DE602004026748D1 - Polierkissen mit ausgespartem fenster - Google Patents

Polierkissen mit ausgespartem fenster

Info

Publication number
DE602004026748D1
DE602004026748D1 DE602004026748T DE602004026748T DE602004026748D1 DE 602004026748 D1 DE602004026748 D1 DE 602004026748D1 DE 602004026748 T DE602004026748 T DE 602004026748T DE 602004026748 T DE602004026748 T DE 602004026748T DE 602004026748 D1 DE602004026748 D1 DE 602004026748D1
Authority
DE
Germany
Prior art keywords
polishing
layer
aperture
width
length
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602004026748T
Other languages
English (en)
Inventor
Kyle A Turner
Jeffrey L Beeler
Kelly J Newell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CMC Materials Inc
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of DE602004026748D1 publication Critical patent/DE602004026748D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
DE602004026748T 2003-09-19 2004-09-14 Polierkissen mit ausgespartem fenster Active DE602004026748D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/666,797 US7195539B2 (en) 2003-09-19 2003-09-19 Polishing pad with recessed window
PCT/US2004/030105 WO2005032765A1 (en) 2003-09-19 2004-09-14 Polishing pad with recessed window

Publications (1)

Publication Number Publication Date
DE602004026748D1 true DE602004026748D1 (de) 2010-06-02

Family

ID=34313201

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004026748T Active DE602004026748D1 (de) 2003-09-19 2004-09-14 Polierkissen mit ausgespartem fenster

Country Status (9)

Country Link
US (1) US7195539B2 (de)
EP (1) EP1667816B1 (de)
JP (1) JP4991294B2 (de)
KR (1) KR100936594B1 (de)
CN (1) CN1852788A (de)
AT (1) ATE464976T1 (de)
DE (1) DE602004026748D1 (de)
TW (1) TWI276504B (de)
WO (1) WO2005032765A1 (de)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8485862B2 (en) * 2000-05-19 2013-07-16 Applied Materials, Inc. Polishing pad for endpoint detection and related methods
US7001242B2 (en) * 2002-02-06 2006-02-21 Applied Materials, Inc. Method and apparatus of eddy current monitoring for chemical mechanical polishing
US20040209066A1 (en) * 2003-04-17 2004-10-21 Swisher Robert G. Polishing pad with window for planarization
US7258602B2 (en) * 2003-10-22 2007-08-21 Iv Technologies Co., Ltd. Polishing pad having grooved window therein and method of forming the same
US6984163B2 (en) * 2003-11-25 2006-01-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with high optical transmission window
US7182670B2 (en) * 2004-09-22 2007-02-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP pad having a streamlined windowpane
US20060089095A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US20060089094A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US20060089093A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
JP2007118106A (ja) * 2005-10-26 2007-05-17 Toyo Tire & Rubber Co Ltd 研磨パッド及びその製造方法
JP4859109B2 (ja) * 2006-03-27 2012-01-25 東洋ゴム工業株式会社 研磨パッドの製造方法
JP5110677B2 (ja) * 2006-05-17 2012-12-26 東洋ゴム工業株式会社 研磨パッド
JP2007307639A (ja) * 2006-05-17 2007-11-29 Toyo Tire & Rubber Co Ltd 研磨パッド
US8562389B2 (en) * 2007-06-08 2013-10-22 Applied Materials, Inc. Thin polishing pad with window and molding process
TWI411495B (zh) * 2007-08-16 2013-10-11 Cabot Microelectronics Corp 拋光墊
WO2009070352A1 (en) * 2007-11-30 2009-06-04 Innopad, Inc. Chemical-mechanical planarization pad having end point detection window
US8157614B2 (en) * 2009-04-30 2012-04-17 Applied Materials, Inc. Method of making and apparatus having windowless polishing pad and protected fiber
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
JP5501785B2 (ja) * 2010-02-05 2014-05-28 株式会社ディスコ サファイア基板の加工方法
JP5443192B2 (ja) * 2010-02-10 2014-03-19 株式会社ディスコ サファイア基板の加工方法
JP5426469B2 (ja) * 2010-05-10 2014-02-26 東洋ゴム工業株式会社 研磨パッドおよびガラス基板の製造方法
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
US8758659B2 (en) 2010-09-29 2014-06-24 Fns Tech Co., Ltd. Method of grooving a chemical-mechanical planarization pad
SG188632A1 (en) * 2010-09-30 2013-04-30 Nexplanar Corp Polishing pad for eddy current end-point detection
US8628384B2 (en) * 2010-09-30 2014-01-14 Nexplanar Corporation Polishing pad for eddy current end-point detection
US8657653B2 (en) 2010-09-30 2014-02-25 Nexplanar Corporation Homogeneous polishing pad for eddy current end-point detection
JP5918254B2 (ja) * 2010-11-18 2016-05-18 キャボット マイクロエレクトロニクス コーポレイション 透過性領域を含む研磨パッド
US8920219B2 (en) * 2011-07-15 2014-12-30 Nexplanar Corporation Polishing pad with alignment aperture
US9156125B2 (en) 2012-04-11 2015-10-13 Cabot Microelectronics Corporation Polishing pad with light-stable light-transmitting region
US9597769B2 (en) 2012-06-04 2017-03-21 Nexplanar Corporation Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer
US20140256231A1 (en) * 2013-03-07 2014-09-11 Dow Global Technologies Llc Multilayer Chemical Mechanical Polishing Pad With Broad Spectrum, Endpoint Detection Window
JP6255991B2 (ja) * 2013-12-26 2018-01-10 株式会社Sumco ワークの両面研磨装置
US9259820B2 (en) 2014-03-28 2016-02-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with polishing layer and window
US9216489B2 (en) 2014-03-28 2015-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US9064806B1 (en) 2014-03-28 2015-06-23 Rohm and Haas Electronics Materials CMP Holdings, Inc. Soft and conditionable chemical mechanical polishing pad with window
US9314897B2 (en) 2014-04-29 2016-04-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US9333620B2 (en) 2014-04-29 2016-05-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with clear endpoint detection window
KR101555822B1 (ko) * 2014-09-05 2015-09-25 임흥빈 절개형 핸드 그라인더 휠
US9475168B2 (en) * 2015-03-26 2016-10-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad window
CN104889874B (zh) * 2015-06-25 2017-08-04 蓝思科技（长沙）有限公司 一种蓝宝石抛光用吸附垫及其制备方法
US10213894B2 (en) 2016-02-26 2019-02-26 Applied Materials, Inc. Method of placing window in thin polishing pad
US10569383B2 (en) * 2017-09-15 2020-02-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Flanged optical endpoint detection windows and CMP polishing pads containing them
CN109202693B (zh) * 2017-10-16 2021-10-12 Skc索密思株式会社 防泄漏抛光垫及其制造方法
US11002034B2 (en) 2019-05-31 2021-05-11 Fred Joseph Horrell, III Utility pole crossarm conversion apparatuses
CN113246015B (zh) * 2021-05-25 2022-09-20 万华化学集团电子材料有限公司 具有终点检测窗的抛光垫及其应用
CN114918823B (zh) * 2022-05-20 2023-08-25 安徽禾臣新材料有限公司 一种大尺寸衬底抛光用白垫及其生产工艺
CN115415931B (zh) * 2022-07-26 2024-03-15 安徽禾臣新材料有限公司 一种半导体加工用化学机械抛光垫

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5433651A (en) * 1993-12-22 1995-07-18 International Business Machines Corporation In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing
US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US5605760A (en) * 1995-08-21 1997-02-25 Rodel, Inc. Polishing pads
JP3454658B2 (ja) * 1997-02-03 2003-10-06 大日本スクリーン製造株式会社 研磨処理モニター装置
JPH1177517A (ja) 1997-09-02 1999-03-23 Nikon Corp 研磨部材及び研磨装置
US6068539A (en) * 1998-03-10 2000-05-30 Lam Research Corporation Wafer polishing device with movable window
US6248000B1 (en) * 1998-03-24 2001-06-19 Nikon Research Corporation Of America Polishing pad thinning to optically access a semiconductor wafer surface
WO2000060650A1 (fr) * 1999-03-31 2000-10-12 Nikon Corporation Corps de polissage, dispositif de polissage, procede de reglage du dispositif de polissage, dispositif de mesure de l'epaisseur du film poli ou du point terminal de polissage, procede de fabrication d'un dispositif a semi-conducteur
US6146242A (en) * 1999-06-11 2000-11-14 Strasbaugh, Inc. Optical view port for chemical mechanical planarization endpoint detection
US6171181B1 (en) * 1999-08-17 2001-01-09 Rodel Holdings, Inc. Molded polishing pad having integral window
JP2001066217A (ja) * 1999-08-30 2001-03-16 Sekisui Chem Co Ltd ライニング槽の溶接検査方法
US6524164B1 (en) * 1999-09-14 2003-02-25 Applied Materials, Inc. Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus
US6454630B1 (en) * 1999-09-14 2002-09-24 Applied Materials, Inc. Rotatable platen having a transparent window for a chemical mechanical polishing apparatus and method of making the same
EP1224060B1 (de) * 1999-09-29 2004-06-23 Rodel Holdings, Inc. Schleifkissen
JP3259225B2 (ja) * 1999-12-27 2002-02-25 株式会社ニコン 研磨状況モニタ方法及びその装置、研磨装置、プロセスウエハ、半導体デバイス製造方法、並びに半導体デバイス
JP4342667B2 (ja) * 1999-12-28 2009-10-14 ロンシール工業株式会社 ポリオレフィン系樹脂シートの接合方法
KR20020084150A (ko) * 2000-02-25 2002-11-04 로델 홀딩스 인코포레이티드 투명부를 갖는 연마 패드
US6860793B2 (en) * 2000-03-15 2005-03-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Window portion with an adjusted rate of wear
US6685537B1 (en) 2000-06-05 2004-02-03 Speedfam-Ipec Corporation Polishing pad window for a chemical mechanical polishing tool
JP2002001647A (ja) 2000-06-19 2002-01-08 Rodel Nitta Co 研磨パッド
US20020137431A1 (en) * 2001-03-23 2002-09-26 Labunsky Michael A. Methods and apparatus for polishing and planarization
US6641470B1 (en) 2001-03-30 2003-11-04 Lam Research Corporation Apparatus for accurate endpoint detection in supported polishing pads
JP4131632B2 (ja) * 2001-06-15 2008-08-13 株式会社荏原製作所 ポリッシング装置及び研磨パッド
US6599765B1 (en) * 2001-12-12 2003-07-29 Lam Research Corporation Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection
US6524176B1 (en) * 2002-03-25 2003-02-25 Macronix International Co. Ltd. Polishing pad
US6806100B1 (en) * 2002-12-24 2004-10-19 Lam Research Corporation Molded end point detection window for chemical mechanical planarization
US6676483B1 (en) * 2003-02-03 2004-01-13 Rodel Holdings, Inc. Anti-scattering layer for polishing pad windows

Also Published As

Publication number Publication date
ATE464976T1 (de) 2010-05-15
JP4991294B2 (ja) 2012-08-01
US7195539B2 (en) 2007-03-27
TWI276504B (en) 2007-03-21
US20050060943A1 (en) 2005-03-24
CN1852788A (zh) 2006-10-25
KR100936594B1 (ko) 2010-01-13
EP1667816B1 (de) 2010-04-21
EP1667816A1 (de) 2006-06-14
TW200526357A (en) 2005-08-16
JP2007506280A (ja) 2007-03-15
KR20060079231A (ko) 2006-07-05
WO2005032765A1 (en) 2005-04-14

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