JP2009184093A - Continuous polishing device and continuous polishing method of traveling substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a continuous polishing device capable of preventing clogging of a polishing pad and improving polishing efficiency. <P>SOLUTION: In the polishing device for continuously polishing a traveling substrate using a polishing head rotating around a rotary shaft, a supply hole for supplying polishing liquid is provided at a central part of the polishing head along the rotary shaft, the polishing pad, which does not have a through-hole and into which the polishing liquid penetrates, is closely adhered on the entire surface of the bottom part of the polishing head, and a pad side edge part is fixed to a peripheral part of the polishing head. The continuous polishing method using the continuous polishing device is also provided. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a continuous polishing apparatus for continuously mirror-polishing a traveling substrate such as a coil material such as stainless steel, a band plate or a fixed plate such as an endless belt, and a small cut plate formed by an array. It is.

  Conventionally, when such a traveling substrate is polished, polishing is performed while supplying a polishing liquid to the polishing pad from the side of the polishing head. However, the polishing liquid cannot be uniformly drawn into the polishing pad, and the polishing residue generated by the polishing gradually adheres to the polishing pad and causes clogging, so the polishing pad must be frequently cleaned, There was a problem that the traveling substrate could not be mirror-polished continuously.

In contrast, for example, as disclosed in Patent Document 1, polishing is performed between the donut-shaped polishing pad 2 and the traveling substrate 5 from the supply hole 3 provided in the center of the polishing head 1 shown in FIG. There has been proposed a continuous polishing apparatus that allows mirror polishing continuously by allowing the liquid 4 to enter.
JP-A-2-65963

  However, in the continuous polishing apparatus as described above, the polishing head 1 and the polishing pad 2 are usually fixed with an adhesive, an adhesive, or the like 6 as shown in FIG. 2, and have the following problems.

  If the polishing pad 2 has a donut shape, the contact area with the traveling substrate 5 is smaller than that of the disk-shaped polishing pad 2 having the same outer diameter and no through-holes, so that the polishing efficiency is reduced and efficient polishing cannot be performed. . On the contrary, if the polishing pad 2 with a donut-shaped inner diameter is used to improve the polishing efficiency and the polishing liquid 4 is allowed to enter between the traveling substrate 5 and the contact area with the traveling substrate 5, The increased amount leads to an increase in contact resistance, and the polishing liquid 4 supplied from the central portion of the polishing head 1 cannot be discharged well to the outer peripheral portion, resulting in clogging of the polishing pad 2 and a decrease in polishing efficiency. . Therefore, if the supply pressure of the polishing liquid 4 is increased and the polishing liquid 4 is forced to be discharged, a hydro-playing phenomenon occurs due to the floating of the polishing head 1, and the polishing head 1 is shaken and stable polishing cannot be performed. There was a problem I said.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a continuous polishing apparatus capable of preventing clogging of the polishing pad 2 and improving the polishing efficiency. It is in.

The present invention is a polishing apparatus for continuously polishing a traveling substrate using a polishing head that rotates about a rotation axis.
A supply hole for supplying a polishing liquid is provided at the center along the rotation axis of the polishing head, and a polishing pad that does not have a through hole and penetrates the polishing liquid is in close contact with the entire bottom surface of the polishing head. The pad edge is fixed to the periphery of the polishing head.

  The present invention also provides a continuous polishing method for polishing a substrate while allowing the polishing liquid to penetrate the entire polishing pad using the continuous polishing apparatus described above and supplying the polishing liquid to the substrate running from the polishing pad. It is.

  As described above, the present invention allows the polishing pad 2 having no through holes to be used by infiltrating the polishing pad 2 from the central portion of the polishing head 1 and supplying the polishing liquid 4 to the traveling substrate 5. Can be improved. Further, the polishing liquid 4 can be uniformly and easily supplied from the center portion of the polishing head 1 to the outer peripheral portion, and the polishing residue generated by the polishing can be discharged together with the polishing solution 4 to the outside. The polishing pad 2 can be prevented from being clogged, and stable continuous polishing can be performed for a long time.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a view showing a cross section of a continuous polishing apparatus according to the present invention. This continuous polishing apparatus is intended to continuously polish a traveling substrate 5 such as a coil material such as stainless steel, a band plate such as an endless belt or a fixed plate, and a small cut plate formed by an array. From the viewpoint of ease of polishing, the traveling direction of the traveling substrate 5 is preferably traveling in a certain direction. Further, from the viewpoint of the permeability of the polishing liquid, the traveling substrate 5 preferably travels horizontally. The traveling speed of the traveling substrate 5 is preferably 0.01 to 5 m / min. If the traveling speed is too slow, the polishing work efficiency is deteriorated, and if the traveling speed is too fast, the polishing efficiency is deteriorated.

  A single or a plurality of polishing heads 1 are arranged above the traveling substrate 5, and the polishing head 1 rotates on the traveling substrate 5 with an arbitrary polishing pressure around a rotation axis. The polishing head 1 can be rotated by a driving device such as a motor. The rotational speed of the polishing head 1 is preferably 100 to 1000 rpm. When the rotation speed is too slow, the penetrating force of the polishing liquid at the center of the rotating shaft into the entire polishing pad is deteriorated and the polishing efficiency is deteriorated because the centrifugal force due to the rotation is small. If the rotation speed is too high, the polishing liquid will become scattered.

  The polishing pressure can be adjusted, for example, by pressurization with an air cylinder or an electric cylinder connected to the polishing head 1. The polishing pressure is preferably 0.01 to 0.1 MPa. If the polishing pressure is too low, the polishing efficiency will deteriorate, and if the polishing pressure is too high, the substrate surface will become rough, and the torque load during polishing will increase, so the motor will have to be enlarged to withstand it. .

  The polishing head 1 is preferably circular in shape from the bottom of the polishing head, that is, the surface facing the substrate, from the viewpoint of maintaining a stable rotational state.

  The polishing head 1 may be fixed at a specific location, or may freely move on the surface of the traveling substrate 5.

  The polishing head 1 is provided with a supply hole 3 through which a polishing liquid 4 is supplied at the center along the rotation axis.

  A polishing pad is in close contact with the entire surface of the bottom of the polishing head. Here, the close contact means a state in contact with the surface, and is not fixed with an adhesive or the like. The “polishing head bottom” refers to the surface side facing the polishing surface of the substrate. The edge portion of the polishing pad 2 (the end portion of the portion deviating from the portion in close contact with the bottom of the polishing head) is fixedly attached to the periphery of the polishing head (near the outer periphery of the side surface or the surface opposite to the bottom). . At this time, it is preferable to use a fixing jig as the fixing method. When the polishing pad is fixed, it is preferable that the polishing pad is fixed in a state where there is no wrinkle and an appropriate tension is applied. As a fixing method, for example, as shown in FIG. 1, there is a method in which a polishing pad 2 is sandwiched between a plate-shaped jig and a polishing head 1 and screwed. Other methods include a method in which the polishing pad 1 is wrapped around the polishing head 1 and then fastened with a string or a stop band. In addition, the method is not limited to the above as long as the fixing jig 7 can pull the polishing pad 2 to the polishing head 1 and stop it.

The polishing liquid 4 penetrates the polishing pad 2 attached to the polishing head 1 and is supplied to the traveling substrate 5. At this time, the polishing pad 2 is preferably a material that can penetrate the polishing liquid 4 throughout the polishing pad 2 and can easily supply the polishing liquid to the traveling substrate 5. Examples of the material include those made of nonwoven fabric. Examples of the material for the nonwoven fabric include nylon, rayon and urethane. The fiber diameter of the nonwoven fabric is preferably 10 to 100 μm, and the basis weight is preferably 10 to 1000 g / m ² .

  The polishing pad 2 does not have a through-hole, and its shape is preferably circular from the viewpoint of adhesion to the polishing head. Here, the through-hole means a hole having an inner diameter of 1 mm or more penetrating in the thickness direction.

  As the polishing liquid 4, one containing inorganic fine particles can be used. The concentration of the polishing liquid is preferably from 0.01 to 5% by mass, and the pH value of the polishing liquid is preferably from 0.01 to 6. The supply amount of the polishing liquid is preferably 0.5 to 5 L / min. When this supply amount is too small, the polishing efficiency is lowered, and the polishing residue generated by polishing tends to accumulate. If the supply amount is too large, the polishing efficiency is not increased and the polishing liquid is wasted. The particle size of the inorganic fine particles contained in the polishing liquid is preferably 0.01 to 5 μm, and the inorganic fine particles are preferably alumina.

  In order to improve the permeability of the polishing liquid, a plate-like elastic body may be attached in advance to the polishing head, and the polishing pad 2 may be brought into close contact with the elastic body. As the elastic body, a material (nonwoven fabric or the like) equivalent to the polishing pad can be used. When the elastic body is attached, it not only contributes to the improvement of the permeability of the polishing liquid, but also functions as a substrate protective material when the polishing pad is damaged.

  With the above-described configuration, the polishing liquid 4 can be uniformly discharged from the central portion of the polishing head 1 to the outer peripheral portion even when the polishing pad 2 having no through hole is used. As a result, the polishing efficiency (the size of the polishing area per unit time) can be improved, and the supply amount of the polishing liquid can be made relatively large. It becomes easy to discharge to As a result, the polishing pad 2 is not easily clogged with the polishing residue, and stable continuous polishing for a long time is possible.

  Next, embodiments of the present invention will be specifically described by the following examples.

Example 1
A stainless steel plate of SUS304 was polished as the traveling substrate 5 by a continuous polishing apparatus using the polishing head 1 shown in FIG.

  The stainless steel plate has a thickness of 1.5 mm, a width of 100 mm, and a length of 100 mm, and is fitted into a mold having the same thickness. The polishing pad 2 has a disc shape with a diameter of 200 mm, and uses a non-penetrating non-penetrating non-woven material made by stripping FEL (trade name) adhesive made by Kemet Japan Co., Ltd. The edge of the polishing pad 2 was lifted up by the stopper 7 without being fixed to the bottom of 1 and attached and fixed in the vicinity of the outer periphery of the surface opposite to the bottom of the polishing head 1. As the polishing agent, a polishing liquid 4 diluted 10 times with pure water using A3000 manufactured by Showa Denko Co., Ltd. is used. Polishing liquid 4 was supplied. The polishing head 1 was continuously polished together with the mold so that the traveling substrate 5 was polished evenly at a rotational speed of 300 rpm, a polishing pressure of 0.03 MPa, and a traveling substrate 5 speed of 0.5 m / min. Even after 120 minutes, the polishing efficiency was hardly reduced, stable polishing was possible, and a mirror surface was obtained.

(Comparative Example 1)
Polishing was performed in the same manner as in Example 1 except that the polishing liquid 4 was supplied onto the substrate near the outer periphery of the polishing head 1. Immediately after the start of polishing, polishing residue adhered to the polishing pad 2 to cause clogging, and after 90 minutes, the polishing efficiency decreased to half or less.

(Comparative Example 2)
Except that the center portion of the polishing pad 2 having the same diameter as that of Example 1 was pulled out and a through hole having an inner diameter of 8 mm was provided, and this was adhered to the entire bottom surface of the polishing head 1 using a double-sided tape as an adhesive 6 without any gaps. Polishing was performed in the same manner as in Example 1. First, when the polishing liquid 4 is to be supplied with the same polishing liquid supply / discharge pressure as in the first embodiment, the polishing liquid 4 is hardly discharged from the outer peripheral portion of the polishing pad 2, so that the traveling substrate 5 is baked and polished. Canceled. Next, when the polishing liquid supply / discharge pressure was increased to supply the same amount of polishing liquid 4 as in Example 1, the polishing head 1 floated and shook (hydroplating phenomenon), so that stable polishing was possible. Canceled without stopping.

(Comparative Example 3)
A polishing pad 2 having the same diameter as in Example 1 was polished in the same manner as in Example 1 except that it was affixed to the polishing head 1 as a pressure sensitive adhesive 6 with a double-sided tape without gaps as shown in FIG. . The polishing liquid 4 penetrates between the traveling substrate 5 and the polishing pad 2 and can be discharged to the outer peripheral portion of the polishing pad 2, and stable polishing can be performed. Since the contact area with 5 decreased, the polishing efficiency decreased about 40% compared with Example 1.

  Since the polishing efficiency can be improved by using the polishing apparatus of the present invention, it can be applied to various plate-like objects.

It is sectional drawing which shows the continuous grinding | polishing apparatus which concerns on this invention. It is sectional drawing which shows the conventional continuous grinding | polishing apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Polishing head 2 Polishing pad 3 Supply hole 4 Polishing liquid 5 Running board 6 Adhesive, adhesive, etc. 7 Fixing jig

Claims (3)

In a polishing apparatus that continuously polishes a traveling substrate using a polishing head that rotates about a rotation axis,
A supply hole for supplying a polishing liquid is provided at the center along the rotation axis of the polishing head, and a polishing pad that does not have a through hole and penetrates the polishing liquid is in close contact with the entire bottom surface of the polishing head. The pad edge is fixed to the periphery of the polishing head.   The continuous polishing apparatus according to claim 1, wherein the polishing pad is made of a nonwoven fabric.   3. Continuous polishing for polishing a substrate using the continuous polishing apparatus according to claim 1 or 2 while allowing the polishing liquid to permeate the entire polishing pad and supplying the polishing liquid to the substrate running from the polishing pad. Method.

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