TW200730300A - Polishing pad and polishing apparatus - Google Patents

Polishing pad and polishing apparatus

Info

Publication number
TW200730300A
TW200730300A TW095132441A TW95132441A TW200730300A TW 200730300 A TW200730300 A TW 200730300A TW 095132441 A TW095132441 A TW 095132441A TW 95132441 A TW95132441 A TW 95132441A TW 200730300 A TW200730300 A TW 200730300A
Authority
TW
Taiwan
Prior art keywords
polishing
pad
polishing pad
supporting surface
polishing apparatus
Prior art date
Application number
TW095132441A
Other languages
Chinese (zh)
Inventor
Masaomi Nakahata
Original Assignee
Toshiba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Kk filed Critical Toshiba Kk
Publication of TW200730300A publication Critical patent/TW200730300A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

The present invention relates to a polishing pad and polishing apparatus, which can prolong the service life of the polishing pad, and improve the in-plane uniformity, and prevent objects to be polished from sticking on the polishing pad. A polishing pad is characterized in that one surface of a plate-like pad body 21 is a polishing surface 22 and the other surface of it is a supporting surface 23; and a plurality of hole sections 30 are provided in which a plurality of slots 31 are formed through the pad body 21 from the polishing surface 22 to the supporting surface 23 and extended in a plurality of directions different from each other in the plane direction of the polishing surface 22.
TW095132441A 2005-10-03 2006-09-01 Polishing pad and polishing apparatus TW200730300A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005290313A JP2007103602A (en) 2005-10-03 2005-10-03 Polishing pad and polishing device

Publications (1)

Publication Number Publication Date
TW200730300A true TW200730300A (en) 2007-08-16

Family

ID=37964661

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095132441A TW200730300A (en) 2005-10-03 2006-09-01 Polishing pad and polishing apparatus

Country Status (5)

Country Link
US (1) US20070077867A1 (en)
JP (1) JP2007103602A (en)
KR (2) KR20070037683A (en)
CN (1) CN1943993A (en)
TW (1) TW200730300A (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3843933B2 (en) * 2002-02-07 2006-11-08 ソニー株式会社 Polishing pad, polishing apparatus and polishing method
JP5308637B2 (en) * 2007-07-11 2013-10-09 東洋ゴム工業株式会社 Polishing pad
JP2009184093A (en) * 2008-02-08 2009-08-20 Mitsubishi Rayon Co Ltd Continuous polishing device and continuous polishing method of traveling substrate
KR101102710B1 (en) * 2010-01-15 2012-01-05 주식회사 엘지실트론 Wafer Unloading System and Wafer Double Side Processing Equipment including the same
EP2939788A1 (en) * 2010-10-05 2015-11-04 Black & Decker Inc. Universal abrasive disc
US9211628B2 (en) * 2011-01-26 2015-12-15 Nexplanar Corporation Polishing pad with concentric or approximately concentric polygon groove pattern
JP5375895B2 (en) * 2011-08-17 2013-12-25 旭硝子株式会社 Polishing system
KR101953469B1 (en) * 2017-07-21 2019-02-28 에스케이실트론 주식회사 Wafer polishing apparatus
KR102570825B1 (en) * 2020-07-16 2023-08-28 한국생산기술연구원 Polishing pad including porous protruding pattern and polishing apparatus including the same
CN113183008B (en) * 2021-03-31 2022-11-25 安徽禾臣新材料有限公司 Porous polyurethane polishing pad and polishing pad concave part forming method thereof
CN115042021A (en) * 2022-05-19 2022-09-13 江苏富乐德石英科技有限公司 Ultrasonic quartz grinding device and grinding process

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5329734A (en) * 1993-04-30 1994-07-19 Motorola, Inc. Polishing pads used to chemical-mechanical polish a semiconductor substrate
US5650039A (en) * 1994-03-02 1997-07-22 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved slurry distribution
KR100646702B1 (en) * 2001-08-16 2006-11-17 에스케이씨 주식회사 Chemical mechanical polishing pad having holes and/or grooves

Also Published As

Publication number Publication date
KR20080053268A (en) 2008-06-12
KR20070037683A (en) 2007-04-06
US20070077867A1 (en) 2007-04-05
JP2007103602A (en) 2007-04-19
CN1943993A (en) 2007-04-11

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