JP2006121101A5 - - Google Patents
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- Publication number
- JP2006121101A5 JP2006121101A5 JP2005349782A JP2005349782A JP2006121101A5 JP 2006121101 A5 JP2006121101 A5 JP 2006121101A5 JP 2005349782 A JP2005349782 A JP 2005349782A JP 2005349782 A JP2005349782 A JP 2005349782A JP 2006121101 A5 JP2006121101 A5 JP 2006121101A5
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- Prior art keywords
- product
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- dequest
- systems
- wafers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 235000012431 wafers Nutrition 0.000 description 3
- 229920002873 Polyethylenimine Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- XGDRLCRGKUCBQL-UHFFFAOYSA-N 1h-imidazole-4,5-dicarbonitrile Chemical compound N#CC=1N=CNC=1C#N XGDRLCRGKUCBQL-UHFFFAOYSA-N 0.000 description 1
- XUSNPFGLKGCWGN-UHFFFAOYSA-N 3-[4-(3-aminopropyl)piperazin-1-yl]propan-1-amine Chemical compound NCCCN1CCN(CCCN)CC1 XUSNPFGLKGCWGN-UHFFFAOYSA-N 0.000 description 1
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229920013808 TRITON DF-16 Polymers 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- YDONNITUKPKTIG-UHFFFAOYSA-N [Nitrilotris(methylene)]trisphosphonic acid Chemical compound OP(O)(=O)CN(CP(O)(O)=O)CP(O)(O)=O YDONNITUKPKTIG-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- WOWHHFRSBJGXCM-UHFFFAOYSA-M cetyltrimethylammonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCC[N+](C)(C)C WOWHHFRSBJGXCM-UHFFFAOYSA-M 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14881399P | 1999-08-13 | 1999-08-13 | |
| US60/148,813 | 1999-08-13 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001517628A Division JP4391715B2 (ja) | 1999-08-13 | 2000-08-10 | 化学機械的研磨系 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009102674A Division JP5384994B2 (ja) | 1999-08-13 | 2009-04-21 | 停止化合物を伴う化学機械的研磨系及びその使用方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006121101A JP2006121101A (ja) | 2006-05-11 |
| JP2006121101A5 true JP2006121101A5 (enExample) | 2008-08-28 |
| JP4851174B2 JP4851174B2 (ja) | 2012-01-11 |
Family
ID=22527505
Family Applications (5)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001517629A Expired - Lifetime JP4188598B2 (ja) | 1999-08-13 | 2000-08-10 | 停止化合物を伴う研磨系及びその使用方法 |
| JP2001517628A Expired - Lifetime JP4391715B2 (ja) | 1999-08-13 | 2000-08-10 | 化学機械的研磨系 |
| JP2005349782A Expired - Lifetime JP4851174B2 (ja) | 1999-08-13 | 2005-12-02 | 研磨系 |
| JP2006104616A Expired - Lifetime JP4723409B2 (ja) | 1999-08-13 | 2006-04-05 | 研磨組成物、研磨系及び研磨方法 |
| JP2009102674A Expired - Lifetime JP5384994B2 (ja) | 1999-08-13 | 2009-04-21 | 停止化合物を伴う化学機械的研磨系及びその使用方法 |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001517629A Expired - Lifetime JP4188598B2 (ja) | 1999-08-13 | 2000-08-10 | 停止化合物を伴う研磨系及びその使用方法 |
| JP2001517628A Expired - Lifetime JP4391715B2 (ja) | 1999-08-13 | 2000-08-10 | 化学機械的研磨系 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006104616A Expired - Lifetime JP4723409B2 (ja) | 1999-08-13 | 2006-04-05 | 研磨組成物、研磨系及び研磨方法 |
| JP2009102674A Expired - Lifetime JP5384994B2 (ja) | 1999-08-13 | 2009-04-21 | 停止化合物を伴う化学機械的研磨系及びその使用方法 |
Country Status (14)
| Country | Link |
|---|---|
| US (1) | US6852632B2 (enExample) |
| EP (3) | EP1218465B1 (enExample) |
| JP (5) | JP4188598B2 (enExample) |
| KR (2) | KR100590664B1 (enExample) |
| CN (2) | CN100335580C (enExample) |
| AT (2) | ATE360051T1 (enExample) |
| AU (2) | AU6632100A (enExample) |
| CA (2) | CA2378790A1 (enExample) |
| DE (2) | DE60034474T2 (enExample) |
| HK (2) | HK1046422A1 (enExample) |
| IL (2) | IL147236A0 (enExample) |
| MY (2) | MY139997A (enExample) |
| TW (2) | TW500784B (enExample) |
| WO (2) | WO2001012741A1 (enExample) |
Families Citing this family (96)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US20030003747A1 (en) * | 2001-06-29 | 2003-01-02 | Jae Hong Kim | Chemical mechanical polishing slurry for ruthenium titanium nitride and polishing process using the same |
| SG144688A1 (en) * | 2001-07-23 | 2008-08-28 | Fujimi Inc | Polishing composition and polishing method employing it |
| US20050028449A1 (en) * | 2001-09-03 | 2005-02-10 | Norihiko Miyata | Polishing composition |
| US6805812B2 (en) | 2001-10-11 | 2004-10-19 | Cabot Microelectronics Corporation | Phosphono compound-containing polishing composition and method of using same |
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- 2000-08-10 IL IL14723600A patent/IL147236A0/xx unknown
- 2000-08-10 DE DE60034474T patent/DE60034474T2/de not_active Expired - Lifetime
- 2000-08-10 HK HK02108002.7A patent/HK1046422A1/zh unknown
- 2000-08-10 EP EP00952726A patent/EP1218465B1/en not_active Expired - Lifetime
- 2000-08-10 CA CA002378790A patent/CA2378790A1/en not_active Abandoned
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