US20080003935A1 - Polishing pad having surface texture - Google Patents
Polishing pad having surface texture Download PDFInfo
- Publication number
- US20080003935A1 US20080003935A1 US11/478,605 US47860506A US2008003935A1 US 20080003935 A1 US20080003935 A1 US 20080003935A1 US 47860506 A US47860506 A US 47860506A US 2008003935 A1 US2008003935 A1 US 2008003935A1
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- United States
- Prior art keywords
- polishing pad
- grooves
- groove
- holes
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
Definitions
- the present invention relates to a polishing pad having a surface texture, and more particularly, to a polishing pad with holes to store polishing slurry.
- Polishing generally refers to a wear control for a preliminary coarse surface in the process of chemical mechanical polishing (CMP), which makes the slurry containing fine particles evenly dispersed on the upper surface of a polishing pad, and at the same time places a polishing workpiece against the polishing pad and then rubs the workpiece repeatedly with a regular motion.
- the polishing workpiece may be objects such as a semiconductor, a storage medium substrate, an integrated circuit, an LCD flat-panel glass, an optical glass and a photoelectric panel.
- the upper surface of the polishing pad is usually cut with a plurality of grooves or formed with a surface texture. Therefore, the polishing effect of the polishing pad on the workpiece to be polished is easily affected by the grooves and the surface texture.
- FIG. 1 a top view of a polishing pad having a surface texture disclosed in the ROC (Taiwan) Patent Publication No. 504,429 is shown.
- the surface texture of the polishing pad 1 comprises a plurality of concentric circular grooves 11 , wherein the depth and the width of the circular grooves 11 are designed in accordance with the requirement.
- the polishing pad 1 has the disadvantage that the impurities produced during the polishing process cannot be quickly removed from the polishing pad 1 , thus negatively affecting the polishing precision and the service life of the polishing pad 1 .
- FIG. 2 a top view of a polishing pad having a surface texture disclosed in the ROC (Taiwan) Patent Publication No. 562,716 is shown.
- the surface texture of the polishing pad 2 comprises a plurality of radial grooves 21 , wherein the radial grooves 21 are connected to the center 22 of the polishing pad 2 and the edge 23 of the polishing pad 2 .
- the advantage of the polishing pad 2 is that the impurities produced during the polishing process can be quickly removed from the polishing pad 2 .
- the polishing pad 2 has the disadvantage that the polishing particles in the polishing slurry are also quickly removed from the polishing pad 2 , thus negatively affecting the polishing precision and the service life of the polishing pad 2 .
- the objective of the present invention is to provide a polishing pad having a surface texture.
- the polishing pad comprises a surface texture disposed on a polishing surface of the polishing pad.
- the surface texture comprises at least one first groove, at least one second groove, and a plurality of holes.
- the second groove is connected to the edge of the polishing pad, and the first groove(s) is intersected with the second groove(s) to form a plurality of intersection points.
- the holes are disposed at the intersection points, and the depth of the holes is larger than that of the first groove.
- the second groove(s) enables the impurities suspended in the polishing slurry to be quickly removed, and the holes then store the polishing slurry to delay the polishing particles in the polishing slurry from departing from the polishing pad.
- FIG. 1 is a top view of a polishing pad having a surface texture disclosed in the ROC (Taiwan) Patent Publication No. 504,429;
- FIG. 2 is a top view of a polishing pad having a surface texture disclosed in the ROC (Taiwan) Patent Publication No. 562,716;
- FIG. 3 is a top view of the polishing pad according to the first embodiment of the present invention.
- FIG. 4 is a top view of the polishing pad according to the second embodiment of the present invention.
- FIG. 5 is a top view of the polishing pad according to the third embodiment of the present invention.
- FIG. 6 is a top view of the polishing pad according to the fourth embodiment of the present invention.
- FIG. 7 is a top view of the polishing pad according to the fifth embodiment of the present invention.
- the present invention provides a polishing pad having a surface texture.
- the polishing pad is suitable for polishing an object to be polished in the chemical mechanical polishing (CMP) process.
- the object to be polished comprises, but is not limited to, objects such as semiconductors, storage medium substrates, integrated circuits, LCD flat glass, optical glass, and photoelectric panels.
- the polishing pad comprises a surface texture disposed on a polishing surface of the polishing pad.
- the surface texture comprises at least one first groove, at least one second groove, and a plurality of holes. That is, the first groove, the second groove and the holes are on the same surface (polishing surface).
- the first grooves are a plurality of circular grooves with different radii from the top view and the circular grooves are concentric grooves.
- the first grooves can also be a plurality of rectangular grooves with different side lengths and the rectangular grooves are concentric grooves.
- the first groove(s) may be a spiral groove, or grooves of other shapes.
- the second groove(s) extends from a central portion of the polishing pad to an edge of the polishing pad, and the first groove(s) is intersected with the second groove(s) to form a plurality of intersection points.
- the second groove(s) is a plurality of radial grooves from the top view, each of which is a linear or arced groove.
- the holes are disposed at the intersection points.
- the holes are blind holes and the depth of the holes is larger than that of the first groove(s) and the second groove(s).
- the surface texture of the polishing pad 3 of the present embodiment comprises a plurality of the first grooves 31 , a plurality of the second grooves 32 , and a plurality of holes 33 .
- the first grooves 31 are a plurality of concentric circular grooves, and the first grooves are a plurality of circular grooves with different radii from the top view.
- the second grooves 32 are a plurality of radial grooves, and each of the second grooves 32 is a linear groove extending from a central portion of the polishing pad 3 to the edge 34 of the polishing pad 3 .
- the first grooves 31 are intersected with the second grooves 32 to form a plurality of intersection points.
- the holes 33 are disposed at the intersection points, and the depth of the holes 33 is larger than that of the first grooves 31 and the second grooves 32 .
- the diameter of the hole 33 is larger than the width of the first grooves 31 and the second grooves 32 .
- the surface texture of the polishing pad 4 of the present embodiment comprises a plurality of the first grooves 41 , a plurality of the second grooves 42 , and a plurality of holes 43 .
- the first grooves 41 are a plurality of concentric circular grooves.
- the second grooves 42 are a plurality of radial grooves, and each of the second grooves 42 is a linear groove extending from a central portion of the polishing pad 4 to the edge 44 of the polishing pad 4 .
- the first grooves 41 are intersected with the second grooves 42 to form a plurality of intersection points.
- the holes 43 are disposed at the intersection points, and the depth of the holes 43 is larger than that of the first grooves 41 and the second grooves 42 .
- the diameter of the hole 43 is larger than the width of the first grooves 41 and the second grooves 42 .
- the difference between the surface texture of the polishing pad 4 of the present embodiment and that of the polishing pad 3 of the first embodiment is that the first groove 411 at the innermost circle of the polishing pad 4 are not intersected with the second grooves 42 .
- the surface texture of the polishing pad 5 of the present embodiment comprises a plurality of the first grooves 51 , a plurality of the second grooves 52 , a plurality of the first holes 53 , and a plurality of the second holes 55 .
- the first grooves 51 are a plurality of concentric circular grooves.
- the second grooves 52 are a plurality of radial grooves, and each of the second grooves 52 is a linear groove extending from a central portion of the polishing pad 5 to the edge 54 of the polishing pad 5 .
- the first grooves 51 are intersected with the second grooves 52 to form a plurality of intersection points.
- the first holes 53 are disposed at the intersection points, and the depth of the first holes 53 is larger than that of the first grooves 51 and the second grooves 52 .
- the second holes 55 are disposed on the second grooves 52 except for the intersection points, and the depth of the second holes 55 is the same as that of the first holes 53 .
- the diameters of the first hole 53 and the second holes 55 are larger than the widths of the first grooves 51 and the second grooves 52 .
- the surface texture of the polishing pad 6 of the present embodiment comprises a plurality of the first grooves 61 , a plurality of the second grooves 62 , and a plurality of holes 63 .
- the first grooves 61 are a plurality of concentric rectangular grooves from the top view, and the first grooves 61 are a plurality of rectangular grooves with different side lengths.
- the second grooves 62 are a plurality of radial grooves, and each of the second grooves 62 is a linear groove extending from a central portion of the polishing pad 6 to the edge 64 of the polishing pad 6 .
- the first grooves 61 are intersected with the second grooves 62 to form a plurality of intersection points.
- the holes 63 are disposed at the intersection points, and the depth of the holes 63 is larger than that of the first grooves 61 and the second grooves 62 .
- the surface texture of the polishing pad 7 of the present embodiment comprises a first groove 71 , a plurality of the second grooves 72 , and a plurality of holes 73 .
- the first groove 71 is a spiral groove from the top view.
- the second grooves 72 are a plurality of radial grooves, and each of the second grooves 72 is a linear groove extending from a central portion of the polishing pad 7 to the edge 74 of the polishing pad 7 .
- the first groove 71 is intersected with the second grooves 72 to form a plurality of intersection points.
- the holes 73 are disposed at the intersection points, and the depth of the holes 73 is larger than that of the first groove 71 and the second grooves 72 .
- the diameter of the hole 73 is larger than the widths of the first grooves 71 and the second grooves 72 .
- the surface texture of the polishing pad 8 of the present embodiment comprises a plurality of the first grooves 81 , a plurality of the second grooves 82 , and a plurality of holes 83 .
- the first grooves 81 are a plurality of concentric circular grooves.
- the second grooves 82 are a plurality of radial grooves, and each of the second grooves 82 is an arced groove extending from a central portion of the polishing pad 8 to the edge 84 of the polishing pad 8 .
- the first grooves 81 are intersected with the second grooves 82 to form a plurality of intersection points.
- the holes 83 are disposed at the intersection points and the depth of the holes 83 is larger than that of the first grooves 81 and the second grooves 82 .
- the diameter of the hole 83 is larger than the widths of the first grooves 81 and the second grooves 82 .
Abstract
Description
- 1. Field of the Invention
- The present invention relates to a polishing pad having a surface texture, and more particularly, to a polishing pad with holes to store polishing slurry.
- 2. Description of the Related Art
- Polishing generally refers to a wear control for a preliminary coarse surface in the process of chemical mechanical polishing (CMP), which makes the slurry containing fine particles evenly dispersed on the upper surface of a polishing pad, and at the same time places a polishing workpiece against the polishing pad and then rubs the workpiece repeatedly with a regular motion. The polishing workpiece may be objects such as a semiconductor, a storage medium substrate, an integrated circuit, an LCD flat-panel glass, an optical glass and a photoelectric panel. In order to maintain the distribution and flow of the polishing slurry and the planarization and polishing efficiency after the chemical mechanical polishing, the upper surface of the polishing pad is usually cut with a plurality of grooves or formed with a surface texture. Therefore, the polishing effect of the polishing pad on the workpiece to be polished is easily affected by the grooves and the surface texture.
- Referring to
FIG. 1 , a top view of a polishing pad having a surface texture disclosed in the ROC (Taiwan) Patent Publication No. 504,429 is shown. The surface texture of thepolishing pad 1 comprises a plurality of concentriccircular grooves 11, wherein the depth and the width of thecircular grooves 11 are designed in accordance with the requirement. However, thepolishing pad 1 has the disadvantage that the impurities produced during the polishing process cannot be quickly removed from thepolishing pad 1, thus negatively affecting the polishing precision and the service life of thepolishing pad 1. - Referring to
FIG. 2 , a top view of a polishing pad having a surface texture disclosed in the ROC (Taiwan) Patent Publication No. 562,716 is shown. The surface texture of thepolishing pad 2 comprises a plurality ofradial grooves 21, wherein theradial grooves 21 are connected to thecenter 22 of thepolishing pad 2 and theedge 23 of thepolishing pad 2. The advantage of thepolishing pad 2 is that the impurities produced during the polishing process can be quickly removed from thepolishing pad 2. However, thepolishing pad 2 has the disadvantage that the polishing particles in the polishing slurry are also quickly removed from thepolishing pad 2, thus negatively affecting the polishing precision and the service life of thepolishing pad 2. - Consequently, there is an existing need for a polishing pad having a surface texture to solve the above-mentioned problems.
- The objective of the present invention is to provide a polishing pad having a surface texture. The polishing pad comprises a surface texture disposed on a polishing surface of the polishing pad. The surface texture comprises at least one first groove, at least one second groove, and a plurality of holes. The second groove is connected to the edge of the polishing pad, and the first groove(s) is intersected with the second groove(s) to form a plurality of intersection points. The holes are disposed at the intersection points, and the depth of the holes is larger than that of the first groove.
- Thus, the second groove(s) enables the impurities suspended in the polishing slurry to be quickly removed, and the holes then store the polishing slurry to delay the polishing particles in the polishing slurry from departing from the polishing pad.
-
FIG. 1 is a top view of a polishing pad having a surface texture disclosed in the ROC (Taiwan) Patent Publication No. 504,429; -
FIG. 2 is a top view of a polishing pad having a surface texture disclosed in the ROC (Taiwan) Patent Publication No. 562,716; -
FIG. 3 is a top view of the polishing pad according to the first embodiment of the present invention; -
FIG. 4 is a top view of the polishing pad according to the second embodiment of the present invention; -
FIG. 5 is a top view of the polishing pad according to the third embodiment of the present invention; -
FIG. 6 is a top view of the polishing pad according to the fourth embodiment of the present invention; -
FIG. 7 is a top view of the polishing pad according to the fifth embodiment of the present invention; and -
FIG. 8 is a top view of the polishing pad according to the sixth embodiment of the present invention. - The present invention provides a polishing pad having a surface texture. The polishing pad is suitable for polishing an object to be polished in the chemical mechanical polishing (CMP) process. The object to be polished comprises, but is not limited to, objects such as semiconductors, storage medium substrates, integrated circuits, LCD flat glass, optical glass, and photoelectric panels.
- According to the present invention, the polishing pad comprises a surface texture disposed on a polishing surface of the polishing pad. The surface texture comprises at least one first groove, at least one second groove, and a plurality of holes. That is, the first groove, the second groove and the holes are on the same surface (polishing surface).In a preferred embodiment, the first grooves are a plurality of circular grooves with different radii from the top view and the circular grooves are concentric grooves. However, the first grooves can also be a plurality of rectangular grooves with different side lengths and the rectangular grooves are concentric grooves. Alternatively, the first groove(s) may be a spiral groove, or grooves of other shapes.
- The second groove(s) extends from a central portion of the polishing pad to an edge of the polishing pad, and the first groove(s) is intersected with the second groove(s) to form a plurality of intersection points. Preferably, the second groove(s) is a plurality of radial grooves from the top view, each of which is a linear or arced groove. The holes are disposed at the intersection points. The holes are blind holes and the depth of the holes is larger than that of the first groove(s) and the second groove(s). Thus, the second groove enables the impurities suspended in the polishing slurry to be quickly removed, and the holes then store the polishing slurry to delay the polishing particles in the polishing slurry from departing from the polishing pad.
- The present invention will be described in detail with the following examples, but it does not mean that the present invention is limited to the content disclosed by the examples.
- Referring to
FIG. 3 , a top view of the polishing pad according to the first embodiment of the present invention is shown. The surface texture of thepolishing pad 3 of the present embodiment comprises a plurality of thefirst grooves 31, a plurality of thesecond grooves 32, and a plurality ofholes 33. Thefirst grooves 31 are a plurality of concentric circular grooves, and the first grooves are a plurality of circular grooves with different radii from the top view. Thesecond grooves 32 are a plurality of radial grooves, and each of thesecond grooves 32 is a linear groove extending from a central portion of thepolishing pad 3 to theedge 34 of thepolishing pad 3. Thefirst grooves 31 are intersected with thesecond grooves 32 to form a plurality of intersection points. Theholes 33 are disposed at the intersection points, and the depth of theholes 33 is larger than that of thefirst grooves 31 and thesecond grooves 32. The diameter of thehole 33 is larger than the width of thefirst grooves 31 and thesecond grooves 32. - Referring to
FIG. 4 , a top view of the polishing pad according to the second embodiment of the present invention is shown. The surface texture of thepolishing pad 4 of the present embodiment comprises a plurality of thefirst grooves 41, a plurality of thesecond grooves 42, and a plurality ofholes 43. Thefirst grooves 41 are a plurality of concentric circular grooves. Thesecond grooves 42 are a plurality of radial grooves, and each of thesecond grooves 42 is a linear groove extending from a central portion of thepolishing pad 4 to theedge 44 of thepolishing pad 4. Thefirst grooves 41 are intersected with thesecond grooves 42 to form a plurality of intersection points. Theholes 43 are disposed at the intersection points, and the depth of theholes 43 is larger than that of thefirst grooves 41 and thesecond grooves 42. The diameter of thehole 43 is larger than the width of thefirst grooves 41 and thesecond grooves 42. The difference between the surface texture of thepolishing pad 4 of the present embodiment and that of thepolishing pad 3 of the first embodiment is that thefirst groove 411 at the innermost circle of thepolishing pad 4 are not intersected with thesecond grooves 42. - Referring to
FIG. 5 , a top view of the polishing pad according to the third embodiment of the present invention is shown. The surface texture of thepolishing pad 5 of the present embodiment comprises a plurality of thefirst grooves 51, a plurality of thesecond grooves 52, a plurality of thefirst holes 53, and a plurality of the second holes 55. Thefirst grooves 51 are a plurality of concentric circular grooves. Thesecond grooves 52 are a plurality of radial grooves, and each of thesecond grooves 52 is a linear groove extending from a central portion of thepolishing pad 5 to theedge 54 of thepolishing pad 5. Thefirst grooves 51 are intersected with thesecond grooves 52 to form a plurality of intersection points. Thefirst holes 53 are disposed at the intersection points, and the depth of thefirst holes 53 is larger than that of thefirst grooves 51 and thesecond grooves 52. Thesecond holes 55 are disposed on thesecond grooves 52 except for the intersection points, and the depth of thesecond holes 55 is the same as that of the first holes 53. The diameters of thefirst hole 53 and thesecond holes 55 are larger than the widths of thefirst grooves 51 and thesecond grooves 52. - Referring to
FIG. 6 , a top view of the polishing pad according to the fourth embodiment of the present invention is shown. The surface texture of thepolishing pad 6 of the present embodiment comprises a plurality of thefirst grooves 61, a plurality of thesecond grooves 62, and a plurality ofholes 63. Thefirst grooves 61 are a plurality of concentric rectangular grooves from the top view, and thefirst grooves 61 are a plurality of rectangular grooves with different side lengths. Thesecond grooves 62 are a plurality of radial grooves, and each of thesecond grooves 62 is a linear groove extending from a central portion of thepolishing pad 6 to theedge 64 of thepolishing pad 6. Thefirst grooves 61 are intersected with thesecond grooves 62 to form a plurality of intersection points. Theholes 63 are disposed at the intersection points, and the depth of theholes 63 is larger than that of thefirst grooves 61 and thesecond grooves 62. - Referring to
FIG. 7 , a top view of the polishing pad according to the fifth embodiment of the present invention is shown. The surface texture of thepolishing pad 7 of the present embodiment comprises afirst groove 71, a plurality of thesecond grooves 72, and a plurality ofholes 73. Thefirst groove 71 is a spiral groove from the top view. Thesecond grooves 72 are a plurality of radial grooves, and each of thesecond grooves 72 is a linear groove extending from a central portion of thepolishing pad 7 to theedge 74 of thepolishing pad 7. Thefirst groove 71 is intersected with thesecond grooves 72 to form a plurality of intersection points. Theholes 73 are disposed at the intersection points, and the depth of theholes 73 is larger than that of thefirst groove 71 and thesecond grooves 72. The diameter of thehole 73 is larger than the widths of thefirst grooves 71 and thesecond grooves 72. - Referring to
FIG. 8 , a top view of the polishing pad according to the sixth embodiment of the present invention is shown. The surface texture of thepolishing pad 8 of the present embodiment comprises a plurality of thefirst grooves 81, a plurality of thesecond grooves 82, and a plurality ofholes 83. Thefirst grooves 81 are a plurality of concentric circular grooves. Thesecond grooves 82 are a plurality of radial grooves, and each of thesecond grooves 82 is an arced groove extending from a central portion of thepolishing pad 8 to theedge 84 of thepolishing pad 8. Thefirst grooves 81 are intersected with thesecond grooves 82 to form a plurality of intersection points. Theholes 83 are disposed at the intersection points and the depth of theholes 83 is larger than that of thefirst grooves 81 and thesecond grooves 82. The diameter of thehole 83 is larger than the widths of thefirst grooves 81 and thesecond grooves 82. - While several embodiments of the present invention have been illustrated and described, various modifications and improvements can be made by those skilled in the art. The embodiments of the present invention are therefore described in an illustrative but not restrictive sense. It is intended that the present invention may not be limited to the particular forms as illustrated, and that all modifications which maintain the spirit and scope of the present invention are within the scope as defined in the appended claims.
Claims (15)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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US11/478,605 US20080003935A1 (en) | 2006-07-03 | 2006-07-03 | Polishing pad having surface texture |
US12/124,594 US20080220702A1 (en) | 2006-07-03 | 2008-05-21 | Polishing pad having surface texture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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US11/478,605 US20080003935A1 (en) | 2006-07-03 | 2006-07-03 | Polishing pad having surface texture |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US12/124,594 Continuation-In-Part US20080220702A1 (en) | 2006-07-03 | 2008-05-21 | Polishing pad having surface texture |
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US20080003935A1 true US20080003935A1 (en) | 2008-01-03 |
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US11/478,605 Abandoned US20080003935A1 (en) | 2006-07-03 | 2006-07-03 | Polishing pad having surface texture |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120040532A1 (en) * | 2007-07-26 | 2012-02-16 | Macronix International Co., Ltd. | Pad and method for chemical mechanical polishing |
US9180570B2 (en) | 2008-03-14 | 2015-11-10 | Nexplanar Corporation | Grooved CMP pad |
US10071461B2 (en) | 2014-04-03 | 2018-09-11 | 3M Innovative Properties Company | Polishing pads and systems and methods of making and using the same |
CN110732983A (en) * | 2019-10-30 | 2020-01-31 | 郑州伯利森新材料科技有限公司 | Repair-free superhard grinding wheel for processing hard and brittle materials and preparation method thereof |
USD1000928S1 (en) * | 2022-06-03 | 2023-10-10 | Beng Youl Cho | Polishing pad |
USD1004393S1 (en) * | 2021-11-09 | 2023-11-14 | Ehwa Diamond Industrial Co., Ltd. | Grinding pad |
US11878388B2 (en) * | 2018-06-15 | 2024-01-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Polishing pad, polishing apparatus and method of manufacturing semiconductor package using the same |
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US9180570B2 (en) | 2008-03-14 | 2015-11-10 | Nexplanar Corporation | Grooved CMP pad |
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US11878388B2 (en) * | 2018-06-15 | 2024-01-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Polishing pad, polishing apparatus and method of manufacturing semiconductor package using the same |
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