JP5883119B2 - エッジコネクタを有する積層チップ・オン・ボードモジュール - Google Patents

エッジコネクタを有する積層チップ・オン・ボードモジュール Download PDF

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Publication number
JP5883119B2
JP5883119B2 JP2014506417A JP2014506417A JP5883119B2 JP 5883119 B2 JP5883119 B2 JP 5883119B2 JP 2014506417 A JP2014506417 A JP 2014506417A JP 2014506417 A JP2014506417 A JP 2014506417A JP 5883119 B2 JP5883119 B2 JP 5883119B2
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microelectronic element
microelectronic
module
chip
contacts
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JP2014512686A5 (enExample
JP2014512686A (ja
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ゾーニ，ワエル
ハーバ，ベルガセム
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テッセラ，インコーポレイテッド
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    • H10W90/811—
    • H10W70/40—
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
    • H10W70/415—
    • H10W70/421—
    • H10W72/073—
    • H10W72/075—
    • H10W72/50—
    • H10W90/00—
    • H10W99/00—
    • H10W70/60—
    • H10W70/68—
    • H10W72/252—
    • H10W72/29—
    • H10W72/354—
    • H10W72/551—
    • H10W72/856—
    • H10W72/865—
    • H10W72/877—
    • H10W72/884—
    • H10W72/9445—
    • H10W74/00—
    • H10W90/24—
    • H10W90/26—
    • H10W90/724—
    • H10W90/732—
    • H10W90/734—
    • H10W90/736—
    • H10W90/754—
    • H10W90/756—

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Semiconductor Memories (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2014506417A 2011-04-21 2012-03-21 エッジコネクタを有する積層チップ・オン・ボードモジュール Expired - Fee Related JP5883119B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201161477820P 2011-04-21 2011-04-21
US61/477,820 2011-04-21
US13/306,203 US8633576B2 (en) 2011-04-21 2011-11-29 Stacked chip-on-board module with edge connector
US13/306,203 2011-11-29
PCT/US2012/029876 WO2012145115A1 (en) 2011-04-21 2012-03-21 Stacked chip-on-board module with edge connector

Publications (3)

Publication Number Publication Date
JP2014512686A JP2014512686A (ja) 2014-05-22
JP2014512686A5 JP2014512686A5 (enExample) 2015-05-07
JP5883119B2 true JP5883119B2 (ja) 2016-03-09

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JP2014506417A Expired - Fee Related JP5883119B2 (ja) 2011-04-21 2012-03-21 エッジコネクタを有する積層チップ・オン・ボードモジュール

Country Status (8)

Country Link
US (4) US8633576B2 (enExample)
EP (1) EP2700096A1 (enExample)
JP (1) JP5883119B2 (enExample)
KR (1) KR20140027999A (enExample)
CN (1) CN103620775A (enExample)
BR (1) BR112013027143A2 (enExample)
TW (1) TWI493795B (enExample)
WO (1) WO2012145115A1 (enExample)

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