FR3041625B1 - Dispositif de fixation de deux elements tels qu'une puce, un interposeur et un support - Google Patents

Dispositif de fixation de deux elements tels qu'une puce, un interposeur et un support Download PDF

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Publication number
FR3041625B1
FR3041625B1 FR1559213A FR1559213A FR3041625B1 FR 3041625 B1 FR3041625 B1 FR 3041625B1 FR 1559213 A FR1559213 A FR 1559213A FR 1559213 A FR1559213 A FR 1559213A FR 3041625 B1 FR3041625 B1 FR 3041625B1
Authority
FR
France
Prior art keywords
fixing
elements
stud
interposer
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1559213A
Other languages
English (en)
Other versions
FR3041625A1 (fr
Inventor
Valerie Volant
Olivier Gigan
Jacques Leclerc
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tronics Microsystems SA
Original Assignee
Tronics Microsystems SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tronics Microsystems SA filed Critical Tronics Microsystems SA
Priority to FR1559213A priority Critical patent/FR3041625B1/fr
Priority to US15/753,615 priority patent/US20200198962A1/en
Priority to PCT/EP2016/070993 priority patent/WO2017055029A1/fr
Priority to JP2018511203A priority patent/JP2018529532A/ja
Priority to EP16769883.6A priority patent/EP3356287A1/fr
Publication of FR3041625A1 publication Critical patent/FR3041625A1/fr
Application granted granted Critical
Publication of FR3041625B1 publication Critical patent/FR3041625B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0045—Packages or encapsulation for reducing stress inside of the package structure
    • B81B7/0048—Packages or encapsulation for reducing stress inside of the package structure between the MEMS die and the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H01L2224/32147—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked the layer connector connecting to a bonding area disposed in a recess of the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H01L2224/32148—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked the layer connector connecting to a bonding area protruding from the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Abstract

L'invention concerne un dispositif de fixation de deux éléments (11-12) tels qu'une puce, un interposeur et un support dont un au moins des deux éléments (11-12) est micro fabriqué, le dispositif comportant : - au moins un plot (25) saillant et structuré dans un premier élément (11) s'étendant en regard du deuxième élément (12), - le plot (25) étant configuré pour créer une zone de fixation (16) entre une extrémité (27) du plot (25) et le deuxième élément (12), - une couche de fixation (14) déposée dans la zone de fixation (16) de sorte à fixer le plot (25) avec le deuxième élément (12), et - une cavité (30) réalisée au niveau de la zone de fixation (16) de sorte que la couche de fixation (14) s'étende au moins en partie à l'intérieur de la cavité (30).
FR1559213A 2015-09-29 2015-09-29 Dispositif de fixation de deux elements tels qu'une puce, un interposeur et un support Active FR3041625B1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR1559213A FR3041625B1 (fr) 2015-09-29 2015-09-29 Dispositif de fixation de deux elements tels qu'une puce, un interposeur et un support
US15/753,615 US20200198962A1 (en) 2015-09-29 2016-09-06 Device for Attaching Two Elements Such as a Chip, an Interposer and a Support
PCT/EP2016/070993 WO2017055029A1 (fr) 2015-09-29 2016-09-06 Dispositif de fixation de deux elements tels qu'une puce, un interposeur et un support
JP2018511203A JP2018529532A (ja) 2015-09-29 2016-09-06 チップ、インターポーザおよび支持体などの２つの要素を付着させるための装置
EP16769883.6A EP3356287A1 (fr) 2015-09-29 2016-09-06 Dispositif de fixation de deux elements tels qu'une puce, un interposeur et un support

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1559213A FR3041625B1 (fr) 2015-09-29 2015-09-29 Dispositif de fixation de deux elements tels qu'une puce, un interposeur et un support

Publications (2)

Publication Number Publication Date
FR3041625A1 FR3041625A1 (fr) 2017-03-31
FR3041625B1 true FR3041625B1 (fr) 2021-07-30

Family

ID=55299585

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1559213A Active FR3041625B1 (fr) 2015-09-29 2015-09-29 Dispositif de fixation de deux elements tels qu'une puce, un interposeur et un support

Country Status (5)

Country Link
US (1) US20200198962A1 (fr)
EP (1) EP3356287A1 (fr)
JP (1) JP2018529532A (fr)
FR (1) FR3041625B1 (fr)
WO (1) WO2017055029A1 (fr)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2555412A (en) 2016-10-25 2018-05-02 Atlantic Inertial Systems Ltd Inertial sensor
CN108279320B (zh) * 2018-02-09 2020-12-04 中北大学 一种基于Fano共振纳米光波导加速度计制备方法

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Also Published As

Publication number Publication date
WO2017055029A1 (fr) 2017-04-06
FR3041625A1 (fr) 2017-03-31
JP2018529532A (ja) 2018-10-11
EP3356287A1 (fr) 2018-08-08
US20200198962A1 (en) 2020-06-25

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