|
US8324660B2
(en)
|
2005-05-17 |
2012-12-04 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Lattice-mismatched semiconductor structures with reduced dislocation defect densities and related methods for device fabrication
|
|
US9153645B2
(en)
*
|
2005-05-17 |
2015-10-06 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Lattice-mismatched semiconductor structures with reduced dislocation defect densities and related methods for device fabrication
|
|
JP5063594B2
(ja)
*
|
2005-05-17 |
2012-10-31 |
台湾積體電路製造股▲ふん▼有限公司 |
転位欠陥密度の低い格子不整合半導体構造およびこれに関連するデバイス製造方法
|
|
US20070267722A1
(en)
*
|
2006-05-17 |
2007-11-22 |
Amberwave Systems Corporation |
Lattice-mismatched semiconductor structures with reduced dislocation defect densities and related methods for device fabrication
|
|
TWI363437B
(en)
*
|
2008-05-21 |
2012-05-01 |
Ind Tech Res Inst |
Light emitting diode package capable of providing electrostatic discharge circuit protection and process of making the same
|
|
US20070054460A1
(en)
*
|
2005-06-23 |
2007-03-08 |
Atmel Corporation |
System and method for providing a nanoscale, highly selective, and thermally resilient silicon, germanium, or silicon-germanium etch-stop
|
|
US20060292809A1
(en)
*
|
2005-06-23 |
2006-12-28 |
Enicks Darwin G |
Method for growth and optimization of heterojunction bipolar transistor film stacks by remote injection
|
|
US20080050883A1
(en)
*
|
2006-08-25 |
2008-02-28 |
Atmel Corporation |
Hetrojunction bipolar transistor (hbt) with periodic multilayer base
|
|
EP1911086A2
(en)
*
|
2005-07-26 |
2008-04-16 |
Amberwave Systems Corporation |
Solutions integrated circuit integration of alternative active area materials
|
|
US8120060B2
(en)
*
|
2005-11-01 |
2012-02-21 |
Massachusetts Institute Of Technology |
Monolithically integrated silicon and III-V electronics
|
|
US8530934B2
(en)
|
2005-11-07 |
2013-09-10 |
Atmel Corporation |
Integrated circuit structures containing a strain-compensated compound semiconductor layer and methods and systems related thereto
|
|
US20070148890A1
(en)
*
|
2005-12-27 |
2007-06-28 |
Enicks Darwin G |
Oxygen enhanced metastable silicon germanium film layer
|
|
US8106379B2
(en)
*
|
2006-04-26 |
2012-01-31 |
The Regents Of The University Of California |
Hybrid silicon evanescent photodetectors
|
|
US8110823B2
(en)
|
2006-01-20 |
2012-02-07 |
The Regents Of The University Of California |
III-V photonic integration on silicon
|
|
WO2007112066A2
(en)
|
2006-03-24 |
2007-10-04 |
Amberwave Systems Corporation |
Lattice-mismatched semiconductor structures and related methods for device fabrication
|
|
US8063397B2
(en)
*
|
2006-06-28 |
2011-11-22 |
Massachusetts Institute Of Technology |
Semiconductor light-emitting structure and graded-composition substrate providing yellow-green light emission
|
|
US20080002929A1
(en)
*
|
2006-06-30 |
2008-01-03 |
Bowers John E |
Electrically pumped semiconductor evanescent laser
|
|
US8062919B2
(en)
|
2006-08-11 |
2011-11-22 |
Cornell Research Foundation, Inc. |
Monolithic silicon-based photonic receiver
|
|
EP2062290B1
(en)
|
2006-09-07 |
2019-08-28 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Defect reduction using aspect ratio trapping
|
|
US20080070355A1
(en)
*
|
2006-09-18 |
2008-03-20 |
Amberwave Systems Corporation |
Aspect ratio trapping for mixed signal applications
|
|
WO2008039495A1
(en)
|
2006-09-27 |
2008-04-03 |
Amberwave Systems Corporation |
Tri-gate field-effect transistors formed by aspect ratio trapping
|
|
US7875958B2
(en)
|
2006-09-27 |
2011-01-25 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Quantum tunneling devices and circuits with lattice-mismatched semiconductor structures
|
|
WO2008051503A2
(en)
|
2006-10-19 |
2008-05-02 |
Amberwave Systems Corporation |
Light-emitter-based devices with lattice-mismatched semiconductor structures
|
|
US7569913B2
(en)
*
|
2006-10-26 |
2009-08-04 |
Atmel Corporation |
Boron etch-stop layer and methods related thereto
|
|
US7550758B2
(en)
|
2006-10-31 |
2009-06-23 |
Atmel Corporation |
Method for providing a nanoscale, high electron mobility transistor (HEMT) on insulator
|
|
FR2914783A1
(fr)
*
|
2007-04-03 |
2008-10-10 |
St Microelectronics Sa |
Procede de fabrication d'un dispositif a gradient de concentration et dispositif correspondant.
|
|
US7825328B2
(en)
|
2007-04-09 |
2010-11-02 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Nitride-based multi-junction solar cell modules and methods for making the same
|
|
US8304805B2
(en)
|
2009-01-09 |
2012-11-06 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Semiconductor diodes fabricated by aspect ratio trapping with coalesced films
|
|
US8237151B2
(en)
*
|
2009-01-09 |
2012-08-07 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Diode-based devices and methods for making the same
|
|
US9508890B2
(en)
|
2007-04-09 |
2016-11-29 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Photovoltaics on silicon
|
|
DE102007024355B4
(de)
*
|
2007-05-24 |
2011-04-21 |
Infineon Technologies Ag |
Verfahren zum Herstellen einer Schutzstruktur
|
|
US8329541B2
(en)
|
2007-06-15 |
2012-12-11 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
InP-based transistor fabrication
|
|
KR101305786B1
(ko)
*
|
2007-06-21 |
2013-09-06 |
엘지이노텍 주식회사 |
질화물 반도체 발광소자 및 그 제조방법
|
|
US10505083B2
(en)
*
|
2007-07-11 |
2019-12-10 |
Cree, Inc. |
Coating method utilizing phosphor containment structure and devices fabricated using same
|
|
US20090050939A1
(en)
*
|
2007-07-17 |
2009-02-26 |
Briere Michael A |
Iii-nitride device
|
|
JP2010536170A
(ja)
*
|
2007-08-08 |
2010-11-25 |
エージェンシー フォー サイエンス,テクノロジー アンド リサーチ |
半導体構造および製造方法
|
|
JP2010538495A
(ja)
|
2007-09-07 |
2010-12-09 |
アンバーウェーブ・システムズ・コーポレーション |
多接合太陽電池
|
|
KR100889956B1
(ko)
*
|
2007-09-27 |
2009-03-20 |
서울옵토디바이스주식회사 |
교류용 발광다이오드
|
|
US7999288B2
(en)
*
|
2007-11-26 |
2011-08-16 |
International Rectifier Corporation |
High voltage durability III-nitride semiconductor device
|
|
US8299485B2
(en)
|
2008-03-19 |
2012-10-30 |
Soitec |
Substrates for monolithic optical circuits and electronic circuits
|
|
KR101428719B1
(ko)
*
|
2008-05-22 |
2014-08-12 |
삼성전자 주식회사 |
발광 소자 및 발광 장치의 제조 방법, 상기 방법을이용하여 제조한 발광 소자 및 발광 장치
|
|
US8183667B2
(en)
|
2008-06-03 |
2012-05-22 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Epitaxial growth of crystalline material
|
|
WO2009151979A2
(en)
*
|
2008-06-09 |
2009-12-17 |
4Power, Llc |
High-efficiency solar cell structures and methods
|
|
US7737534B2
(en)
*
|
2008-06-10 |
2010-06-15 |
Northrop Grumman Systems Corporation |
Semiconductor devices that include germanium nanofilm layer disposed within openings of silicon dioxide layer
|
|
US8274097B2
(en)
|
2008-07-01 |
2012-09-25 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Reduction of edge effects from aspect ratio trapping
|
|
US8981427B2
(en)
|
2008-07-15 |
2015-03-17 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Polishing of small composite semiconductor materials
|
|
US8410568B2
(en)
|
2008-08-29 |
2013-04-02 |
Tau-Metrix, Inc. |
Integrated photodiode for semiconductor substrates
|
|
CN102160145B
(zh)
|
2008-09-19 |
2013-08-21 |
台湾积体电路制造股份有限公司 |
通过外延层过成长的元件形成
|
|
US20100072515A1
(en)
|
2008-09-19 |
2010-03-25 |
Amberwave Systems Corporation |
Fabrication and structures of crystalline material
|
|
US8253211B2
(en)
|
2008-09-24 |
2012-08-28 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Semiconductor sensor structures with reduced dislocation defect densities
|
|
JP5075786B2
(ja)
*
|
2008-10-06 |
2012-11-21 |
株式会社東芝 |
発光装置及びその製造方法
|
|
US7834456B2
(en)
*
|
2009-01-20 |
2010-11-16 |
Raytheon Company |
Electrical contacts for CMOS devices and III-V devices formed on a silicon substrate
|
|
US8853745B2
(en)
*
|
2009-01-20 |
2014-10-07 |
Raytheon Company |
Silicon based opto-electric circuits
|
|
KR20110120274A
(ko)
*
|
2009-03-11 |
2011-11-03 |
스미또모 가가꾸 가부시키가이샤 |
반도체 기판, 반도체 기판의 제조 방법, 전자 디바이스 및 전자 디바이스의 제조 방법
|
|
US8217410B2
(en)
*
|
2009-03-27 |
2012-07-10 |
Wisconsin Alumni Research Foundation |
Hybrid vertical cavity light emitting sources
|
|
CN102379046B
(zh)
|
2009-04-02 |
2015-06-17 |
台湾积体电路制造股份有限公司 |
从晶体材料的非极性平面形成的器件及其制作方法
|
|
US8669778B1
(en)
|
2009-04-14 |
2014-03-11 |
Monolithic 3D Inc. |
Method for design and manufacturing of a 3D semiconductor device
|
|
US9509313B2
(en)
|
2009-04-14 |
2016-11-29 |
Monolithic 3D Inc. |
3D semiconductor device
|
|
US8427200B2
(en)
|
2009-04-14 |
2013-04-23 |
Monolithic 3D Inc. |
3D semiconductor device
|
|
US20110199116A1
(en)
*
|
2010-02-16 |
2011-08-18 |
NuPGA Corporation |
Method for fabrication of a semiconductor device and structure
|
|
US8362482B2
(en)
|
2009-04-14 |
2013-01-29 |
Monolithic 3D Inc. |
Semiconductor device and structure
|
|
US8058137B1
(en)
|
2009-04-14 |
2011-11-15 |
Monolithic 3D Inc. |
Method for fabrication of a semiconductor device and structure
|
|
US7964916B2
(en)
*
|
2009-04-14 |
2011-06-21 |
Monolithic 3D Inc. |
Method for fabrication of a semiconductor device and structure
|
|
US9577642B2
(en)
|
2009-04-14 |
2017-02-21 |
Monolithic 3D Inc. |
Method to form a 3D semiconductor device
|
|
US8395191B2
(en)
|
2009-10-12 |
2013-03-12 |
Monolithic 3D Inc. |
Semiconductor device and structure
|
|
US9711407B2
(en)
|
2009-04-14 |
2017-07-18 |
Monolithic 3D Inc. |
Method of manufacturing a three dimensional integrated circuit by transfer of a mono-crystalline layer
|
|
US8754533B2
(en)
|
2009-04-14 |
2014-06-17 |
Monolithic 3D Inc. |
Monolithic three-dimensional semiconductor device and structure
|
|
US8962376B2
(en)
*
|
2009-04-21 |
2015-02-24 |
The Silanna Group Pty Ltd |
Optoelectronic device with lateral pin or pin junction
|
|
US7994550B2
(en)
|
2009-05-22 |
2011-08-09 |
Raytheon Company |
Semiconductor structures having both elemental and compound semiconductor devices on a common substrate
|
|
CN102439696A
(zh)
*
|
2009-05-22 |
2012-05-02 |
住友化学株式会社 |
半导体基板及其制造方法、电子器件及其制造方法
|
|
US8269931B2
(en)
*
|
2009-09-14 |
2012-09-18 |
The Aerospace Corporation |
Systems and methods for preparing films using sequential ion implantation, and films formed using same
|
|
US9099424B1
(en)
|
2012-08-10 |
2015-08-04 |
Monolithic 3D Inc. |
Semiconductor system, device and structure with heat removal
|
|
US10910364B2
(en)
|
2009-10-12 |
2021-02-02 |
Monolitaic 3D Inc. |
3D semiconductor device
|
|
US10388863B2
(en)
|
2009-10-12 |
2019-08-20 |
Monolithic 3D Inc. |
3D memory device and structure
|
|
US12027518B1
(en)
|
2009-10-12 |
2024-07-02 |
Monolithic 3D Inc. |
3D semiconductor devices and structures with metal layers
|
|
US11984445B2
(en)
|
2009-10-12 |
2024-05-14 |
Monolithic 3D Inc. |
3D semiconductor devices and structures with metal layers
|
|
US8476145B2
(en)
*
|
2010-10-13 |
2013-07-02 |
Monolithic 3D Inc. |
Method of fabricating a semiconductor device and structure
|
|
US8536023B2
(en)
|
2010-11-22 |
2013-09-17 |
Monolithic 3D Inc. |
Method of manufacturing a semiconductor device and structure
|
|
US10354995B2
(en)
|
2009-10-12 |
2019-07-16 |
Monolithic 3D Inc. |
Semiconductor memory device and structure
|
|
US8148728B2
(en)
|
2009-10-12 |
2012-04-03 |
Monolithic 3D, Inc. |
Method for fabrication of a semiconductor device and structure
|
|
US11374118B2
(en)
|
2009-10-12 |
2022-06-28 |
Monolithic 3D Inc. |
Method to form a 3D integrated circuit
|
|
US8742476B1
(en)
|
2012-11-27 |
2014-06-03 |
Monolithic 3D Inc. |
Semiconductor device and structure
|
|
US10366970B2
(en)
|
2009-10-12 |
2019-07-30 |
Monolithic 3D Inc. |
3D semiconductor device and structure
|
|
US11018133B2
(en)
|
2009-10-12 |
2021-05-25 |
Monolithic 3D Inc. |
3D integrated circuit
|
|
US10043781B2
(en)
|
2009-10-12 |
2018-08-07 |
Monolithic 3D Inc. |
3D semiconductor device and structure
|
|
US8581349B1
(en)
|
2011-05-02 |
2013-11-12 |
Monolithic 3D Inc. |
3D memory semiconductor device and structure
|
|
US10157909B2
(en)
|
2009-10-12 |
2018-12-18 |
Monolithic 3D Inc. |
3D semiconductor device and structure
|
|
US8450804B2
(en)
|
2011-03-06 |
2013-05-28 |
Monolithic 3D Inc. |
Semiconductor device and structure for heat removal
|
|
DE102009051520B4
(de)
|
2009-10-31 |
2016-11-03 |
X-Fab Semiconductor Foundries Ag |
Verfahren zur Herstellung von Siliziumhalbleiterscheiben mit Schichtstrukturen zur Integration von III-V Halbleiterbauelementen
|
|
DE102009051521B4
(de)
|
2009-10-31 |
2012-04-26 |
X-Fab Semiconductor Foundries Ag |
Herstellung von Siliziumhalbleiterscheiben mit III-V-Schichtstrukturen für High Electron Mobility Transistoren (HEMT) und eine entsprechende Halbleiterschichtanordnung
|
|
KR101287196B1
(ko)
*
|
2009-12-03 |
2013-07-16 |
한국전자통신연구원 |
광 검출기 및 그 제조방법
|
|
US8530938B2
(en)
*
|
2009-12-10 |
2013-09-10 |
International Rectifier Corporation |
Monolithic integrated composite group III-V and group IV semiconductor device and method for fabricating same
|
|
JP5946771B2
(ja)
*
|
2009-12-16 |
2016-07-06 |
ナショナル セミコンダクター コーポレーションNational Semiconductor Corporation |
半導体基板上のラージエリアガリウム窒化物又は他の窒化物ベース構造のための応力補償
|
|
US8242510B2
(en)
*
|
2010-01-28 |
2012-08-14 |
Intersil Americas Inc. |
Monolithic integration of gallium nitride and silicon devices and circuits, structure and method
|
|
US8461035B1
(en)
|
2010-09-30 |
2013-06-11 |
Monolithic 3D Inc. |
Method for fabrication of a semiconductor device and structure
|
|
US8541819B1
(en)
|
2010-12-09 |
2013-09-24 |
Monolithic 3D Inc. |
Semiconductor device and structure
|
|
US9099526B2
(en)
|
2010-02-16 |
2015-08-04 |
Monolithic 3D Inc. |
Integrated circuit device and structure
|
|
US8492886B2
(en)
|
2010-02-16 |
2013-07-23 |
Monolithic 3D Inc |
3D integrated circuit with logic
|
|
US8026521B1
(en)
*
|
2010-10-11 |
2011-09-27 |
Monolithic 3D Inc. |
Semiconductor device and structure
|
|
DE102010002204A1
(de)
*
|
2010-02-22 |
2011-08-25 |
OSRAM Opto Semiconductors GmbH, 93055 |
Halbleiterdiode und Verfahren zum Herstellen einer Halbleiterdiode
|
|
DE202010004874U1
(de)
*
|
2010-04-11 |
2010-07-22 |
Lightdesign Solutions Gmbh |
LED-Modul mit Passiv-LED
|
|
US8318563B2
(en)
|
2010-05-19 |
2012-11-27 |
National Semiconductor Corporation |
Growth of group III nitride-based structures and integration with conventional CMOS processing tools
|
|
US10217667B2
(en)
|
2011-06-28 |
2019-02-26 |
Monolithic 3D Inc. |
3D semiconductor device, fabrication method and system
|
|
US9953925B2
(en)
|
2011-06-28 |
2018-04-24 |
Monolithic 3D Inc. |
Semiconductor system and device
|
|
US9219005B2
(en)
|
2011-06-28 |
2015-12-22 |
Monolithic 3D Inc. |
Semiconductor system and device
|
|
US8642416B2
(en)
|
2010-07-30 |
2014-02-04 |
Monolithic 3D Inc. |
Method of forming three dimensional integrated circuit devices using layer transfer technique
|
|
US8901613B2
(en)
|
2011-03-06 |
2014-12-02 |
Monolithic 3D Inc. |
Semiconductor device and structure for heat removal
|
|
US8592292B2
(en)
|
2010-09-02 |
2013-11-26 |
National Semiconductor Corporation |
Growth of multi-layer group III-nitride buffers on large-area silicon substrates and other substrates
|
|
DE102010046215B4
(de)
*
|
2010-09-21 |
2019-01-03 |
Infineon Technologies Austria Ag |
Halbleiterkörper mit verspanntem Bereich, Elektronisches Bauelement und ein Verfahren zum Erzeugen des Halbleiterkörpers.
|
|
US9070851B2
(en)
|
2010-09-24 |
2015-06-30 |
Seoul Semiconductor Co., Ltd. |
Wafer-level light emitting diode package and method of fabricating the same
|
|
US8273610B2
(en)
|
2010-11-18 |
2012-09-25 |
Monolithic 3D Inc. |
Method of constructing a semiconductor device and structure
|
|
US10497713B2
(en)
|
2010-11-18 |
2019-12-03 |
Monolithic 3D Inc. |
3D semiconductor memory device and structure
|
|
US8163581B1
(en)
|
2010-10-13 |
2012-04-24 |
Monolith IC 3D |
Semiconductor and optoelectronic devices
|
|
US12362219B2
(en)
|
2010-11-18 |
2025-07-15 |
Monolithic 3D Inc. |
3D semiconductor memory device and structure
|
|
US11482440B2
(en)
|
2010-12-16 |
2022-10-25 |
Monolithic 3D Inc. |
3D semiconductor device and structure with a built-in test circuit for repairing faulty circuits
|
|
US11469271B2
(en)
|
2010-10-11 |
2022-10-11 |
Monolithic 3D Inc. |
Method to produce 3D semiconductor devices and structures with memory
|
|
US11018191B1
(en)
|
2010-10-11 |
2021-05-25 |
Monolithic 3D Inc. |
3D semiconductor device and structure
|
|
US11600667B1
(en)
|
2010-10-11 |
2023-03-07 |
Monolithic 3D Inc. |
Method to produce 3D semiconductor devices and structures with memory
|
|
US11257867B1
(en)
|
2010-10-11 |
2022-02-22 |
Monolithic 3D Inc. |
3D semiconductor device and structure with oxide bonds
|
|
US10290682B2
(en)
|
2010-10-11 |
2019-05-14 |
Monolithic 3D Inc. |
3D IC semiconductor device and structure with stacked memory
|
|
US8114757B1
(en)
|
2010-10-11 |
2012-02-14 |
Monolithic 3D Inc. |
Semiconductor device and structure
|
|
US11315980B1
(en)
|
2010-10-11 |
2022-04-26 |
Monolithic 3D Inc. |
3D semiconductor device and structure with transistors
|
|
US11024673B1
(en)
|
2010-10-11 |
2021-06-01 |
Monolithic 3D Inc. |
3D semiconductor device and structure
|
|
US11158674B2
(en)
|
2010-10-11 |
2021-10-26 |
Monolithic 3D Inc. |
Method to produce a 3D semiconductor device and structure
|
|
US11227897B2
(en)
|
2010-10-11 |
2022-01-18 |
Monolithic 3D Inc. |
Method for producing a 3D semiconductor memory device and structure
|
|
US10896931B1
(en)
|
2010-10-11 |
2021-01-19 |
Monolithic 3D Inc. |
3D semiconductor device and structure
|
|
US12094892B2
(en)
|
2010-10-13 |
2024-09-17 |
Monolithic 3D Inc. |
3D micro display device and structure
|
|
US11694922B2
(en)
|
2010-10-13 |
2023-07-04 |
Monolithic 3D Inc. |
Multilevel semiconductor device and structure with oxide bonding
|
|
US11327227B2
(en)
|
2010-10-13 |
2022-05-10 |
Monolithic 3D Inc. |
Multilevel semiconductor device and structure with electromagnetic modulators
|
|
US11043523B1
(en)
|
2010-10-13 |
2021-06-22 |
Monolithic 3D Inc. |
Multilevel semiconductor device and structure with image sensors
|
|
US9197804B1
(en)
|
2011-10-14 |
2015-11-24 |
Monolithic 3D Inc. |
Semiconductor and optoelectronic devices
|
|
US10978501B1
(en)
|
2010-10-13 |
2021-04-13 |
Monolithic 3D Inc. |
Multilevel semiconductor device and structure with waveguides
|
|
US10679977B2
(en)
|
2010-10-13 |
2020-06-09 |
Monolithic 3D Inc. |
3D microdisplay device and structure
|
|
US11605663B2
(en)
|
2010-10-13 |
2023-03-14 |
Monolithic 3D Inc. |
Multilevel semiconductor device and structure with image sensors and wafer bonding
|
|
US11164898B2
(en)
|
2010-10-13 |
2021-11-02 |
Monolithic 3D Inc. |
Multilevel semiconductor device and structure
|
|
US11929372B2
(en)
|
2010-10-13 |
2024-03-12 |
Monolithic 3D Inc. |
Multilevel semiconductor device and structure with image sensors and wafer bonding
|
|
US11855114B2
(en)
|
2010-10-13 |
2023-12-26 |
Monolithic 3D Inc. |
Multilevel semiconductor device and structure with image sensors and wafer bonding
|
|
US11855100B2
(en)
|
2010-10-13 |
2023-12-26 |
Monolithic 3D Inc. |
Multilevel semiconductor device and structure with oxide bonding
|
|
US10833108B2
(en)
|
2010-10-13 |
2020-11-10 |
Monolithic 3D Inc. |
3D microdisplay device and structure
|
|
US10998374B1
(en)
|
2010-10-13 |
2021-05-04 |
Monolithic 3D Inc. |
Multilevel semiconductor device and structure
|
|
US12360310B2
(en)
|
2010-10-13 |
2025-07-15 |
Monolithic 3D Inc. |
Multilevel semiconductor device and structure with oxide bonding
|
|
US10943934B2
(en)
|
2010-10-13 |
2021-03-09 |
Monolithic 3D Inc. |
Multilevel semiconductor device and structure
|
|
US11163112B2
(en)
|
2010-10-13 |
2021-11-02 |
Monolithic 3D Inc. |
Multilevel semiconductor device and structure with electromagnetic modulators
|
|
US11984438B2
(en)
|
2010-10-13 |
2024-05-14 |
Monolithic 3D Inc. |
Multilevel semiconductor device and structure with oxide bonding
|
|
US12080743B2
(en)
|
2010-10-13 |
2024-09-03 |
Monolithic 3D Inc. |
Multilevel semiconductor device and structure with image sensors and wafer bonding
|
|
US11063071B1
(en)
|
2010-10-13 |
2021-07-13 |
Monolithic 3D Inc. |
Multilevel semiconductor device and structure with waveguides
|
|
US11869915B2
(en)
|
2010-10-13 |
2024-01-09 |
Monolithic 3D Inc. |
Multilevel semiconductor device and structure with image sensors and wafer bonding
|
|
US11437368B2
(en)
|
2010-10-13 |
2022-09-06 |
Monolithic 3D Inc. |
Multilevel semiconductor device and structure with oxide bonding
|
|
US11133344B2
(en)
|
2010-10-13 |
2021-09-28 |
Monolithic 3D Inc. |
Multilevel semiconductor device and structure with image sensors
|
|
US11404466B2
(en)
|
2010-10-13 |
2022-08-02 |
Monolithic 3D Inc. |
Multilevel semiconductor device and structure with image sensors
|
|
US11094576B1
(en)
|
2010-11-18 |
2021-08-17 |
Monolithic 3D Inc. |
Methods for producing a 3D semiconductor memory device and structure
|
|
US11164770B1
(en)
|
2010-11-18 |
2021-11-02 |
Monolithic 3D Inc. |
Method for producing a 3D semiconductor memory device and structure
|
|
US11521888B2
(en)
|
2010-11-18 |
2022-12-06 |
Monolithic 3D Inc. |
3D semiconductor device and structure with high-k metal gate transistors
|
|
US11862503B2
(en)
|
2010-11-18 |
2024-01-02 |
Monolithic 3D Inc. |
Method for producing a 3D semiconductor device and structure with memory cells and multiple metal layers
|
|
US11735462B2
(en)
|
2010-11-18 |
2023-08-22 |
Monolithic 3D Inc. |
3D semiconductor device and structure with single-crystal layers
|
|
US12136562B2
(en)
|
2010-11-18 |
2024-11-05 |
Monolithic 3D Inc. |
3D semiconductor device and structure with single-crystal layers
|
|
US11804396B2
(en)
|
2010-11-18 |
2023-10-31 |
Monolithic 3D Inc. |
Methods for producing a 3D semiconductor device and structure with memory cells and multiple metal layers
|
|
US12154817B1
(en)
|
2010-11-18 |
2024-11-26 |
Monolithic 3D Inc. |
Methods for producing a 3D semiconductor memory device and structure
|
|
US11355381B2
(en)
|
2010-11-18 |
2022-06-07 |
Monolithic 3D Inc. |
3D semiconductor memory device and structure
|
|
US11355380B2
(en)
|
2010-11-18 |
2022-06-07 |
Monolithic 3D Inc. |
Methods for producing 3D semiconductor memory device and structure utilizing alignment marks
|
|
US11615977B2
(en)
|
2010-11-18 |
2023-03-28 |
Monolithic 3D Inc. |
3D semiconductor memory device and structure
|
|
US11610802B2
(en)
|
2010-11-18 |
2023-03-21 |
Monolithic 3D Inc. |
Method for producing a 3D semiconductor device and structure with single crystal transistors and metal gate electrodes
|
|
US11107721B2
(en)
|
2010-11-18 |
2021-08-31 |
Monolithic 3D Inc. |
3D semiconductor device and structure with NAND logic
|
|
US11854857B1
(en)
|
2010-11-18 |
2023-12-26 |
Monolithic 3D Inc. |
Methods for producing a 3D semiconductor device and structure with memory cells and multiple metal layers
|
|
US12033884B2
(en)
|
2010-11-18 |
2024-07-09 |
Monolithic 3D Inc. |
Methods for producing a 3D semiconductor device and structure with memory cells and multiple metal layers
|
|
US11482439B2
(en)
|
2010-11-18 |
2022-10-25 |
Monolithic 3D Inc. |
Methods for producing a 3D semiconductor memory device comprising charge trap junction-less transistors
|
|
US11482438B2
(en)
|
2010-11-18 |
2022-10-25 |
Monolithic 3D Inc. |
Methods for producing a 3D semiconductor memory device and structure
|
|
US12100611B2
(en)
|
2010-11-18 |
2024-09-24 |
Monolithic 3D Inc. |
Methods for producing a 3D semiconductor device and structure with memory cells and multiple metal layers
|
|
US11443971B2
(en)
|
2010-11-18 |
2022-09-13 |
Monolithic 3D Inc. |
3D semiconductor device and structure with memory
|
|
US11121021B2
(en)
|
2010-11-18 |
2021-09-14 |
Monolithic 3D Inc. |
3D semiconductor device and structure
|
|
US11901210B2
(en)
|
2010-11-18 |
2024-02-13 |
Monolithic 3D Inc. |
3D semiconductor device and structure with memory
|
|
US11018042B1
(en)
|
2010-11-18 |
2021-05-25 |
Monolithic 3D Inc. |
3D semiconductor memory device and structure
|
|
US11784082B2
(en)
|
2010-11-18 |
2023-10-10 |
Monolithic 3D Inc. |
3D semiconductor device and structure with bonding
|
|
US12272586B2
(en)
|
2010-11-18 |
2025-04-08 |
Monolithic 3D Inc. |
3D semiconductor memory device and structure with memory and metal layers
|
|
US11211279B2
(en)
|
2010-11-18 |
2021-12-28 |
Monolithic 3D Inc. |
Method for processing a 3D integrated circuit and structure
|
|
US12144190B2
(en)
|
2010-11-18 |
2024-11-12 |
Monolithic 3D Inc. |
3D semiconductor device and structure with bonding and memory cells preliminary class
|
|
US11508605B2
(en)
|
2010-11-18 |
2022-11-22 |
Monolithic 3D Inc. |
3D semiconductor memory device and structure
|
|
US12068187B2
(en)
|
2010-11-18 |
2024-08-20 |
Monolithic 3D Inc. |
3D semiconductor device and structure with bonding and DRAM memory cells
|
|
US12243765B2
(en)
|
2010-11-18 |
2025-03-04 |
Monolithic 3D Inc. |
3D semiconductor device and structure with metal layers and memory cells
|
|
US11495484B2
(en)
|
2010-11-18 |
2022-11-08 |
Monolithic 3D Inc. |
3D semiconductor devices and structures with at least two single-crystal layers
|
|
US11569117B2
(en)
|
2010-11-18 |
2023-01-31 |
Monolithic 3D Inc. |
3D semiconductor device and structure with single-crystal layers
|
|
US12125737B1
(en)
|
2010-11-18 |
2024-10-22 |
Monolithic 3D Inc. |
3D semiconductor device and structure with metal layers and memory cells
|
|
US11923230B1
(en)
|
2010-11-18 |
2024-03-05 |
Monolithic 3D Inc. |
3D semiconductor device and structure with bonding
|
|
US11004719B1
(en)
|
2010-11-18 |
2021-05-11 |
Monolithic 3D Inc. |
Methods for producing a 3D semiconductor memory device and structure
|
|
US11031275B2
(en)
|
2010-11-18 |
2021-06-08 |
Monolithic 3D Inc. |
3D semiconductor device and structure with memory
|
|
US8604330B1
(en)
|
2010-12-06 |
2013-12-10 |
4Power, Llc |
High-efficiency solar-cell arrays with integrated devices and methods for forming them
|
|
US12463076B2
(en)
|
2010-12-16 |
2025-11-04 |
Monolithic 3D Inc. |
3D semiconductor device and structure
|
|
KR101785644B1
(ko)
*
|
2011-01-26 |
2017-10-16 |
엘지이노텍 주식회사 |
발광소자 및 그 발광 소자의 제조 방법
|
|
US8975670B2
(en)
|
2011-03-06 |
2015-03-10 |
Monolithic 3D Inc. |
Semiconductor device and structure for heat removal
|
|
FR2972567B1
(fr)
*
|
2011-03-09 |
2013-03-22 |
Soitec Silicon On Insulator |
Méthode de formation d'une structure de ge sur iii/v sur isolant
|
|
US8946864B2
(en)
|
2011-03-16 |
2015-02-03 |
The Aerospace Corporation |
Systems and methods for preparing films comprising metal using sequential ion implantation, and films formed using same
|
|
CN102790084B
(zh)
*
|
2011-05-16 |
2016-03-16 |
中国科学院上海微系统与信息技术研究所 |
锗和iii-v混合共平面的soi半导体结构及其制备方法
|
|
US10388568B2
(en)
|
2011-06-28 |
2019-08-20 |
Monolithic 3D Inc. |
3D semiconductor device and system
|
|
JP2013012574A
(ja)
*
|
2011-06-29 |
2013-01-17 |
Toshiba Corp |
固体撮像装置および固体撮像装置の製造方法
|
|
US9595438B2
(en)
*
|
2011-09-12 |
2017-03-14 |
Nasp Iii/V Gmbh |
Method for producing a III/V Si template
|
|
US8575666B2
(en)
*
|
2011-09-30 |
2013-11-05 |
Raytheon Company |
Method and structure having monolithic heterogeneous integration of compound semiconductors with elemental semiconductor
|
|
US8687399B2
(en)
|
2011-10-02 |
2014-04-01 |
Monolithic 3D Inc. |
Semiconductor device and structure
|
|
US9029173B2
(en)
|
2011-10-18 |
2015-05-12 |
Monolithic 3D Inc. |
Method for fabrication of a semiconductor device and structure
|
|
CN107275287B
(zh)
|
2011-12-19 |
2021-08-13 |
英特尔公司 |
用于集成有功率管理和射频电路的片上系统(soc)结构的iii族-n晶体管
|
|
US9000557B2
(en)
|
2012-03-17 |
2015-04-07 |
Zvi Or-Bach |
Semiconductor device and structure
|
|
US9530763B2
(en)
|
2012-04-04 |
2016-12-27 |
Massachusetts Institute Of Technology |
Monolithic integration of CMOS and non-silicon devices
|
|
US11694944B1
(en)
|
2012-04-09 |
2023-07-04 |
Monolithic 3D Inc. |
3D semiconductor device and structure with metal layers and a connective path
|
|
US11735501B1
(en)
|
2012-04-09 |
2023-08-22 |
Monolithic 3D Inc. |
3D semiconductor device and structure with metal layers and a connective path
|
|
US11410912B2
(en)
|
2012-04-09 |
2022-08-09 |
Monolithic 3D Inc. |
3D semiconductor device with vias and isolation layers
|
|
US11881443B2
(en)
|
2012-04-09 |
2024-01-23 |
Monolithic 3D Inc. |
3D semiconductor device and structure with metal layers and a connective path
|
|
US10600888B2
(en)
|
2012-04-09 |
2020-03-24 |
Monolithic 3D Inc. |
3D semiconductor device
|
|
US11594473B2
(en)
|
2012-04-09 |
2023-02-28 |
Monolithic 3D Inc. |
3D semiconductor device and structure with metal layers and a connective path
|
|
US11164811B2
(en)
|
2012-04-09 |
2021-11-02 |
Monolithic 3D Inc. |
3D semiconductor device with isolation layers and oxide-to-oxide bonding
|
|
US11616004B1
(en)
|
2012-04-09 |
2023-03-28 |
Monolithic 3D Inc. |
3D semiconductor device and structure with metal layers and a connective path
|
|
US11476181B1
(en)
|
2012-04-09 |
2022-10-18 |
Monolithic 3D Inc. |
3D semiconductor device and structure with metal layers
|
|
US11088050B2
(en)
|
2012-04-09 |
2021-08-10 |
Monolithic 3D Inc. |
3D semiconductor device with isolation layers
|
|
US8557632B1
(en)
|
2012-04-09 |
2013-10-15 |
Monolithic 3D Inc. |
Method for fabrication of a semiconductor device and structure
|
|
US9142400B1
(en)
|
2012-07-17 |
2015-09-22 |
Stc.Unm |
Method of making a heteroepitaxial layer on a seed area
|
|
US9076763B2
(en)
*
|
2012-08-13 |
2015-07-07 |
Infineon Technologies Austria Ag |
High breakdown voltage III-nitride device
|
|
US8558282B1
(en)
|
2012-09-08 |
2013-10-15 |
International Business Machines Corporation |
Germanium lateral bipolar junction transistor
|
|
CN104756245B
(zh)
*
|
2012-10-26 |
2017-09-22 |
Rfhic公司 |
具有提高的可靠性和工作寿命的半导体器件及其制造方法
|
|
US8686428B1
(en)
|
2012-11-16 |
2014-04-01 |
Monolithic 3D Inc. |
Semiconductor device and structure
|
|
US8574929B1
(en)
|
2012-11-16 |
2013-11-05 |
Monolithic 3D Inc. |
Method to form a 3D semiconductor device and structure
|
|
US8674470B1
(en)
|
2012-12-22 |
2014-03-18 |
Monolithic 3D Inc. |
Semiconductor device and structure
|
|
US11018116B2
(en)
|
2012-12-22 |
2021-05-25 |
Monolithic 3D Inc. |
Method to form a 3D semiconductor device and structure
|
|
US11217565B2
(en)
|
2012-12-22 |
2022-01-04 |
Monolithic 3D Inc. |
Method to form a 3D semiconductor device and structure
|
|
US11784169B2
(en)
|
2012-12-22 |
2023-10-10 |
Monolithic 3D Inc. |
3D semiconductor device and structure with metal layers
|
|
US11309292B2
(en)
|
2012-12-22 |
2022-04-19 |
Monolithic 3D Inc. |
3D semiconductor device and structure with metal layers
|
|
US12051674B2
(en)
|
2012-12-22 |
2024-07-30 |
Monolithic 3D Inc. |
3D semiconductor device and structure with metal layers
|
|
US11961827B1
(en)
|
2012-12-22 |
2024-04-16 |
Monolithic 3D Inc. |
3D semiconductor device and structure with metal layers
|
|
US11063024B1
(en)
|
2012-12-22 |
2021-07-13 |
Monlithic 3D Inc. |
Method to form a 3D semiconductor device and structure
|
|
US11967583B2
(en)
|
2012-12-22 |
2024-04-23 |
Monolithic 3D Inc. |
3D semiconductor device and structure with metal layers
|
|
US11916045B2
(en)
|
2012-12-22 |
2024-02-27 |
Monolithic 3D Inc. |
3D semiconductor device and structure with metal layers
|
|
US12249538B2
(en)
|
2012-12-29 |
2025-03-11 |
Monolithic 3D Inc. |
3D semiconductor device and structure including power distribution grids
|
|
US11430668B2
(en)
|
2012-12-29 |
2022-08-30 |
Monolithic 3D Inc. |
3D semiconductor device and structure with bonding
|
|
US10903089B1
(en)
|
2012-12-29 |
2021-01-26 |
Monolithic 3D Inc. |
3D semiconductor device and structure
|
|
US9871034B1
(en)
|
2012-12-29 |
2018-01-16 |
Monolithic 3D Inc. |
Semiconductor device and structure
|
|
US11177140B2
(en)
|
2012-12-29 |
2021-11-16 |
Monolithic 3D Inc. |
3D semiconductor device and structure
|
|
US10892169B2
(en)
|
2012-12-29 |
2021-01-12 |
Monolithic 3D Inc. |
3D semiconductor device and structure
|
|
US11087995B1
(en)
|
2012-12-29 |
2021-08-10 |
Monolithic 3D Inc. |
3D semiconductor device and structure
|
|
US10600657B2
(en)
|
2012-12-29 |
2020-03-24 |
Monolithic 3D Inc |
3D semiconductor device and structure
|
|
US10115663B2
(en)
|
2012-12-29 |
2018-10-30 |
Monolithic 3D Inc. |
3D semiconductor device and structure
|
|
US11004694B1
(en)
|
2012-12-29 |
2021-05-11 |
Monolithic 3D Inc. |
3D semiconductor device and structure
|
|
US9385058B1
(en)
|
2012-12-29 |
2016-07-05 |
Monolithic 3D Inc. |
Semiconductor device and structure
|
|
US10651054B2
(en)
|
2012-12-29 |
2020-05-12 |
Monolithic 3D Inc. |
3D semiconductor device and structure
|
|
US11430667B2
(en)
|
2012-12-29 |
2022-08-30 |
Monolithic 3D Inc. |
3D semiconductor device and structure with bonding
|
|
CN103077892B
(zh)
*
|
2013-01-22 |
2015-08-19 |
中国科学院半导体研究所 |
在硅上集成hemt器件的方法
|
|
US10325651B2
(en)
|
2013-03-11 |
2019-06-18 |
Monolithic 3D Inc. |
3D semiconductor device with stacked memory
|
|
US11869965B2
(en)
|
2013-03-11 |
2024-01-09 |
Monolithic 3D Inc. |
3D semiconductor device and structure with metal layers and memory cells
|
|
US11935949B1
(en)
|
2013-03-11 |
2024-03-19 |
Monolithic 3D Inc. |
3D semiconductor device and structure with metal layers and memory cells
|
|
US8902663B1
(en)
|
2013-03-11 |
2014-12-02 |
Monolithic 3D Inc. |
Method of maintaining a memory state
|
|
US12094965B2
(en)
|
2013-03-11 |
2024-09-17 |
Monolithic 3D Inc. |
3D semiconductor device and structure with metal layers and memory cells
|
|
US10840239B2
(en)
|
2014-08-26 |
2020-11-17 |
Monolithic 3D Inc. |
3D semiconductor device and structure
|
|
US8994404B1
(en)
|
2013-03-12 |
2015-03-31 |
Monolithic 3D Inc. |
Semiconductor device and structure
|
|
US11088130B2
(en)
|
2014-01-28 |
2021-08-10 |
Monolithic 3D Inc. |
3D semiconductor device and structure
|
|
US11923374B2
(en)
|
2013-03-12 |
2024-03-05 |
Monolithic 3D Inc. |
3D semiconductor device and structure with metal layers
|
|
US12100646B2
(en)
|
2013-03-12 |
2024-09-24 |
Monolithic 3D Inc. |
3D semiconductor device and structure with metal layers
|
|
US11398569B2
(en)
|
2013-03-12 |
2022-07-26 |
Monolithic 3D Inc. |
3D semiconductor device and structure
|
|
US9324579B2
(en)
|
2013-03-14 |
2016-04-26 |
The Aerospace Corporation |
Metal structures and methods of using same for transporting or gettering materials disposed within semiconductor substrates
|
|
US9117749B1
(en)
|
2013-03-15 |
2015-08-25 |
Monolithic 3D Inc. |
Semiconductor device and structure
|
|
US10224279B2
(en)
|
2013-03-15 |
2019-03-05 |
Monolithic 3D Inc. |
Semiconductor device and structure
|
|
US11487928B2
(en)
|
2013-04-15 |
2022-11-01 |
Monolithic 3D Inc. |
Automation for monolithic 3D devices
|
|
US11270055B1
(en)
|
2013-04-15 |
2022-03-08 |
Monolithic 3D Inc. |
Automation for monolithic 3D devices
|
|
US9021414B1
(en)
|
2013-04-15 |
2015-04-28 |
Monolithic 3D Inc. |
Automation for monolithic 3D devices
|
|
US11030371B2
(en)
|
2013-04-15 |
2021-06-08 |
Monolithic 3D Inc. |
Automation for monolithic 3D devices
|
|
US11720736B2
(en)
|
2013-04-15 |
2023-08-08 |
Monolithic 3D Inc. |
Automation methods for 3D integrated circuits and devices
|
|
US11341309B1
(en)
|
2013-04-15 |
2022-05-24 |
Monolithic 3D Inc. |
Automation for monolithic 3D devices
|
|
US11574109B1
(en)
|
2013-04-15 |
2023-02-07 |
Monolithic 3D Inc |
Automation methods for 3D integrated circuits and devices
|
|
US9396948B2
(en)
*
|
2013-05-03 |
2016-07-19 |
Texas Instruments Incorporated |
Layer transfer of silicon onto III-nitride material for heterogenous integration
|
|
US9690042B2
(en)
*
|
2013-05-23 |
2017-06-27 |
Electronics And Telecommunications Research Institute |
Optical input/output device, optical electronic system including the same, and method of manufacturing the same
|
|
US8987765B2
(en)
|
2013-06-17 |
2015-03-24 |
LuxVue Technology Corporation |
Reflective bank structure and method for integrating a light emitting device
|
|
US9184191B2
(en)
*
|
2013-10-17 |
2015-11-10 |
Micron Technology, Inc. |
Method providing an epitaxial photonic device having a reduction in defects and resulting structure
|
|
EP3084806A4
(en)
*
|
2013-12-18 |
2017-07-26 |
Intel Corporation |
Planar heterogeneous device
|
|
US9360623B2
(en)
*
|
2013-12-20 |
2016-06-07 |
The Regents Of The University Of California |
Bonding of heterogeneous material grown on silicon to a silicon photonic circuit
|
|
WO2015094377A1
(en)
*
|
2013-12-20 |
2015-06-25 |
Intel Corporation |
Photodetector with tapered waveguide structure
|
|
EP3095133B8
(en)
*
|
2014-01-14 |
2025-06-25 |
Massachusetts Institute Of Technology |
Method of forming an integrated circuit and related integrated circuit
|
|
US10297586B2
(en)
|
2015-03-09 |
2019-05-21 |
Monolithic 3D Inc. |
Methods for processing a 3D semiconductor device
|
|
US11031394B1
(en)
|
2014-01-28 |
2021-06-08 |
Monolithic 3D Inc. |
3D semiconductor device and structure
|
|
US11107808B1
(en)
|
2014-01-28 |
2021-08-31 |
Monolithic 3D Inc. |
3D semiconductor device and structure
|
|
US12094829B2
(en)
|
2014-01-28 |
2024-09-17 |
Monolithic 3D Inc. |
3D semiconductor device and structure
|
|
US9129863B2
(en)
|
2014-02-11 |
2015-09-08 |
International Business Machines Corporation |
Method to form dual channel group III-V and Si/Ge FINFET CMOS
|
|
US9123585B1
(en)
|
2014-02-11 |
2015-09-01 |
International Business Machines Corporation |
Method to form group III-V and Si/Ge FINFET on insulator
|
|
US10050015B2
(en)
*
|
2014-03-27 |
2018-08-14 |
Intel Corporation |
Multi-device flexible electronics system on a chip (SOC) process integration
|
|
FR3023065B1
(fr)
*
|
2014-06-27 |
2017-12-15 |
Commissariat Energie Atomique |
Dispositif optoelectronique a jonction p-n permettant une ionisation de dopants par effet de champ
|
|
US10366883B2
(en)
|
2014-07-30 |
2019-07-30 |
Hewlett Packard Enterprise Development Lp |
Hybrid multilayer device
|
|
FR3028050B1
(fr)
*
|
2014-10-29 |
2016-12-30 |
Commissariat Energie Atomique |
Substrat pre-structure pour la realisation de composants photoniques, circuit photonique et procede de fabrication associes
|
|
US10852492B1
(en)
|
2014-10-29 |
2020-12-01 |
Acacia Communications, Inc. |
Techniques to combine two integrated photonic substrates
|
|
US9412744B1
(en)
*
|
2015-01-30 |
2016-08-09 |
International Business Machines Corporation |
III-V CMOS integration on silicon substrate via embedded germanium-containing layer
|
|
KR102279162B1
(ko)
*
|
2015-03-03 |
2021-07-20 |
한국전자통신연구원 |
게르마늄 온 인슐레이터 기판 및 그의 형성방법
|
|
US9362444B1
(en)
*
|
2015-03-18 |
2016-06-07 |
International Business Machines Corporation |
Optoelectronics and CMOS integration on GOI substrate
|
|
US11011507B1
(en)
|
2015-04-19 |
2021-05-18 |
Monolithic 3D Inc. |
3D semiconductor device and structure
|
|
US10825779B2
(en)
|
2015-04-19 |
2020-11-03 |
Monolithic 3D Inc. |
3D semiconductor device and structure
|
|
US10381328B2
(en)
|
2015-04-19 |
2019-08-13 |
Monolithic 3D Inc. |
Semiconductor device and structure
|
|
US11056468B1
(en)
|
2015-04-19 |
2021-07-06 |
Monolithic 3D Inc. |
3D semiconductor device and structure
|
|
EP3363050B1
(en)
*
|
2015-07-23 |
2020-07-08 |
Artilux Inc. |
High efficiency wide spectrum sensor
|
|
EP3326203B1
(en)
|
2015-07-24 |
2024-03-06 |
Artilux, Inc. |
Multi-wafer based light absorption apparatus and applications thereof
|
|
US10644187B2
(en)
|
2015-07-24 |
2020-05-05 |
Artilux, Inc. |
Multi-wafer based light absorption apparatus and applications thereof
|
|
US10707260B2
(en)
*
|
2015-08-04 |
2020-07-07 |
Artilux, Inc. |
Circuit for operating a multi-gate VIS/IR photodiode
|
|
US10761599B2
(en)
|
2015-08-04 |
2020-09-01 |
Artilux, Inc. |
Eye gesture tracking
|
|
TWI676282B
(zh)
|
2015-08-04 |
2019-11-01 |
光澄科技股份有限公司 |
影像感測陣列
|
|
US10861888B2
(en)
|
2015-08-04 |
2020-12-08 |
Artilux, Inc. |
Silicon germanium imager with photodiode in trench
|
|
US11956952B2
(en)
|
2015-08-23 |
2024-04-09 |
Monolithic 3D Inc. |
Semiconductor memory device and structure
|
|
CN114754864B
(zh)
|
2015-08-27 |
2023-03-24 |
光程研创股份有限公司 |
宽频谱光学传感器
|
|
US10658177B2
(en)
|
2015-09-03 |
2020-05-19 |
Hewlett Packard Enterprise Development Lp |
Defect-free heterogeneous substrates
|
|
CN107924810B
(zh)
|
2015-09-04 |
2022-09-30 |
南洋理工大学 |
包封基板的方法
|
|
US12100658B2
(en)
|
2015-09-21 |
2024-09-24 |
Monolithic 3D Inc. |
Method to produce a 3D multilayer semiconductor device and structure
|
|
US11114427B2
(en)
|
2015-11-07 |
2021-09-07 |
Monolithic 3D Inc. |
3D semiconductor processor and memory device and structure
|
|
US11937422B2
(en)
|
2015-11-07 |
2024-03-19 |
Monolithic 3D Inc. |
Semiconductor memory device and structure
|
|
US10515981B2
(en)
|
2015-09-21 |
2019-12-24 |
Monolithic 3D Inc. |
Multilevel semiconductor device and structure with memory
|
|
US11978731B2
(en)
|
2015-09-21 |
2024-05-07 |
Monolithic 3D Inc. |
Method to produce a multi-level semiconductor memory device and structure
|
|
US12250830B2
(en)
|
2015-09-21 |
2025-03-11 |
Monolithic 3D Inc. |
3D semiconductor memory devices and structures
|
|
US12477752B2
(en)
|
2015-09-21 |
2025-11-18 |
Monolithic 3D Inc. |
3D semiconductor memory devices and structures
|
|
US12178055B2
(en)
|
2015-09-21 |
2024-12-24 |
Monolithic 3D Inc. |
3D semiconductor memory devices and structures
|
|
US10522225B1
(en)
|
2015-10-02 |
2019-12-31 |
Monolithic 3D Inc. |
Semiconductor device with non-volatile memory
|
|
US12120880B1
(en)
|
2015-10-24 |
2024-10-15 |
Monolithic 3D Inc. |
3D semiconductor device and structure with logic and memory
|
|
US11114464B2
(en)
|
2015-10-24 |
2021-09-07 |
Monolithic 3D Inc. |
3D semiconductor device and structure
|
|
US12016181B2
(en)
|
2015-10-24 |
2024-06-18 |
Monolithic 3D Inc. |
3D semiconductor device and structure with logic and memory
|
|
US12219769B2
(en)
|
2015-10-24 |
2025-02-04 |
Monolithic 3D Inc. |
3D semiconductor device and structure with logic and memory
|
|
US12035531B2
(en)
|
2015-10-24 |
2024-07-09 |
Monolithic 3D Inc. |
3D semiconductor device and structure with logic and memory
|
|
US10418369B2
(en)
|
2015-10-24 |
2019-09-17 |
Monolithic 3D Inc. |
Multi-level semiconductor memory device and structure
|
|
US10847540B2
(en)
|
2015-10-24 |
2020-11-24 |
Monolithic 3D Inc. |
3D semiconductor memory device and structure
|
|
US11296115B1
(en)
|
2015-10-24 |
2022-04-05 |
Monolithic 3D Inc. |
3D semiconductor device and structure
|
|
US11991884B1
(en)
|
2015-10-24 |
2024-05-21 |
Monolithic 3D Inc. |
3D semiconductor device and structure with logic and memory
|
|
US10739443B2
(en)
|
2015-11-06 |
2020-08-11 |
Artilux, Inc. |
High-speed light sensing apparatus II
|
|
US10741598B2
(en)
|
2015-11-06 |
2020-08-11 |
Atrilux, Inc. |
High-speed light sensing apparatus II
|
|
US10254389B2
(en)
|
2015-11-06 |
2019-04-09 |
Artilux Corporation |
High-speed light sensing apparatus
|
|
US10418407B2
(en)
|
2015-11-06 |
2019-09-17 |
Artilux, Inc. |
High-speed light sensing apparatus III
|
|
US10886309B2
(en)
|
2015-11-06 |
2021-01-05 |
Artilux, Inc. |
High-speed light sensing apparatus II
|
|
US9859382B2
(en)
|
2015-12-04 |
2018-01-02 |
Globalfoundries Inc. |
Integrated CMOS wafers
|
|
US9704958B1
(en)
|
2015-12-18 |
2017-07-11 |
International Business Machines Corporation |
III-V field effect transistor on a dielectric layer
|
|
US10586847B2
(en)
|
2016-01-15 |
2020-03-10 |
Hewlett Packard Enterprise Development Lp |
Multilayer device
|
|
WO2017142482A1
(en)
*
|
2016-02-18 |
2017-08-24 |
Massachusetts Institute Of Technology |
High voltage logic circuit
|
|
CN105676368A
(zh)
*
|
2016-03-18 |
2016-06-15 |
中国电子科技集团公司第五十五研究所 |
一种硅基微环滤波器与磷化铟基光探测器异质集成单片制作方法
|
|
US11088244B2
(en)
|
2016-03-30 |
2021-08-10 |
Hewlett Packard Enterprise Development Lp |
Devices having substrates with selective airgap regions
|
|
CN205944139U
(zh)
|
2016-03-30 |
2017-02-08 |
首尔伟傲世有限公司 |
紫外线发光二极管封装件以及包含此的发光二极管模块
|
|
US10190973B2
(en)
|
2016-03-31 |
2019-01-29 |
Sensor Electronic Technology, Inc. |
Integrated ultraviolet analyzer
|
|
CN107331663B
(zh)
*
|
2016-04-29 |
2021-09-28 |
上海芯晨科技有限公司 |
一种iii族氮化物和硅异质集成衬底及其制作方法
|
|
CN109478533B
(zh)
*
|
2016-05-17 |
2021-09-07 |
香港大学 |
具有单片集成的光电检测器用于原位实时强度监视的发光二极管(led)
|
|
WO2017210300A1
(en)
*
|
2016-06-03 |
2017-12-07 |
The Regents Of The University Of California |
Integration of direct-bandgap optically active devices on indirect-bandgap-based substrates
|
|
JP2019533302A
(ja)
*
|
2016-08-31 |
2019-11-14 |
ジーレイ スイッツァーランド エスアー |
接合インターフェースの電荷輸送で構成される電磁吸収放射線検出器
|
|
US9773893B1
(en)
|
2016-09-26 |
2017-09-26 |
International Business Machines Corporation |
Forming a sacrificial liner for dual channel devices
|
|
US11812620B2
(en)
|
2016-10-10 |
2023-11-07 |
Monolithic 3D Inc. |
3D DRAM memory devices and structures with control circuits
|
|
US11329059B1
(en)
|
2016-10-10 |
2022-05-10 |
Monolithic 3D Inc. |
3D memory devices and structures with thinned single crystal substrates
|
|
US11711928B2
(en)
|
2016-10-10 |
2023-07-25 |
Monolithic 3D Inc. |
3D memory devices and structures with control circuits
|
|
US11869591B2
(en)
|
2016-10-10 |
2024-01-09 |
Monolithic 3D Inc. |
3D memory devices and structures with control circuits
|
|
US11251149B2
(en)
|
2016-10-10 |
2022-02-15 |
Monolithic 3D Inc. |
3D memory device and structure
|
|
US11930648B1
(en)
|
2016-10-10 |
2024-03-12 |
Monolithic 3D Inc. |
3D memory devices and structures with metal layers
|
|
US12225704B2
(en)
|
2016-10-10 |
2025-02-11 |
Monolithic 3D Inc. |
3D memory devices and structures with memory arrays and metal layers
|
|
JP2020513681A
(ja)
*
|
2016-11-11 |
2020-05-14 |
キューエムエイティ・インコーポレーテッド |
層転写によるマイクロ発光ダイオード(led)製造
|
|
JP7079940B2
(ja)
*
|
2017-01-13 |
2022-06-03 |
マサチューセッツ インスティテュート オブ テクノロジー |
ピクセル化ディスプレイ用多層構造体を形成する方法およびピクセル化ディスプレイ用多層構造体
|
|
GB2563278B
(en)
*
|
2017-06-09 |
2022-10-26 |
Univ Southampton |
Optoelectronic device and method of manufacturing thereof
|
|
WO2019052672A1
(en)
*
|
2017-09-18 |
2019-03-21 |
Tty-Säätiö Sr. |
Semiconductor multilayer structure
|
|
US10707308B2
(en)
|
2017-12-24 |
2020-07-07 |
HangZhou HaiCun Information Technology Co., Ltd. |
Hetero-epitaxial output device array
|
|
US11105928B2
(en)
|
2018-02-23 |
2021-08-31 |
Artilux, Inc. |
Light-sensing apparatus and light-sensing method thereof
|
|
JP6975341B2
(ja)
|
2018-02-23 |
2021-12-01 |
アーティラックス・インコーポレイテッド |
光検出装置およびその光検出方法
|
|
TWI758599B
(zh)
|
2018-04-08 |
2022-03-21 |
美商光程研創股份有限公司 |
光偵測裝置
|
|
US10381801B1
(en)
|
2018-04-26 |
2019-08-13 |
Hewlett Packard Enterprise Development Lp |
Device including structure over airgap
|
|
KR102510356B1
(ko)
*
|
2018-05-03 |
2023-03-17 |
오픈라이트 포토닉스, 인크. |
포토닉스와 일렉트로닉스의 이종 통합을 위한 원자 층 퇴적 본딩
|
|
US10854770B2
(en)
|
2018-05-07 |
2020-12-01 |
Artilux, Inc. |
Avalanche photo-transistor
|
|
US10969877B2
(en)
|
2018-05-08 |
2021-04-06 |
Artilux, Inc. |
Display apparatus
|
|
US10690853B2
(en)
|
2018-06-25 |
2020-06-23 |
International Business Machines Corporation |
Optoelectronics integration using semiconductor on insulator substrate
|
|
CN108649048A
(zh)
*
|
2018-07-10 |
2018-10-12 |
南方科技大学 |
一种单片集成半导体器件及其制备方法
|
|
US10903216B2
(en)
|
2018-09-07 |
2021-01-26 |
Samsung Electronics Co., Ltd. |
Semiconductor memory device and method of fabricating the same
|
|
DE102019100521A1
(de)
*
|
2019-01-10 |
2020-07-16 |
Osram Opto Semiconductors Gmbh |
Verfahren zur herstellung eines optoelektronischen bauteils und optoelektronisches bauteil
|
|
US10892016B1
(en)
|
2019-04-08 |
2021-01-12 |
Monolithic 3D Inc. |
3D memory semiconductor devices and structures
|
|
US11763864B2
(en)
|
2019-04-08 |
2023-09-19 |
Monolithic 3D Inc. |
3D memory semiconductor devices and structures with bit-line pillars
|
|
US11158652B1
(en)
|
2019-04-08 |
2021-10-26 |
Monolithic 3D Inc. |
3D memory semiconductor devices and structures
|
|
US11018156B2
(en)
|
2019-04-08 |
2021-05-25 |
Monolithic 3D Inc. |
3D memory semiconductor devices and structures
|
|
US11296106B2
(en)
|
2019-04-08 |
2022-04-05 |
Monolithic 3D Inc. |
3D memory semiconductor devices and structures
|
|
WO2021037857A1
(en)
*
|
2019-08-26 |
2021-03-04 |
Rockley Photonics Limited |
Optical modulator and method of fabricating an optical modulator
|
|
JP7646225B2
(ja)
|
2019-09-27 |
2025-03-17 |
ニュー シリコン コーポレーション プライベート リミテッド |
半導体デバイスを製造する方法およびその半導体デバイス
|
|
KR102721080B1
(ko)
*
|
2019-10-08 |
2024-10-24 |
삼성전자주식회사 |
반도체 장치, 그 제조 방법 및 이를 포함하는 디스플레이 장치
|
|
KR102813369B1
(ko)
|
2019-10-23 |
2025-05-27 |
삼성전자주식회사 |
디스플레이 장치 및 이의 제조 방법
|
|
GB2593693B
(en)
*
|
2020-03-30 |
2022-08-03 |
Plessey Semiconductors Ltd |
LED precursor
|
|
US11340512B2
(en)
*
|
2020-04-27 |
2022-05-24 |
Raytheon Bbn Technologies Corp. |
Integration of electronics with Lithium Niobate photonics
|
|
KR102607828B1
(ko)
*
|
2021-05-28 |
2023-11-29 |
아주대학교산학협력단 |
모놀리식 3차원 집적 회로 및 이의 제조 방법
|
|
US11784189B2
(en)
|
2021-08-20 |
2023-10-10 |
Globalfoundries U.S. Inc. |
Monolithic integration of diverse device types with shared electrical isolation
|