JP2006245598A5 - - Google Patents
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- Publication number
- JP2006245598A5 JP2006245598A5 JP2006104616A JP2006104616A JP2006245598A5 JP 2006245598 A5 JP2006245598 A5 JP 2006245598A5 JP 2006104616 A JP2006104616 A JP 2006104616A JP 2006104616 A JP2006104616 A JP 2006104616A JP 2006245598 A5 JP2006245598 A5 JP 2006245598A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- substrate
- abrasive
- layer
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 24
- 239000000203 mixture Substances 0.000 claims description 16
- 150000001875 compounds Chemical class 0.000 claims description 15
- 239000010949 copper Substances 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000000654 additive Substances 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 230000000996 additive effect Effects 0.000 claims description 4
- 229910052715 tantalum Inorganic materials 0.000 claims description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical group [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 6
- 239000007788 liquid Substances 0.000 claims 5
- 239000000377 silicon dioxide Substances 0.000 claims 3
- -1 thiomicamine Chemical compound 0.000 claims 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims 2
- 229910019142 PO4 Inorganic materials 0.000 claims 2
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 claims 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 2
- YBMRDBCBODYGJE-UHFFFAOYSA-N germanium dioxide Chemical compound O=[Ge]=O YBMRDBCBODYGJE-UHFFFAOYSA-N 0.000 claims 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 claims 2
- 239000007800 oxidant agent Substances 0.000 claims 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims 2
- 239000010452 phosphate Substances 0.000 claims 2
- 238000007517 polishing process Methods 0.000 claims 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 claims 2
- 150000003839 salts Chemical class 0.000 claims 2
- 235000012239 silicon dioxide Nutrition 0.000 claims 2
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 claims 2
- LSRUBRSFDNKORM-UHFFFAOYSA-N 1,1-diaminopropan-1-ol Chemical compound CCC(N)(N)O LSRUBRSFDNKORM-UHFFFAOYSA-N 0.000 claims 1
- JPIGSMKDJQPHJC-UHFFFAOYSA-N 1-(2-aminoethoxy)ethanol Chemical compound CC(O)OCCN JPIGSMKDJQPHJC-UHFFFAOYSA-N 0.000 claims 1
- JCBPETKZIGVZRE-UHFFFAOYSA-N 2-aminobutan-1-ol Chemical compound CCC(N)CO JCBPETKZIGVZRE-UHFFFAOYSA-N 0.000 claims 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 claims 1
- KDXKERNSBIXSRK-YFKPBYRVSA-N L-lysine Chemical compound NCCCC[C@H](N)C(O)=O KDXKERNSBIXSRK-YFKPBYRVSA-N 0.000 claims 1
- KDXKERNSBIXSRK-UHFFFAOYSA-N Lysine Natural products NCCCCC(N)C(O)=O KDXKERNSBIXSRK-UHFFFAOYSA-N 0.000 claims 1
- 239000004472 Lysine Substances 0.000 claims 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 239000003125 aqueous solvent Substances 0.000 claims 1
- 150000001735 carboxylic acids Chemical class 0.000 claims 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 claims 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical group [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 claims 1
- 235000011180 diphosphates Nutrition 0.000 claims 1
- AXEYWFGSQDLHDX-UHFFFAOYSA-N hexane-1,3,6-triamine Chemical compound NCCCC(N)CCN AXEYWFGSQDLHDX-UHFFFAOYSA-N 0.000 claims 1
- 229910044991 metal oxide Inorganic materials 0.000 claims 1
- 150000004706 metal oxides Chemical class 0.000 claims 1
- ITZPOSYADVYECJ-UHFFFAOYSA-N n'-cyclohexylpropane-1,3-diamine Chemical compound NCCCNC1CCCCC1 ITZPOSYADVYECJ-UHFFFAOYSA-N 0.000 claims 1
- 150000002978 peroxides Chemical group 0.000 claims 1
- 150000003009 phosphonic acids Chemical class 0.000 claims 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 claims 1
- 150000003627 tricarboxylic acid derivatives Chemical class 0.000 claims 1
- 235000011178 triphosphate Nutrition 0.000 claims 1
- 239000001226 triphosphate Substances 0.000 claims 1
- UNXRWKVEANCORM-UHFFFAOYSA-N triphosphoric acid Chemical compound OP(O)(=O)OP(O)(=O)OP(O)(O)=O UNXRWKVEANCORM-UHFFFAOYSA-N 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- 239000012634 fragment Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000006172 buffering agent Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000003002 pH adjusting agent Substances 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14881399P | 1999-08-13 | 1999-08-13 | |
| US60/148,813 | 1999-08-13 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001517629A Division JP4188598B2 (ja) | 1999-08-13 | 2000-08-10 | 停止化合物を伴う研磨系及びその使用方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006245598A JP2006245598A (ja) | 2006-09-14 |
| JP2006245598A5 true JP2006245598A5 (enExample) | 2009-05-14 |
| JP4723409B2 JP4723409B2 (ja) | 2011-07-13 |
Family
ID=22527505
Family Applications (5)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001517628A Expired - Lifetime JP4391715B2 (ja) | 1999-08-13 | 2000-08-10 | 化学機械的研磨系 |
| JP2001517629A Expired - Lifetime JP4188598B2 (ja) | 1999-08-13 | 2000-08-10 | 停止化合物を伴う研磨系及びその使用方法 |
| JP2005349782A Expired - Lifetime JP4851174B2 (ja) | 1999-08-13 | 2005-12-02 | 研磨系 |
| JP2006104616A Expired - Lifetime JP4723409B2 (ja) | 1999-08-13 | 2006-04-05 | 研磨組成物、研磨系及び研磨方法 |
| JP2009102674A Expired - Lifetime JP5384994B2 (ja) | 1999-08-13 | 2009-04-21 | 停止化合物を伴う化学機械的研磨系及びその使用方法 |
Family Applications Before (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001517628A Expired - Lifetime JP4391715B2 (ja) | 1999-08-13 | 2000-08-10 | 化学機械的研磨系 |
| JP2001517629A Expired - Lifetime JP4188598B2 (ja) | 1999-08-13 | 2000-08-10 | 停止化合物を伴う研磨系及びその使用方法 |
| JP2005349782A Expired - Lifetime JP4851174B2 (ja) | 1999-08-13 | 2005-12-02 | 研磨系 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009102674A Expired - Lifetime JP5384994B2 (ja) | 1999-08-13 | 2009-04-21 | 停止化合物を伴う化学機械的研磨系及びその使用方法 |
Country Status (14)
| Country | Link |
|---|---|
| US (1) | US6852632B2 (enExample) |
| EP (3) | EP1811005B1 (enExample) |
| JP (5) | JP4391715B2 (enExample) |
| KR (2) | KR100590666B1 (enExample) |
| CN (2) | CN100335580C (enExample) |
| AT (2) | ATE292167T1 (enExample) |
| AU (2) | AU6537000A (enExample) |
| CA (2) | CA2378790A1 (enExample) |
| DE (2) | DE60019142T2 (enExample) |
| HK (2) | HK1046423A1 (enExample) |
| IL (2) | IL147234A0 (enExample) |
| MY (2) | MY129591A (enExample) |
| TW (2) | TW570965B (enExample) |
| WO (2) | WO2001012740A1 (enExample) |
Families Citing this family (96)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US6503418B2 (en) * | 1999-11-04 | 2003-01-07 | Advanced Micro Devices, Inc. | Ta barrier slurry containing an organic additive |
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| US20030003747A1 (en) * | 2001-06-29 | 2003-01-02 | Jae Hong Kim | Chemical mechanical polishing slurry for ruthenium titanium nitride and polishing process using the same |
| SG144688A1 (en) * | 2001-07-23 | 2008-08-28 | Fujimi Inc | Polishing composition and polishing method employing it |
| WO2003020839A1 (en) * | 2001-09-03 | 2003-03-13 | Showa Denko K.K. | Polishing composition |
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| US6776810B1 (en) | 2002-02-11 | 2004-08-17 | Cabot Microelectronics Corporation | Anionic abrasive particles treated with positively charged polyelectrolytes for CMP |
| US6755721B2 (en) | 2002-02-22 | 2004-06-29 | Saint-Gobain Ceramics And Plastics, Inc. | Chemical mechanical polishing of nickel phosphorous alloys |
| TWI248970B (en) * | 2002-03-25 | 2006-02-11 | Rohm & Haas Elect Mat | Tantalum barrier removal solution |
| JP2004006628A (ja) * | 2002-03-27 | 2004-01-08 | Hitachi Ltd | 半導体装置の製造方法 |
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- 2000-08-10 IL IL14723400A patent/IL147234A0/xx unknown
- 2000-08-10 IL IL14723600A patent/IL147236A0/xx unknown
- 2000-08-10 AT AT00952726T patent/ATE292167T1/de not_active IP Right Cessation
- 2000-08-10 CN CNB008116393A patent/CN100335580C/zh not_active Expired - Lifetime
- 2000-08-10 CA CA002378790A patent/CA2378790A1/en not_active Abandoned
- 2000-08-10 AT AT00953960T patent/ATE360051T1/de not_active IP Right Cessation
- 2000-08-10 WO PCT/US2000/021938 patent/WO2001012740A1/en not_active Ceased
- 2000-08-10 WO PCT/US2000/021952 patent/WO2001012741A1/en not_active Ceased
- 2000-08-10 HK HK02108003.6A patent/HK1046423A1/zh unknown
- 2000-08-10 JP JP2001517628A patent/JP4391715B2/ja not_active Expired - Lifetime
- 2000-08-10 JP JP2001517629A patent/JP4188598B2/ja not_active Expired - Lifetime
- 2000-08-10 DE DE60019142T patent/DE60019142T2/de not_active Expired - Lifetime
- 2000-08-10 EP EP07005350.9A patent/EP1811005B1/en not_active Expired - Lifetime
- 2000-08-10 DE DE60034474T patent/DE60034474T2/de not_active Expired - Lifetime
- 2000-08-10 EP EP00953960A patent/EP1226220B1/en not_active Expired - Lifetime
- 2000-08-10 KR KR1020027001011A patent/KR100590666B1/ko not_active Expired - Fee Related
- 2000-08-10 HK HK02108002.7A patent/HK1046422A1/zh unknown
- 2000-08-10 CA CA002378793A patent/CA2378793A1/en not_active Abandoned
- 2000-08-10 KR KR1020027001010A patent/KR100590664B1/ko not_active Expired - Fee Related
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- 2000-08-11 MY MYPI20003660A patent/MY129591A/en unknown
- 2000-08-11 TW TW089116251A patent/TW570965B/zh not_active IP Right Cessation
- 2000-08-11 MY MYPI20003665A patent/MY139997A/en unknown
- 2000-08-11 TW TW089116226A patent/TW500784B/zh not_active IP Right Cessation
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2003
- 2003-01-29 US US10/353,542 patent/US6852632B2/en not_active Expired - Lifetime
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2005
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2006
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