JP5883122B2 - ポータブル電子デバイスおよび電子デバイスを組み立てる方法 - Google Patents
ポータブル電子デバイスおよび電子デバイスを組み立てる方法 Download PDFInfo
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0017—Casings, cabinets or drawers for electric apparatus with operator interface units
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0086—Casings, cabinets or drawers for electric apparatus portable, e.g. battery operated apparatus
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49004—Electrical device making including measuring or testing of device or component part
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Telephone Set Structure (AREA)
- Casings For Electric Apparatus (AREA)
Description
Claims (25)
- 底面及び側面を含む電子デバイス筐体と、
前記電子デバイス筐体の上面のためのガラスカバーと、
前記ガラスカバーの底面の周囲領域に固定され、前記ガラスカバーの周囲内に位置する少なくとも1つの周囲内部支持構造と、
上面及び底面を有し、前記上面が前記ガラスカバーの前記底面の中央領域に固定されているスクリーンアセンブリと、
前記スクリーンアセンブリの前記底面に隣接するように前記電子デバイス筐体の内部に固定された少なくとも1つの面支持構造と、を備え、
前記ガラスカバーを前記電子デバイス筐体に固定するために、前記少なくとも1つの周囲内部支持構造は1つ以上の前記側面に固定され、
前記少なくとも1つの面支持構造は、前記少なくとも1つの周囲内部支持構造または少なくとも1つの前記側面に固定されていることを特徴とするポータブル電子デバイス。 - 前記少なくとも1つの周囲内部支持構造及び前記少なくとも1つの面支持構造は金属であることを特徴とする請求項1に記載のポータブル電子デバイス。
- 前記少なくとも1つの周囲内部支持構造及び前記少なくとも1つの面支持構造の各々の厚さは約0.1〜0.6mmであることを特徴とする請求項1に記載のポータブル電子デバイス。
- 前記スクリーンアセンブリはタッチスクリーンアセンブリであることを特徴とする請求項1に記載のポータブル電子デバイス。
- 前記少なくとも1つの周囲内部支持構造は少なくとも1つの取り付けブラケットを備え、
前記少なくとも1つの面支持構造はフレームを備えることを特徴とする請求項1に記載のポータブル電子デバイス。 - 前記フレームは前記少なくとも1つの取り付けブラケットに固定されることを特徴とする請求項5に記載のポータブル電子デバイス。
- 前記フレームは前記側面のうち少なくとも1つの側面に固定されることを特徴とする請求項5に記載のポータブル電子デバイス。
- 前記フレームと前記スクリーンアセンブリの前記底面との間に分離間隙があり、
前記分離間隙は約0.1〜1.0mmであることを特徴とする請求項5に記載のポータブル電子デバイス。 - 前記スクリーンアセンブリはタッチスクリーンアセンブリであることを特徴とする請求項5に記載のポータブル電子デバイス。
- 前記側面のうち少なくとも一部は所定の場所にモールド成形されていることを特徴とする請求項5に記載のポータブル電子デバイス。
- 前記フレームは前記少なくとも1つの取り付けブラケットに固定され、
前記少なくとも1つの取り付けブラケットは前記ガラスカバーの前記底面の前記周囲領域に接着剤を使用して固定されていることを特徴とする請求項5から10のいずれか1項に記載のポータブル電子デバイス。 - 前記少なくとも1つの取り付けブラケットは、前記ガラスカバーの前記底面の前記周囲領域の対向する辺に固定された一対のレールを備えることを特徴とする請求項11に記載のポータブル電子デバイス。
- 前記少なくとも1つの取り付けブラケットは、前記電子デバイス筐体に固定され且つ前記ガラスカバー及び前記フレームを前記電子デバイス筐体に固定するように構成されることを特徴とする請求項5から10のいずれか1項に記載のポータブル電子デバイス。
- 前記ガラスカバーの厚さは約0.3〜1.0mmであることを特徴とする請求項5から10のいずれか1項に記載のポータブル電子デバイス。
- 前記少なくとも1つの周囲内部支持構造はフレームを備え、
前記少なくとも1つの面支持構造は少なくとも1つの取り付けブラケットを備えることを特徴とする請求項1に記載のポータブル電子デバイス。 - 電子デバイスを組み立てる方法であって、
上面及び底面を有し、前記上面が前記電子デバイスの1つの面の実質的にすべてに対応する外面を提供するガラス部材を取得し、
少なくとも1つの周囲支持構造を前記ガラス部材の前記底面の周囲領域に装着し、
前記ガラス部材の前記底面の中央領域にスクリーンアセンブリを装着し、
前記少なくとも1つの周囲支持構造に少なくとも1つの面支持構造を装着し、前記ガラス部材、前記スクリーンアセンブリ及び前記少なくとも1つの周囲支持構造は結果としてディスプレイアセンブリを形成し、
その後、前記結果として得られるディスプレイアセンブリを前記少なくとも1つの周囲支持構造を使用して製品筐体に固定し、
前記ガラス部材を含む前記結果としてのディスプレイアセンブリを前記製品筐体に固定するために、前記少なくとも1つの周囲支持構造が前記製品筐体の1つ以上の内部の側面に固定されること、を備えることを特徴とする方法。 - 前記少なくとも1つの周囲支持構造は、前記少なくとも1つの周囲支持構造が前記ガラス部材の周囲内に位置するように、前記ガラス部材の前記底面の前記周囲領域に装着されることを特徴とする請求項16に記載の方法。
- 前記少なくとも1つの周囲支持構造はフレームを備え、
前記少なくとも1つの面支持構造は少なくとも1つの取り付けブラケットを備えることを特徴とする請求項16に記載の方法。 - 前記少なくとも1つの周囲支持構造は少なくとも1つの取り付けブラケットを備え、
前記少なくとも1つの面支持構造はフレームを備えることを特徴とする請求項16に記載の方法。 - 前記フレームを装着することは、
前記ガラス部材の前記底面の前記周囲領域又は前記フレームの一部に接着剤を塗布し、
前記ガラス部材の前記底面の前記周囲領域で前記接着剤に前記フレームを圧着すること、を含むことを特徴とする請求項18に記載の方法。 - 前記取り付けブラケット及び前記フレームの厚さは約0.1〜0.6mmであり、
前記取り付けブラケット及び前記フレームはステンレス鋼から形成されることを特徴とする請求項18または20に記載の方法。 - 電子デバイスを組み立てる方法であって、
上面及び底面を有し、前記上面が前記電子デバイスの1つの面の実質的に全体に対応する外面を提供するガラス部材を取得し、
前記ガラス部材の前記底面の周囲領域に1つ以上の取り付けブラケットを装着し、
前記ガラス部材の前記底面の中央領域にスクリーンアセンブリの上面を装着し、
前記スクリーンアセンブリの底面に隣接させてフレームを装着し、前記ガラス部材、前記フレーム、前記スクリーンアセンブリ及び前記取り付けブラケットが結果としてディスプレイアセンブリを形成し、
その後、前記フレームを、少なくとも1つ以上の前記取り付けブラケットを使用して製品筐体に固定すること、を備え、
前記ガラス部材を含む、前記結果としてのディスプレイアセンブリを前記製品筐体に固定するために、前記1つ以上の取り付けブラケットが前記製品筐体の1つ以上の内部の側面に固定されることを特徴とする方法。 - 前記取り付けブラケットを装着することは、
前記ガラス部材の前記底面の前記周囲領域又は前記取り付けブラケットに接着剤を塗布し、
前記ガラス部材の前記底面の前記周囲領域で前記取り付けブラケットを前記接着剤に圧着すること、を含むことを特徴とする請求項22に記載の方法。 - 前記スクリーンアセンブリを装着することは、
前記スクリーンアセンブリの上面又は前記ガラス部材の前記底面に接着剤を塗布し、
前記スクリーンアセンブリを前記ガラス部材の前記底面に前記接着剤を介して圧着すること、を含むことを特徴とする請求項18または22に記載の方法。 - 前記取り付けブラケット及び前記フレームの厚さは約0.1〜0.6mmであることを特徴とする請求項24に記載の方法。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
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US201161482513P | 2011-05-04 | 2011-05-04 | |
US61/482,513 | 2011-05-04 | ||
US13/246,697 | 2011-09-27 | ||
US13/246,697 US9128666B2 (en) | 2011-05-04 | 2011-09-27 | Housing for portable electronic device with reduced border region |
PCT/US2012/036379 WO2012151434A1 (en) | 2011-05-04 | 2012-05-03 | Housing for portable electronic device with reduced border region |
Publications (2)
Publication Number | Publication Date |
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JP2014514880A JP2014514880A (ja) | 2014-06-19 |
JP5883122B2 true JP5883122B2 (ja) | 2016-03-09 |
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JP2014509454A Active JP5883122B2 (ja) | 2011-05-04 | 2012-05-03 | ポータブル電子デバイスおよび電子デバイスを組み立てる方法 |
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Country | Link |
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US (8) | US9128666B2 (ja) |
EP (2) | EP3611594A1 (ja) |
JP (1) | JP5883122B2 (ja) |
KR (1) | KR101627024B1 (ja) |
CN (3) | CN106341963B (ja) |
AU (1) | AU2012250671B2 (ja) |
WO (1) | WO2012151434A1 (ja) |
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US20200249718A1 (en) | 2020-08-06 |
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