MY153268A - Dresser for abrasive cloth - Google Patents

Dresser for abrasive cloth

Info

Publication number
MY153268A
MY153268A MYPI2010003221A MYPI20103221A MY153268A MY 153268 A MY153268 A MY 153268A MY PI2010003221 A MYPI2010003221 A MY PI2010003221A MY PI20103221 A MYPI20103221 A MY PI20103221A MY 153268 A MY153268 A MY 153268A
Authority
MY
Malaysia
Prior art keywords
dresser
abrasive
abrasive grains
center
grains
Prior art date
Application number
MYPI2010003221A
Inventor
Sakamoto Hiroaki
Kinoshita Toshiya
Original Assignee
Nippon Steel Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Materials Co Ltd filed Critical Nippon Steel Materials Co Ltd
Publication of MY153268A publication Critical patent/MY153268A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

THE INVENTION PROVIDES A DRESSER FOR AN ABRASIVE CLOTH, WHICH HAS A SMALLER ABRASIVE GRAIN DIAMETER THAN THE CONVENTIONAL DRESSER AND HAS AN ABRASIVE GRAIN SPACING REGULATED IN A PREDETERMINED RANGE DEPENDING UPON THE ABRASIVE GRAIN DIAMETER TO SIMULTANEOUSLY MEET A HIGH LEVEL OF PAD GRINDING POWER AND A PAD FLATNESS AND, AT THE SAME TIME, IS LESS LIKELY TO CAUSE DROPOUT OF ABRASIVE GRAINS. THE DRESSER COMPRISES A PLURALITY OF ABRASIVE GRAINS FIXED AS A SINGLE LAYER ON A SURFACE OF A METALLIC SUPPORT MATERIAL. THE DRESSER IS CHARACTERIZED IN THAT THE METALLIC SUPPORT MATERIAL ON ITS SURFACE ON WHICH THE ABRASIVE GRAINS ARE FIXED HAS A CONVEX SHAPE, THE DIFFERENCE IN HEIGHT BETWEEN THE END PART AND THE CENTRAL PORT ON THE SURFACE IS NOT LESS THAN 3µM AND NOT MORE THAN 40µM, AND THE CENTER-TO-CENTER SPACING BETWEEN AT LEAST ONE SET OF ADJACENT GRAINS IS D=L<2D WHEREIN D REPRESENTS THE DIAMETER OF THE ABRASIVE GRAINS; L REPRESENTS THE CENTER-TO-CENTER SPACING BETWEEN ADJACENT ABRASIVE GRAINS. THE DIAMETER (D) OF THE ABRASIVE GRAINS IS PREFERABLY 3µM=D<100µM.
MYPI2010003221A 2008-02-20 2008-10-28 Dresser for abrasive cloth MY153268A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008039218A JP5255860B2 (en) 2008-02-20 2008-02-20 Polishing cloth dresser

Publications (1)

Publication Number Publication Date
MY153268A true MY153268A (en) 2015-01-29

Family

ID=40985120

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2010003221A MY153268A (en) 2008-02-20 2008-10-28 Dresser for abrasive cloth

Country Status (5)

Country Link
US (1) US20100291844A1 (en)
JP (1) JP5255860B2 (en)
MY (1) MY153268A (en)
TW (1) TWI455794B (en)
WO (1) WO2009104224A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201246342A (en) * 2010-12-13 2012-11-16 Saint Gobain Abrasives Inc Chemical mechanical planarization (CMP) pad conditioner and method of making
TWI422466B (en) * 2011-01-28 2014-01-11 Advanced Surface Tech Inc Diamond abrasive tool and manufacturing method thereof
JP5809880B2 (en) * 2011-08-25 2015-11-11 新日鉄住金マテリアルズ株式会社 Polishing cloth dresser
JP6193388B2 (en) * 2013-09-30 2017-09-06 Hoya株式会社 Method of manufacturing glass substrate for magnetic disk, method of manufacturing glass substrate, method of manufacturing magnetic disk, and fixed abrasive wheel
JP6900523B2 (en) * 2015-09-07 2021-07-07 日鉄ケミカル＆マテリアル株式会社 Dresser for abrasive cloth
JP2017052019A (en) * 2015-09-07 2017-03-16 新日鉄住金マテリアルズ株式会社 Dresser for abrasive cloth
JP6666749B2 (en) * 2016-02-29 2020-03-18 日鉄ケミカル＆マテリアル株式会社 Dresser for polishing cloth
US11389928B2 (en) * 2017-11-30 2022-07-19 Taiwan Semiconductor Manufacturing Co., Ltd. Method for conditioning polishing pad
JP7309772B2 (en) * 2021-03-25 2023-07-18 株式会社ノリタケカンパニーリミテド rotary dresser

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2564950B2 (en) * 1989-05-30 1996-12-18 富士電機株式会社 Drinking water sterilizer
KR100328108B1 (en) * 1996-10-15 2002-03-09 아사무라 타카싯 Semiconductor substrate polishing pad dresser, method of manufacturing the same, and chemicomechanical polishing method using the same dresser
US9463552B2 (en) * 1997-04-04 2016-10-11 Chien-Min Sung Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods
US7124753B2 (en) * 1997-04-04 2006-10-24 Chien-Min Sung Brazed diamond tools and methods for making the same
US6884155B2 (en) * 1999-11-22 2005-04-26 Kinik Diamond grid CMP pad dresser
US6368198B1 (en) * 1999-11-22 2002-04-09 Kinik Company Diamond grid CMP pad dresser
US20040112359A1 (en) * 1997-04-04 2004-06-17 Chien-Min Sung Brazed diamond tools and methods for making the same
US7323049B2 (en) * 1997-04-04 2008-01-29 Chien-Min Sung High pressure superabrasive particle synthesis
CN1197687C (en) * 1998-06-29 2005-04-20 台湾积体电路制造股份有限公司 Work-table of chemicomechanical grinding mill
JP2000106353A (en) * 1998-07-31 2000-04-11 Nippon Steel Corp Dresser for polishing cloth for semiconductor substrate
JP2000141204A (en) * 1998-09-08 2000-05-23 Sumitomo Metal Ind Ltd Dressing device, and polishing device and cmp device using the same
JP3484686B2 (en) * 1998-10-13 2004-01-06 オムロン株式会社 Axle load measurement method and axle load measurement device
JP2000218512A (en) * 1999-01-28 2000-08-08 Osaka Diamond Ind Co Ltd Cmp pad conditioner and manufacture thereof
JP2001018172A (en) * 1999-07-08 2001-01-23 Osaka Diamond Ind Co Ltd Correcting tool for polishing tool
JP2001025973A (en) * 1999-07-15 2001-01-30 Noritake Co Ltd Vitrified bond tool, and its manufacture
TW412461B (en) * 1999-09-29 2000-11-21 Kinik Co Diamond disk for trimming wafer polishing pad and method for making the same
US7201645B2 (en) * 1999-11-22 2007-04-10 Chien-Min Sung Contoured CMP pad dresser and associated methods
JP3072991U (en) * 2000-02-24 2000-11-07 株式会社藤森技術研究所 Polishing dresser for polishing machine of chemical machine polisher
US7011134B2 (en) * 2000-10-13 2006-03-14 Chien-Min Sung Casting method for producing surface acoustic wave devices
US6659161B1 (en) * 2000-10-13 2003-12-09 Chien-Min Sung Molding process for making diamond tools
US6814130B2 (en) * 2000-10-13 2004-11-09 Chien-Min Sung Methods of making diamond tools using reverse casting of chemical vapor deposition
US20040072510A1 (en) * 2000-12-21 2004-04-15 Toshiya Kinoshita Cmp conditioner, method for arranging rigid grains used for cmp conditioner, and method for manufacturing cmp conditioner
JP4216025B2 (en) * 2002-09-09 2009-01-28 株式会社リード Dresser for polishing cloth and dressing method for polishing cloth using the same
US20060213128A1 (en) * 2002-09-24 2006-09-28 Chien-Min Sung Methods of maximizing retention of superabrasive particles in a metal matrix
JP3801551B2 (en) * 2002-10-11 2006-07-26 株式会社ノリタケスーパーアブレーシブ CMP pad conditioner
JP2006055944A (en) * 2004-08-20 2006-03-02 Allied Material Corp Cmp pad conditioner
US20070060026A1 (en) * 2005-09-09 2007-03-15 Chien-Min Sung Methods of bonding superabrasive particles in an organic matrix
US7258708B2 (en) * 2004-12-30 2007-08-21 Chien-Min Sung Chemical mechanical polishing pad dresser
JP2006305659A (en) * 2005-04-27 2006-11-09 Nippon Steel Corp Dresser for polishing cloth
US8398466B2 (en) * 2006-11-16 2013-03-19 Chien-Min Sung CMP pad conditioners with mosaic abrasive segments and associated methods
US20110275288A1 (en) * 2010-05-10 2011-11-10 Chien-Min Sung Cmp pad dressers with hybridized conditioning and related methods
US8622787B2 (en) * 2006-11-16 2014-01-07 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US8393934B2 (en) * 2006-11-16 2013-03-12 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
JP4791121B2 (en) * 2005-09-22 2011-10-12 新日鉄マテリアルズ株式会社 Polishing cloth dresser
US20070128994A1 (en) * 2005-12-02 2007-06-07 Chien-Min Sung Electroplated abrasive tools, methods, and molds
JP5008969B2 (en) * 2006-01-31 2012-08-22 新日本製鐵株式会社 Alloy for liquid phase diffusion bonding
US20080014845A1 (en) * 2006-07-11 2008-01-17 Alpay Yilmaz Conditioning disk having uniform structures
CN102341215B (en) * 2009-03-24 2014-06-18 圣戈班磨料磨具有限公司 Abrasive tool for use as a chemical mechanical planarization pad conditioner

Also Published As

Publication number Publication date
US20100291844A1 (en) 2010-11-18
TWI455794B (en) 2014-10-11
WO2009104224A1 (en) 2009-08-27
TW200936317A (en) 2009-09-01
JP5255860B2 (en) 2013-08-07
JP2009196025A (en) 2009-09-03

Similar Documents

Publication Publication Date Title
MY153268A (en) Dresser for abrasive cloth
WO2014020075A8 (en) Abrasive grain containing a first face without vertices and a second face with vertices
SG170662A1 (en) Method for producing a semiconductor wafer
KR101604076B1 (en) Method for polishing semiconductor wafers by means of simultaneous doubleside polishing
JP2012533888A (en) Grooved CMP polished PAD
WO2010123744A3 (en) Cmp porous pad with particles in a polymeric matrix
TW200632085A (en) Conductive pad with high abrasion
US20140308883A1 (en) Chemical mechanical polishing conditioner
MY170361A (en) Sapphire polishing slurry and sapphire polishing method
MY155449A (en) Method and apparatus for trimming the working layers of a double-side grinding apparatus
CN104907895A (en) Method for quickly processing doubly polished sapphire wafers
MY163872A (en) Method and apparatus for dressing polishing pad
WO2014179419A8 (en) Chemical mechanical planarization slurry composition comprising composite particles, process for removing material using said composition, cmp polishing pad and process for preparing said composition
KR101144981B1 (en) Cmp pad conditioner and method for producing the same
MY169975A (en) Abrasive grain embedding apparatus, lapping apparatus and lapping method
WO2015046543A8 (en) Method for manufacturing glass substrate for magnetic disk, method for manufacturing magnetic disk, and grinding tool
CN201519904U (en) Chip stripping device
TWI412428B (en)
WO2011090681A3 (en) Anti-loading abrasive article
JP2016204187A5 (en)
JP2014217935A (en) Dressing tool
CN103009273A (en) Pyramid grinding plate
CN202878097U (en) Abrasive plate with buffering layer
CN102975093A (en) Floating cutter head of ground polishing machine
CN202862022U (en) Novel device capable of prolonging service life of polishing upper pad