JP2951882B2 - 半導体装置の製造方法及びこれを用いて製造した半導体装置 - Google Patents

半導体装置の製造方法及びこれを用いて製造した半導体装置

Info

Publication number
JP2951882B2
JP2951882B2 JP8049065A JP4906596A JP2951882B2 JP 2951882 B2 JP2951882 B2 JP 2951882B2 JP 8049065 A JP8049065 A JP 8049065A JP 4906596 A JP4906596 A JP 4906596A JP 2951882 B2 JP2951882 B2 JP 2951882B2
Authority
JP
Japan
Prior art keywords
semiconductor device
circuit board
electrode
semiconductor element
electrode terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP8049065A
Other languages
English (en)
Japanese (ja)
Other versions
JPH09246320A (ja
Inventor
司 白石
芳宏 別所
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP8049065A priority Critical patent/JP2951882B2/ja
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to EP01129307A priority patent/EP1191578A3/en
Priority to EP97905446A priority patent/EP0951063B1/en
Priority to KR1019980707001A priority patent/KR100300758B1/ko
Priority to DE69722661T priority patent/DE69722661T2/de
Priority to CNB971927987A priority patent/CN1175480C/zh
Priority to PCT/JP1997/000672 priority patent/WO1997033313A1/ja
Priority to US09/117,695 priority patent/US6452280B1/en
Publication of JPH09246320A publication Critical patent/JPH09246320A/ja
Application granted granted Critical
Publication of JP2951882B2 publication Critical patent/JP2951882B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10W72/071—
    • H10W72/012—
    • H10W74/012—
    • H10W74/15—
    • H10W72/0711—
    • H10W72/072—
    • H10W72/07236—
    • H10W72/07251—
    • H10W72/20—
    • H10W72/227—
    • H10W72/241—
    • H10W72/251—
    • H10W72/856—
    • H10W72/923—
    • H10W72/952—

Landscapes

  • Wire Bonding (AREA)
JP8049065A 1996-03-06 1996-03-06 半導体装置の製造方法及びこれを用いて製造した半導体装置 Expired - Fee Related JP2951882B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP8049065A JP2951882B2 (ja) 1996-03-06 1996-03-06 半導体装置の製造方法及びこれを用いて製造した半導体装置
EP97905446A EP0951063B1 (en) 1996-03-06 1997-03-05 Process for producing a semiconductor device
KR1019980707001A KR100300758B1 (ko) 1996-03-06 1997-03-05 반도체장치와 그 제조방법
DE69722661T DE69722661T2 (de) 1996-03-06 1997-03-05 Verfahren zur herstellung einer halbleitervorrichtung
EP01129307A EP1191578A3 (en) 1996-03-06 1997-03-05 Semiconductor apparatus and method for producing the same
CNB971927987A CN1175480C (zh) 1996-03-06 1997-03-05 半导体装置及其制造方法
PCT/JP1997/000672 WO1997033313A1 (en) 1996-03-06 1997-03-05 Semiconductor device and process for producing the same
US09/117,695 US6452280B1 (en) 1996-03-06 1997-03-05 Flip chip semiconductor apparatus with projecting electrodes and method for producing same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8049065A JP2951882B2 (ja) 1996-03-06 1996-03-06 半導体装置の製造方法及びこれを用いて製造した半導体装置

Publications (2)

Publication Number Publication Date
JPH09246320A JPH09246320A (ja) 1997-09-19
JP2951882B2 true JP2951882B2 (ja) 1999-09-20

Family

ID=12820690

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8049065A Expired - Fee Related JP2951882B2 (ja) 1996-03-06 1996-03-06 半導体装置の製造方法及びこれを用いて製造した半導体装置

Country Status (7)

Country Link
US (1) US6452280B1 (enExample)
EP (2) EP0951063B1 (enExample)
JP (1) JP2951882B2 (enExample)
KR (1) KR100300758B1 (enExample)
CN (1) CN1175480C (enExample)
DE (1) DE69722661T2 (enExample)
WO (1) WO1997033313A1 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001086716A1 (en) * 2000-05-12 2001-11-15 Matsushita Electric Industrial Co., Ltd. Semiconductor device mounting circuit board, method of producing the same, and method of producing mounting structure using the same
US6940178B2 (en) * 2001-02-27 2005-09-06 Chippac, Inc. Self-coplanarity bumping shape for flip chip
TWI245395B (en) * 2001-11-20 2005-12-11 Advanced Semiconductor Eng Multi-chip module package device
CN100356559C (zh) * 2003-09-24 2007-12-19 财团法人工业技术研究院 倒装芯片封装结构及其制造方法
TWI273664B (en) * 2004-03-26 2007-02-11 Advanced Semiconductor Eng Bumping process, bump structure, packaging process and package structure
KR100696190B1 (ko) * 2004-12-14 2007-03-20 한국전자통신연구원 플립 칩 본딩방법
JP4325571B2 (ja) * 2005-02-28 2009-09-02 株式会社日立製作所 電子装置の製造方法
TWI253697B (en) * 2005-04-08 2006-04-21 Phoenix Prec Technology Corp Method for fabricating a flip chip package
JP4765804B2 (ja) * 2006-07-14 2011-09-07 株式会社デンソー 半導体装置の製造方法
JP2008135719A (ja) * 2006-10-31 2008-06-12 Sanyo Electric Co Ltd 半導体モジュール、半導体モジュールの製造方法および携帯機器
JP2008218643A (ja) * 2007-03-02 2008-09-18 Fujitsu Ltd 半導体装置及びその製造方法
JP5028291B2 (ja) * 2008-01-31 2012-09-19 三洋電機株式会社 素子搭載用基板、素子搭載用基板の製造方法、半導体モジュールおよび半導体モジュールの製造方法
US8309864B2 (en) * 2008-01-31 2012-11-13 Sanyo Electric Co., Ltd. Device mounting board and manufacturing method therefor, and semiconductor module
JP5385004B2 (ja) * 2009-05-22 2014-01-08 富士通テン株式会社 回路部品
JP6143104B2 (ja) * 2012-12-05 2017-06-07 株式会社村田製作所 バンプ付き電子部品及びバンプ付き電子部品の製造方法
KR102248876B1 (ko) * 2014-12-24 2021-05-07 엘지디스플레이 주식회사 표시장치 어레이 기판 및 표시장치

Family Cites Families (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE296385C (enExample)
US4661192A (en) * 1985-08-22 1987-04-28 Motorola, Inc. Low cost integrated circuit bonding process
US4740657A (en) 1986-02-14 1988-04-26 Hitachi, Chemical Company, Ltd Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained
JPS6360540A (ja) 1986-09-01 1988-03-16 Seiko Epson Corp 接続端子の製造方法
JPS63152135A (ja) 1986-12-17 1988-06-24 Hitachi Ltd 半導体装置の製造方法
JPS63289824A (ja) 1987-05-21 1988-11-28 Fuji Electric Co Ltd 集積回路装置の実装方法
JPS647542A (en) 1987-06-30 1989-01-11 Toshiba Corp Formation of bump
JPH0793306B2 (ja) 1987-08-05 1995-10-09 日本電装株式会社 半導体集積回路装置
US5014111A (en) * 1987-12-08 1991-05-07 Matsushita Electric Industrial Co., Ltd. Electrical contact bump and a package provided with the same
JP2541284B2 (ja) * 1988-06-09 1996-10-09 富士通株式会社 半導体チップの実装方法
US5001542A (en) 1988-12-05 1991-03-19 Hitachi Chemical Company Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips
JPH02177546A (ja) * 1988-12-28 1990-07-10 Fujitsu Ltd 半導体集積回路の製造方法
JPH03209831A (ja) 1990-01-12 1991-09-12 Matsushita Electric Ind Co Ltd 半導体装置
JP2764632B2 (ja) 1990-04-09 1998-06-11 イビデン株式会社 電子回路基板とその製造方法
JPH046841A (ja) 1990-04-24 1992-01-10 Matsushita Electric Works Ltd 半導体装置の実装構造
JPH0433348A (ja) * 1990-05-29 1992-02-04 Sharp Corp 半導体装置
JP2881999B2 (ja) 1990-08-06 1999-04-12 松下電器産業株式会社 半導体素子の実装方法および実装基板
JPH04137541A (ja) 1990-09-27 1992-05-12 Sharp Corp 突起電極の形成方法
JPH04137630A (ja) 1990-09-28 1992-05-12 Seiko Epson Corp 半導体装置
JPH04144145A (ja) 1990-10-04 1992-05-18 Matsushita Electric Ind Co Ltd 半導体装置の実装方法
JPH05283414A (ja) * 1991-04-16 1993-10-29 Nippon Steel Corp 半導体装置用金属配線のバンプ高さ制御装置
JPH05144821A (ja) 1991-04-30 1993-06-11 Toshiba Corp 半導体装置
JPH0562977A (ja) 1991-09-02 1993-03-12 Fuji Electric Co Ltd 集積回路装置用バンプ電極
JP2730357B2 (ja) * 1991-11-18 1998-03-25 松下電器産業株式会社 電子部品実装接続体およびその製造方法
JPH05144888A (ja) * 1991-11-19 1993-06-11 Fujitsu Ltd 半導体チツプの実装方法
JPH05166879A (ja) 1991-12-12 1993-07-02 Matsushita Electric Ind Co Ltd Ｉｃ実装方法
US5436503A (en) 1992-11-18 1995-07-25 Matsushita Electronics Corporation Semiconductor device and method of manufacturing the same
JP3259393B2 (ja) * 1993-01-08 2002-02-25 ソニー株式会社 半導体チップの実装方法
JPH06302649A (ja) 1993-04-13 1994-10-28 Citizen Watch Co Ltd 半導体装置の接続方法
JP3209831B2 (ja) 1993-06-07 2001-09-17 大和製罐株式会社 金属薄板の溶接不良検出方法および装置
EP0645805B1 (en) 1993-09-29 2000-11-29 Matsushita Electric Industrial Co., Ltd. Method for mounting a semiconductor device on a circuit board, and a circuit board with a semiconductor device mounted thereon
US5640051A (en) * 1993-12-13 1997-06-17 Matsushita Electric Industrial Co., Ltd. Chip package, a chip carrier, a terminal electrode for a circuit substrate and a chip package-mounted complex
JP2793766B2 (ja) 1993-12-27 1998-09-03 株式会社ピーエフユー 導電ペースト転写方法
JP3255796B2 (ja) 1994-05-26 2002-02-12 松下電器産業株式会社 半導体装置の実装方法
JP3400125B2 (ja) 1994-07-18 2003-04-28 ソニー株式会社 部品実装方法
US5907187A (en) * 1994-07-18 1999-05-25 Kabushiki Kaisha Toshiba Electronic component and electronic component connecting structure
JPH0855874A (ja) * 1994-08-11 1996-02-27 Matsushita Electric Ind Co Ltd 半導体チップの接着方法
US5686353A (en) 1994-12-26 1997-11-11 Matsushita Electric Industrial Co., Ltd. Semiconductor device and manufacturing method thereof
JP3291950B2 (ja) 1994-12-28 2002-06-17 日産自動車株式会社 設計支援装置
EP0732107A3 (en) * 1995-03-16 1997-05-07 Toshiba Kk Shielding device for a circuit substrate
US5801446A (en) * 1995-03-28 1998-09-01 Tessera, Inc. Microelectronic connections with solid core joining units
US5796591A (en) 1995-06-07 1998-08-18 International Business Machines Corporation Direct chip attach circuit card
US5578527A (en) 1995-06-23 1996-11-26 Industrial Technology Research Institute Connection construction and method of manufacturing the same
JPH0982760A (ja) * 1995-07-07 1997-03-28 Toshiba Corp 半導体装置、半導体素子およびその半田接続部検査方法
US5874780A (en) * 1995-07-27 1999-02-23 Nec Corporation Method of mounting a semiconductor device to a substrate and a mounted structure
JPH09134934A (ja) * 1995-11-07 1997-05-20 Sumitomo Metal Ind Ltd 半導体パッケージ及び半導体装置
WO1997019579A1 (fr) * 1995-11-17 1997-05-29 Kabushiki Kaisha Toshiba Tableau de connexion multicouches, materiau prefabrique pour ce tableau, procede de fabrication de ce dernier groupement de composants electroniques et procede de formation de connexions verticales conductrices
US5611884A (en) 1995-12-11 1997-03-18 Dow Corning Corporation Flip chip silicone pressure sensitive conductive adhesive
KR100438256B1 (ko) * 1995-12-18 2004-08-25 마츠시타 덴끼 산교 가부시키가이샤 반도체장치 및 그 제조방법
JP3409957B2 (ja) 1996-03-06 2003-05-26 松下電器産業株式会社 半導体ユニット及びその形成方法
JP2891184B2 (ja) * 1996-06-13 1999-05-17 日本電気株式会社 半導体装置及びその製造方法
US5808319A (en) * 1996-10-10 1998-09-15 Advanced Micro Devices, Inc. Localized semiconductor substrate for multilevel transistors

Also Published As

Publication number Publication date
CN1175480C (zh) 2004-11-10
WO1997033313A1 (en) 1997-09-12
KR100300758B1 (ko) 2001-11-02
EP1191578A2 (en) 2002-03-27
DE69722661D1 (de) 2003-07-10
KR19990087563A (ko) 1999-12-27
EP0951063A1 (en) 1999-10-20
JPH09246320A (ja) 1997-09-19
EP0951063A4 (enExample) 1999-10-20
DE69722661T2 (de) 2004-05-13
CN1212786A (zh) 1999-03-31
EP0951063B1 (en) 2003-06-04
EP1191578A3 (en) 2002-05-08
US6452280B1 (en) 2002-09-17

Similar Documents

Publication Publication Date Title
JP2951882B2 (ja) 半導体装置の製造方法及びこれを用いて製造した半導体装置
CN101064270B (zh) 半导体器件的制造方法
EP1445995B1 (en) Method of mounting an electronic component on a circuit board and system for carrying out the method
JP3420435B2 (ja) 基板の製造方法、半導体装置及び半導体装置の製造方法
US8344492B2 (en) Semiconductor device and method of manufacturing the same, and electronic apparatus
US7495179B2 (en) Components with posts and pads
CN100423258C (zh) 半导体器件及其制造方法
US6420787B1 (en) Semiconductor device and process of producing same
US7884453B2 (en) Semiconductor device and manufacturing method thereof
JP2002184904A (ja) 半導体装置の製造方法及び半導体装置
US9490224B2 (en) Semiconductor device and manufacturing method thereof
US6369600B2 (en) Test carrier for testing semiconductor components including interconnect with support members for preventing component flexure
US6207550B1 (en) Method for fabricating bump electrodes with a leveling step for uniform heights
US20040012080A1 (en) Connection of integrated circuits
KR20020096968A (ko) 회로 장치의 제조 방법
JP2000277649A (ja) 半導体装置及びその製造方法
JP3116926B2 (ja) パッケージ構造並びに半導体装置、パッケージ製造方法及び半導体装置製造方法
JP3496569B2 (ja) 半導体装置及びその製造方法並びにその実装構造
JP2002231765A (ja) 半導体装置
JP2002151801A (ja) 回路基板構造およびその製造方法
JP3851585B2 (ja) プリント配線板へのベアチップ半導体素子の接続方法
JP4024458B2 (ja) 半導体装置の実装方法および半導体装置実装体の製造方法
JP3500378B2 (ja) 半導体装置およびその製造方法
JP3078781B2 (ja) 半導体装置の製造方法及び半導体装置
JPH09283555A (ja) 半導体チップの実装構造および半導体パッケージの製造方法および半導体パッケージ

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees