KR100936594B1 - 오목한 창을 구비한 폴리싱 패드 - Google Patents
오목한 창을 구비한 폴리싱 패드 Download PDFInfo
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- KR100936594B1 KR100936594B1 KR1020067005345A KR20067005345A KR100936594B1 KR 100936594 B1 KR100936594 B1 KR 100936594B1 KR 1020067005345 A KR1020067005345 A KR 1020067005345A KR 20067005345 A KR20067005345 A KR 20067005345A KR 100936594 B1 KR100936594 B1 KR 100936594B1
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- polishing
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
Claims (22)
- (a) 폴리싱 표면과, 제1 길이 및 제1 폭을 갖는 제1 개구를 포함하는 제1 폴리싱 층과,(b) 본체와, 제2 길이 및 제2 폭을 갖는 제2 개구를 포함하고, 상기 제1 폴리싱 층과 사실상 동일한 공간에 걸쳐있으며, 상기 제1 길이와 제1 폭 중 적어도 하나는 각각 상기 제2 길이와 제2 폭보다 각각 작은 제2 층과,(c) 상기 제1 폴리싱 층의 제1 개구와 정렬되도록 제2 층의 제2 개구 내에 배치되고, 상기 제2 층의 본체로부터 간극에 의해 분리되는 사실상 투명한 창 부분을 포함하고,투명한 창 부분은 폴리싱 표면으로부터 100 마이크로미터 이상 오목하고, 간극은 0.1mm 내지 1mm의 폭을 가지며, 제1 개구의 주연부는 둥글거나 또는 경사진 화학-기계적 폴리싱용 폴리싱 패드.
- 제1항에 있어서, 투명한 창 부분은 제1 폴리싱 층에 부착되는 화학-기계적 폴리싱용 폴리싱 패드.
- 제1항에 있어서, 투명한 창 부분은 제1 폴리싱 층에 용접되는 화학-기계적 폴리싱용 폴리싱 패드.
- 제1항에 있어서, 제1 길이와 제1 폭 모두는 상기 제2 길이와 제2 폭보다 각각 작은 화학-기계적 폴리싱용 폴리싱 패드.
- 삭제
- 제1항에 있어서, 간극은 압축성 재료로 충진되는 화학-기계적 폴리싱용 폴리싱 패드.
- 제1항에 있어서, 제1 개구의 주연부는 경사진 화학-기계적 폴리싱용 폴리싱 패드.
- 제1항에 있어서, 제1 개구의 주연부는 둥근 화학-기계적 폴리싱용 폴리싱 패드.
- 제1항에 있어서, 투명한 창 부분은 제1 폴리싱 층의 제1 개구 내에도 배치되는 화학-기계적 폴리싱용 폴리싱 패드.
- 제1항에 있어서, 제1 폴리싱 층의 폴리싱 표면은 하나 이상의 홈을 더 포함하는 화학-기계적 폴리싱용 폴리싱 패드.
- 제10항에 있어서, 홈은 개구의 각 측부에 정렬되는 화학-기계적 폴리싱용 폴리싱 패드.
- 제1항에 있어서, 투명한 창 부분은 제2 층의 두께보다 얇은 두께를 갖는 화학-기계적 폴리싱용 폴리싱 패드.
- 제1항에 있어서, 제1 폴리싱 층은 폴리우레탄을 포함하는 화학-기계적 폴리싱용 폴리싱 패드.
- 제1항에 있어서, 투명한 창 부분은 열가소성 폴리우레탄을 포함하는 화학-기계적 폴리싱용 폴리싱 패드.
- 제14항에 있어서, 상기 투명한 창 부분은 200nm 내지 10,000nm의 적어도 하나의 파장에서 1% 이상의 광 투과율을 갖는 화학-기계적 폴리싱용 폴리싱 패드.
- 제14항에 있어서, 상기 투명한 창 부분은 폴리머 입자, 무기 입자 및 이들의 조합체로부터 선택된 입자를 더 포함하는 화학-기계적 폴리싱용 폴리싱 패드.
- 제1항에 있어서, 상기 투명한 창 부분은 기공을 포함하는 화학-기계적 폴리싱용 폴리싱 패드.
- (a) 회전하는 플래튼과,(b) 제1항의 폴리싱 패드와,(c) 회전 폴리싱 패드와 접촉됨으로써 폴리싱될 작업편을 유지하는 캐리어를 포함하는 화학-기계적 폴리싱 장치.
- 제18항에 있어서, 현장 폴리싱 종점 검출 시스템을 더 포함하는 화학-기계적 폴리싱 장치.
- (i) 제1항의 폴리싱 패드를 제공하는 단계와,(ⅱ) 작업편을 폴리싱 패드와 접촉시키는 단계와,(ⅲ) 작업편을 연마하도록 폴리싱 패드를 작업편에 대해 이동시켜 작업편을 폴리싱하는 단계를 포함하는 작업편 폴리싱 방법.
- 제20항에 있어서, 폴리싱 패드가 작업편을 연마하도록 작업편에 대해 이동되어 작업편을 폴리싱하면서, 현장 폴리싱 종점 검출 시스템으로 작업편의 폴리싱 진행을 감시하는 단계를 더 포함하는 작업편 폴리싱 방법.
- 제20항에 있어서, 현장 폴리싱 종점 검출 시스템으로 작업편 폴리싱의 종점을 결정하는 단계를 더 포함하는 작업편 폴리싱 방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US10/666,797 US7195539B2 (en) | 2003-09-19 | 2003-09-19 | Polishing pad with recessed window |
US10/666,797 | 2003-09-19 |
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KR20060079231A KR20060079231A (ko) | 2006-07-05 |
KR100936594B1 true KR100936594B1 (ko) | 2010-01-13 |
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KR1020067005345A KR100936594B1 (ko) | 2003-09-19 | 2004-09-14 | 오목한 창을 구비한 폴리싱 패드 |
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US (1) | US7195539B2 (ko) |
EP (1) | EP1667816B1 (ko) |
JP (1) | JP4991294B2 (ko) |
KR (1) | KR100936594B1 (ko) |
CN (1) | CN1852788A (ko) |
AT (1) | ATE464976T1 (ko) |
DE (1) | DE602004026748D1 (ko) |
TW (1) | TWI276504B (ko) |
WO (1) | WO2005032765A1 (ko) |
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Also Published As
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JP4991294B2 (ja) | 2012-08-01 |
WO2005032765A1 (en) | 2005-04-14 |
EP1667816B1 (en) | 2010-04-21 |
US20050060943A1 (en) | 2005-03-24 |
KR20060079231A (ko) | 2006-07-05 |
ATE464976T1 (de) | 2010-05-15 |
TW200526357A (en) | 2005-08-16 |
CN1852788A (zh) | 2006-10-25 |
JP2007506280A (ja) | 2007-03-15 |
EP1667816A1 (en) | 2006-06-14 |
TWI276504B (en) | 2007-03-21 |
US7195539B2 (en) | 2007-03-27 |
DE602004026748D1 (de) | 2010-06-02 |
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