JP2007513517A5 - - Google Patents

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Publication number
JP2007513517A5
JP2007513517A5 JP2006542572A JP2006542572A JP2007513517A5 JP 2007513517 A5 JP2007513517 A5 JP 2007513517A5 JP 2006542572 A JP2006542572 A JP 2006542572A JP 2006542572 A JP2006542572 A JP 2006542572A JP 2007513517 A5 JP2007513517 A5 JP 2007513517A5
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JP
Japan
Prior art keywords
layer
base layer
strained
forming
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006542572A
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English (en)
Japanese (ja)
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JP2007513517A (ja
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Publication date
Priority claimed from US10/729,479 external-priority patent/US7144818B2/en
Application filed filed Critical
Publication of JP2007513517A publication Critical patent/JP2007513517A/ja
Publication of JP2007513517A5 publication Critical patent/JP2007513517A5/ja
Pending legal-status Critical Current

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JP2006542572A 2003-12-05 2004-10-26 歪み半導体基板およびその製造プロセス Pending JP2007513517A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/729,479 US7144818B2 (en) 2003-12-05 2003-12-05 Semiconductor substrate and processes therefor
PCT/US2004/035417 WO2005062357A1 (en) 2003-12-05 2004-10-26 Strained semiconductor substrate and processes therefor

Publications (2)

Publication Number Publication Date
JP2007513517A JP2007513517A (ja) 2007-05-24
JP2007513517A5 true JP2007513517A5 (enExample) 2007-12-13

Family

ID=34633951

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006542572A Pending JP2007513517A (ja) 2003-12-05 2004-10-26 歪み半導体基板およびその製造プロセス

Country Status (7)

Country Link
US (2) US7144818B2 (enExample)
EP (1) EP1690288A1 (enExample)
JP (1) JP2007513517A (enExample)
KR (1) KR101086896B1 (enExample)
CN (1) CN1890784B (enExample)
TW (1) TWI369737B (enExample)
WO (1) WO2005062357A1 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070020860A1 (en) * 2003-06-26 2007-01-25 Rj Mears, Llc Method for Making Semiconductor Device Including a Strained Superlattice and Overlying Stress Layer and Related Methods
US20070015344A1 (en) * 2003-06-26 2007-01-18 Rj Mears, Llc Method for Making a Semiconductor Device Including a Strained Superlattice Between at Least One Pair of Spaced Apart Stress Regions
US20070063185A1 (en) * 2003-06-26 2007-03-22 Rj Mears, Llc Semiconductor device including a front side strained superlattice layer and a back side stress layer
US7531828B2 (en) * 2003-06-26 2009-05-12 Mears Technologies, Inc. Semiconductor device including a strained superlattice between at least one pair of spaced apart stress regions
US7598515B2 (en) * 2003-06-26 2009-10-06 Mears Technologies, Inc. Semiconductor device including a strained superlattice and overlying stress layer and related methods
US20070020833A1 (en) * 2003-06-26 2007-01-25 Rj Mears, Llc Method for Making a Semiconductor Device Including a Channel with a Non-Semiconductor Layer Monolayer
US7612366B2 (en) * 2003-06-26 2009-11-03 Mears Technologies, Inc. Semiconductor device including a strained superlattice layer above a stress layer
US20070010040A1 (en) * 2003-06-26 2007-01-11 Rj Mears, Llc Method for Making a Semiconductor Device Including a Strained Superlattice Layer Above a Stress Layer
US20070063186A1 (en) * 2003-06-26 2007-03-22 Rj Mears, Llc Method for making a semiconductor device including a front side strained superlattice layer and a back side stress layer
US7144818B2 (en) * 2003-12-05 2006-12-05 Advanced Micro Devices, Inc. Semiconductor substrate and processes therefor
JP2009500870A (ja) * 2005-07-15 2009-01-08 メアーズ テクノロジーズ， インコーポレイテッド 応力層上に歪み超格子層を含む半導体デバイス、及びその製造方法
DE102006007293B4 (de) 2006-01-31 2023-04-06 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zum Herstellen eines Quasi-Substratwafers und ein unter Verwendung eines solchen Quasi-Substratwafers hergestellter Halbleiterkörper
JP5055846B2 (ja) * 2006-06-09 2012-10-24 ソニー株式会社 半導体装置およびその製造方法
US9496227B2 (en) 2009-07-15 2016-11-15 Qualcomm Incorporated Semiconductor-on-insulator with back side support layer
US9390974B2 (en) 2012-12-21 2016-07-12 Qualcomm Incorporated Back-to-back stacked integrated circuit assembly and method of making
US9466719B2 (en) 2009-07-15 2016-10-11 Qualcomm Incorporated Semiconductor-on-insulator with back side strain topology
US8912646B2 (en) 2009-07-15 2014-12-16 Silanna Semiconductor U.S.A., Inc. Integrated circuit assembly and method of making
EP2454752B1 (en) * 2009-07-15 2015-09-09 Silanna Semiconductor U.S.A., Inc. Semiconductor-on-insulator with backside heat dissipation
CN102420253A (zh) * 2011-12-13 2012-04-18 清华大学 一种背面嵌入应变介质区的vdmos器件及其制备方法
US9515181B2 (en) 2014-08-06 2016-12-06 Qualcomm Incorporated Semiconductor device with self-aligned back side features
CN111883418B (zh) * 2020-08-05 2021-04-27 长江存储科技有限责任公司 半导体结构的制造方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58138033A (ja) * 1982-02-10 1983-08-16 Toshiba Corp 半導体基板及び半導体装置の製造方法
JPS61181931A (ja) 1985-02-08 1986-08-14 Fuji Electric Co Ltd 圧覚センサ
JPH03201536A (ja) * 1989-12-28 1991-09-03 Mitsubishi Electric Corp 半導体装置の製造方法
JP2803321B2 (ja) 1990-04-27 1998-09-24 株式会社デンソー 半導体感歪センサ
US5294559A (en) * 1990-07-30 1994-03-15 Texas Instruments Incorporated Method of forming a vertical transistor
JP2728310B2 (ja) * 1990-07-30 1998-03-18 シャープ株式会社 半導体ウェーハーのゲッタリング方法
JPH04245640A (ja) 1991-01-31 1992-09-02 Kawasaki Steel Corp 半導体基板の加工方法
JP2824818B2 (ja) * 1991-08-02 1998-11-18 キヤノン株式会社 アクティブマトリックス液晶表示装置
JPH05198783A (ja) 1992-01-23 1993-08-06 Hitachi Ltd 半導体集積回路装置の製造方法
US6191432B1 (en) * 1996-09-02 2001-02-20 Kabushiki Kaisha Toshiba Semiconductor device and memory device
US20020046985A1 (en) * 2000-03-24 2002-04-25 Daneman Michael J. Process for creating an electrically isolated electrode on a sidewall of a cavity in a base
US6593191B2 (en) * 2000-05-26 2003-07-15 Amberwave Systems Corporation Buried channel strained silicon FET using a supply layer created through ion implantation
US6580124B1 (en) * 2000-08-14 2003-06-17 Matrix Semiconductor Inc. Multigate semiconductor device with vertical channel current and method of fabrication
US6835246B2 (en) * 2001-11-16 2004-12-28 Saleem H. Zaidi Nanostructures for hetero-expitaxial growth on silicon substrates
US6900521B2 (en) * 2002-06-10 2005-05-31 Micron Technology, Inc. Vertical transistors and output prediction logic circuits containing same
US6707106B1 (en) * 2002-10-18 2004-03-16 Advanced Micro Devices, Inc. Semiconductor device with tensile strain silicon introduced by compressive material in a buried oxide layer
JP2004228273A (ja) * 2003-01-22 2004-08-12 Renesas Technology Corp 半導体装置
US6803631B2 (en) * 2003-01-23 2004-10-12 Advanced Micro Devices, Inc. Strained channel finfet
US7144818B2 (en) * 2003-12-05 2006-12-05 Advanced Micro Devices, Inc. Semiconductor substrate and processes therefor

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