JP2017048467A - 銅箔、キャリア箔付銅箔及び銅張積層板 - Google Patents
銅箔、キャリア箔付銅箔及び銅張積層板 Download PDFInfo
- Publication number
- JP2017048467A JP2017048467A JP2016231862A JP2016231862A JP2017048467A JP 2017048467 A JP2017048467 A JP 2017048467A JP 2016231862 A JP2016231862 A JP 2016231862A JP 2016231862 A JP2016231862 A JP 2016231862A JP 2017048467 A JP2017048467 A JP 2017048467A
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- copper
- layer
- roughened
- foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 378
- 239000011889 copper foil Substances 0.000 title claims abstract description 319
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 50
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims abstract description 41
- 239000005751 Copper oxide Substances 0.000 claims abstract description 35
- 229910000431 copper oxide Inorganic materials 0.000 claims abstract description 35
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 claims abstract description 29
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 claims abstract description 29
- 229940112669 cuprous oxide Drugs 0.000 claims abstract description 29
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 claims abstract description 20
- 239000000470 constituent Substances 0.000 claims abstract description 11
- 239000010949 copper Substances 0.000 claims description 119
- 238000007788 roughening Methods 0.000 claims description 103
- 239000011888 foil Substances 0.000 claims description 80
- 229910052802 copper Inorganic materials 0.000 claims description 58
- 239000002131 composite material Substances 0.000 claims description 21
- 150000001875 compounds Chemical class 0.000 claims description 21
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 16
- 229910000077 silane Inorganic materials 0.000 claims description 16
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- 150000001336 alkenes Chemical class 0.000 claims description 3
- 229910052743 krypton Inorganic materials 0.000 claims description 3
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 claims description 3
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims description 3
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims description 2
- PXQLVRUNWNTZOS-UHFFFAOYSA-N sulfanyl Chemical class [SH] PXQLVRUNWNTZOS-UHFFFAOYSA-N 0.000 claims description 2
- 229920002554 vinyl polymer Polymers 0.000 claims description 2
- 229920005989 resin Polymers 0.000 abstract description 41
- 239000011347 resin Substances 0.000 abstract description 41
- 239000000463 material Substances 0.000 abstract description 33
- 238000005530 etching Methods 0.000 abstract description 26
- -1 copper complex compound Chemical class 0.000 abstract description 8
- 238000004458 analytical method Methods 0.000 abstract description 2
- 238000009413 insulation Methods 0.000 abstract description 2
- VMQMZMRVKUZKQL-UHFFFAOYSA-N Cu+ Chemical compound [Cu+] VMQMZMRVKUZKQL-UHFFFAOYSA-N 0.000 abstract 2
- 239000010410 layer Substances 0.000 description 179
- 238000000034 method Methods 0.000 description 56
- 230000000052 comparative effect Effects 0.000 description 54
- 229960004643 cupric oxide Drugs 0.000 description 35
- 239000002585 base Substances 0.000 description 30
- 238000010521 absorption reaction Methods 0.000 description 28
- 230000009467 reduction Effects 0.000 description 28
- 239000000758 substrate Substances 0.000 description 27
- 230000008569 process Effects 0.000 description 26
- 239000000243 solution Substances 0.000 description 22
- 230000003647 oxidation Effects 0.000 description 21
- 238000007254 oxidation reaction Methods 0.000 description 21
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 20
- 230000006866 deterioration Effects 0.000 description 20
- 239000007864 aqueous solution Substances 0.000 description 18
- 238000012360 testing method Methods 0.000 description 16
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 15
- 239000007788 liquid Substances 0.000 description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 14
- 238000004451 qualitative analysis Methods 0.000 description 13
- 230000015572 biosynthetic process Effects 0.000 description 12
- 239000003795 chemical substances by application Substances 0.000 description 12
- 230000000694 effects Effects 0.000 description 12
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- 239000005749 Copper compound Substances 0.000 description 9
- 239000012670 alkaline solution Substances 0.000 description 9
- 150000001880 copper compounds Chemical class 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 238000011946 reduction process Methods 0.000 description 6
- 239000011342 resin composition Substances 0.000 description 6
- 238000001179 sorption measurement Methods 0.000 description 6
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 5
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 5
- 230000002265 prevention Effects 0.000 description 5
- 229910052725 zinc Inorganic materials 0.000 description 5
- 239000011701 zinc Substances 0.000 description 5
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000001000 micrograph Methods 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical group [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
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- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- OMHYGQBGFWWXJK-UHFFFAOYSA-N cyclobutane-1,2,3,4-tetracarboxylic acid;dihydrate Chemical compound O.O.OC(=O)C1C(C(O)=O)C(C(O)=O)C1C(O)=O OMHYGQBGFWWXJK-UHFFFAOYSA-N 0.000 description 3
- 238000006731 degradation reaction Methods 0.000 description 3
- 238000005238 degreasing Methods 0.000 description 3
- 238000005868 electrolysis reaction Methods 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 229910052717 sulfur Inorganic materials 0.000 description 3
- 239000002335 surface treatment layer Substances 0.000 description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 2
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 2
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000008151 electrolyte solution Substances 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 2
- 229910000368 zinc sulfate Inorganic materials 0.000 description 2
- 229960001763 zinc sulfate Drugs 0.000 description 2
- OYHQOLUKZRVURQ-NTGFUMLPSA-N (9Z,12Z)-9,10,12,13-tetratritiooctadeca-9,12-dienoic acid Chemical compound C(CCCCCCC\C(=C(/C\C(=C(/CCCCC)\[3H])\[3H])\[3H])\[3H])(=O)O OYHQOLUKZRVURQ-NTGFUMLPSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- AZUHEGMJQWJCFQ-UHFFFAOYSA-N 1,1-bis(2h-benzotriazol-4-ylmethyl)urea Chemical compound C1=CC2=NNN=C2C(CN(CC=2C3=NNN=C3C=CC=2)C(=O)N)=C1 AZUHEGMJQWJCFQ-UHFFFAOYSA-N 0.000 description 1
- WZRRRFSJFQTGGB-UHFFFAOYSA-N 1,3,5-triazinane-2,4,6-trithione Chemical compound S=C1NC(=S)NC(=S)N1 WZRRRFSJFQTGGB-UHFFFAOYSA-N 0.000 description 1
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- POYODSZSSBWJPD-UHFFFAOYSA-N 2-methylprop-2-enoyloxy 2-methylprop-2-eneperoxoate Chemical compound CC(=C)C(=O)OOOC(=O)C(C)=C POYODSZSSBWJPD-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- KFJDQPJLANOOOB-UHFFFAOYSA-N 2h-benzotriazole-4-carboxylic acid Chemical compound OC(=O)C1=CC=CC2=NNN=C12 KFJDQPJLANOOOB-UHFFFAOYSA-N 0.000 description 1
- LMPMFQXUJXPWSL-UHFFFAOYSA-N 3-(3-sulfopropyldisulfanyl)propane-1-sulfonic acid Chemical compound OS(=O)(=O)CCCSSCCCS(O)(=O)=O LMPMFQXUJXPWSL-UHFFFAOYSA-N 0.000 description 1
- KFSRINVVFGTVOA-UHFFFAOYSA-N 3-[butoxy(dimethoxy)silyl]propan-1-amine Chemical compound CCCCO[Si](OC)(OC)CCCN KFSRINVVFGTVOA-UHFFFAOYSA-N 0.000 description 1
- SBHBXEGSFJXBTA-UHFFFAOYSA-N 3-methoxysilylpropyl prop-2-enoate Chemical compound CO[SiH2]CCCOC(=O)C=C SBHBXEGSFJXBTA-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
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- PRKPGWQEKNEVEU-UHFFFAOYSA-N 4-methyl-n-(3-triethoxysilylpropyl)pentan-2-imine Chemical compound CCO[Si](OCC)(OCC)CCCN=C(C)CC(C)C PRKPGWQEKNEVEU-UHFFFAOYSA-N 0.000 description 1
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- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
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- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- 241000080590 Niso Species 0.000 description 1
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- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- NJSSICCENMLTKO-HRCBOCMUSA-N [(1r,2s,4r,5r)-3-hydroxy-4-(4-methylphenyl)sulfonyloxy-6,8-dioxabicyclo[3.2.1]octan-2-yl] 4-methylbenzenesulfonate Chemical compound C1=CC(C)=CC=C1S(=O)(=O)O[C@H]1C(O)[C@@H](OS(=O)(=O)C=2C=CC(C)=CC=2)[C@@H]2OC[C@H]1O2 NJSSICCENMLTKO-HRCBOCMUSA-N 0.000 description 1
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- DTOSIQBPPRVQHS-PDBXOOCHSA-N alpha-linolenic acid Chemical compound CC\C=C/C\C=C/C\C=C/CCCCCCCC(O)=O DTOSIQBPPRVQHS-PDBXOOCHSA-N 0.000 description 1
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- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
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- QBWCMBCROVPCKQ-UHFFFAOYSA-N chlorous acid Chemical compound OCl=O QBWCMBCROVPCKQ-UHFFFAOYSA-N 0.000 description 1
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- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- VMYXFDVIMUEKNP-UHFFFAOYSA-N trimethoxy-[5-(oxiran-2-yl)pentyl]silane Chemical compound CO[Si](OC)(OC)CCCCCC1CO1 VMYXFDVIMUEKNP-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
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Abstract
Description
表面の光沢度(Gs60°):100以上、好ましくは300以上
未処理銅箔自体の導電率:99.8%以上
未処理銅箔内の不純物濃度:100ppm以下(但し、不純物とはS、N、C、Clの総含有量をいうものとする。)
銅濃度 : 80g/L
フリー硫酸濃度 : 140g/L
ビス(3−スルホプロピル)ジスルフィド濃度 : 5mg/L
ジアリルジメチルアンモニウムクロライド重合体濃度 : 30mg/L
塩素濃度 : 25mg/L
日本電色工業株式会社製光沢計PG−1M型を用い、光沢度の測定方法であるJIS Z 8741−1997に準拠して、光沢度の測定を行った。
株式会社キーエンス レーザーマイクロスコープ VK−X100を用い、表面粗度の測定方法であるJIS B 0601−2001に準拠して、測定範囲:150μm角として、表面粗度の測定を行った。
粗化処理面の形状観察結果: この実施例で得られた銅箔の走査型電子顕微鏡観察像を図1に示す。
粗化処理面の形状観察結果: この実施例2で得られたキャリア箔付銅箔の電解銅箔層の粗化処理面の走査型電子顕微鏡観察像は、図1に示したと同様の形態を備えていた。
比較例1の銅箔は、実施例1の銅箔において、シランカップリング剤処理を省略したものであり、実施例1に記載の銅箔と対比して、シランカップリング剤処理の有無が、耐吸湿劣化性能に与える影響を確認するためのものである。従って、シランカップリング剤処理を除いて、その他の製造条件に関しては、実施例と同様であるため、重複した説明は省略し、評価結果に関してのみ以下に述べる。
粗化処理面の形状観察結果: この比較例1で得られた銅箔の走査型電子顕微鏡観察像は、図1に示したもので同様であった。
比較例2のキャリア箔付銅箔は、実施例2で用いたキャリア箔付銅箔に下記の手順で粗化処理、防錆処理、シランカップリング剤処理を施したものある。ここでは、実施例2に記載のキャリア箔付銅箔と対比して、粗化処理層の相違が耐PCT吸湿劣化率に与える影響を確認するためのものである。従って、製造条件に関しては、実施例2と異なる部分に関して述べ、重複した説明は省略する。
粗化処理面の形状観察結果: この比較例2で得られたキャリア箔付銅箔の電解銅箔層の粗化表面の走査型電子顕微鏡観察像を図4に示す。
比較例3では、実施例1と同じ電解銅箔を用いて、実施例1と同じ予備処理を施し、実施例の粗化処理に代えて、黒化処理及び還元処理を施し比較試料3を得た。以下、黒化処理及び還元処理について説明する。
実施例1と比較例1との対比: この実施例1と比較例1との対比は、シランカップリング剤処理の効果を確認するためのものである。実施例1と比較例1との評価結果を、以下の表1に示す。
Claims (7)
- 酸化銅及び亜酸化銅を含有する銅複合化合物からなる針状又は板状の凸状部より形成された微細凹凸構造を有する平均厚さが100nm以上400nm以下の粗化処理層と、当該粗化処理層の表面にシランカップリング剤処理層とを少なくとも一面に備え、
X線光電子分光分析法により前記粗化処理層の構成元素を分析したときに得られるCu(I)のピーク面積とCu(II)のピーク面積との合計面積に対して、Cu(I)のピーク面積が占める割合が50%以上99%以下であることを特徴とする銅箔。 - 走査型電子顕微鏡を用いて、傾斜角45°、50000倍以上の倍率で前記粗化処理層の表面を観察したときに、互いに隣接する凸状部のうち、他の凸状部と分離観察可能な先端部分の長さが250nm以下である請求項1に記載の銅箔。
- 前記粗化処理層の表面にクリプトンを吸着して測定した比表面積が0.035m2/g以上である請求項1又は請求項2に記載の銅箔。
- 前記シランカップリング剤処理層は、オレフィン官能性シラン、エポキシ官能性シラン、ビニル官能性シラン、アクリル官能性シラン、アミノ官能性シラン及びメルカプト官能性シランのいずれかを用いて形成したものである請求項1〜請求項3のいずれか一項に記載の銅箔。
- 当該銅箔の前記粗化処理層側の表面のL*a*b*表色系における明度L*の値が25以下である請求項1〜請求項4のいずれか一項に記載の銅箔。
- 請求項1〜請求項5のいずれか一項に記載の銅箔の片面に接合界面層を介してキャリア箔を備えたことを特徴とするキャリア箔付銅箔。
- 請求項1〜請求項5のいずれか一項に記載の銅箔を備えたことを特徴とする銅張積層板。
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JP6806405B1 (ja) * | 2020-04-27 | 2021-01-06 | ナミックス株式会社 | 複合銅部材 |
WO2021220524A1 (ja) * | 2020-04-27 | 2021-11-04 | ナミックス株式会社 | 複合銅部材 |
EP4057782A1 (en) * | 2021-03-12 | 2022-09-14 | Atotech Deutschland GmbH & Co. KG | Method for increasing adhesion strength between copper and an organic material and reducing halo and wedge void formation by modifying the copper surface and/or by using heteroaromatic silane compounds |
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WO2017149810A1 (ja) * | 2016-02-29 | 2017-09-08 | 三井金属鉱業株式会社 | キャリア付銅箔及びその製造方法、並びに配線層付コアレス支持体及びプリント配線板の製造方法 |
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JP6178035B1 (ja) * | 2016-03-03 | 2017-08-09 | 三井金属鉱業株式会社 | 銅張積層板の製造方法 |
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JPWO2015040998A1 (ja) | 2017-03-02 |
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MY182166A (en) | 2021-01-18 |
KR20160060046A (ko) | 2016-05-27 |
TW201524279A (zh) | 2015-06-16 |
KR101920976B1 (ko) | 2018-11-21 |
JP6283664B2 (ja) | 2018-02-21 |
TWI587757B (zh) | 2017-06-11 |
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