。
動作(i):エネルギービームに、粉末床の少なくとも一部分を変形して変形した材料を変形するように指示することであって、この変形した材料は多層状物体の少なくとも一部分を形成する、指示すること、
動作(ii):検出器に、多層状物体の少なくとも一部分の湾曲変形を検知するように指示すること、動作(iii):湾曲変形の程度を評価して結果を生成すること、および動作
(iv):結果を使用して多層状物体の湾曲変形を制御し、エネルギービームが動作(i)で粉末床の少なくとも一部分を変形するプロセスの少なくとも1つのパラメータを変更することで標的変形湾曲を達成すること、を行うようにプログラムされ、ここで、検出器が動作(ii)で湾曲変形を検知するプロセスおよび動作(iv)で湾曲変形を制御するプロセスは、エネルギービームが動作(i)で粉末床の少なくとも一部分を変形するプロセスの間に生じ、多層状物体は所望のモデルに実質的に対応し、少なくとも1つのコントローラは、エネルギービーム、および検出器に動作可能に連結される。
予め変形された材料は、材料床の少なくとも一部分とすることができる。材料床は、サイクロンセパレータを含む層分注機構を使用する印刷の間に平面化することができる。材料床は、粉末床としてもよい。予め変形された材料は、金属合金、元素金属、セラミック、および元素炭素の同素体からなる群の少なくとも1つの部材から選択してもよい。分注は、層分注機構を使用することを含みうる。層分注機構はサイクロンセパレータを備えてもよい。変形した材料部分は少なくとも1つの溶融プールを含んでもよいが、物理的属性は、溶融プールの温度、基本的な長さスケール(FLS)、または反射率を含みうる。基本的な長さスケール(FLS)は、高さ、深さ、または直径(例えば、または直径当量)を含みうる。物理的属性パルスは、ドゥエル時間および中断を含みうる。ドゥエル時間は、先端および/または後端を含みうる。本方法は、制御することを使用して、経時の複数の物理的属性パルスの実質的に同一の先端、または後端を(例えば、経時で)維持することをさらに含みうる。本方法は、実質的に同一の先端、後端、プラトー、またはそれらの任意の組み合わせを経時で維持する(例えば、制御することを使用して)ことをさらに含みうる。ドゥエル時間は、プラトーを含みうる。本方法は、複数の物理的属性パルスの実質的に同一のプラトーを経時で維持する(例えば、制御することを使用して)ことをさらに含みうる。同一とは、強度、期間、またはそれらの任意の組み合わせの観点からを含みうる。制御は、閉ループ制御を含みうる。閉ループ制御は、最大で約20ミリ秒のループサンプル時間を含みうる。制御は、計算を含みうる。計算は、ドゥエル時間(例えば、エネルギービームの)の間に実行することができる。計算は、中断(例えば、エネルギービームの)の間に実行することができる。計算は、ドゥエル時間の間に実行されなくてもよい。計算は、中断の間に実行されなくてもよい。計算は、最大で約20マイクロ秒の間に生じてもよい。本方法は、複数の物理的属性パルスの実質的に同一のプロファイルを経時で維持する(例えば、制御することを使用して)ことをさらに含みうる。プロファイルは、エネルギービームのエネルギープロファイルを含みうる。プロファイルは、材料床の一部分(例えば、エネルギービームの軌道に沿った)の経時の温度プロファイルを含みうる。プロファイルは、エネルギービームの経時の出力密度プロファイルを含みうる。エネルギープロファイルは、エネルギー源の経時の出力プロファイルを含みうる。変形した材料部分は、少なくとも1つの溶融プールを含んでもよい。プロファイルは、溶融プールの温度を含んでもよい。変形した材料部分は、少なくとも1つの溶融プールを含んでもよい。プロファイルは、溶融プールの基本的な長さスケール(例えば、深さ、直径、または直径当量)を含みうる。プロファイルは、(i)複数の溶融プールの温度プロファイル、または(ii)複数の溶融プールに隣接した位置の温度プロファイル、を含むことができる。隣接とは、溶融プールの周囲からの距離としうるが、この距離は、エネルギービームによって生成された溶融プールの最大で約6直径であり、この溶融プールは複数の溶融プールのものである。プロファイルは、エネルギービームの出力密度を含むことができる。プロファイルは、エネルギービームを生成するエネルギー源の出力プロファイルを含むことができる。制御することは、プロセッサを使用することを含んでもよい。プロセッサは、並列処理を含みうる。プロセッサは、マイクロプロセッサ、データプロセッサ、中央処理ユニット(CPU)、グラフィック処理ユニット(GPU)、システムオンチップ(SOC)、コプロセッサ、ネットワークプロセッサ、特定用途向け集積回路(ASIC)、特定用途向け命令セットプロセッサ(ASIP)、コントローラ、プログラマブルロジックデバイス(PLD)、チップセット、または、フィールドプログラマブルゲートアレイ(FPGA)を含みうる。プロセッサは、グラフィック処理ユニット(GPU)を含みうる。プロセッサは、フィールドプログラマブルゲートアレイ(FPGA)を含みうる。プロセッサは、単一の物理的処理ユニット内に多数の処理ユニットを含みうる。多数の処理ユニットは、並列処理ユニットとしてもよい。多数の並列処理ユニットは、少なくとも約200個の並列処理ユニットを含むことができる。多数の並列処理ユニットは、コアまたは単一のデジタル信号処理スライスを含むことができる。多数の並列処理ユニットは、第1の処理ユニットと第2の処理ユニットを含みうるが、ここでプロセッサは、第1の処理ユニットから第2の処理ユニットまでのデータ転送において低レイテンシを含みうる。レイテンシは、少なくとも約10テラFLOPSのいくつかの数の浮動小数点演算毎秒(FLOPS)を許容するのに十分に低い。レイテンシは、少なくとも約10テラMACのいくつかの数の積和演算毎秒(MAC)を許容するのに十分に低い。
動作(d):複数の現象パルス内の一の現象パルス内の少なくとも一部分を制御することであって、この制御することは動作(a)の間に行われ、また動作(c)において検出器によって検知された現象を考慮する、制御することと、を行うようにプログラムされ、ここで少なくとも1つのコントローラは、検出器、およびエネルギービームに動作可能に連結される。
少なくとも1つの特徴は、層分注機構(例えば、材料分注機、平準化機構、および/または材料除去機構)、エネルギービーム、エネルギー源、および/または光学システムを制御することを含みうる。評価することは、処理ユニットを使用して測定から取得される少なくとも1つの信号を処理して結果を生成することを含むことができる。処理ユニットは、最大で1分の間に結果を生成する。プロセスは、画像処理を含むことができる。評価することは、少なくとも1つの位置における測定に基づいてマップを生成することを含むことができる。マップは、位相マップとすることができる。マップは、温度マップとすることができる。マップは、材料床、材料床の露出した表面、3D物体、硬化した材料の層、溶融プール、またはそれらの任意の組み合わせのマップとすることができる。位相マップは、計測センサーを使用して形成されうる。計測センサーは、ストライプパターンの投影を含みうる。計測センサーは、縞投影形状測定装置を含みうる。計測センサーは、高さマッパーとしうる。計測センサーは、感知エネルギービーム(例えば、エミッタ)およびレシーバーとしうる。エミッタは、プロジェクタを含みうる。エミッタは、感知エネルギービームを標的表面上に投影しうる。標的表面は、材料床、硬化した材料の層、3D物体、または溶融プールの露出した表面を含みうる。感知エネルギービームは、露出した表面上にパターンを形成しうる。パターンは、様々なレベルの光強度の領域を含みうる。光強度プロファイルは、オンオフパターンを含みうる。光強度プロファイルは、変動パターンを含みうる。変動パターンは、段階的な変動強度パターンまたは急激な変動強度パターンを含みうる。変動パターンは、多数の正弦波の重ね合わせとしうる。変動パターンは、多数の周波数関数(例えば、正弦関数および/または余弦関数)の重ね合わせとしうる。変動パターンは、正弦波および減少関数の重ね合わせを含みうる。減少関数は、直線的、対数的、指数的、またはそれらの任意の組み合わせで減少しうる。変動パターンは、多数の関数(例えば、重ね合わせられる)を含みうる。多数の関数は、シフトされてもよい(例えば、相によって)。検出器は、多数の感知エネルギービームを含みうる。多数のエネルギービームは、干渉パターンを形成しうる。変動パターンは、干渉パターンを含みうる。投影された感知エネルギービームは、同一の色のものでも異なる色のものでもよい。投影された感知エネルギービームは、同一の周波数のものでも異なる周波数のものでもよい。様々な多数の投影された感知エネルギービームは、同時に、または逐次的に投影されうる。検出システムは、多数の検出器(例えば、多数の受信器および/または送信器)を含みうる。多数の受信器および/または送信器は、多数の空間位置から標的位置を見てもよい。多数の空間位置は、多視点画像を形成しうる。計測検出器(例えば、高さマッパー)は、標的表面(例えば、粉末床、3D物体、または溶融プールの露出した表面)の均一性を判定しうる。均一性は、標的表面の、標準偏差、中央、または平均高さを含みうる。均一性は、標的表面内の、高さスキュウ、トレンド、またはステップを含みうる。計測検出器は、粉末床の長さに沿った均一性と幅に沿った均一性との間で異なりうる。粉末床の長さは、層分注機構が並進移動するのに沿った方向としうる。粉末床の幅は、層分注機構が並進移動するのに沿った方向に垂直な方向としうる。
本明細書で述べられているすべての出版物、特許、および特許出願は、あたかも各個別の出版物、特許、または特許出願が参照により組み込まれているように具体的かつ個別に示されているのと同一の程度で参照により本明細書に組み込まれる。
変形エネルギービームの出力密度の変動(例えば、使用される関数)の様式は、(i)測定値(例えば、1つ以上のセンサーの信号)、(ii)理論的に(例えば、シミュレーションによる)、(iii)またはそれらの任意の組み合わせ、による影響を受けうる。変形エネルギービームの出力密度プラトーの期間および/またはピークは、(i)測定値(例えば、1つ以上のセンサーの信号)、(ii)理論的に(例えば、シミュレーションによる)、(iii)またはそれらの任意の組み合わせ、による影響を受けうる。エネルギービームの出力密度は、シーケンス(例えば、中断時間およびドゥエル時間の)を形成するセンサー測定値(例えば、照射された位置またはその近接における温度の)の関数として変動しうる。変動した出力密度は、ドゥエル時間および中断時間を含みうる。シーケンスにおける中断時間の少なくとも2つは、(例えば、実質的に)同一の期間または異なる期間のものとしてもよい。シーケンスにおける中断時間の少なくとも2つは、(例えば、実質的に)同一のまたは異なる最小出力密度値のものとしてもよい。シーケンスにおけるドゥエル時間の少なくとも2つは、(例えば、実質的に)同一の期間または異なる期間のものとしてもよい。シーケンスにおける中断時間の少なくとも2つは、(例えば、実質的に)同一のまたは異なる最大出力密度値のものとしてもよい。エネルギー源の出力は、出力シーケンス(例えば、最小出力(例えば、オフ)時間および最大出力時間)を形成するセンサー測定値(例えば、照射された位置またはその近接における温度の)の関数として変動しうる。シーケンスにおける最小出力時間の少なくとも2つは、(例えば、実質的に)同一の期間または異なる期間のものとしてもよい。シーケンスにおける最小出力時間の少なくとも2つは、(例えば、実質的に)同一のまたは異なる最小出力密度値のものとしてもよい。シーケンスにおける最大出力時間の少なくとも2つは、(例えば、実質的に)同一の期間または異なる期間のものとしてもよい。シーケンスにおける最大出力時間の少なくとも2つは、(例えば、実質的に)同一のまたは異なる最大出力密度値のものとしてもよい。図32Cは、時間の関数としてのエネルギー源出力の、または時間の関数としてのエネルギービームの出力密度の実施例を示しており、現象プロファイルは、エネルギー源の出力またはエネルギービームの出力密度にそれぞれ関連する。例えば、図32Cは、3つのピーク(ピークプラトー)3231、3232、および3233を有する、エネルギービームの出力密度の変動(例えば、変動、振動、またはパルス)を示しており、各ピークの後には、3つのバレー(バレープラトー)を有する低減が続く(例えば、図32Aの実施例に従う)。例えば、図32Cは、3つのピーク(プラトー)出力値3231、3232、および3233を有する、エネルギービームを生成するエネルギー源の出力の変動を示しており、各ピークの後には、3つのバレー(バレーピーク)を有する低減が続く(例えば、図32Aの実施例に従う)。図33Cに示す実施例において、ピーク値は異なる最大現象値に対応し、バレー値は異なる最小現象値に対応し、各現象パルスの期間は同一である(例えば、ピークプラトーの間の期間、バレープラトー、およびそれらの間の移行は、それぞれ全ての現象パルス間で同一である)。図32Dは、時間の関数としてのエネルギー源出力の、または時間の関数としてのエネルギービームの出力密度の実施例を示しており、現象プロファイルは、エネルギー源の出力またはエネルギービームの出力密度にそれぞれ関連する。例えば、図32Dは、3つのピーク(プラトー)出力密度3241、3242、および3243を有する、エネルギービームの出力密度の変動(例えば、振動)を示しており、各ピークの後には3つのバレー(バレープラトー)を有する低減が続く(例えば、図32Aの実施例に従う)。例えば、図32Dは、3つのピーク(プラトー)出力値3241、3242、および3243を有する、エネルギービームを生成するエネルギー源の出力の変動を示しており、各ピークの後は、3つのバレー(バレープラトー)を有する低減が続く(例えば、図32Aの実施例に従う)。図33Dに示す実施例において、ピーク値は同一の最大現象値(例えば、それぞれ、エネルギービームの出力密度、またはエネルギー源の出力)に対応し、バレー値は同一の最小現象値に対応し、現象パルスの期間は変動する(例えば、ピークプラトー、バレープラトー、およびそれらの間の移行の期間は、現象パルス間で変動する)。検知可能なエネルギーパルスは、形成溶融プールに対応しうる。例えば、検知可能なエネルギーパルスそれぞれは、溶融プールの形成に対応しうる。検知可能なエネルギーパルスは、形成タイルに対応しうる。例えば、検知可能なエネルギーパルスそれぞれは、タイルの形成に対応しうる。
変動パターンは、(i)標的表面にわたって第1の時間(または第1の期間)において第1の値だけ、および(ii)標的表面にわたって第2の時間(または第2の期間)において第2の値だけ、シフトされてもよい。例えば、標的表面は、時間t1ではλ/3のシフトおよび変動パターンで感知され、時間t2(t1とは異なる)ではλ/5のシフト変動パターンで感知されうる。一部の実施形態において、標的表面の特定の領域において特定の変動パターンのシフトを使用することは、その特定の領域の検知の特定の感度(例えば、解像度)に関連する。標的表面の異なる領域において異なる変動パターンのシフト値を使用することは、異なる感度(例えば、解像度)でのこれらの異なる領域の検知を許容しうる。変動パターンの異なるシフトは、材料特性(例えば、位相)の差に相関されうる。例えば、予め変形された材料を含む標的表面領域上に、変形した材料を含む標的表面領域上とは異なるシフト値を使用しうる。検出器は、多数の感知エネルギービームを含みうる。多数のエネルギービームは、干渉パターンを形成しうる。変動パターンは、干渉パターンを含みうる。投影された感知エネルギービームは、同一の色のものでも異なる色のものでもよい。投影された感知エネルギービームの少なくとも2つは、同一の、または(例えば、実質的に)同一の色のものとしてもよい。投影された感知エネルギービームの少なくとも2つは、異なる色のものとしてもよい。投影された感知エネルギービームは、同一の周波数のものでも異なる周波数のものでもよい。投影された感知エネルギービームの少なくとも2つは、異なる周波数のものとしてもよい。投影された感知エネルギービームの少なくとも2つは、同一の、または(例えば、実質的に)同一の周波数のものとしてもよい。様々な多数の投影された感知エネルギービームは、同時に、または逐次的に投影されうる。投影された感知エネルギービームの少なくとも2つは、逐次的に投影されるものとしてもよい。投影された感知エネルギービームの少なくとも2つは、(例えば、実質的に)同時に投影されるものとしてもよい。実質的とは、検知上の影響に対するものとしてもよい(例えば、検知の解像度上の影響)。変動パターンは、標的表面をスキャンしうる(例えば、1つ以上の形状を投影することで)。時々、変動パターンは、標的表面の少なくとも一部分の上に現れる場合がある(例えば、様々な強度の振動する長方形(例えば、厚い線)を示す、図19)。一部の実施形態において、変動パターンは、標的表面の少なくとも一部分上で検知可能(例えば、現れうる)であり、変動強度パターンは、位置の(例えば、標的表面の少なくとも一部分の)関数として示される。変動位置強度関数は、図21A〜21Bに示される関数と類似しうるが、「時間」標識は「位置」標識に変えられる。追加的にまたは代替的に、変動位置パターンは、時間の関数として変化しうる(例えば、図21A〜21Bに示すように)。
材料床内に配置された重量センサーを材料床の底部につけることができる(例えば、プラットフォームに隣接して)。重量センサーは、エンクロージャの底部(例えば、図1、111)とその上に基部(例えば、図1、102)または材料床(例えば、図1、104)が配置されうる基板(例えば、図1、109)との間につけることができる。重量センサーをエンクロージャの底部と、その上に材料床が配置されうる基部との間につけることができる。重量センサーをエンクロージャの底部と材料層との間につけることができる。重量センサーは圧力センサーを備えることができる。重量センサーは、バネ秤、圧力式秤、ニューマチックスケール、または秤を備えてもよい。圧力センサーの少なくとも一部分を材料床の底部表面上に露出することができる。重量センサーは底部ロードセルを備えることができる。底部ロードセルはロードセルに隣接する予め変形された材料(例えば、粉末)からの圧力を感知することができる。一の実施例では、粉体層の上方、下方、および/または側面へなどのように材料床に隣接して1つ以上のセンサー(例えば、光学センサー、例えば、光学レベルセンサー)を提供することができる。一部の実施例において、1つ以上のセンサーは、材料床内の予め変形された材料のレベル(例えば、高さおよび/または量)を感知することができる。予め変形された材料(例えば、粉末)のレベルセンサーは、層分注機構(例えば、粉末分注機)と連通することができる。材料床を含む構造体の重量をモニターすることによって材料床の重量をモニターするようにセンサーを構成することができる。1つ以上の位置センサー(例えば、高さセンサー)はプラットフォーム(例えば、1つ以上の位置における)に対する材料床の高さを測定することができる。位置センサーは光学センサーとすることができる。位置センサーは、1つ以上のエネルギービーム(例えば、レーザーまたは電子ビーム)と材料(例えば、粉末)床の露出した表面との間の距離を判定することができる。1つ以上のセンサーは、制御システムに(例えば、プロセッサおよび/またはコンピュータに)接続されてもよい。
レイテンシとは、プロセッサ内の物理的変化(例えば、信号)の原因と結果との間の時間遅延を意味する場合がある。レイテンシとは、ソース(例えば、第1のコア)がパケットを受信する宛先(例えば、第2のコア)に送信してからの経過時間(2点のレイテンシとも称する)を意味する場合がある。1点のレイテンシは、ソース(例えば、第1のコア)がパケット(例えば、信号)をパケットを受信する宛先(例えば、第2のコア)に送信してから、そして宛先がソースにパケットを送り返してからの経過時間を意味する場合がある(例えば、往復するパケット)。レイテンシは、大きな数の浮動小数点演算毎秒(FLOPS)を許容するのに十分に低いものとしてもよい。FLOPSの数は、少なくとも約0.1テラFLOPS(T−FLOPS)、0.2T−FLOPS、0.25T−FLOPS、0.5T−FLOPS、0.75T−FLOPS、1T−FLOPS、2T−FLOPS、3T−FLOPS、5T−FLOPS、6T−FLOPS、7T−FLOPS、8T−FLOPS、9T−FLOPS、または10T−FLOPSとしてもよい。FLOPSの数は、最大で約0.2T−FLOPS、0.25T−FLOPS、0.5T−FLOPS、0.75T−FLOPS、1T−FLOPS、2T−FLOPS、3T−FLOPS、5T−FLOPS、6T−FLOPS、7T−FLOPS、8T−FLOPS、9T−FLOPS、10T−FLOPS、20T−FLOPS、30T−FLOPS、50T−FLOPS、100T−FLOPS、1P−FLOPS、2P−FLOPS、3P−FLOPS、4P−FLOPS、5P−FLOPS、10P−FLOPS、50P−FLOPS、100P−FLOPS、1EXA−FLOP、2EXA−FLOPSまたは10EXA−FLOPSとしてもよい。FLOPSの数は、上述の値の間の任意の値としてもよい(例えば、約0.1T−FLOP〜約10EXA−FLOPS、約0.1T−FLOPS〜約1T−FLOPS、約1T−FLOPS〜約4T−FLOPS、約4T−FLOPS〜約10T−FLOPS、約1T−FLOPS〜約10T−FLOPS、約10T−FLOPS〜約30T−FLOPS、約50T−FLOPS〜約1EXA−FLOP、または約0.1T−FLOP〜約10EXA−FLOPS)。一部のプロセッサ(例えば、FPGA)において、演算毎秒は、(例えば、Giga)積和演算毎秒(例えば、MACまたはGMAC)として測定されうる。MAC値は、それぞれT−FLOPSの代わりにTera−MAC(T−MAC)として測定される、本明細書に記載する任意のT−FLOPS値と等しくすることができる。FLOPSは、ベンチマークに従って測定することができる。ベンチマークは、HPCチャレンジベンチマークとしてもよい。ベンチマークは、数学的演算(例えば、線形方程式などの算式)、グラフィカル演算(例えば、レンダリング)、または暗号化/復号ベンチマークを含んでもよい。ベンチマークは、高性能LINPACK、行列乗算(例えば、DGEMM)、メモリへの/メモリからの持続型メモリ帯域幅(例えば、STREAM)、行列転置速度測定(例えば、PTRANS)、ランダムアクセス高速フーリエ変換速度(例えば、一般化されたクーリー−テューキアルゴリズムを使用した大きな1次元ベクトル上)、または通信帯域幅およびレイテンシ(例えば、効率的な帯域幅/レイテンシベンチマークに基づくMPI中心の性能測定)。LINPACKは、デジタルコンピュータ上で数値線形代数を行うためのソフトウェアライブラリを指す場合がある。DGEMMは、倍精度行列乗算を指す場合がある。STREAMベンチマークは、持続可能なメモリ帯域幅(MB/s)と4つの簡易なベクトルカーネル(Copy、Scale、AddおよびTriad)の対応する算出速度を測定するよう設計される合成ベンチマークを指す場合がある。PTRANSベンチマークは、システムが大きな列(グローバル)に転置することができる速度測定値を示す場合がある。MPIはメッセージパッシングインターフェースを指す場合がある。
揮発性ストレージメディアは、コンピュータプラットフォームの主メモリなどの動的メモリを含むことができる。有形伝送媒体は、コンピュータシステム内のバスを備える電線を含む、同軸ケーブル、電線(例えば、銅線)、および/または光ファイバーを挙げることができる。搬送波伝送媒体は、無線周波数(RF)および赤外線(IR)データ通信の間に生成されるもののような、電気信号もしくは電磁信号、または音波もしくは光波の形態を取りうる。したがって、コンピュータ可読媒体の一般的な形態としては、例えば、フロッピーディスク、フレキシブルディスク、ハードディスク、磁気テープ、任意の他の磁気媒体、CD−ROM、DVD、もしくはDVD−ROM、任意の他の光媒体、パンチカード、紙テープ、任意の他の孔のパターンを用いた物理的ストレージ媒体、RAM、ROM、PROM、およびEPROM、FLASH−EPROM、任意の他のメモリチップもしくはカートリッジ、搬送波輸送データもしくは命令、ケーブルもしくは搬送波などのリンク輸送、またはコンピュータがこれからプログラムコードおよび/またはデータを読み出しうる任意の他の媒体、またはそれらの任意の組み合わせが挙げられる。メモリおよび/またはストレージは、ユニバーサルシリアルバス(USB)メモリスティック、および/またはハードディスクなどの、装置の外部および/または装置から取り外し可能な記憶装置を含んでもよい。コンピュータ可読媒体のこれらの形態の多くは、プロセッサへの実行するための1つ以上の命令の1つ以上のシーケンスの搬送に関与している場合がある。
[実施例]
Claims (12)
- 3次元物体を生成するための方法であって、
(a)3次元印刷によって前記3次元物体の第1の部分を、露出した表面を含む材料床内に生成することと、
(b)前記3次元印刷の間に前記露出した表面の少なくとも1つの位置の測定を行うことであって、前記測定を行うことは、前記露出した表面上にパターンを形成する感知エネルギービームを光学的に測定することを含み、前記パターンは様々なレベルの光強度の領域を含み、前記測定は、計測測定に対応する、測定を行うことと、前記計測測定は、前記露出した表面の均一性を決定する計測検出器を使用することを含み、そして、前記計測検出器は、前記材料床の長さに沿った均一性と幅に沿った均一性との間の差を区別し、
(c)前記測定に基づいて前記3次元印刷の少なくとも1つの特徴の変更を評価することであって、前記評価は前記3次元印刷の間である、評価することと、
(d)前記3次元印刷によって前記3次元物体の第2の部分を生成することであって、前記生成することは前記評価の結果に従う、生成することと、を含む、方法。 - 前記計測検出器は、材料床の前記露出した表面上にストライプ画像を投影する、請求項1に記載の方法。
- 前記計測検出器は、前記露出した表面上に光強度プロファイルを投影し、前記光強度プロファイルは、変動パターンを含む、請求項1〜2のいずれか1項に記載の方法。
- 前記均一性は、標的表面内の高さスキュー、トレンド、またはステップを含みうる、請求項1〜3のいずれか1項に記載の方法。
- 少なくとも1つの特徴を変更することは、生成装置の少なくとも1つのパラメータを変更することを含む、請求項1〜4のいずれか1項に記載の方法。
- 別の態様では、少なくとも1つの3次元物体を印刷するためのシステムであって、
材料床を受けるように構成されたプラットフォームであって、使用中、前記材料床の少なくとも一部分は少なくとも1つの3次元物体を生成するのに使用され、前記材料床は前記プラットフォームに隣接している、プラットフォームと、
信号を生成するように構成された第1の装置であって、前記第1の装置は1つ以上の入力信号を感知して出力信号を生成するように構成された第1のセンサーを含み、前記出力信号は、前記3次元物体の第1の部分の生成の間に生成され、前記出力信号は前記露出した表面上のパターンを含み、前記パターンは、様々なレベルの光強度の領域を含み、前記第1の装置は、前記露出した表面の均一性を決定する計測検出器であり、そして、前記計測検出器は、前記材料床の長さに沿った均一性と幅に沿った均一性との間の差を区別する、第1の装置と、
3次元印刷を使用して少なくとも1つの形成パラメータの下で前記3次元物体を生成するように構成された第2の装置であって、前記第2の装置は、前記材料床に隣接して配置される、第2の装置と、
コントローラであって、(i)出力信号を処理して、前記3次元物体の一部としての第1の部分の生成の間に前記形成パラメータを示す結果を生成し、そして(ii)前記結果に基づいて、前記第2の装置の関数を変更して前記3次元物体の第2の部分を生成するよう前記第2の装置に指示するようにプログラムされた処理ユニットを含み、前記コントローラは、前記第1の装置、および前記第2の装置に動作可能に連結される、コントローラと、を備える、システム。 - プロセスは、画像処理を含む、請求項6に記載のシステム。
- 前記画像処理は、前記表面の少なくとも1区分の位置マップを提供する、請求項6又は7のいずれか1項に記載のシステム。
- 1つ以上の3次元物体を印刷するための装置であって、コントローラを備え、前記コントローラは、以下の動作:動作(a)処理ユニットに、センサーから受信した出力信号を処理して、3次元印刷によって形成される前記3次元物体の一部としての第1の部分の形成の間に、形成パラメータを示す結果を生成するように、指示することであって、前記センサーは前記第1の部分の形成の間に入力信号を感知し、前記信号は、材料床の露出した表面上のパターンを含み、前記材料床から前記3次元印刷によって前記3次元物体が印刷され、前記パターンは、様々なレベルの光強度の領域を含み、前記結果は、前記材料床、その一部分、またはそこからの任意の突出物体の前記露出した表面の高さの評価を含み、前記コントローラは、前記センサーに、および前記処理ユニットに動作可能に連結される、指示することと、動作(b)前記3次元印刷で使用される機構に、前記結果に基づいて、前記3次元物体の第2の部分の形成の前、または間に前記機構の関数を変更するように指示することであって、前記コントローラは、前記機構に動作可能に連結される、指示することと、を行うようにプログラムされる、装置。
- 前記コントローラは、閉ループ制御またはフィードバック制御を含む、請求項9に記載の装置。
- プログラム命令が保存される非一時的コンピュータ可読媒体を含むコンピュータソフトウェア製品であって、前記命令は、コンピュータによって読み取られると、前記コンピュータに、動作(a)センサーから第1の入力信号を受信することであって、前記センサーは、3次元印刷プロセスによって形成される3次元物体の第1の部分の形成の前に前記第1の入力信号を生成し、前記第1の信号は前記露出した表面上のパターンを含み、前記パターンは様々なレベルの光強度の領域を含み、前記非一時コンピュータ可読媒体は、前記センサーに動作可能に連結される、受信することと、動作(b)センサーから第2の入力信号を受信することであって、前記センサーは前記第1の部分の形成の間に前記第2の入力信号を生成し、前記第2の信号は前記露出した表面上のパターンを含み、前記パターンは様々なレベルの光強度の領域を含む、受信することと、動作(c)前記第1の入力信号と前記第2の入力信号を比較して結果を生成することと、動作(d)前記3次元印刷プロセスで使用される機構に、前記3次元印刷によって形成される前記3次元物体の第2の部分の形成の前、または間に、前記結果に基づいて前記機構の関数を変更するように指示することと、を含む動作を行わせる、コンピュータソフトウェア製品であって、前記非一時コンピュータ可読媒体が前記機構および前記センサーに動作可能に連結される、コンピュータソフトウェア製品。
- 前記機構は前記材料床を形成するのに利用される層分注機構を含む、請求項11に記載のコンピュータソフトウェア製品。
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