MY153268A - Dresser for abrasive cloth - Google Patents
Dresser for abrasive clothInfo
- Publication number
- MY153268A MY153268A MYPI2010003221A MYPI20103221A MY153268A MY 153268 A MY153268 A MY 153268A MY PI2010003221 A MYPI2010003221 A MY PI2010003221A MY PI20103221 A MYPI20103221 A MY PI20103221A MY 153268 A MY153268 A MY 153268A
- Authority
- MY
- Malaysia
- Prior art keywords
- dresser
- abrasive
- abrasive grains
- center
- grains
- Prior art date
Links
- 239000004744 fabric Substances 0.000 title abstract 2
- 239000006061 abrasive grain Substances 0.000 abstract 9
- 239000000463 material Substances 0.000 abstract 2
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 239000002356 single layer Substances 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/12—Dressing tools; Holders therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
THE INVENTION PROVIDES A DRESSER FOR AN ABRASIVE CLOTH, WHICH HAS A SMALLER ABRASIVE GRAIN DIAMETER THAN THE CONVENTIONAL DRESSER AND HAS AN ABRASIVE GRAIN SPACING REGULATED IN A PREDETERMINED RANGE DEPENDING UPON THE ABRASIVE GRAIN DIAMETER TO SIMULTANEOUSLY MEET A HIGH LEVEL OF PAD GRINDING POWER AND A PAD FLATNESS AND, AT THE SAME TIME, IS LESS LIKELY TO CAUSE DROPOUT OF ABRASIVE GRAINS. THE DRESSER COMPRISES A PLURALITY OF ABRASIVE GRAINS FIXED AS A SINGLE LAYER ON A SURFACE OF A METALLIC SUPPORT MATERIAL. THE DRESSER IS CHARACTERIZED IN THAT THE METALLIC SUPPORT MATERIAL ON ITS SURFACE ON WHICH THE ABRASIVE GRAINS ARE FIXED HAS A CONVEX SHAPE, THE DIFFERENCE IN HEIGHT BETWEEN THE END PART AND THE CENTRAL PORT ON THE SURFACE IS NOT LESS THAN 3µM AND NOT MORE THAN 40µM, AND THE CENTER-TO-CENTER SPACING BETWEEN AT LEAST ONE SET OF ADJACENT GRAINS IS D=L<2D WHEREIN D REPRESENTS THE DIAMETER OF THE ABRASIVE GRAINS; L REPRESENTS THE CENTER-TO-CENTER SPACING BETWEEN ADJACENT ABRASIVE GRAINS. THE DIAMETER (D) OF THE ABRASIVE GRAINS IS PREFERABLY 3µM=D<100µM.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008039218A JP5255860B2 (en) | 2008-02-20 | 2008-02-20 | Polishing cloth dresser |
Publications (1)
Publication Number | Publication Date |
---|---|
MY153268A true MY153268A (en) | 2015-01-29 |
Family
ID=40985120
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2010003221A MY153268A (en) | 2008-02-20 | 2008-10-28 | Dresser for abrasive cloth |
Country Status (5)
Country | Link |
---|---|
US (1) | US20100291844A1 (en) |
JP (1) | JP5255860B2 (en) |
MY (1) | MY153268A (en) |
TW (1) | TWI455794B (en) |
WO (1) | WO2009104224A1 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201246342A (en) * | 2010-12-13 | 2012-11-16 | Saint Gobain Abrasives Inc | Chemical mechanical planarization (CMP) pad conditioner and method of making |
TWI422466B (en) * | 2011-01-28 | 2014-01-11 | Advanced Surface Tech Inc | Diamond abrasive tool and manufacturing method thereof |
JP5809880B2 (en) * | 2011-08-25 | 2015-11-11 | 新日鉄住金マテリアルズ株式会社 | Polishing cloth dresser |
JP6193388B2 (en) * | 2013-09-30 | 2017-09-06 | Hoya株式会社 | Method of manufacturing glass substrate for magnetic disk, method of manufacturing glass substrate, method of manufacturing magnetic disk, and fixed abrasive wheel |
JP6900523B2 (en) * | 2015-09-07 | 2021-07-07 | 日鉄ケミカル&マテリアル株式会社 | Dresser for abrasive cloth |
JP2017052019A (en) * | 2015-09-07 | 2017-03-16 | 新日鉄住金マテリアルズ株式会社 | Dresser for abrasive cloth |
JP6666749B2 (en) * | 2016-02-29 | 2020-03-18 | 日鉄ケミカル&マテリアル株式会社 | Dresser for polishing cloth |
US11389928B2 (en) * | 2017-11-30 | 2022-07-19 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for conditioning polishing pad |
JP7309772B2 (en) * | 2021-03-25 | 2023-07-18 | 株式会社ノリタケカンパニーリミテド | rotary dresser |
Family Cites Families (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2564950B2 (en) * | 1989-05-30 | 1996-12-18 | 富士電機株式会社 | Drinking water sterilizer |
KR100328108B1 (en) * | 1996-10-15 | 2002-03-09 | 아사무라 타카싯 | Semiconductor substrate polishing pad dresser, method of manufacturing the same, and chemicomechanical polishing method using the same dresser |
US9463552B2 (en) * | 1997-04-04 | 2016-10-11 | Chien-Min Sung | Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods |
US7124753B2 (en) * | 1997-04-04 | 2006-10-24 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
US6884155B2 (en) * | 1999-11-22 | 2005-04-26 | Kinik | Diamond grid CMP pad dresser |
US6368198B1 (en) * | 1999-11-22 | 2002-04-09 | Kinik Company | Diamond grid CMP pad dresser |
US20040112359A1 (en) * | 1997-04-04 | 2004-06-17 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
US7323049B2 (en) * | 1997-04-04 | 2008-01-29 | Chien-Min Sung | High pressure superabrasive particle synthesis |
CN1197687C (en) * | 1998-06-29 | 2005-04-20 | 台湾积体电路制造股份有限公司 | Work-table of chemicomechanical grinding mill |
JP2000106353A (en) * | 1998-07-31 | 2000-04-11 | Nippon Steel Corp | Dresser for polishing cloth for semiconductor substrate |
JP2000141204A (en) * | 1998-09-08 | 2000-05-23 | Sumitomo Metal Ind Ltd | Dressing device, and polishing device and cmp device using the same |
JP3484686B2 (en) * | 1998-10-13 | 2004-01-06 | オムロン株式会社 | Axle load measurement method and axle load measurement device |
JP2000218512A (en) * | 1999-01-28 | 2000-08-08 | Osaka Diamond Ind Co Ltd | Cmp pad conditioner and manufacture thereof |
JP2001018172A (en) * | 1999-07-08 | 2001-01-23 | Osaka Diamond Ind Co Ltd | Correcting tool for polishing tool |
JP2001025973A (en) * | 1999-07-15 | 2001-01-30 | Noritake Co Ltd | Vitrified bond tool, and its manufacture |
TW412461B (en) * | 1999-09-29 | 2000-11-21 | Kinik Co | Diamond disk for trimming wafer polishing pad and method for making the same |
US7201645B2 (en) * | 1999-11-22 | 2007-04-10 | Chien-Min Sung | Contoured CMP pad dresser and associated methods |
JP3072991U (en) * | 2000-02-24 | 2000-11-07 | 株式会社藤森技術研究所 | Polishing dresser for polishing machine of chemical machine polisher |
US7011134B2 (en) * | 2000-10-13 | 2006-03-14 | Chien-Min Sung | Casting method for producing surface acoustic wave devices |
US6659161B1 (en) * | 2000-10-13 | 2003-12-09 | Chien-Min Sung | Molding process for making diamond tools |
US6814130B2 (en) * | 2000-10-13 | 2004-11-09 | Chien-Min Sung | Methods of making diamond tools using reverse casting of chemical vapor deposition |
US20040072510A1 (en) * | 2000-12-21 | 2004-04-15 | Toshiya Kinoshita | Cmp conditioner, method for arranging rigid grains used for cmp conditioner, and method for manufacturing cmp conditioner |
JP4216025B2 (en) * | 2002-09-09 | 2009-01-28 | 株式会社リード | Dresser for polishing cloth and dressing method for polishing cloth using the same |
US20060213128A1 (en) * | 2002-09-24 | 2006-09-28 | Chien-Min Sung | Methods of maximizing retention of superabrasive particles in a metal matrix |
JP3801551B2 (en) * | 2002-10-11 | 2006-07-26 | 株式会社ノリタケスーパーアブレーシブ | CMP pad conditioner |
JP2006055944A (en) * | 2004-08-20 | 2006-03-02 | Allied Material Corp | Cmp pad conditioner |
US20070060026A1 (en) * | 2005-09-09 | 2007-03-15 | Chien-Min Sung | Methods of bonding superabrasive particles in an organic matrix |
US7258708B2 (en) * | 2004-12-30 | 2007-08-21 | Chien-Min Sung | Chemical mechanical polishing pad dresser |
JP2006305659A (en) * | 2005-04-27 | 2006-11-09 | Nippon Steel Corp | Dresser for polishing cloth |
US8398466B2 (en) * | 2006-11-16 | 2013-03-19 | Chien-Min Sung | CMP pad conditioners with mosaic abrasive segments and associated methods |
US20110275288A1 (en) * | 2010-05-10 | 2011-11-10 | Chien-Min Sung | Cmp pad dressers with hybridized conditioning and related methods |
US8622787B2 (en) * | 2006-11-16 | 2014-01-07 | Chien-Min Sung | CMP pad dressers with hybridized abrasive surface and related methods |
US8393934B2 (en) * | 2006-11-16 | 2013-03-12 | Chien-Min Sung | CMP pad dressers with hybridized abrasive surface and related methods |
JP4791121B2 (en) * | 2005-09-22 | 2011-10-12 | 新日鉄マテリアルズ株式会社 | Polishing cloth dresser |
US20070128994A1 (en) * | 2005-12-02 | 2007-06-07 | Chien-Min Sung | Electroplated abrasive tools, methods, and molds |
JP5008969B2 (en) * | 2006-01-31 | 2012-08-22 | 新日本製鐵株式会社 | Alloy for liquid phase diffusion bonding |
US20080014845A1 (en) * | 2006-07-11 | 2008-01-17 | Alpay Yilmaz | Conditioning disk having uniform structures |
CN102341215B (en) * | 2009-03-24 | 2014-06-18 | 圣戈班磨料磨具有限公司 | Abrasive tool for use as a chemical mechanical planarization pad conditioner |
-
2008
- 2008-02-20 JP JP2008039218A patent/JP5255860B2/en active Active
- 2008-10-28 WO PCT/JP2008/003076 patent/WO2009104224A1/en active Application Filing
- 2008-10-28 MY MYPI2010003221A patent/MY153268A/en unknown
- 2008-10-28 US US12/812,643 patent/US20100291844A1/en not_active Abandoned
-
2009
- 2009-02-20 TW TW098105440A patent/TWI455794B/en active
Also Published As
Publication number | Publication date |
---|---|
US20100291844A1 (en) | 2010-11-18 |
TWI455794B (en) | 2014-10-11 |
WO2009104224A1 (en) | 2009-08-27 |
TW200936317A (en) | 2009-09-01 |
JP5255860B2 (en) | 2013-08-07 |
JP2009196025A (en) | 2009-09-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
MY153268A (en) | Dresser for abrasive cloth | |
WO2014020075A8 (en) | Abrasive grain containing a first face without vertices and a second face with vertices | |
SG170662A1 (en) | Method for producing a semiconductor wafer | |
KR101604076B1 (en) | Method for polishing semiconductor wafers by means of simultaneous doubleside polishing | |
JP2012533888A (en) | Grooved CMP polished PAD | |
WO2010123744A3 (en) | Cmp porous pad with particles in a polymeric matrix | |
TW200632085A (en) | Conductive pad with high abrasion | |
US20140308883A1 (en) | Chemical mechanical polishing conditioner | |
MY170361A (en) | Sapphire polishing slurry and sapphire polishing method | |
MY155449A (en) | Method and apparatus for trimming the working layers of a double-side grinding apparatus | |
CN104907895A (en) | Method for quickly processing doubly polished sapphire wafers | |
MY163872A (en) | Method and apparatus for dressing polishing pad | |
WO2014179419A8 (en) | Chemical mechanical planarization slurry composition comprising composite particles, process for removing material using said composition, cmp polishing pad and process for preparing said composition | |
KR101144981B1 (en) | Cmp pad conditioner and method for producing the same | |
MY169975A (en) | Abrasive grain embedding apparatus, lapping apparatus and lapping method | |
WO2015046543A8 (en) | Method for manufacturing glass substrate for magnetic disk, method for manufacturing magnetic disk, and grinding tool | |
CN201519904U (en) | Chip stripping device | |
TWI412428B (en) | ||
WO2011090681A3 (en) | Anti-loading abrasive article | |
JP2016204187A5 (en) | ||
JP2014217935A (en) | Dressing tool | |
CN103009273A (en) | Pyramid grinding plate | |
CN202878097U (en) | Abrasive plate with buffering layer | |
CN102975093A (en) | Floating cutter head of ground polishing machine | |
CN202862022U (en) | Novel device capable of prolonging service life of polishing upper pad |