AU2003299866A1 - High frequency chip packages with connecting elements - Google Patents

High frequency chip packages with connecting elements

Info

Publication number
AU2003299866A1
AU2003299866A1 AU2003299866A AU2003299866A AU2003299866A1 AU 2003299866 A1 AU2003299866 A1 AU 2003299866A1 AU 2003299866 A AU2003299866 A AU 2003299866A AU 2003299866 A AU2003299866 A AU 2003299866A AU 2003299866 A1 AU2003299866 A1 AU 2003299866A1
Authority
AU
Australia
Prior art keywords
high frequency
connecting elements
frequency chip
chip packages
packages
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003299866A
Other versions
AU2003299866A8 (en
Inventor
Masud Beroz
Teck-Gyu Kang
Yoichi Kubota
Jae M. Park
Lee Smith
Glenn Urbish
Michael Warner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Adeia Semiconductor Solutions LLC
Original Assignee
Tessera LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tessera LLC filed Critical Tessera LLC
Publication of AU2003299866A8 publication Critical patent/AU2003299866A8/en
Publication of AU2003299866A1 publication Critical patent/AU2003299866A1/en
Abandoned legal-status Critical Current

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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
AU2003299866A 2003-02-25 2003-12-24 High frequency chip packages with connecting elements Abandoned AU2003299866A1 (en)

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US44967303P 2003-02-25 2003-02-25
US60/449,673 2003-02-25
US46217003P 2003-04-11 2003-04-11
US60/462,170 2003-04-11
PCT/US2003/041132 WO2004080134A2 (en) 2003-02-25 2003-12-24 High frequency chip packages with connecting elements

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JP4504204B2 (en) 2010-07-14
JP2006514438A (en) 2006-04-27
WO2004080134A2 (en) 2004-09-16
WO2004080134A3 (en) 2005-01-27

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