ATE417700T1 - Trägermaterial und polierverfahren dafür - Google Patents

Trägermaterial und polierverfahren dafür

Info

Publication number
ATE417700T1
ATE417700T1 AT06111884T AT06111884T ATE417700T1 AT E417700 T1 ATE417700 T1 AT E417700T1 AT 06111884 T AT06111884 T AT 06111884T AT 06111884 T AT06111884 T AT 06111884T AT E417700 T1 ATE417700 T1 AT E417700T1
Authority
AT
Austria
Prior art keywords
polishing process
backing material
less
polishing
polishing pad
Prior art date
Application number
AT06111884T
Other languages
English (en)
Inventor
Kazuyoshi Nakamura
Toshihide Nakajima
Kousuke Nakajima
Takahisa Oonami
Original Assignee
Ohara Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ohara Kk filed Critical Ohara Kk
Application granted granted Critical
Publication of ATE417700T1 publication Critical patent/ATE417700T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
AT06111884T 2005-04-08 2006-03-29 Trägermaterial und polierverfahren dafür ATE417700T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005112070 2005-04-08

Publications (1)

Publication Number Publication Date
ATE417700T1 true ATE417700T1 (de) 2009-01-15

Family

ID=36645621

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06111884T ATE417700T1 (de) 2005-04-08 2006-03-29 Trägermaterial und polierverfahren dafür

Country Status (7)

Country Link
US (1) US7553768B2 (de)
EP (1) EP1710045B1 (de)
KR (1) KR100850732B1 (de)
CN (1) CN1845007B (de)
AT (1) ATE417700T1 (de)
DE (1) DE602006004241D1 (de)
TW (1) TWI315886B (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5065574B2 (ja) * 2005-01-12 2012-11-07 住友電気工業株式会社 ＧａＮ基板の研磨方法
US20080280539A1 (en) * 2007-05-11 2008-11-13 Asml Holding N.V. Optical component fabrication using amorphous oxide coated substrates
US20080318066A1 (en) * 2007-05-11 2008-12-25 Asml Holding N.V. Optical Component Fabrication Using Coated Substrates
JP2008293552A (ja) * 2007-05-22 2008-12-04 Fujitsu Ltd 基板、磁気記録媒体及びその製造方法、並びに磁気記憶装置
CN102187275B (zh) * 2008-11-26 2013-09-04 Hoya株式会社 掩模板用基板、掩模板用基板组及半导体器件的制造方法
TWI396003B (zh) * 2009-07-30 2013-05-11 Au Optronics Corp 顯示面板及其邊框窄化、邊緣強度提昇方法
US8772817B2 (en) 2010-12-22 2014-07-08 Cree, Inc. Electronic device submounts including substrates with thermally conductive vias
US10384324B2 (en) * 2015-02-02 2019-08-20 Corning Incorporated Methods for strengthening edges of laminated glass articles and laminated glass articles formed therefrom
CN105842898B (zh) * 2016-05-30 2023-06-02 京东方科技集团股份有限公司 显示面板的制造方法和装置
JP7219009B2 (ja) * 2018-03-27 2023-02-07 株式会社荏原製作所 基板保持装置およびドライブリングの製造方法
CN114527592A (zh) * 2020-11-23 2022-05-24 群创光电股份有限公司 电子装置及其制造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6648733B2 (en) * 1997-04-04 2003-11-18 Rodel Holdings, Inc. Polishing pads and methods relating thereto
GB2334205B (en) * 1998-02-12 2001-11-28 Shinetsu Handotai Kk Polishing method for semiconductor wafer and polishing pad used therein
US6159643A (en) * 1999-03-01 2000-12-12 Advanced Micro Devices, Inc. Extreme ultraviolet lithography reflective mask
JP4391715B2 (ja) * 1999-08-13 2009-12-24 キャボット マイクロエレクトロニクス コーポレイション 化学機械的研磨系
JP3664676B2 (ja) * 2001-10-30 2005-06-29 信越半導体株式会社 ウェーハの研磨方法及びウェーハ研磨用研磨パッド
JP2003257910A (ja) * 2001-12-28 2003-09-12 Fujikoshi Mach Corp 基板における銅層の研磨方法
WO2004028745A1 (en) * 2002-09-25 2004-04-08 Ppg Industries Ohio, Inc. Polishing pad for planarization
JP4234991B2 (ja) * 2002-12-26 2009-03-04 Ｈｏｙａ株式会社 情報記録媒体用ガラス基板の製造方法及びその製造方法によって製造される情報記録媒体用ガラス基板
DE10302342A1 (de) * 2003-01-17 2004-08-05 Schott Glas Substrat für die EUV-Mikrolithographie und Herstellverfahren hierfür
JP4790973B2 (ja) * 2003-03-28 2011-10-12 Ｈｏｙａ株式会社 研磨パッドを使用した情報記録媒体用ガラス基板の製造方法及びその方法で得られた情報記録媒体用ガラス基板
US7654885B2 (en) * 2003-10-03 2010-02-02 Applied Materials, Inc. Multi-layer polishing pad

Also Published As

Publication number Publication date
TW200701303A (en) 2007-01-01
US7553768B2 (en) 2009-06-30
DE602006004241D1 (de) 2009-01-29
EP1710045B1 (de) 2008-12-17
KR100850732B1 (ko) 2008-08-06
EP1710045A1 (de) 2006-10-11
CN1845007B (zh) 2011-04-13
TWI315886B (en) 2009-10-11
CN1845007A (zh) 2006-10-11
US20060226124A1 (en) 2006-10-12
KR20060107319A (ko) 2006-10-13

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Legal Events

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