ATE417700T1 - Trägermaterial und polierverfahren dafür - Google Patents

Trägermaterial und polierverfahren dafür

Info

Publication number
ATE417700T1
ATE417700T1 AT06111884T AT06111884T ATE417700T1 AT E417700 T1 ATE417700 T1 AT E417700T1 AT 06111884 T AT06111884 T AT 06111884T AT 06111884 T AT06111884 T AT 06111884T AT E417700 T1 ATE417700 T1 AT E417700T1
Authority
AT
Austria
Prior art keywords
polishing process
backing material
less
polishing
polishing pad
Prior art date
Application number
AT06111884T
Other languages
English (en)
Inventor
Kazuyoshi Nakamura
Toshihide Nakajima
Kousuke Nakajima
Takahisa Oonami
Original Assignee
Ohara Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ohara Kk filed Critical Ohara Kk
Application granted granted Critical
Publication of ATE417700T1 publication Critical patent/ATE417700T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
AT06111884T 2005-04-08 2006-03-29 Trägermaterial und polierverfahren dafür ATE417700T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005112070 2005-04-08

Publications (1)

Publication Number Publication Date
ATE417700T1 true ATE417700T1 (de) 2009-01-15

Family

ID=36645621

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06111884T ATE417700T1 (de) 2005-04-08 2006-03-29 Trägermaterial und polierverfahren dafür

Country Status (7)

Country Link
US (1) US7553768B2 (de)
EP (1) EP1710045B1 (de)
KR (1) KR100850732B1 (de)
CN (1) CN1845007B (de)
AT (1) ATE417700T1 (de)
DE (1) DE602006004241D1 (de)
TW (1) TWI315886B (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5065574B2 (ja) * 2005-01-12 2012-11-07 住友電気工業株式会社 ＧａＮ基板の研磨方法
US20080280539A1 (en) * 2007-05-11 2008-11-13 Asml Holding N.V. Optical component fabrication using amorphous oxide coated substrates
US20080318066A1 (en) * 2007-05-11 2008-12-25 Asml Holding N.V. Optical Component Fabrication Using Coated Substrates
JP2008293552A (ja) * 2007-05-22 2008-12-04 Fujitsu Ltd 基板、磁気記録媒体及びその製造方法、並びに磁気記憶装置
WO2010061828A1 (ja) 2008-11-26 2010-06-03 Hoya株式会社 マスクブランク用基板
TWI396003B (zh) * 2009-07-30 2013-05-11 Au Optronics Corp 顯示面板及其邊框窄化、邊緣強度提昇方法
US8772817B2 (en) * 2010-12-22 2014-07-08 Cree, Inc. Electronic device submounts including substrates with thermally conductive vias
CN112250313A (zh) * 2015-02-02 2021-01-22 康宁股份有限公司 强化层压玻璃制品边缘的方法及由此形成的层压玻璃制品
CN105842898B (zh) * 2016-05-30 2023-06-02 京东方科技集团股份有限公司 显示面板的制造方法和装置
JP7219009B2 (ja) * 2018-03-27 2023-02-07 株式会社荏原製作所 基板保持装置およびドライブリングの製造方法
CN114527592A (zh) * 2020-11-23 2022-05-24 群创光电股份有限公司 电子装置及其制造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6648733B2 (en) * 1997-04-04 2003-11-18 Rodel Holdings, Inc. Polishing pads and methods relating thereto
GB2334205B (en) * 1998-02-12 2001-11-28 Shinetsu Handotai Kk Polishing method for semiconductor wafer and polishing pad used therein
US6159643A (en) * 1999-03-01 2000-12-12 Advanced Micro Devices, Inc. Extreme ultraviolet lithography reflective mask
AU6537000A (en) * 1999-08-13 2001-03-13 Cabot Microelectronics Corporation Polishing system with stopping compound and method of its use
JP3664676B2 (ja) * 2001-10-30 2005-06-29 信越半導体株式会社 ウェーハの研磨方法及びウェーハ研磨用研磨パッド
JP2003257910A (ja) * 2001-12-28 2003-09-12 Fujikoshi Mach Corp 基板における銅層の研磨方法
CN1684799A (zh) * 2002-09-25 2005-10-19 Ppg工业俄亥俄公司 平面化用的抛光垫片
JP4234991B2 (ja) * 2002-12-26 2009-03-04 Ｈｏｙａ株式会社 情報記録媒体用ガラス基板の製造方法及びその製造方法によって製造される情報記録媒体用ガラス基板
DE10302342A1 (de) * 2003-01-17 2004-08-05 Schott Glas Substrat für die EUV-Mikrolithographie und Herstellverfahren hierfür
JP4790973B2 (ja) * 2003-03-28 2011-10-12 Ｈｏｙａ株式会社 研磨パッドを使用した情報記録媒体用ガラス基板の製造方法及びその方法で得られた情報記録媒体用ガラス基板
US7654885B2 (en) * 2003-10-03 2010-02-02 Applied Materials, Inc. Multi-layer polishing pad

Also Published As

Publication number Publication date
DE602006004241D1 (de) 2009-01-29
US20060226124A1 (en) 2006-10-12
CN1845007A (zh) 2006-10-11
EP1710045A1 (de) 2006-10-11
TWI315886B (en) 2009-10-11
US7553768B2 (en) 2009-06-30
KR20060107319A (ko) 2006-10-13
EP1710045B1 (de) 2008-12-17
TW200701303A (en) 2007-01-01
KR100850732B1 (ko) 2008-08-06
CN1845007B (zh) 2011-04-13

Similar Documents

Publication Publication Date Title
ATE417700T1 (de) Trägermaterial und polierverfahren dafür
IL201028A (en) A metal layer polishing pad and a metal layer polishing method that uses it
BRPI0814033A2 (pt) Artigo abrasivo estruturado com sobrecamada, e método de produção e uso do mesmo
MY152047A (en) Method of processing synthetic quartz glass substrate for semiconductor
SG150468A1 (en) Chemical mechanical polishing pad with controlled wetting
TNSN07353A1 (en) Methods and tool for maintenance of hard surfaces, and a method for manufacturing such a tool (stone or stone like)
DE60304505D1 (de) Polierartikel zum elektrochemisch-mechanischen Polieren von Substraten
DE602006019876D1 (de) Schleifagglomeratpolierverfahren
TW200515971A (en) Porous polyurethane polishing pads
ATE400405T1 (de) Verfahren zur herstellung eines schleifgegenstands
MX2008001827A (es) Articulo abrasivo flexible y metodo de elaboracion.
SG153668A1 (en) Customized polish pads for chemical mechanical planarization
ATE376479T1 (de) Schleifscheibe und verschlussverbindung
WO2007121135A3 (en) Laminated flexible resilient abrasive article
MY136868A (en) Pad constructions for chemical mechanical planarization applications
DE602005004882D1 (de) Schleifteller mit Bearbeitungselement
ATE439944T1 (de) Gewellte kissenaufbereitungsvorrichtung und verwendungsverfahren dafür
DE602005019101D1 (de) Feinschleifpapierträgermaterial und herstellungsverfahren dafür
TW200706373A (en) Display surface material and a display incorporating the same
SG164366A1 (en) Methods and tool for maintenance of hard surfaces, and a method for manufacturing such a tool
TW200621965A (en) Polishing composition for a semiconductor substrate
TW200714412A (en) Methods and tool for maintenance of hard surfaces, and a method for manufacturing such a tool
TWI256333B (en) Abrasive working plate
TW200730300A (en) Polishing pad and polishing apparatus
WO2009066710A1 (ja) 研磨シート及び研磨シートの製造方法

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties