JP2008538655A5 - - Google Patents
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- Publication number
- JP2008538655A5 JP2008538655A5 JP2008507818A JP2008507818A JP2008538655A5 JP 2008538655 A5 JP2008538655 A5 JP 2008538655A5 JP 2008507818 A JP2008507818 A JP 2008507818A JP 2008507818 A JP2008507818 A JP 2008507818A JP 2008538655 A5 JP2008538655 A5 JP 2008538655A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor structure
- gate dielectric
- dielectric layer
- metal
- structure according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 16
- 239000002184 metal Substances 0.000 claims 7
- 229910052751 metal Inorganic materials 0.000 claims 7
- 239000000758 substrate Substances 0.000 claims 3
- 150000001875 compounds Chemical class 0.000 claims 2
- 239000012212 insulator Substances 0.000 claims 2
- 229910052710 silicon Inorganic materials 0.000 claims 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims 1
- 229910000673 Indium arsenide Inorganic materials 0.000 claims 1
- 229910003811 SiGeC Inorganic materials 0.000 claims 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 claims 1
- 229910052732 germanium Inorganic materials 0.000 claims 1
- 229910052735 hafnium Inorganic materials 0.000 claims 1
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229910044991 metal oxide Inorganic materials 0.000 claims 1
- 150000004706 metal oxides Chemical class 0.000 claims 1
- 150000004767 nitrides Chemical class 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- 229910052726 zirconium Inorganic materials 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/907,935 | 2005-04-21 | ||
| US10/907,935 US7504700B2 (en) | 2005-04-21 | 2005-04-21 | Method of forming an ultra-thin [[HfSiO]] metal silicate film for high performance CMOS applications and semiconductor structure formed in said method |
| PCT/US2006/014622 WO2006115914A1 (en) | 2005-04-21 | 2006-04-19 | Ultra-thin hf-doped silicon oxynitride film for high performance cmos applications and method of manufacture |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008538655A JP2008538655A (ja) | 2008-10-30 |
| JP2008538655A5 true JP2008538655A5 (enExample) | 2009-02-19 |
| JP5159609B2 JP5159609B2 (ja) | 2013-03-06 |
Family
ID=37185981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008507818A Expired - Fee Related JP5159609B2 (ja) | 2005-04-21 | 2006-04-19 | 高性能CMOS用途のためのHfドープされた極薄の酸窒化シリコン膜及び製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7504700B2 (enExample) |
| EP (1) | EP1872409A4 (enExample) |
| JP (1) | JP5159609B2 (enExample) |
| CN (1) | CN100550422C (enExample) |
| TW (1) | TW200727479A (enExample) |
| WO (1) | WO2006115914A1 (enExample) |
Families Citing this family (49)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7589029B2 (en) | 2002-05-02 | 2009-09-15 | Micron Technology, Inc. | Atomic layer deposition and conversion |
| US7588988B2 (en) | 2004-08-31 | 2009-09-15 | Micron Technology, Inc. | Method of forming apparatus having oxide films formed using atomic layer deposition |
| US7820538B2 (en) * | 2005-04-21 | 2010-10-26 | Freescale Semiconductor, Inc. | Method of fabricating a MOS device with non-SiO2 gate dielectric |
| US7662729B2 (en) | 2005-04-28 | 2010-02-16 | Micron Technology, Inc. | Atomic layer deposition of a ruthenium layer to a lanthanide oxide dielectric layer |
| US7927948B2 (en) | 2005-07-20 | 2011-04-19 | Micron Technology, Inc. | Devices with nanocrystals and methods of formation |
| US7799668B2 (en) * | 2005-08-17 | 2010-09-21 | Texas Instruments Incorporated | Formation of uniform silicate gate dielectrics |
| US8110469B2 (en) * | 2005-08-30 | 2012-02-07 | Micron Technology, Inc. | Graded dielectric layers |
| US8053849B2 (en) * | 2005-11-09 | 2011-11-08 | Advanced Micro Devices, Inc. | Replacement metal gate transistors with reduced gate oxide leakage |
| JP5039396B2 (ja) * | 2007-02-19 | 2012-10-03 | ローム株式会社 | 半導体装置の製造方法 |
| KR100877100B1 (ko) * | 2007-04-16 | 2009-01-09 | 주식회사 하이닉스반도체 | 비휘발성 메모리 소자 제조 방법 |
| JP2008288364A (ja) * | 2007-05-17 | 2008-11-27 | Sony Corp | 半導体装置および半導体装置の製造方法 |
| US9449831B2 (en) | 2007-05-25 | 2016-09-20 | Cypress Semiconductor Corporation | Oxide-nitride-oxide stack having multiple oxynitride layers |
| US8633537B2 (en) | 2007-05-25 | 2014-01-21 | Cypress Semiconductor Corporation | Memory transistor with multiple charge storing layers and a high work function gate electrode |
| US8940645B2 (en) | 2007-05-25 | 2015-01-27 | Cypress Semiconductor Corporation | Radical oxidation process for fabricating a nonvolatile charge trap memory device |
| US8283261B2 (en) * | 2007-05-25 | 2012-10-09 | Cypress Semiconductor Corporation | Radical oxidation process for fabricating a nonvolatile charge trap memory device |
| US20090179253A1 (en) | 2007-05-25 | 2009-07-16 | Cypress Semiconductor Corporation | Oxide-nitride-oxide stack having multiple oxynitride layers |
| US8063434B1 (en) | 2007-05-25 | 2011-11-22 | Cypress Semiconductor Corporation | Memory transistor with multiple charge storing layers and a high work function gate electrode |
| US7632745B2 (en) * | 2007-06-30 | 2009-12-15 | Intel Corporation | Hybrid high-k gate dielectric film |
| JP5349903B2 (ja) * | 2008-02-28 | 2013-11-20 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法および半導体装置 |
| US20100102393A1 (en) * | 2008-10-29 | 2010-04-29 | Chartered Semiconductor Manufacturing, Ltd. | Metal gate transistors |
| KR101049875B1 (ko) * | 2008-11-18 | 2011-07-19 | 주식회사 동부하이텍 | 반도체 소자 및 그의 제조 방법 |
| CN101752237B (zh) | 2008-12-16 | 2012-08-08 | 国际商业机器公司 | 在半导体器件中形成高k栅极叠层的方法 |
| KR101589440B1 (ko) | 2009-02-09 | 2016-01-29 | 삼성전자주식회사 | 듀얼 게이트 반도체 장치의 제조 방법 |
| US8026539B2 (en) * | 2009-02-18 | 2011-09-27 | Globalfoundries Inc. | Metal oxide semiconductor devices having doped silicon-compromising capping layers and methods for fabricating the same |
| US8048791B2 (en) * | 2009-02-23 | 2011-11-01 | Globalfoundries Inc. | Method of forming a semiconductor device |
| US20100213555A1 (en) * | 2009-02-23 | 2010-08-26 | Advanced Micro Devices, Inc. | Metal oxide semiconductor devices having capping layers and methods for fabricating the same |
| US7943457B2 (en) * | 2009-04-14 | 2011-05-17 | International Business Machines Corporation | Dual metal and dual dielectric integration for metal high-k FETs |
| JP5375362B2 (ja) * | 2009-06-24 | 2013-12-25 | 富士通セミコンダクター株式会社 | 半導体装置の製造方法 |
| DE102009031155B4 (de) * | 2009-06-30 | 2012-02-23 | GLOBALFOUNDRIES Dresden Module One Ltd. Liability Company & Co. KG | Einstellen einer Schwellwertspannung für komplexe Transistoren durch Diffundieren einer Metallsorte in das Gatedielektrikum vor der Gatestrukturierung |
| US20110065287A1 (en) * | 2009-09-11 | 2011-03-17 | Tokyo Electron Limited | Pulsed chemical vapor deposition of metal-silicon-containing films |
| KR20120054660A (ko) * | 2009-11-04 | 2012-05-30 | 가부시끼가이샤 도시바 | 불휘발성 반도체 기억 장치 |
| US8598027B2 (en) | 2010-01-20 | 2013-12-03 | International Business Machines Corporation | High-K transistors with low threshold voltage |
| US8343865B2 (en) * | 2010-01-21 | 2013-01-01 | Renesas Electronics Corporation | Semiconductor device having dual work function metal |
| US20120273861A1 (en) * | 2011-04-29 | 2012-11-01 | Shanghan Institute Of Microsystem And Imformation Technology,Chinese Academ | Method of depositing gate dielectric, method of preparing mis capacitor, and mis capacitor |
| US8633118B2 (en) * | 2012-02-01 | 2014-01-21 | Tokyo Electron Limited | Method of forming thin metal and semi-metal layers by thermal remote oxygen scavenging |
| US8921176B2 (en) * | 2012-06-11 | 2014-12-30 | Freescale Semiconductor, Inc. | Modified high-K gate dielectric stack |
| CN109755135A (zh) * | 2012-07-01 | 2019-05-14 | 赛普拉斯半导体公司 | 用于制造非易失性电荷俘获存储器装置的自由基氧化工艺 |
| KR101934829B1 (ko) * | 2012-10-23 | 2019-03-18 | 삼성전자 주식회사 | 반도체 장치 및 반도체 장치의 제조 방법 |
| KR102392059B1 (ko) | 2013-07-29 | 2022-04-28 | 삼성전자주식회사 | 반도체 소자 및 그 제조 방법 |
| US9070634B1 (en) * | 2013-12-26 | 2015-06-30 | Macronix International Co., Ltd. | Semiconductor device comprising a surface portion implanted with nitrogen and fluorine |
| US9673108B1 (en) | 2015-12-14 | 2017-06-06 | International Business Machines Corporation | Fabrication of higher-K dielectrics |
| CN107516631B (zh) * | 2016-06-15 | 2019-11-05 | 中芯国际集成电路制造(上海)有限公司 | 半导体器件的形成方法 |
| CN107591437B (zh) * | 2016-07-07 | 2020-03-10 | 中芯国际集成电路制造(上海)有限公司 | 半导体器件的形成方法 |
| CN108630538A (zh) * | 2017-03-17 | 2018-10-09 | 中芯国际集成电路制造(上海)有限公司 | 一种半导体器件及其制造方法和电子装置 |
| US10109639B1 (en) * | 2017-06-09 | 2018-10-23 | International Business Machines Corporation | Lateral non-volatile storage cell |
| CN107863349A (zh) * | 2017-10-17 | 2018-03-30 | 安阳师范学院 | 基于HfxSi1‑xO2多元氧化物存储材料的电荷存储器件及其制备方法 |
| CN112005380B (zh) * | 2018-04-06 | 2024-06-21 | 应用材料公司 | 用于三维结构的保形掺杂的方法 |
| US10629499B2 (en) | 2018-06-13 | 2020-04-21 | International Business Machines Corporation | Method and structure for forming a vertical field-effect transistor using a replacement metal gate process |
| JP7189848B2 (ja) * | 2019-08-07 | 2022-12-14 | 株式会社東芝 | 半導体装置およびその製造方法 |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5661165A (en) * | 1979-10-24 | 1981-05-26 | Fujitsu Ltd | Control of threshold voltage of transistor |
| DE19622600C2 (de) * | 1996-06-05 | 2001-08-02 | Fraunhofer Ges Forschung | Elektrochrome Einheit |
| JPH11135774A (ja) * | 1997-07-24 | 1999-05-21 | Texas Instr Inc <Ti> | 高誘電率シリケート・ゲート誘電体 |
| US6004850A (en) * | 1998-02-23 | 1999-12-21 | Motorola Inc. | Tantalum oxide anti-reflective coating (ARC) integrated with a metallic transistor gate electrode and method of formation |
| US6172407B1 (en) * | 1998-04-16 | 2001-01-09 | Advanced Micro Devices, Inc. | Source/drain and lightly doped drain formation at post interlevel dielectric isolation with high-K gate electrode design |
| US6518156B1 (en) * | 1999-03-29 | 2003-02-11 | Hewlett-Packard Company | Configurable nanoscale crossbar electronic circuits made by electrochemical reaction |
| US6194748B1 (en) * | 1999-05-03 | 2001-02-27 | Advanced Micro Devices, Inc. | MOSFET with suppressed gate-edge fringing field effect |
| US6376349B1 (en) * | 2000-01-19 | 2002-04-23 | Motorola, Inc. | Process for forming a semiconductor device and a conductive structure |
| US6184072B1 (en) * | 2000-05-17 | 2001-02-06 | Motorola, Inc. | Process for forming a high-K gate dielectric |
| TW531803B (en) * | 2000-08-31 | 2003-05-11 | Agere Syst Guardian Corp | Electronic circuit structure with improved dielectric properties |
| CN100442454C (zh) | 2000-09-19 | 2008-12-10 | 马特森技术公司 | 形成介电薄膜的方法 |
| US6562718B1 (en) | 2000-12-06 | 2003-05-13 | Advanced Micro Devices, Inc. | Process for forming fully silicided gates |
| US6475874B2 (en) | 2000-12-07 | 2002-11-05 | Advanced Micro Devices, Inc. | Damascene NiSi metal gate high-k transistor |
| US6342414B1 (en) * | 2000-12-12 | 2002-01-29 | Advanced Micro Devices, Inc. | Damascene NiSi metal gate high-k transistor |
| JP2002184973A (ja) * | 2000-12-11 | 2002-06-28 | Hitachi Ltd | 半導体装置及びその製造方法 |
| JP3944367B2 (ja) * | 2001-02-06 | 2007-07-11 | 松下電器産業株式会社 | 絶縁膜の形成方法及び半導体装置の製造方法 |
| JP4184686B2 (ja) * | 2001-03-28 | 2008-11-19 | 株式会社東芝 | 半導体装置の製造方法 |
| US6420279B1 (en) | 2001-06-28 | 2002-07-16 | Sharp Laboratories Of America, Inc. | Methods of using atomic layer deposition to deposit a high dielectric constant material on a substrate |
| US7164169B2 (en) * | 2001-08-23 | 2007-01-16 | Nec Corporation | Semiconductor device having high-permittivity insulation film and production method therefor |
| JP3688631B2 (ja) * | 2001-11-22 | 2005-08-31 | 株式会社東芝 | 半導体装置の製造方法 |
| US6504214B1 (en) * | 2002-01-11 | 2003-01-07 | Advanced Micro Devices, Inc. | MOSFET device having high-K dielectric layer |
| US6797525B2 (en) * | 2002-05-22 | 2004-09-28 | Agere Systems Inc. | Fabrication process for a semiconductor device having a metal oxide dielectric material with a high dielectric constant, annealed with a buffered anneal process |
| JP4004040B2 (ja) * | 2002-09-05 | 2007-11-07 | 株式会社東芝 | 半導体装置 |
| US6624093B1 (en) | 2002-10-09 | 2003-09-23 | Wisys Technology Foundation | Method of producing high dielectric insulator for integrated circuit |
| JP4574951B2 (ja) * | 2003-02-26 | 2010-11-04 | 株式会社東芝 | 半導体装置及びその製造方法 |
| JP2005045166A (ja) * | 2003-07-25 | 2005-02-17 | Toshiba Corp | 半導体装置及びその製造方法 |
| JP3790242B2 (ja) * | 2003-09-26 | 2006-06-28 | 株式会社東芝 | 半導体装置及びその製造方法 |
| US20050224897A1 (en) * | 2004-03-26 | 2005-10-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | High-K gate dielectric stack with buffer layer to improve threshold voltage characteristics |
-
2005
- 2005-04-21 US US10/907,935 patent/US7504700B2/en not_active Expired - Lifetime
-
2006
- 2006-04-07 TW TW095112383A patent/TW200727479A/zh unknown
- 2006-04-19 EP EP06750619A patent/EP1872409A4/en not_active Withdrawn
- 2006-04-19 WO PCT/US2006/014622 patent/WO2006115914A1/en not_active Ceased
- 2006-04-19 JP JP2008507818A patent/JP5159609B2/ja not_active Expired - Fee Related
- 2006-04-19 CN CNB2006800115140A patent/CN100550422C/zh not_active Expired - Fee Related