JP4677758B2 - ダイボンドダイシングシート及びその製造方法、並びに、半導体装置の製造方法 - Google Patents

ダイボンドダイシングシート及びその製造方法、並びに、半導体装置の製造方法 Download PDF

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Publication number
JP4677758B2
JP4677758B2 JP2004300541A JP2004300541A JP4677758B2 JP 4677758 B2 JP4677758 B2 JP 4677758B2 JP 2004300541 A JP2004300541 A JP 2004300541A JP 2004300541 A JP2004300541 A JP 2004300541A JP 4677758 B2 JP4677758 B2 JP 4677758B2
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Japan
Prior art keywords
adhesive layer
substrate
peeling
release substrate
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2004300541A
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English (en)
Japanese (ja)
Other versions
JP2006111727A (ja
Inventor
隆行 松崎
涼士 古谷
道生 宇留野
道夫 増野
麻衣子 金田
禎一 稲田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=36148242&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP4677758(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to JP2004300541A priority Critical patent/JP4677758B2/ja
Priority to KR1020077008283A priority patent/KR100892799B1/ko
Priority to CN201110060460XA priority patent/CN102174298A/zh
Priority to KR1020087024430A priority patent/KR101022175B1/ko
Priority to CN201110060486.4A priority patent/CN102169817B/zh
Priority to KR1020087024429A priority patent/KR100915491B1/ko
Priority to CN2005800349933A priority patent/CN101040023B/zh
Priority to PCT/JP2005/018120 priority patent/WO2006040945A1/ja
Priority to CN201110060453XA priority patent/CN102190978B/zh
Priority to CN201110060467.1A priority patent/CN102176407B/zh
Priority to US11/577,255 priority patent/US20080261039A1/en
Priority to TW094134984A priority patent/TW200627536A/zh
Publication of JP2006111727A publication Critical patent/JP2006111727A/ja
Publication of JP4677758B2 publication Critical patent/JP4677758B2/ja
Application granted granted Critical
Priority to US13/310,515 priority patent/US8470115B2/en
Priority to US13/310,531 priority patent/US8465615B2/en
Priority to US13/367,118 priority patent/US20120135176A1/en
Priority to US13/921,321 priority patent/US20130302570A1/en
Priority to US13/921,331 priority patent/US20130295314A1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/204—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive coating being discontinuous
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
    • H10P72/7442—Separation by peeling
    • H10P72/7444—Separation by peeling using a peeling wedge, a knife or a bar
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01331—Manufacture or treatment of die-attach connectors using blanket deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/381—Auxiliary members
    • H10W72/387—Flow barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1082—Partial cutting bonded sandwich [e.g., grooving or incising]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face
    • Y10T156/1093—All laminae planar and face to face with covering of discrete laminae with additional lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/1476—Release layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24562—Interlaminar spaces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2839—Web or sheet containing structurally defined element or component and having an adhesive outermost layer with release or antistick coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
JP2004300541A 2004-06-08 2004-10-14 ダイボンドダイシングシート及びその製造方法、並びに、半導体装置の製造方法 Expired - Lifetime JP4677758B2 (ja)

Priority Applications (17)

Application Number Priority Date Filing Date Title
JP2004300541A JP4677758B2 (ja) 2004-10-14 2004-10-14 ダイボンドダイシングシート及びその製造方法、並びに、半導体装置の製造方法
US11/577,255 US20080261039A1 (en) 2004-10-14 2005-09-30 Adhesive Sheet and Method for Manufacturing the Same, Semiconductor Device Manufacturing Method and Semiconductor Device
CN201110060460XA CN102174298A (zh) 2004-10-14 2005-09-30 粘接片及其制造方法、以及半导体装置的制造方法及半导体装置
KR1020087024430A KR101022175B1 (ko) 2004-10-14 2005-09-30 적층체 부착 반도체 웨이퍼의 제조방법 및 적층체 첩부방법
CN201110060486.4A CN102169817B (zh) 2004-10-14 2005-09-30 粘接片及其制造方法、以及半导体装置的制造方法及半导体装置
KR1020087024429A KR100915491B1 (ko) 2004-10-14 2005-09-30 접착시트 및 그 제조방법, 및, 반도체장치의 제조방법 및 반도체장치
CN2005800349933A CN101040023B (zh) 2004-10-14 2005-09-30 粘接片及其制造方法、以及半导体装置的制造方法及半导体装置
PCT/JP2005/018120 WO2006040945A1 (ja) 2004-10-14 2005-09-30 接着シート及びその製造方法、並びに、半導体装置の製造方法及び半導体装置
CN201110060453XA CN102190978B (zh) 2004-10-14 2005-09-30 粘接片及其制造方法、以及半导体装置的制造方法及半导体装置
CN201110060467.1A CN102176407B (zh) 2004-10-14 2005-09-30 粘接片及其制造方法、以及半导体装置的制造方法及半导体装置
KR1020077008283A KR100892799B1 (ko) 2004-10-14 2005-09-30 접착시트 및 그 제조방법, 및, 반도체장치의 제조방법 및반도체장치
TW094134984A TW200627536A (en) 2004-06-08 2005-10-06 Adhesive sheet, method for producing the sheet, method for producing semiconductor device, and the semiconductor device
US13/310,531 US8465615B2 (en) 2004-10-14 2011-12-02 Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device
US13/310,515 US8470115B2 (en) 2004-10-14 2011-12-02 Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device
US13/367,118 US20120135176A1 (en) 2004-10-14 2012-02-06 Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device
US13/921,321 US20130302570A1 (en) 2004-10-14 2013-06-19 Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device
US13/921,331 US20130295314A1 (en) 2004-10-14 2013-06-19 Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004300541A JP4677758B2 (ja) 2004-10-14 2004-10-14 ダイボンドダイシングシート及びその製造方法、並びに、半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2006111727A JP2006111727A (ja) 2006-04-27
JP4677758B2 true JP4677758B2 (ja) 2011-04-27

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JP2004300541A Expired - Lifetime JP4677758B2 (ja) 2004-06-08 2004-10-14 ダイボンドダイシングシート及びその製造方法、並びに、半導体装置の製造方法

Country Status (6)

Country Link
US (6) US20080261039A1 (https=)
JP (1) JP4677758B2 (https=)
KR (3) KR100915491B1 (https=)
CN (5) CN101040023B (https=)
TW (1) TW200627536A (https=)
WO (1) WO2006040945A1 (https=)

Families Citing this family (69)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4719042B2 (ja) * 2006-03-16 2011-07-06 株式会社東芝 半導体装置の製造方法
EP1884981A1 (en) * 2006-08-03 2008-02-06 STMicroelectronics Ltd (Malta) Removable wafer expander for die bonding equipment.
FR2934056B1 (fr) * 2008-07-21 2011-01-07 Essilor Int Procede de transfert d'une portion de film fonctionnel
JP2010192856A (ja) * 2009-02-20 2010-09-02 Furukawa Electric Co Ltd:The ウエハ加工用フィルム
JP5580719B2 (ja) 2009-12-24 2014-08-27 日東電工株式会社 ダイシングテープ一体型半導体裏面用フィルム
JP4902812B2 (ja) * 2010-02-12 2012-03-21 積水化学工業株式会社 粘接着剤層付き半導体チップの製造方法
JP4934730B2 (ja) * 2010-02-19 2012-05-16 古河電気工業株式会社 ウエハ加工用テープ及びその製造方法
CN102782813B (zh) * 2010-03-09 2015-08-12 古河电气工业株式会社 晶片加工用薄膜及使用晶片加工用薄膜来制造半导体装置的方法
JP5196034B2 (ja) * 2010-06-18 2013-05-15 日立化成株式会社 接着シート
CN102337089B (zh) * 2010-07-07 2014-01-29 古河电气工业株式会社 晶片加工用胶带和使用其的半导体加工方法
JP5546985B2 (ja) * 2010-07-28 2014-07-09 日東電工株式会社 半導体装置製造用フィルム、半導体装置製造用フィルムの製造方法、及び、半導体装置の製造方法。
TW201206813A (en) * 2010-08-11 2012-02-16 Furukawa Electric Co Ltd Wafer processing tape
JP4976531B2 (ja) * 2010-09-06 2012-07-18 日東電工株式会社 半導体装置用フィルム
JP5408571B2 (ja) * 2010-10-06 2014-02-05 古河電気工業株式会社 ウエハ加工用テープ及びその製造方法
WO2012050134A1 (ja) 2010-10-15 2012-04-19 日立化成工業株式会社 ウェハ加工用テープ、ウェハ加工用テープの製造方法、及び半導体装置の製造方法
USD656909S1 (en) * 2010-10-15 2012-04-03 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
KR101351615B1 (ko) * 2010-12-13 2014-01-15 제일모직주식회사 반도체용 점접착시트 및 그의 제조 방법
KR101351621B1 (ko) * 2010-12-29 2014-01-15 제일모직주식회사 점착제 조성물 및 이를 이용한 광학 부재
JP5036887B1 (ja) * 2011-03-11 2012-09-26 日東電工株式会社 保護フィルム付きダイシングフィルム
US8647966B2 (en) * 2011-06-09 2014-02-11 National Semiconductor Corporation Method and apparatus for dicing die attach film on a semiconductor wafer
JP5800640B2 (ja) * 2011-08-30 2015-10-28 日東電工株式会社 発光ダイオード装置の製造方法
JP5998730B2 (ja) * 2011-09-16 2016-09-28 日立化成株式会社 粘着フィルム及び粘着フィルムの製造方法
JP5823232B2 (ja) * 2011-09-28 2015-11-25 リンテック株式会社 積層シート製造装置および積層シート製造方法
JP5897856B2 (ja) * 2011-09-28 2016-04-06 リンテック株式会社 シート製造装置及び製造方法
JP5912022B2 (ja) * 2011-09-28 2016-04-27 リンテック株式会社 シート製造装置及び製造方法
TWI444295B (zh) * 2011-11-18 2014-07-11 Au Optronics Corp 脫黏器及自基板分離薄膜的方法
KR101403864B1 (ko) * 2011-12-27 2014-06-09 제일모직주식회사 다이싱 다이본딩 필름
JP5158906B1 (ja) 2012-04-02 2013-03-06 古河電気工業株式会社 接着シート
JP5158907B1 (ja) 2012-04-02 2013-03-06 古河電気工業株式会社 接着シート
US9188871B2 (en) * 2012-05-17 2015-11-17 Taiyo Ink Mfg. Co., Ltd. Pattern forming method, alkali-developable thermosetting resin composition, printed circuit board and manufacturing method thereof
KR102189257B1 (ko) 2012-05-25 2020-12-11 쇼와덴코머티리얼즈가부시끼가이샤 권취 코어 및 롤
KR20130139134A (ko) * 2012-06-12 2013-12-20 제일모직주식회사 접착제 조성물, 이를 이용한 편광판, 그 제조 방법 및 이를 포함하는 광학 부재
US9136173B2 (en) * 2012-11-07 2015-09-15 Semiconductor Components Industries, Llc Singulation method for semiconductor die having a layer of material along one major surface
US9484260B2 (en) * 2012-11-07 2016-11-01 Semiconductor Components Industries, Llc Heated carrier substrate semiconductor die singulation method
USD692056S1 (en) * 2012-12-19 2013-10-22 3M Innovative Properties Company Tape
WO2014156127A1 (ja) * 2013-03-26 2014-10-02 三井化学東セロ株式会社 積層フィルムの製造方法、積層フィルムおよびそれを用いた半導体装置の製造方法
TWD164050S (zh) * 2013-06-25 2014-11-11 尼托母斯股份有限公司 清掃用黏著膠帶之帶體
JP6436081B2 (ja) * 2013-07-16 2018-12-12 日立化成株式会社 感光性樹脂組成物、フィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ及び半導体装置
US10103128B2 (en) 2013-10-04 2018-10-16 Mediatek Inc. Semiconductor package incorporating redistribution layer interposer
US10074628B2 (en) 2013-10-04 2018-09-11 Mediatek Inc. System-in-package and fabrication method thereof
CN105658422B (zh) * 2013-10-21 2017-07-07 琳得科株式会社 树脂膜形成用片材
JP6262163B2 (ja) * 2014-03-14 2018-01-17 サンコール株式会社 バスリングユニット
JP6337959B2 (ja) * 2014-04-15 2018-06-06 大日本印刷株式会社 粘接着シートを用いた構造物の補修ないし補強方法、粘接着シートを用いて補修ないし補強された構造物を製造する方法、粘接着シート
US8912075B1 (en) * 2014-04-29 2014-12-16 Applied Materials, Inc. Wafer edge warp supression for thin wafer supported by tape frame
KR102535477B1 (ko) * 2014-05-23 2023-05-23 가부시끼가이샤 레조낙 다이본드 다이싱 시트
JP5927249B2 (ja) * 2014-08-07 2016-06-01 日東電工株式会社 半導体装置製造用フィルムを用いた半導体装置の製造方法
EP3098277A1 (en) 2015-05-27 2016-11-30 Henkel AG & Co. KGaA Pre-cut film and a production method thereof
EP3151275A3 (en) * 2015-09-11 2017-04-19 MediaTek Inc. System-in-package and fabrication method thereof
JP2017088782A (ja) * 2015-11-13 2017-05-25 日東電工株式会社 積層体および合同体・組み合わせの回収方法・半導体装置の製造方法
JP6716941B2 (ja) * 2016-02-18 2020-07-01 株式会社オートネットワーク技術研究所 端子台およびその製造方法
PH12018501116B1 (en) * 2016-02-24 2022-11-16 Lintec Corp Adhesive sheet and usage method therefor
JP7154737B2 (ja) * 2017-03-27 2022-10-18 リンテック株式会社 シート貼付装置および貼付方法
US10373869B2 (en) 2017-05-24 2019-08-06 Semiconductor Components Industries, Llc Method of separating a back layer on a substrate using exposure to reduced temperature and related apparatus
WO2019058425A1 (ja) * 2017-09-19 2019-03-28 日立化成株式会社 半導体装置製造用接着フィルム
WO2019058429A1 (ja) * 2017-09-19 2019-03-28 日立化成株式会社 半導体装置製造用接着フィルム及びその製造方法
JP6978890B2 (ja) * 2017-10-16 2021-12-08 リンテック株式会社 ダイシングダイボンディングシート及び半導体チップの製造方法
JP7045201B2 (ja) * 2018-01-24 2022-03-31 リンテック株式会社 長尺積層シートおよびその巻収体
SG11202006914YA (en) * 2018-01-24 2020-08-28 Lintec Corp Rolled body of elongated laminated sheet
CN111655470A (zh) * 2018-01-24 2020-09-11 琳得科株式会社 长条层叠片及其卷料
JP7204389B2 (ja) * 2018-09-18 2023-01-16 株式会社ディスコ テープ貼着装置
CN113613853B (zh) * 2019-03-31 2024-04-09 迪睿合株式会社 切缝装置、切缝方法和层叠带
KR20210016137A (ko) * 2019-07-31 2021-02-15 쓰리엠 이노베이티브 프로퍼티즈 캄파니 접착제 조성물, 접착 필름, 적층체 및 이의 제조방법
JP7382265B2 (ja) * 2020-03-27 2023-11-16 株式会社ジャパンディスプレイ 一時保持用部材、及び表示装置の製造方法
USD1070795S1 (en) * 2021-10-15 2025-04-15 Shin-Etsu Chemical Co., Ltd. Stamp component for transferring microstructure
CN119403894A (zh) * 2022-06-21 2025-02-07 株式会社力森诺科 膜、卷绕体、连接结构体及连接结构体的制造方法
WO2024064046A1 (en) * 2022-09-19 2024-03-28 Henkel Ag & Co. Kgaa Method for producing a die attach adhesive film sheet
CN120051541A (zh) * 2023-07-20 2025-05-27 株式会社Lg化学 用于半导体封装的粘合剂组合物
WO2025106944A1 (en) * 2023-11-16 2025-05-22 Henkel Ag & Co. Kgaa Flexible conductive adhesive compositions
USD1098455S1 (en) * 2024-02-26 2025-10-14 Hillary Fazio Adhesive bandage dispensing roll

Family Cites Families (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3850451T2 (de) * 1987-07-08 1995-03-09 Furukawa Electric Co Ltd Strahlungsvernetzbare Klebestreifen.
JPH0271878A (ja) 1988-09-08 1990-03-12 Kawasaki Steel Corp 細粒焼結鉱の篩分方法
JPH0618383Y2 (ja) * 1988-11-22 1994-05-11 リンテック株式会社 半導体製造工程用粘着ラベルシート
JP2678655B2 (ja) 1989-03-20 1997-11-17 日東電工株式会社 半導体チップ固着キャリヤの製造方法及びウエハ固定部材
US5035741A (en) 1989-10-13 1991-07-30 Safer, Inc. Fatty acid based emulsifiable concentrate having herbicidal activity
US5131686A (en) * 1990-09-20 1992-07-21 Carlson Thomas S Method for producing identification cards
AU664693B2 (en) * 1990-11-13 1995-11-30 Mobil Oil Corporation Polypropylene sheet material with improved cut resistance
JPH0618383A (ja) 1992-06-30 1994-01-25 S R L:Kk 押圧器具
JP2759590B2 (ja) 1993-01-12 1998-05-28 リンテック株式会社 半導体ウエハに貼着する粘着テープの貼着方法
JP3226065B2 (ja) 1993-06-28 2001-11-05 キヤノン株式会社 単一波長半導体レーザ
JP3348923B2 (ja) 1993-07-27 2002-11-20 リンテック株式会社 ウェハ貼着用粘着シート
JP3521099B2 (ja) * 1994-11-29 2004-04-19 リンテック株式会社 ダイシング用リングフレームへの接着剤の付着防止用粘着シートおよび該粘着シートを備えたウェハ加工用シート
JPH08243997A (ja) 1995-03-10 1996-09-24 New Oji Paper Co Ltd ダイカット装置
JPH0985696A (ja) 1995-09-25 1997-03-31 Ckd Corp Ｐｔｐシートのチップ片打ち抜き装置
JP3722394B2 (ja) * 1996-11-06 2005-11-30 信越ポリマー株式会社 ハーフカットセパレータ付きヒートシールコネクタ
JPH10291376A (ja) 1997-04-18 1998-11-04 Dainippon Printing Co Ltd 熱転写受像シート
JPH10335271A (ja) * 1997-06-02 1998-12-18 Texas Instr Japan Ltd ウェハ貼着用シートおよび半導体装置の製造方法
JPH1134281A (ja) 1997-07-14 1999-02-09 Somar Corp フィルム張付方法及び装置
JP3905628B2 (ja) 1997-10-22 2007-04-18 富士フイルム株式会社 フィルム張付制御方法
JPH11309792A (ja) 1998-04-28 1999-11-09 Sankyo Co Ltd 包装用袋の製造方法
CN1331736A (zh) * 1998-11-23 2002-01-16 让－马克·弗朗索斯 压敏粘合层合材料,改进此类层合材料起始剥离力的方法和装置
JP2000221888A (ja) * 1999-01-29 2000-08-11 Nitto Denko Corp 半導体ウエハ用粘着ラベルシート
JP2000254891A (ja) * 1999-03-04 2000-09-19 Makita Corp ラベルシートのハーフカット装置
JP2001051604A (ja) 1999-08-17 2001-02-23 Sato Corp ラベル連続体
JP2001059074A (ja) * 1999-08-24 2001-03-06 Nichiei Kako Kk ロール状粘着シート
JP3340979B2 (ja) * 1999-09-06 2002-11-05 日東電工株式会社 ダイシング用粘着シート
JP2001162594A (ja) 1999-12-08 2001-06-19 Canon Inc 軟弱部材の加工供給装置及び方法
DE10052955A1 (de) * 2000-10-25 2002-06-06 Tesa Ag Verwendung von Haftklebemassen mit anisotropen Eigenschaften für Stanzprodukte
CN1264940C (zh) * 2001-08-10 2006-07-19 日东电工株式会社 切割用胶粘薄膜及切割方法
JP2004043763A (ja) * 2001-08-27 2004-02-12 Hitachi Chem Co Ltd 接着シート並びに半導体装置及びその製造方法
JP3839305B2 (ja) 2001-11-07 2006-11-01 日栄化工株式会社 両面粘着シートの型抜き方法
JP4067308B2 (ja) * 2002-01-15 2008-03-26 リンテック株式会社 ウエハダイシング・接着用シートおよび半導体装置の製造方法
JP3941106B2 (ja) 2002-07-09 2007-07-04 ブラザー工業株式会社 印字用テープ及びテープ印字装置
JP2004045812A (ja) 2002-07-12 2004-02-12 Brother Ind Ltd 印字媒体およびこれを収納したテープカセット
JP2004046763A (ja) * 2002-07-12 2004-02-12 X Denshi Sekkei:Kk コンピュータによる自動制御装置
JP2004047823A (ja) * 2002-07-12 2004-02-12 Tokyo Seimitsu Co Ltd ダイシングテープ貼付装置およびバックグラインド・ダイシングテープ貼付システム
KR100468748B1 (ko) * 2002-07-12 2005-01-29 삼성전자주식회사 프리컷 다이싱 테이프와 범용 다이싱 테이프를 웨이퍼에 마운팅할 수 있는 다이싱 테이프 부착 장비 및 이를포함하는 인라인 시스템
JP2004072040A (ja) 2002-08-09 2004-03-04 Lintec Corp 属性表示付ダイシングテープおよびその製造方法
JP4107417B2 (ja) 2002-10-15 2008-06-25 日東電工株式会社 チップ状ワークの固定方法
JP5058428B2 (ja) * 2003-01-15 2012-10-24 日立化成工業株式会社 接着シートならびに半導体装置およびその製造方法
JP4519409B2 (ja) * 2003-02-24 2010-08-04 リンテック株式会社 粘着シートおよびその使用方法
JP4714406B2 (ja) * 2003-03-03 2011-06-29 日立化成工業株式会社 半導体装置用ダイボンディング材及びこれを用いた半導体装置
JP2005064239A (ja) * 2003-08-12 2005-03-10 Lintec Corp 半導体装置の製造方法
JP2005162818A (ja) 2003-12-01 2005-06-23 Hitachi Chem Co Ltd ダイシングダイボンドシート
WO2005057644A1 (ja) * 2003-12-15 2005-06-23 The Furukawa Electric Co., Ltd. ウェハ加工用テープおよびその製造方法
JP2005203749A (ja) * 2003-12-15 2005-07-28 Furukawa Electric Co Ltd:The ウェハ加工用テープおよびその製造方法
JP2005239759A (ja) 2004-02-24 2005-09-08 Nitto Shinko Kk フィルム粘着シート
JP2005350520A (ja) * 2004-06-08 2005-12-22 Hitachi Chem Co Ltd 接着シート及びその製造方法、並びに、半導体装置の製造方法及び半導体装置
US10051498B2 (en) * 2007-05-02 2018-08-14 Telefonaktiebolaget Lm Ericsson (Publ) Method and arrangement in a communication network

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