JP2013536592A - 全般照明用の固体光シートまたはストリップ - Google Patents
全般照明用の固体光シートまたはストリップ Download PDFInfo
- Publication number
- JP2013536592A JP2013536592A JP2013527135A JP2013527135A JP2013536592A JP 2013536592 A JP2013536592 A JP 2013536592A JP 2013527135 A JP2013527135 A JP 2013527135A JP 2013527135 A JP2013527135 A JP 2013527135A JP 2013536592 A JP2013536592 A JP 2013536592A
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- JP
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- Prior art keywords
- substrate
- die
- conductor
- led
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/813—Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
- F21S8/04—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures
- F21S8/06—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures by suspension
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
- F21Y2107/90—Light sources with three-dimensionally disposed light-generating elements on two opposite sides of supports or substrates
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0364—Manufacture or treatment of packages of interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0365—Manufacture or treatment of packages of means for heat extraction or cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8515—Wavelength conversion means not being in contact with the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Applications Claiming Priority (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/870,760 | 2010-08-27 | ||
| US12/870,760 US8338199B2 (en) | 2010-08-27 | 2010-08-27 | Solid state light sheet for general illumination |
| US12/917,319 US8210716B2 (en) | 2010-08-27 | 2010-11-01 | Solid state bidirectional light sheet for general illumination |
| US12/917,319 | 2010-11-01 | ||
| US13/018,330 US8461602B2 (en) | 2010-08-27 | 2011-01-31 | Solid state light sheet using thin LEDs for general illumination |
| US13/018,330 | 2011-01-31 | ||
| US13/044,456 | 2011-03-09 | ||
| US13/044,456 US8198109B2 (en) | 2010-08-27 | 2011-03-09 | Manufacturing methods for solid state light sheet or strip with LEDs connected in series for general illumination |
| PCT/US2011/049233 WO2012027616A2 (en) | 2010-08-27 | 2011-08-25 | Solid state light sheet or strip for general illumination |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013536592A true JP2013536592A (ja) | 2013-09-19 |
| JP2013536592A5 JP2013536592A5 (enExample) | 2014-10-09 |
Family
ID=44352981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013527135A Pending JP2013536592A (ja) | 2010-08-27 | 2011-08-25 | 全般照明用の固体光シートまたはストリップ |
Country Status (6)
| Country | Link |
|---|---|
| US (13) | US8198109B2 (enExample) |
| EP (2) | EP2609624B1 (enExample) |
| JP (1) | JP2013536592A (enExample) |
| KR (1) | KR20140031832A (enExample) |
| CN (2) | CN103210490B (enExample) |
| WO (1) | WO2012027616A2 (enExample) |
Cited By (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015513213A (ja) * | 2012-02-02 | 2015-04-30 | ザ プロクター アンド ギャンブルカンパニー | 二方向性光シート |
| JP2015095488A (ja) * | 2013-11-08 | 2015-05-18 | シチズン電子株式会社 | Led照明装置 |
| JP2015109331A (ja) * | 2013-12-04 | 2015-06-11 | シャープ株式会社 | 窒化物半導体発光装置 |
| WO2015146115A1 (ja) * | 2014-03-25 | 2015-10-01 | 東芝ホクト電子株式会社 | 発光装置 |
| JP2016115934A (ja) * | 2014-12-11 | 2016-06-23 | シチズン電子株式会社 | 発光装置及び発光装置の製造方法 |
| JP2016171199A (ja) * | 2015-03-12 | 2016-09-23 | イビデン株式会社 | 発光素子搭載基板 |
| JP2016178307A (ja) * | 2015-03-20 | 2016-10-06 | コミサリア ア エナジー アトミック エ オックス エナジーズ オルタネティヴ | 発光ダイオードを備えた光電子デバイス |
| JP2017507493A (ja) * | 2014-03-04 | 2017-03-16 | エムシー10 インコーポレイテッドMc10,Inc. | 電子デバイス用の可撓性を有するマルチパート封止ハウジング |
| JP2017092092A (ja) * | 2015-11-04 | 2017-05-25 | 豊田合成株式会社 | 発光装置の製造方法 |
| JP2017092199A (ja) * | 2015-11-09 | 2017-05-25 | 三菱電機株式会社 | 半導体レーザーおよびその製造方法 |
| JP2017123393A (ja) * | 2016-01-07 | 2017-07-13 | 日亜化学工業株式会社 | 発光装置の製造方法 |
| KR20170100999A (ko) * | 2016-02-26 | 2017-09-05 | 삼성전자주식회사 | 멀티 컬러를 구현할 수 있는 발광 소자 |
| JP2017201666A (ja) * | 2016-05-06 | 2017-11-09 | 日亜化学工業株式会社 | 発光装置の製造方法 |
| JP2018049981A (ja) * | 2016-09-23 | 2018-03-29 | スタンレー電気株式会社 | 半導体発光装置、および、その製造方法 |
| JP2018107257A (ja) * | 2016-12-26 | 2018-07-05 | 日亜化学工業株式会社 | 発光装置 |
| US10447347B2 (en) | 2016-08-12 | 2019-10-15 | Mc10, Inc. | Wireless charger and high speed data off-loader |
| JP2019530249A (ja) * | 2016-09-30 | 2019-10-17 | フォルシュングスフェアブント ベルリン エー ファウForschungsverbund Berlin e.V. | 光パルス発生器及び光パルス発生器の操作方法 |
| JP2019212879A (ja) * | 2018-06-06 | 2019-12-12 | 海華科技股▲分▼有限公司 | フリップチップ型発光モジュール |
| US10567152B2 (en) | 2016-02-22 | 2020-02-18 | Mc10, Inc. | System, devices, and method for on-body data and power transmission |
| KR20200018365A (ko) * | 2014-03-06 | 2020-02-19 | 에피스타 코포레이션 | 발광 소자 |
| JP2020113799A (ja) * | 2020-04-22 | 2020-07-27 | 日亜化学工業株式会社 | 発光装置 |
| JP2020205355A (ja) * | 2019-06-18 | 2020-12-24 | スタンレー電気株式会社 | 発光装置 |
| US10986465B2 (en) | 2015-02-20 | 2021-04-20 | Medidata Solutions, Inc. | Automated detection and configuration of wearable devices based on on-body status, location, and/or orientation |
| JP2022158612A (ja) * | 2021-04-02 | 2022-10-17 | 株式会社ジャパンディスプレイ | 電子部品の実装方法、表示装置、及び、回路基板 |
| WO2023176205A1 (ja) * | 2022-03-17 | 2023-09-21 | 日亜化学工業株式会社 | 発光装置 |
| US11992326B2 (en) | 2016-04-19 | 2024-05-28 | Medidata Solutions, Inc. | Method and system for measuring perspiration |
| JP2024136273A (ja) * | 2023-03-23 | 2024-10-04 | 日亜化学工業株式会社 | 光源及び発光モジュール |
Families Citing this family (274)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100880638B1 (ko) * | 2007-07-06 | 2009-01-30 | 엘지전자 주식회사 | 발광 소자 패키지 |
| US20120037886A1 (en) | 2007-11-13 | 2012-02-16 | Epistar Corporation | Light-emitting diode device |
| US9545216B2 (en) | 2011-08-05 | 2017-01-17 | Mc10, Inc. | Catheter balloon methods and apparatus employing sensing elements |
| US8097926B2 (en) | 2008-10-07 | 2012-01-17 | Mc10, Inc. | Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy |
| US9123614B2 (en) | 2008-10-07 | 2015-09-01 | Mc10, Inc. | Methods and applications of non-planar imaging arrays |
| EP2349440B1 (en) | 2008-10-07 | 2019-08-21 | Mc10, Inc. | Catheter balloon having stretchable integrated circuitry and sensor array |
| US8389862B2 (en) | 2008-10-07 | 2013-03-05 | Mc10, Inc. | Extremely stretchable electronics |
| JP5593620B2 (ja) * | 2009-03-05 | 2014-09-24 | セイコーエプソン株式会社 | 照明装置および表示装置 |
| US8314433B2 (en) * | 2009-03-19 | 2012-11-20 | Cid Technologies Llc | Flexible thermal energy dissipating and light emitting diode mounting arrangement |
| US8384114B2 (en) | 2009-06-27 | 2013-02-26 | Cooledge Lighting Inc. | High efficiency LEDs and LED lamps |
| WO2011041727A1 (en) | 2009-10-01 | 2011-04-07 | Mc10, Inc. | Protective cases with integrated electronics |
| US9480133B2 (en) | 2010-01-04 | 2016-10-25 | Cooledge Lighting Inc. | Light-emitting element repair in array-based lighting devices |
| US8653539B2 (en) | 2010-01-04 | 2014-02-18 | Cooledge Lighting, Inc. | Failure mitigation in arrays of light-emitting devices |
| CN102959708B (zh) | 2010-06-29 | 2016-05-04 | 柯立芝照明有限公司 | 具有易弯曲基板的电子装置 |
| US10037947B1 (en) * | 2010-06-29 | 2018-07-31 | Cooledge Lighting Inc. | Electronic devices with yielding substrates |
| US8198109B2 (en) * | 2010-08-27 | 2012-06-12 | Quarkstar Llc | Manufacturing methods for solid state light sheet or strip with LEDs connected in series for general illumination |
| JP2012069589A (ja) * | 2010-09-21 | 2012-04-05 | Toshiba Corp | 発光装置 |
| TWI446578B (zh) * | 2010-09-23 | 2014-07-21 | Epistar Corp | 發光元件及其製法 |
| TWI446590B (zh) * | 2010-09-30 | 2014-07-21 | 億光電子工業股份有限公司 | 發光二極體封裝結構及其製作方法 |
| CN102456801A (zh) * | 2010-10-20 | 2012-05-16 | 展晶科技(深圳)有限公司 | 发光二极管封装结构 |
| GB2484713A (en) * | 2010-10-21 | 2012-04-25 | Optovate Ltd | Illumination apparatus |
| US9570666B2 (en) * | 2011-01-29 | 2017-02-14 | Gerald Ho Kim | Silicon-based cooling package for light-emitting devices |
| US8770823B2 (en) * | 2011-01-29 | 2014-07-08 | Gerald Ho Kim | Silicon-based cooling package for light-emitting devices |
| WO2012166686A2 (en) | 2011-05-27 | 2012-12-06 | Mc10, Inc. | Electronic, optical and/or mechanical apparatus and systems and methods for fabricating same |
| JP5823033B2 (ja) * | 2011-06-15 | 2015-11-25 | 長塚 康弘 | フレキシブル回路アセンブリおよびその方法 |
| US8789970B2 (en) * | 2011-07-05 | 2014-07-29 | Lunera Lighting, Inc. | Color compensation in LED luminaires |
| DE102011078811B3 (de) * | 2011-07-07 | 2012-05-24 | Semikron Elektronik Gmbh & Co. Kg | Leistungselektronisches System mit einer Kühleinrichtung |
| US8754424B2 (en) | 2011-08-29 | 2014-06-17 | Micron Technology, Inc. | Discontinuous patterned bonds for semiconductor devices and associated systems and methods |
| US8410508B1 (en) * | 2011-09-12 | 2013-04-02 | SemiLEDs Optoelectronics Co., Ltd. | Light emitting diode (LED) package having wavelength conversion member and wafer level fabrication method |
| DE102011084949B4 (de) * | 2011-10-21 | 2016-03-31 | Osram Gmbh | Konverteranordnung, Verfahren zum Herstellen der Konverteranordnung und Beleuchtungsanordnung |
| US8851731B2 (en) * | 2011-10-24 | 2014-10-07 | Ningbo Baishi Electric Co., Ltd | Light-diffusion LED lamp |
| KR101902392B1 (ko) * | 2011-10-26 | 2018-10-01 | 엘지이노텍 주식회사 | 발광 소자 |
| TWI508332B (zh) * | 2011-11-09 | 2015-11-11 | 友達光電股份有限公司 | 發光光源及其顯示面板 |
| US20140306250A1 (en) * | 2011-12-01 | 2014-10-16 | Quarkstar Llc | Solid-state lighting device and method of manufacturing same |
| TW201323218A (zh) * | 2011-12-06 | 2013-06-16 | Shuai-Long Chen | 導電化學強化玻璃製造一體成型背光模組及其製造方法 |
| US9194124B2 (en) | 2011-12-09 | 2015-11-24 | 3M Innovative Properties Company | Acoustic light panel |
| US8796724B2 (en) | 2011-12-20 | 2014-08-05 | Todd W Hodrinsky | Light emitting systems and methods |
| WO2013112435A1 (en) | 2012-01-24 | 2013-08-01 | Cooledge Lighting Inc. | Light - emitting devices having discrete phosphor chips and fabrication methods |
| US8907362B2 (en) | 2012-01-24 | 2014-12-09 | Cooledge Lighting Inc. | Light-emitting dies incorporating wavelength-conversion materials and related methods |
| US8896010B2 (en) | 2012-01-24 | 2014-11-25 | Cooledge Lighting Inc. | Wafer-level flip chip device packages and related methods |
| EP2810301A1 (en) * | 2012-02-02 | 2014-12-10 | The Procter and Gamble Company | Light emitting laminate and method of making thereof |
| KR101847941B1 (ko) * | 2012-02-08 | 2018-04-11 | 삼성전자주식회사 | 반도체 발광소자 및 그 제조방법 |
| US9117991B1 (en) * | 2012-02-10 | 2015-08-25 | Flextronics Ap, Llc | Use of flexible circuits incorporating a heat spreading layer and the rigidizing specific areas within such a construction by creating stiffening structures within said circuits by either folding, bending, forming or combinations thereof |
| US8803185B2 (en) * | 2012-02-21 | 2014-08-12 | Peiching Ling | Light emitting diode package and method of fabricating the same |
| TWI523269B (zh) * | 2012-03-30 | 2016-02-21 | 晶元光電股份有限公司 | 發光元件 |
| DE102012209325B4 (de) * | 2012-06-01 | 2021-09-30 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Modul |
| DE102012025896B4 (de) * | 2012-06-01 | 2024-10-10 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Modul |
| US9231178B2 (en) | 2012-06-07 | 2016-01-05 | Cooledge Lighting, Inc. | Wafer-level flip chip device packages and related methods |
| US9226402B2 (en) | 2012-06-11 | 2015-12-29 | Mc10, Inc. | Strain isolation structures for stretchable electronics |
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Also Published As
| Publication number | Publication date |
|---|---|
| US8198109B2 (en) | 2012-06-12 |
| US20200194620A1 (en) | 2020-06-18 |
| US20110193105A1 (en) | 2011-08-11 |
| US11189753B2 (en) | 2021-11-30 |
| US8338840B2 (en) | 2012-12-25 |
| CN107301992B (zh) | 2020-06-19 |
| US20110198631A1 (en) | 2011-08-18 |
| CN103210490B (zh) | 2017-08-08 |
| US20160161064A1 (en) | 2016-06-09 |
| US8242518B2 (en) | 2012-08-14 |
| US20110193106A1 (en) | 2011-08-11 |
| US20130214300A1 (en) | 2013-08-22 |
| KR20140031832A (ko) | 2014-03-13 |
| CN103210490A (zh) | 2013-07-17 |
| EP2609624B1 (en) | 2019-06-12 |
| EP2609624A2 (en) | 2013-07-03 |
| US8338842B2 (en) | 2012-12-25 |
| EP3618112A1 (en) | 2020-03-04 |
| US20110204391A1 (en) | 2011-08-25 |
| US8344397B2 (en) | 2013-01-01 |
| CN107301992A (zh) | 2017-10-27 |
| US20110204390A1 (en) | 2011-08-25 |
| US8338841B2 (en) | 2012-12-25 |
| US20240243224A1 (en) | 2024-07-18 |
| US20110193114A1 (en) | 2011-08-11 |
| US8338839B2 (en) | 2012-12-25 |
| US20110198632A1 (en) | 2011-08-18 |
| WO2012027616A3 (en) | 2012-04-26 |
| US20220336698A1 (en) | 2022-10-20 |
| US20190027646A1 (en) | 2019-01-24 |
| WO2012027616A2 (en) | 2012-03-01 |
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