DE602006004241D1 - Trägermaterial und Polierverfahren dafür - Google Patents
Trägermaterial und Polierverfahren dafürInfo
- Publication number
- DE602006004241D1 DE602006004241D1 DE602006004241T DE602006004241T DE602006004241D1 DE 602006004241 D1 DE602006004241 D1 DE 602006004241D1 DE 602006004241 T DE602006004241 T DE 602006004241T DE 602006004241 T DE602006004241 T DE 602006004241T DE 602006004241 D1 DE602006004241 D1 DE 602006004241D1
- Authority
- DE
- Germany
- Prior art keywords
- carrier material
- polishing process
- less
- polishing
- polishing pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000012876 carrier material Substances 0.000 title 1
- 238000007517 polishing process Methods 0.000 title 1
- 238000005498 polishing Methods 0.000 abstract 3
- 238000000034 method Methods 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 1
- 230000003746 surface roughness Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005112070 | 2005-04-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602006004241D1 true DE602006004241D1 (de) | 2009-01-29 |
Family
ID=36645621
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602006004241T Active DE602006004241D1 (de) | 2005-04-08 | 2006-03-29 | Trägermaterial und Polierverfahren dafür |
Country Status (7)
Country | Link |
---|---|
US (1) | US7553768B2 (de) |
EP (1) | EP1710045B1 (de) |
KR (1) | KR100850732B1 (de) |
CN (1) | CN1845007B (de) |
AT (1) | ATE417700T1 (de) |
DE (1) | DE602006004241D1 (de) |
TW (1) | TWI315886B (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5065574B2 (ja) * | 2005-01-12 | 2012-11-07 | 住友電気工業株式会社 | GaN基板の研磨方法 |
US20080318066A1 (en) * | 2007-05-11 | 2008-12-25 | Asml Holding N.V. | Optical Component Fabrication Using Coated Substrates |
US20080280539A1 (en) * | 2007-05-11 | 2008-11-13 | Asml Holding N.V. | Optical component fabrication using amorphous oxide coated substrates |
JP2008293552A (ja) * | 2007-05-22 | 2008-12-04 | Fujitsu Ltd | 基板、磁気記録媒体及びその製造方法、並びに磁気記憶装置 |
KR101271644B1 (ko) * | 2008-11-26 | 2013-07-30 | 호야 가부시키가이샤 | 마스크블랭크용 기판 |
TWI396003B (zh) | 2009-07-30 | 2013-05-11 | Au Optronics Corp | 顯示面板及其邊框窄化、邊緣強度提昇方法 |
US8772817B2 (en) * | 2010-12-22 | 2014-07-08 | Cree, Inc. | Electronic device submounts including substrates with thermally conductive vias |
KR102538577B1 (ko) * | 2015-02-02 | 2023-05-31 | 코닝 인코포레이티드 | 라미네이트 유리 제품의 에지를 강화하는 방법 및 이로부터 형성된 라미네이트 유리 제품 |
CN105842898B (zh) * | 2016-05-30 | 2023-06-02 | 京东方科技集团股份有限公司 | 显示面板的制造方法和装置 |
JP7219009B2 (ja) * | 2018-03-27 | 2023-02-07 | 株式会社荏原製作所 | 基板保持装置およびドライブリングの製造方法 |
CN114527592A (zh) * | 2020-11-23 | 2022-05-24 | 群创光电股份有限公司 | 电子装置及其制造方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6648733B2 (en) * | 1997-04-04 | 2003-11-18 | Rodel Holdings, Inc. | Polishing pads and methods relating thereto |
GB2334205B (en) * | 1998-02-12 | 2001-11-28 | Shinetsu Handotai Kk | Polishing method for semiconductor wafer and polishing pad used therein |
US6159643A (en) * | 1999-03-01 | 2000-12-12 | Advanced Micro Devices, Inc. | Extreme ultraviolet lithography reflective mask |
WO2001012740A1 (en) * | 1999-08-13 | 2001-02-22 | Cabot Microelectronics Corporation | Polishing system and method of its use |
JP3664676B2 (ja) * | 2001-10-30 | 2005-06-29 | 信越半導体株式会社 | ウェーハの研磨方法及びウェーハ研磨用研磨パッド |
JP2003257910A (ja) * | 2001-12-28 | 2003-09-12 | Fujikoshi Mach Corp | 基板における銅層の研磨方法 |
CN1684799A (zh) * | 2002-09-25 | 2005-10-19 | Ppg工业俄亥俄公司 | 平面化用的抛光垫片 |
JP4234991B2 (ja) * | 2002-12-26 | 2009-03-04 | Hoya株式会社 | 情報記録媒体用ガラス基板の製造方法及びその製造方法によって製造される情報記録媒体用ガラス基板 |
DE10302342A1 (de) * | 2003-01-17 | 2004-08-05 | Schott Glas | Substrat für die EUV-Mikrolithographie und Herstellverfahren hierfür |
JP4790973B2 (ja) * | 2003-03-28 | 2011-10-12 | Hoya株式会社 | 研磨パッドを使用した情報記録媒体用ガラス基板の製造方法及びその方法で得られた情報記録媒体用ガラス基板 |
US7654885B2 (en) * | 2003-10-03 | 2010-02-02 | Applied Materials, Inc. | Multi-layer polishing pad |
-
2006
- 2006-03-29 AT AT06111884T patent/ATE417700T1/de not_active IP Right Cessation
- 2006-03-29 DE DE602006004241T patent/DE602006004241D1/de active Active
- 2006-03-29 EP EP06111884A patent/EP1710045B1/de not_active Not-in-force
- 2006-03-29 TW TW095110977A patent/TWI315886B/zh not_active IP Right Cessation
- 2006-04-04 KR KR1020060030531A patent/KR100850732B1/ko not_active IP Right Cessation
- 2006-04-06 US US11/398,703 patent/US7553768B2/en not_active Expired - Fee Related
- 2006-04-07 CN CN2006100793850A patent/CN1845007B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TWI315886B (en) | 2009-10-11 |
EP1710045B1 (de) | 2008-12-17 |
EP1710045A1 (de) | 2006-10-11 |
TW200701303A (en) | 2007-01-01 |
KR20060107319A (ko) | 2006-10-13 |
KR100850732B1 (ko) | 2008-08-06 |
ATE417700T1 (de) | 2009-01-15 |
US20060226124A1 (en) | 2006-10-12 |
CN1845007B (zh) | 2011-04-13 |
US7553768B2 (en) | 2009-06-30 |
CN1845007A (zh) | 2006-10-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |