TWI266673B - Polishing pad, polishing device, and polishing method - Google Patents

Polishing pad, polishing device, and polishing method

Info

Publication number
TWI266673B
TWI266673B TW092102513A TW92102513A TWI266673B TW I266673 B TWI266673 B TW I266673B TW 092102513 A TW092102513 A TW 092102513A TW 92102513 A TW92102513 A TW 92102513A TW I266673 B TWI266673 B TW I266673B
Authority
TW
Taiwan
Prior art keywords
polishing
pad
polishing pad
elongated holes
holes
Prior art date
Application number
TW092102513A
Other languages
Chinese (zh)
Other versions
TW200307588A (en
Inventor
Shunichi Shibuki
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of TW200307588A publication Critical patent/TW200307588A/en
Application granted granted Critical
Publication of TWI266673B publication Critical patent/TWI266673B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

This invention provides a polishing pad, a polishing device and a polishing method, capable of easily removing polished matter from the surface thereof after polishing, reducing the consumption of polishing fluid used for the polishing, and lowering the production cost thereof, in which a plurality of elongated holes (11) passing through a first polishing pad (1) in thickness direction are provided in the first polishing pad (1) for polishing the polished matter, the elongated holes (11) are desirably formed so that the lengths thereof in longitudinal direction are 20 mm or shorter and the pitches thereof in lateral direction are less than 100 mm, and small holes (unshown) may be provided in the first polishing pad (1) in addition to the elongated holes (11).
TW092102513A 2002-02-07 2003-02-07 Polishing pad, polishing device, and polishing method TWI266673B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002030322 2002-02-07
JP2002327853A JP3843933B2 (en) 2002-02-07 2002-11-12 Polishing pad, polishing apparatus and polishing method

Publications (2)

Publication Number Publication Date
TW200307588A TW200307588A (en) 2003-12-16
TWI266673B true TWI266673B (en) 2006-11-21

Family

ID=27736451

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092102513A TWI266673B (en) 2002-02-07 2003-02-07 Polishing pad, polishing device, and polishing method

Country Status (6)

Country Link
US (2) US20050153633A1 (en)
JP (1) JP3843933B2 (en)
KR (1) KR20040079965A (en)
CN (1) CN100365773C (en)
TW (1) TWI266673B (en)
WO (1) WO2003067641A1 (en)

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JP4620501B2 (en) * 2005-03-04 2011-01-26 ニッタ・ハース株式会社 Polishing pad
CN100580885C (en) * 2006-02-06 2010-01-13 东丽株式会社 Polishing pad, polishing apparatus, protection film for the polishing apparatus and polishing method
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DE202006004193U1 (en) * 2006-03-14 2006-06-08 Richter, Harald Adapter plate for a vacuum suction device
JP2007290114A (en) * 2006-03-27 2007-11-08 Toshiba Corp Polishing pad, polishing method, and polishing device
JP2007266052A (en) * 2006-03-27 2007-10-11 Nec Electronics Corp Polishing pad, cmp apparatus, and method of manufacturing polishing pad
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US20080003935A1 (en) * 2006-07-03 2008-01-03 Chung-Chih Feng Polishing pad having surface texture
JP5308637B2 (en) * 2007-07-11 2013-10-09 東洋ゴム工業株式会社 Polishing pad
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CN101987431B (en) * 2009-08-06 2015-08-19 智胜科技股份有限公司 Ginding process, grinding pad and grinding system
KR20140062475A (en) * 2011-09-16 2014-05-23 도레이 카부시키가이샤 Polishing pad
US9551075B2 (en) * 2014-08-04 2017-01-24 Sinmat, Inc. Chemical mechanical polishing of alumina
JP7113626B2 (en) * 2018-01-12 2022-08-05 ニッタ・デュポン株式会社 polishing pad
JP7351170B2 (en) * 2019-09-26 2023-09-27 日本電気硝子株式会社 Polishing pad and polishing method
CN114592401A (en) * 2021-05-31 2022-06-07 清华大学 Ice surface polishing method and device
CN115805523A (en) * 2022-12-29 2023-03-17 西安奕斯伟材料科技有限公司 Fixed plate, polishing device and polishing method

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Also Published As

Publication number Publication date
JP2003300149A (en) 2003-10-21
TW200307588A (en) 2003-12-16
KR20040079965A (en) 2004-09-16
WO2003067641A1 (en) 2003-08-14
US20050153633A1 (en) 2005-07-14
JP3843933B2 (en) 2006-11-08
CN100365773C (en) 2008-01-30
CN1628374A (en) 2005-06-15
US20070190911A1 (en) 2007-08-16

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MM4A Annulment or lapse of patent due to non-payment of fees