JP2006210745A5 - - Google Patents

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Publication number
JP2006210745A5
JP2006210745A5 JP2005022478A JP2005022478A JP2006210745A5 JP 2006210745 A5 JP2006210745 A5 JP 2006210745A5 JP 2005022478 A JP2005022478 A JP 2005022478A JP 2005022478 A JP2005022478 A JP 2005022478A JP 2006210745 A5 JP2006210745 A5 JP 2006210745A5
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electrode
semiconductor chip
electrode pad
concave
main surface
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JP2005022478A
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Japanese (ja)
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JP2006210745A (ja
JP4409455B2 (ja
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Priority to JP2005022478A priority Critical patent/JP4409455B2/ja
Priority claimed from JP2005022478A external-priority patent/JP4409455B2/ja
Priority to US11/329,600 priority patent/US7291929B2/en
Publication of JP2006210745A publication Critical patent/JP2006210745A/ja
Publication of JP2006210745A5 publication Critical patent/JP2006210745A5/ja
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Expired - Fee Related legal-status Critical Current

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JP2005022478A 2005-01-31 2005-01-31 半導体装置の製造方法 Expired - Fee Related JP4409455B2 (ja)

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Application Number Priority Date Filing Date Title
JP2005022478A JP4409455B2 (ja) 2005-01-31 2005-01-31 半導体装置の製造方法
US11/329,600 US7291929B2 (en) 2005-01-31 2006-01-10 Semiconductor device and method of manufacturing thereof

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Application Number Priority Date Filing Date Title
JP2005022478A JP4409455B2 (ja) 2005-01-31 2005-01-31 半導体装置の製造方法

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JP2006210745A JP2006210745A (ja) 2006-08-10
JP2006210745A5 true JP2006210745A5 (enExample) 2007-05-31
JP4409455B2 JP4409455B2 (ja) 2010-02-03

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JP2005022478A Expired - Fee Related JP4409455B2 (ja) 2005-01-31 2005-01-31 半導体装置の製造方法

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US (1) US7291929B2 (enExample)
JP (1) JP4409455B2 (enExample)

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