WO2020233873A1 - Beleuchtungsanordnung, lichtführungsanordnung und verfahren - Google Patents
Beleuchtungsanordnung, lichtführungsanordnung und verfahren Download PDFInfo
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- WO2020233873A1 WO2020233873A1 PCT/EP2020/058549 EP2020058549W WO2020233873A1 WO 2020233873 A1 WO2020233873 A1 WO 2020233873A1 EP 2020058549 W EP2020058549 W EP 2020058549W WO 2020233873 A1 WO2020233873 A1 WO 2020233873A1
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- 230000003287 optical effect Effects 0.000 claims abstract description 60
- 230000005693 optoelectronics Effects 0.000 claims abstract description 38
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/16—Optical objectives specially designed for the purposes specified below for use in conjunction with image converters or intensifiers, or for use with projectors, e.g. objectives for projection TV
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/20—Lamp housings
- G03B21/2006—Lamp housings characterised by the light source
- G03B21/2033—LED or laser light sources
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/01—Head-up displays
- G02B27/0101—Head-up displays characterised by optical features
- G02B27/0103—Head-up displays characterised by optical features comprising holographic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/30—Collimators
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/147—Optical correction of image distortions, e.g. keystone
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/20—Lamp housings
- G03B21/2006—Lamp housings characterised by the light source
- G03B21/2013—Plural light sources
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/20—Lamp housings
- G03B21/2046—Positional adjustment of light sources
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/01—Head-up displays
- G02B27/0101—Head-up displays characterised by optical features
- G02B27/0103—Head-up displays characterised by optical features comprising holographic elements
- G02B2027/0105—Holograms with particular structures
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/01—Head-up displays
- G02B27/0101—Head-up displays characterised by optical features
- G02B2027/011—Head-up displays characterised by optical features comprising device for correcting geometrical aberrations, distortion
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/01—Head-up displays
- G02B27/0101—Head-up displays characterised by optical features
- G02B2027/0112—Head-up displays characterised by optical features comprising device for genereting colour display
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0756—Stacked arrangements of devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Definitions
- the invention relates to a lighting arrangement with a light-emitting optoelectronic element and a light guide arrangement with a display device.
- the invention also relates to a method.
- the light generated by a display device still has to be guided and decoupled in a suitable manner in order to achieve the desired effect.
- the ever larger displays for example in displays or TV sets, depending on the position of the user, lead to different viewing angles that can falsify colors and contrast.
- the generated light beam should be ready collimated so that it can be appropriately coupled into other devices.
- a concept is therefore presented that is based on a curved emission surface, a foveated display.
- a slight aberration should be achieved.
- the starting point of the concept is a lighting arrangement with a light-emitting optoelectronic element and an optical device for beam conversion of the electromagnetic radiation generated by the light-emitting optoelectronic element, the optoelectronic element comprising several emission areas arranged in matrix form and each emission area being assigned a main beam direction.
- the optical device following the light-emitting optoelectronic element in the beam path can be designed in a simplified manner if at least some and preferably all of the emission areas of the light-emitting optoelectronic element are arranged in such a way that their centers lie on a curved surface. In one aspect, this can be achieved with a concave curved surface.
- the center of an emission area is understood to mean the intersection of the main beam direction with the surface of the emission areas that emits electromagnetic radiation.
- the curved surface forms a spherical segment, the associated sphere center point of which lies on the optical axis of the optical device.
- the center of the sphere is in the direction of the beam passage at a distance from the light-emitting optoelectronic element.
- the curved surface is a rotating conic section, for example an ellipsoid, paraboloid or hyperboloid.
- adjacent emission areas are tilted relative to one another so that the main beam directions of the emission areas are at an angle to one another.
- the optical device form a system optics, in particular an imaging projection optics.
- the arrangement of the emission areas enables improved compensation of the field curvature of the system optics.
- the mapping in the projection optics can be simplified.
- each individual emission area forms a separate Lambert radiator.
- the emission areas are very small and have maximum edge lengths in the range from 100 pm to 500 pm, in particular in the range from 150 pm to 300 pm.
- at least one of the emission regions is formed by the aperture of a primary optical element assigned to an optoelectronic component or an LED or a converter element assigned to an LED.
- the emission regions can already comprise collimating elements, for example in the form of a photonic structure.
- the emission areas, the centers of which lie on a curved surface can be part of a monolithic pixelated optochip or they are created in several separate optochips arranged on a non-planar IC substrate.
- projection units A large number of different projection units are known from the prior art, with which images can be displayed as required in specifically defined image planes. Such projection units are used in various applications, for example in motor vehicles. In these applications of projection units, enlarged images are regularly displayed at a distance from the viewer. In some cases, the projection optics can also take on the function of a magnifying glass or other magnifying optics, so that the display device is enlarged in the beam path in front of the projection optics.
- display devices for motor vehicles are known from EP 1 544 660 and DE 197 51 649 A1.
- an intermediate image is used on a ground glass in order to display the image correctly on the windshield for the driver using additional optics.
- other projection units are known whose pixels emit light which is mixed from light of different colors.
- light is generated spatially separated and then mixed by suitable optical elements, such as an achromatic lens, and combined to form a beam.
- suitable optical elements such as an achromatic lens
- the optoelectronic lighting device having a matrix with pixels for the emission of visible light.
- Each pixel comprises several optoelectronic components or LEDs with spectrally different light emission, so that differently colored subpixels are formed.
- the matrix of pixels includes one or more LED modules.
- Various measures such as a transparent cover electrode, a photonic structure or the like can be provided in order to improve the coupling-out and directionality.
- the matrix can be formed by pixel modules (each with three subpixels) which are attached to a carrier substrate.
- the carrier substrate can contain supply lines and control circuits and be manufactured in a material system that differs from the matrix.
- a separate collimation optics is assigned to each pixel, which is connected in front of the projection optics to increase the fill factor.
- the collimation optics is designed such that enlarged and superimposed intermediate images of the LEDs of the respective pixel are generated in the beam path in front of the projection optics.
- the collimation optics assigned to each individual pixel not only increase the degree of illumination of a pixel, but also enable a location correction of the radiation of the subpixel forming LEDs by superimposing the subpixel intermediate images as precisely as possible, which enables light to be efficiently coupled into the projection optics downstream in the beam path. It should be mentioned at this point that such an optics would be suitable for the concepts presented here, some of which are Provide redundant subpixel elements.
- a configuration of the collimation optics that leads to the highest possible degree of overlap of the intermediate images of the LEDs that belong to the same pixel is expedient.
- An overlap of the intermediate images of the LEDs of a pixel of at least 85% and further of at least 95% of their intermediate image area has proven to be suitable.
- an embodiment is preferred for which the intermediate images of the LEDs are virtual intermediate pictures are.
- the collimation optics create a virtual image of the subpixels so that the size of the virtual image of a subpixel corresponds to the size of the pixel.
- the collimation optics are preferably arranged between the LEDs of a pixel and the projection optics.
- the LEDs emitting light with different colors can occupy the same size area of the pixel or the areas occupied by the subpixels are adapted to the light emission and of different sizes.
- the subpixel that emits green light occupies the largest surface area of the pixel in comparison to the two other subpixels or that green light is at least emitted over a larger surface area. This is due to the fact that the eye is most sensitive to the green color.
- it is useful if the surface area of an RGB pixel occupied by sub-pixels for red light is larger than the surface area occupied by sub-pixels emitting blue light.
- green light is emitted over a larger surface area of the pixel than red light
- red light in turn is emitted over a larger surface area of the pixel than blue light.
- small-sized LEDs are used, so that large surface areas which do not emit light are present in the individual pixels. It is preferred that the semiconductor lighting devices of a pixel occupy no more than 30% and particularly preferably no more than 15%, very particularly preferably no more than 10% of the pixel area. This ensures that optical and electrical crosstalk between the individual pixels is prevented.
- the subpixels are preferably arranged in such a way that they do not lie directly on the edge of a pixel and do not adjoin one another.
- the term LEDs also includes color-converted LEDs or VCSELs with an edge length of this type, or LEDs illuminated optical fiber end pieces.
- the collimation optics assigned to each pixel offers the advantage that the light emitted by the subpixels is converted into a pre-collimated beam, which is then advantageously available for generating an image by at least one further optical element.
- pre-collimated light beams can be generated, so that optical crosstalk between the individual light beams emitted by the subpixels is again prevented or at least reduced.
- the collimation optics have at least one holographic optical element (HOE) that compensates for the different positions of the three semiconductor lighting devices on the area of the pixel.
- HOE holographic optical element
- ROE refractive optical element
- DOE diffractive optical element
- the projection unit is developed further.
- it comprises projection optics which are arranged downstream of the collimation optics in the beam path.
- an image or another intermediate image is generated from the individual intermediate images that were generated with the aid of the collimation optics, which is used directly or in a further processed form to display the desired information to the viewer.
- the projection optics has using suitable optical elements, such as deflection mirrors, beam splitters and / or lenses, which can preferably be controlled by a control unit and moved in a targeted manner in order to effect beam steering and / or beam shaping as required, so that information is available in an easily understandable and perceptible form a display, on a matt screen and / or as a virtual image, for example in front of the windshield of a motor vehicle.
- suitable optical elements such as deflection mirrors, beam splitters and / or lenses
- a proposed projection unit can be used to generate an image for a head-up display in a motor vehicle.
- Figure 1 shows a first embodiment of a lighting concept of a curved light surface according to some aspects of the proposed concept
- FIG. 2 shows an enlarged partial view for the embodiment example of the light guide concept with separate LEDs on a non-planar IC substrate;
- FIG. 3 represents a third embodiment of a light guide with a monolithic pixelated chip according to further visual points
- FIG. 4 shows a fourth exemplary embodiment of a light guide with some aspects
- FIG. 5 is a further development of one of the above embodiments according to some aspects of the concept presented;
- FIG. 6 is a further embodiment of the example of Figure 2, with additional light-shaping structures;
- FIG. 7 is a supplement to the configuration of FIG. 5, a photonic structure being arranged here in the beam path;
- FIG. 8A shows a further embodiment based on the example for FIG. 4;
- FIG. 8B illustrates a top view of an embodiment of a step-shaped substrate
- FIG. 9A shows a matrix with RGB pixels which has a high fill factor
- FIG. 9B is a schematic representation of the beam guidance in a conventional projection unit
- FIG. 10 shows an embodiment of an implemented matrix with RGB pixels which has a small fill factor according to some aspects of the proposed concept
- FIG. 11 shows a further exemplary embodiment of an implemented matrix with RGB pixels which has a small fill factor in accordance with some aspects
- FIG. 12 illustrates a plan view of an embodiment of a matrix with a light-shaping structure arranged thereon
- FIG. 13 shows a schematic representation of a projection unit according to some aspects of the proposed principle
- FIG. 14 shows, as a schematic illustration, the generation of an intermediate image by the projection unit of the previous figure
- FIG. 15 shows the chromatic phase function of the collimation optics of FIG. 13
- FIG. 16 shows a metal lens of the collimation optics according to some embodiments of the proposed concept
- FIG. 17 shows a schematic side view of a monolithic array with several integrated LEDs for explaining some aspects of the proposed concept
- FIG. 1 shows an exemplary embodiment of a light guide in which a suitable beam guide is achieved by means of a foveated display.
- a lighting arrangement is proposed, for example a display device or a display, which comprises a light-emitting optoelectronic element 1 and an optical device 6 for beam conversion or for beam shaping of the electromagnetic radiation generated by the light-emitting optoelectronic arrangement 1.
- a light-emitting optoelectronic arrangement 1 comprises a multiplicity of LEDs which, during operation, emit light of one color.
- the light-emitting optoelectronic arrangement 1 is designed so that the LEDs emit different colors. As sub-pixels, three LEDs form part of an entire pixel. In one embodiment, the light-emitting optoelectronic arrangement thus contains a large number of such pixels.
- the optical device 6 represents a system optics 19 in the form of an imaging projection optics 20 and comprises a plane-parallel lens 21 and a first aspherical lens 22 and a second aspherical lens in succession in the beam path 23, which realize an image of the light-emitting optoelectronic arrangement 1.
- FIG. 1 shows that the light-emitting opto-electronic arrangement 1 comprises several emission regions 3.1, 3.2 arranged in matrix form. These each have one or more LEDs (for different colors).
- the LEDs can already include primary optics 12. These primary optics can contain converter elements, decoupling structures or photonic crystals in order to achieve a certain beam shaping as soon as the light emerges.
- a main beam direction 4.1 and 4.2 is assigned to each of the emission areas 3.1, 3.2.
- the center points 7 of the emission areas 3.1, 3.2 are arranged on a curved surface 5, which for the present exemplary embodiment has a spherical segment 24 with an assigned spherical center point 30 on the optical axis 10 of the optical device 6 forms.
- a radius R of 10 mm is selected for the curved surface 5 for the arrangement of the emission areas 3.1, 3.2 and for the plane-parallel lens 21 following in the beam path of the optical device Device 6, a material with a refractive index of at least 1.6 and a thickness in the direction of the optical axis 10 of at least twice the diameter D are used.
- FIG. 2 shows an enlarged partial view for an exemplary embodiment of the lighting arrangement with a light-emitting optoelectronic arrangement 1 which has a plurality of emission regions
- Each of the emission areas 3.1 - 3.5 forms a Lambert radiator 11 to which a main beam direction 4.1-4.5 is assigned, whereby due to the non-planar IC substrate in the form of a spherical segment 24 facing the optical device 6, the main beam directions 4.1-4.5 have a common point of intersection on the optical axis 10 of the have optical device 6.
- the Lambertian emission of the emission areas 3.1-3.5 can be transformed into a non-Lambertian emission, in particular into an emission with a narrower opening angle, by primary optics elements 12 (see FIG. 249).
- FIG. 3 shows an alternative embodiment in an enlarged partial view, with an optical device 6 shown only in section.
- a monolithically pixelated optochip 14 Arranged on the flat IC substrate 28 is a monolithically pixelated optochip 14, which has a light-emitting optoelectronic arrangement 1 produced in a joint process with a plurality of emission regions 3.1-3.5 lying on a concavely curved surface 5 of an area 15 of the chip 14, which are each formed by a converter element 13.
- the main emission directions 4.1-4.5 of the emission areas 3.1-3.5 are at an angle to one another and intersect on the optical axis 10 of the optical device 6.
- FIG. 4 shows a fourth exemplary embodiment of a lighting device with a light-emitting optical arrangement 1, comprising a stepped IC substrate 29.
- a stepped IC substrate 29 On concentrically arranged annular surfaces 8.1, 8.2, 8.3 of the stepped IC substrate 29 are separate optochips 17.1-17.5, which are formed by LEDs 11, arranged so that the center points 7 of the emission areas 3.1-3.5 formed by primary optics elements 12 of the respective LEDs 11 on a concavely curved surface 5, while the main beam directions 4.1-4.5 of the emission area 3.1-3.5 have a matching orientation.
- the distances between the separate optochips 17.1-17.5 and the plane-parallel lens 21 of the optical device 6 and thus the beam cross-section in the widening beam path in front of the optical device 6 differ if there is an arrangement on different ring planes 8.1-8.3.
- Figure 5 shows a further development of the invention based on the variant shown in Figure 4, in addition, between the arranged on a concavely curved surface 5 centers 7 of the emission areas 3.1-3.5 and the plane-parallel lens 21 of the optical device 6, a likewise concave curved collimating Optical element 18 is arranged.
- the collimating optical element 18 comprises a curved pinhole 26 and a ge curved lens arrangement 27, which bil a radiation angle filter.
- the functional components of the collimating optical element 18 can be assigned to individual or multiple emission areas 3.1-3.5.
- each functional component of the collimating optical element 18 is used for precollimation of several emission areas 3.1-3.5 which belong to a pixel and which emit different colors.
- FIG. 6 shows an addition to the shape that the optochips 17.1 to 17.5 are designed as LED arrangements with an additional light-shaping structure on the top of the emission surface. This improves light guidance and changes the radiation characteristics of the individual optochips.
- the light-shaping structure which is designed, for example, as a photonic crystal in a semiconductor material of the optochip, results in a higher directionality of the emitted light.
- the light-shaping structure can be formed in various ways.
- the configuration in FIG. 7 is based on the example in FIG. 4. Here too a light-shaping structure is formed, the width of which, however, varies and follows the shape or the surface of the body 1.
- Figures 8A and 8B show a further embodiment in cross-sectional representation and plan view.
- the stepped substrate comprising rectangular stepped surfaces
- the individual optoelectronic components or light-emitting diodes are designed as horizontal diodes, i.e. they have their two contacts on one side. This is indicated in FIG. 8B by the two different areas (white and hatched).
- several light diodes are provided, some of which are arranged here on the substrate.
- FIG. 9A illustrates a plan view of an RGB emitter array according to the prior art with an optoelectronic lighting device 1 which is designed as a matrix with RGB pixels 40 which emit red, green or blue light.
- the RGB pixels 40 are characterized by a high fill factor. This means that a large part of the area 5 of the individual RGB pixels 40 is used as a light-emitting area.
- FIG. 9B shows, by way of example, the beam guidance that is present in projection units with projection optics 7 in a schematic representation.
- the projection optics 7 include all 3 lenses shown in FIG. 9B, including the lens or plate 52. It can be seen that the radiation emitted by the individual RGB pixels 40 is not collimated. As shown in FIG.
- FIG. 10 shows a schematically simplified plan view of an optoelectronic lighting device 1 with a proposed RGB emitter array implemented according to some aspects disclosed here with six pixels, the associated pixel area 5 being provided for the pixel 2.1, which is provided with reference characters as an example.
- the pixel 2.1 comprises separately applied LEDs 3.1, 3.2, 3.3, which form subpixels, which are designed as LEDs and which emit red, green and blue light for the exemplary embodiment shown.
- the individual pixels 2.1 are characterized by a small fill factor, so that only a comparatively small part of the pixel area 5 is occupied by the LEDs 3.1, 3.2, 3.3.
- the LEDs 3.1, 3.2, 3.3 are arranged in such a way that a comparatively large distance is formed between the individual light-emitting surfaces of the subpixels.
- the LEDs 3.1, 3.2, 3.3 or the LEDs are arranged at a distance from the edge of the pixels 2.1, so that there is no optical and / or electrical crosstalk between neighboring pixels 2.1.
- the LEDs 3.1, 3.2, 3.3 are arranged within the individual pixels 2.1 in such a way that optical and electrical crosstalk between the individual semiconductor lighting devices 3.1, 3.2, 3.3 of a pixel 2.1 can be prevented or at least minimized.
- a reflective elevation 2.4 can be configured.
- a transparent cover electrode can also be attached. This application discloses information about this.
- FIG. 11 shows a plan view of a matrix formed from RGB pixels, which an optoelectronic lighting device 1 of a proposed projection unit forms.
- a pixel area 5 of the pixel 2.2 is shown in dashed lines.
- the pixel 2.2 includes three subpixel forming semiconductor lighting devices 3.1, 3.2, 3.3, which emit red, green or blue light and which are arranged in the form of a triangular arrangement on the surface 5 of the pixel 2.2, this embodiment can also be surrounded with a reflective layer.
- FIG. 12 shows a plan view of such an embodiment.
- a light-shaping structure with areas 33 and 34 is configured on the matrix.
- the areas 34 are designed as pillars or columns or holes in the transparent layer 33 covering the matrix.
- the layer 33 has a different refractive index than the columns 34 or holes 34. As shown in the top view, this results in a periodic variation of the refractive index in the two spatial directions. In this way, a photonic structure or a two-dimensional photonic crystal is formed over the matrix from the individual LEDs and pixels. By selecting the periodicity accordingly, the light of at least one wavelength can be shaped appropriately.
- FIG. 13 shows the different components of a proposed projection unit in a schematic view.
- a projection unit has an optoelectronic lighting device 1, with a matrix forming the pixels 2.1, 2.2, which have a low fill factor and each include LEDs 3.1, 3.2, 3.3, which emit light of different colors, namely red, green and blue light .
- a collimation optics 6.1, 6.2 is provided for each pixel 2.1, 2.2, which collimates the light emitted by the LEDs 3.1, 3.2, 3.3 and images it in a preferably virtual intermediate image 8.1, 8.2.
- the intermediate image 8.1, 8.2 of the LEDs 3.1, 3.2, 3.3 is directed to a display, not shown in detail, a screen or some other display unit, which can also be the windshield of a motor vehicle to create an image that can be perceived by the viewer in the desired size, orientation and spacing.
- FIG. 14 shows the proposed spatial correction, which leads to an overlay of the enlarged virtual intermediate images 8.1, 8.2 of the LEDs 3.1, 3.2, 3.3.
- the collimation optics 6.1, 6.2 are designed in such a way that the size of the intermediate images 8.1, 8.2 of the LEDs 3.1, 3.2, 3.3 essentially corresponds to the size of the respective pixel 2.1, 2.2 and also the different positions and sizes of the LEDs
- the intermediate images 30.1, 30.2, 30.3 of the LEDs 3.1, 3.2, 3.3 preferably overlap over at least 85% and preferably over at least 95% of their inter-image area.
- 3.1, 3.2, 3.3 can also overlap over at least 70%, 80% or 90% of their intermediate image area. It is further preferred that the total area of the overlapping intermediate images
- the total area of the overlapping intermediate images 30.1, 30.2, 30.3 of the LEDs 3.1, 3.2, 3.3 of the respective pixel 2.1, 2.2 can correspond to at least 70%, 80% or 90% of the pixel area 5.
- the collimation optics 6.1, 6.2 assigned to each individual pixel 2.1, 2.2 can be brought about with the help of a holographic optical element (HOE), a refractive optical element (ROE) or a diffractive optical element (DOE).
- HOE holographic optical element
- ROE refractive optical element
- DOE diffractive optical element
- FIG. 15 shows the respective necessary chromatic phase function 12, 13, 14 of the collimation optics 6.1, 6.2, 6.3 for the three different LEDs 3.1, 3.2, 3.3 of the respective pixel 2.1, 2.2.
- the upper graphic shows the chromatic phase function 12 for the LED 3, which emits red light
- the middle graphic shows the phase function 13 of the collimation optics 6.1, 6.2 for the green light emitting LED 3.2
- the lower graphic shows the necessary chromatic phase function 14 of the collimation optics 6.1 , 6.2 for the blue light emitting LED 3.3.
- FIG. 16 shows an embodiment for which the collimation optics 6 is implemented with the aid of a metal lens 15.
- a metal lens 15 can be designed in such a way that it creates either a refractive optical element or a diffractive optical element.
- Such metal lenses 15 advantageously have at least two regions which are arranged at a distance from one another and have been structured in different ways. For example, it is conceivable that a grid-shaped structuring is provided in a first area of the metal lens, while the second area of such a metal lens 15 has a circular structure. It is advantageous if the metal lens 15 has a binary structure at least in some areas and / or is made from a dielectric material.
- Another aspect of FIG. 16 results when considering that the column structure can be arranged periodically or quasi-periodically. This creates an area with a periodic variation in the refractive index.
- FIG. 17 shows the side view of a monolithic optochip which has the optoelectronic lighting device 1 for a projection display embodied according to the invention.
- the optochip has a silicon substrate 9 on which the individual pixels 2 with the subpixels provided therein are located. In order to supply the optochip with the required electrical energy, it has a power connection 11 as well as conductor tracks suitable for this.
- the individual light-emitting pixels 2 are supplied with energy and controlled using a CMOS array 10.
- the light generation at the subpixels is realized using LEDs, LEDs preferably being used that emit blue or ultraviolet light, which is converted into light with the required color with the help of suitable converter elements or suitable converter material .
- pixels 2 On the surface of the optochip there are pixels 2, in which subpixels 50, each of which emit red, green and blue light, are arranged.
- the individual subpixels 50 each form a pixel 2 with a low fill factor, so that the individual light-emitting areas within a pixel 2, compared to the areas that do not emit light, only take up part of the area of the pixel 2 and are sufficiently spaced from one another are that optical and electrical crosstalk between the individual subpixels 50 and between adjacent pixels 50 is reliably prevented or at least significantly minimized.
- Each of the pixels 2 formed by three subpixels 50 is assigned a collimation optic, not shown in detail in FIG. 270, which causes a collimation of the radiation emitted by the subpixels 3 and a spatial correction.
- the collimation optics 6 generate intermediate images of the subpixels 50, the size of which corresponds to the size of a pixel 2.
- the collimation optics must be designed in such a way that the different positions and sizes of the individual subpixels in the intermediate image are compensated for.
- FIG. 17 with a monolithic optochip, it is also conceivable to arrange different chips, each of which has one or a plurality of pixels or subpixels, on a common substrate and to make electrical contact.
- the subpixels 50 of the pixels 2 are preferably formed by LEDs which emit light with the respective required color, in particular red, green or blue light.
- LEDs that are direct Emit light with the desired color and / or convert the light emitted by LEDs, in particular blue light, with the aid of suitable converter elements and converter materials into light with the required color.
- the sub-pixels 50 as superluminescent diodes, VCSELs or edge-emitting lasers.
- the individual subpixels 50 to be implemented by end pieces of optical waveguides that guide light with the corresponding color.
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Projection Apparatus (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
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DE112020002482.2T DE112020002482A5 (de) | 2019-05-23 | 2020-03-26 | Beleuchtungsanordnung, lichtführungsanordnung und verfahren |
JP2021569556A JP7494215B2 (ja) | 2019-05-23 | 2020-03-26 | 照明配置構造体、光誘導配置構造体およびそれらに関する方法 |
CN202080053291.4A CN114144727A (zh) | 2019-05-23 | 2020-03-26 | 照明装置、导光装置和方法 |
US17/612,834 US20220244627A1 (en) | 2019-05-23 | 2020-03-26 | Lighting arrangement, light guide arrangement and method |
KR1020217042323A KR20220012334A (ko) | 2019-05-23 | 2020-03-26 | 조명 조립체, 광 안내 조립체 및 방법 |
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DE102019113793.4 | 2019-05-23 | ||
DE102019113793 | 2019-05-23 | ||
DE102019118082.1 | 2019-07-04 | ||
DE102019118082 | 2019-07-04 | ||
EPPCT/EP2020/052191 | 2020-01-29 | ||
PCT/EP2020/052191 WO2020157149A1 (de) | 2019-01-29 | 2020-01-29 | µ-LED, µ-LED ANORDNUNG, DISPLAY UND VERFAHREN ZU SELBEN |
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WO2020233873A1 true WO2020233873A1 (de) | 2020-11-26 |
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PCT/EP2020/058549 WO2020233873A1 (de) | 2019-05-23 | 2020-03-26 | Beleuchtungsanordnung, lichtführungsanordnung und verfahren |
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US (1) | US20220244627A1 (de) |
JP (1) | JP7494215B2 (de) |
KR (1) | KR20220012334A (de) |
CN (1) | CN114144727A (de) |
DE (1) | DE112020002482A5 (de) |
WO (1) | WO2020233873A1 (de) |
Cited By (5)
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CN113885287A (zh) * | 2021-11-12 | 2022-01-04 | 福州京东方光电科技有限公司 | 投影装置、显示系统及光源组件的制备方法 |
WO2022128496A1 (de) * | 2020-12-15 | 2022-06-23 | Ams-Osram International Gmbh | Optoelektronische vorrichtung |
DE102021112717A1 (de) | 2021-05-17 | 2022-11-17 | HELLA GmbH & Co. KGaA | Beleuchtungsvorrichtung für Fahrzeuge |
DE102021212147A1 (de) | 2021-10-27 | 2023-04-27 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronische vorrichtung und verfahren zu deren herstellung |
DE102022117420A1 (de) | 2022-07-13 | 2024-01-18 | Valeo Schalter Und Sensoren Gmbh | Head-Up-Display für ein Kraftfahrzeug und Bilderzeugungseinrichtung für ein Head-Up-Display |
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Also Published As
Publication number | Publication date |
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US20220244627A1 (en) | 2022-08-04 |
KR20220012334A (ko) | 2022-02-03 |
JP2022533788A (ja) | 2022-07-25 |
JP7494215B2 (ja) | 2024-06-03 |
CN114144727A (zh) | 2022-03-04 |
DE112020002482A5 (de) | 2022-02-17 |
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