DE602006004241D1 - Trägermaterial und Polierverfahren dafür - Google Patents

Trägermaterial und Polierverfahren dafür

Info

Publication number
DE602006004241D1
DE602006004241D1 DE602006004241T DE602006004241T DE602006004241D1 DE 602006004241 D1 DE602006004241 D1 DE 602006004241D1 DE 602006004241 T DE602006004241 T DE 602006004241T DE 602006004241 T DE602006004241 T DE 602006004241T DE 602006004241 D1 DE602006004241 D1 DE 602006004241D1
Authority
DE
Germany
Prior art keywords
carrier material
polishing process
less
polishing
polishing pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006004241T
Other languages
English (en)
Inventor
Kazuyoshi Nakamura
Toshihide Nakajima
Kousuke Nakajima
Takahisa Oonami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ohara Inc
Original Assignee
Ohara Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ohara Inc filed Critical Ohara Inc
Publication of DE602006004241D1 publication Critical patent/DE602006004241D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
DE602006004241T 2005-04-08 2006-03-29 Trägermaterial und Polierverfahren dafür Active DE602006004241D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005112070 2005-04-08

Publications (1)

Publication Number Publication Date
DE602006004241D1 true DE602006004241D1 (de) 2009-01-29

Family

ID=36645621

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006004241T Active DE602006004241D1 (de) 2005-04-08 2006-03-29 Trägermaterial und Polierverfahren dafür

Country Status (7)

Country Link
US (1) US7553768B2 (de)
EP (1) EP1710045B1 (de)
KR (1) KR100850732B1 (de)
CN (1) CN1845007B (de)
AT (1) ATE417700T1 (de)
DE (1) DE602006004241D1 (de)
TW (1) TWI315886B (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5065574B2 (ja) * 2005-01-12 2012-11-07 住友電気工業株式会社 ＧａＮ基板の研磨方法
US20080280539A1 (en) * 2007-05-11 2008-11-13 Asml Holding N.V. Optical component fabrication using amorphous oxide coated substrates
US20080318066A1 (en) * 2007-05-11 2008-12-25 Asml Holding N.V. Optical Component Fabrication Using Coated Substrates
JP2008293552A (ja) * 2007-05-22 2008-12-04 Fujitsu Ltd 基板、磁気記録媒体及びその製造方法、並びに磁気記憶装置
KR101680866B1 (ko) 2008-11-26 2016-11-29 호야 가부시키가이샤 마스크블랭크용 기판
TWI396003B (zh) * 2009-07-30 2013-05-11 Au Optronics Corp 顯示面板及其邊框窄化、邊緣強度提昇方法
US8772817B2 (en) 2010-12-22 2014-07-08 Cree, Inc. Electronic device submounts including substrates with thermally conductive vias
EP3253532A1 (de) * 2015-02-02 2017-12-13 Corning Incorporated Verfahren zur verstärkung der kanten von verbundglas und daraus geformte verbundglasartikel
CN105842898B (zh) * 2016-05-30 2023-06-02 京东方科技集团股份有限公司 显示面板的制造方法和装置
JP7219009B2 (ja) * 2018-03-27 2023-02-07 株式会社荏原製作所 基板保持装置およびドライブリングの製造方法
CN114527592A (zh) * 2020-11-23 2022-05-24 群创光电股份有限公司 电子装置及其制造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6648733B2 (en) * 1997-04-04 2003-11-18 Rodel Holdings, Inc. Polishing pads and methods relating thereto
GB2334205B (en) * 1998-02-12 2001-11-28 Shinetsu Handotai Kk Polishing method for semiconductor wafer and polishing pad used therein
US6159643A (en) * 1999-03-01 2000-12-12 Advanced Micro Devices, Inc. Extreme ultraviolet lithography reflective mask
JP4188598B2 (ja) * 1999-08-13 2008-11-26 キャボット マイクロエレクトロニクス コーポレイション 停止化合物を伴う研磨系及びその使用方法
JP3664676B2 (ja) * 2001-10-30 2005-06-29 信越半導体株式会社 ウェーハの研磨方法及びウェーハ研磨用研磨パッド
JP2003257910A (ja) * 2001-12-28 2003-09-12 Fujikoshi Mach Corp 基板における銅層の研磨方法
WO2004028745A1 (en) * 2002-09-25 2004-04-08 Ppg Industries Ohio, Inc. Polishing pad for planarization
JP4234991B2 (ja) * 2002-12-26 2009-03-04 Ｈｏｙａ株式会社 情報記録媒体用ガラス基板の製造方法及びその製造方法によって製造される情報記録媒体用ガラス基板
DE10302342A1 (de) * 2003-01-17 2004-08-05 Schott Glas Substrat für die EUV-Mikrolithographie und Herstellverfahren hierfür
JP4790973B2 (ja) * 2003-03-28 2011-10-12 Ｈｏｙａ株式会社 研磨パッドを使用した情報記録媒体用ガラス基板の製造方法及びその方法で得られた情報記録媒体用ガラス基板
US7654885B2 (en) * 2003-10-03 2010-02-02 Applied Materials, Inc. Multi-layer polishing pad

Also Published As

Publication number Publication date
EP1710045A1 (de) 2006-10-11
US7553768B2 (en) 2009-06-30
TW200701303A (en) 2007-01-01
TWI315886B (en) 2009-10-11
CN1845007B (zh) 2011-04-13
KR100850732B1 (ko) 2008-08-06
KR20060107319A (ko) 2006-10-13
EP1710045B1 (de) 2008-12-17
US20060226124A1 (en) 2006-10-12
ATE417700T1 (de) 2009-01-15
CN1845007A (zh) 2006-10-11

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Legal Events

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