JP5363470B2 - 窓付きの薄い研磨パッド及び成形プロセス - Google Patents
窓付きの薄い研磨パッド及び成形プロセス Download PDFInfo
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- JP5363470B2 JP5363470B2 JP2010511259A JP2010511259A JP5363470B2 JP 5363470 B2 JP5363470 B2 JP 5363470B2 JP 2010511259 A JP2010511259 A JP 2010511259A JP 2010511259 A JP2010511259 A JP 2010511259A JP 5363470 B2 JP5363470 B2 JP 5363470B2
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- JP
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- Prior art keywords
- polishing
- window
- layer
- polishing pad
- aperture
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
Claims (15)
- 研磨面を有する研磨層と、
上記研磨面とは反対の上記研磨層の側にある接着剤層と、
上記研磨層を貫通して延びる固体の光透過窓と、を備え、
上記窓が、
上記研磨層に成形されることによって上記研磨層に固定されており、
上記研磨面と同一平面の最上面及び上記接着剤層の下面と同一平面の底面を有している、研磨パッド。 - 上記研磨層は、単一の層より成る、請求項1に記載の研磨パッド。
- 上記接着剤層に広がる取り外し可能なライナーを更に備えた、請求項1に記載の研磨パッド。
- 上記ライナーは、上記窓と整列された穴を有する、請求項3に記載の研磨パッド。
- 上記ライナーの上記穴に位置付けられて上記窓に当接する取り外し可能な窓バッキング部片を更に備えた、請求項4に記載の研磨パッド。
- 上記研磨面における溝を更に備えた、請求項1に記載の研磨パッド。
- 上記窓の一部分が上記溝へ突出し、そこに成形される、請求項5に記載の研磨パッド。
- 上記窓の周囲は、でこぼこした経路をたどる、請求項1に記載の研磨パッド。
- 研磨パッドを製造する方法において、
研磨層及び接着剤層を貫通するアパーチャーを形成するステップと、
上記研磨層の研磨面とは反対の側で上記接着剤層にバッキング部片を固定し、上記アパーチャーを覆うステップと、
上記アパーチャーに液体ポリマーを投与するステップと、
上記液体ポリマーを硬化して、窓を形成するステップと、を備えた方法。 - 取り外し可能なライナーに穴を形成するステップを更に備え、バッキング部片を固定する上記ステップは、上記バッキング部片を上記穴に設置することを含む、請求項9に記載の方法。
- 上記研磨面の上に突出する上記窓の一部分を除去するステップを更に備えた、請求項9に記載の方法。
- 上記液体ポリマーは、上記研磨面の溝に流れ込む、請求項9に記載の方法。
- 上記研磨層は、単一の層より成る、請求項9に記載の方法。
- アパーチャーを形成する上記ステップは、上記研磨パッドを型抜き又はカットすることを含む、請求項9に記載の方法。
- 上記窓の周囲は、でこぼこした経路をたどる、請求項9に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US94295607P | 2007-06-08 | 2007-06-08 | |
US60/942,956 | 2007-06-08 | ||
PCT/US2008/065316 WO2008154185A2 (en) | 2007-06-08 | 2008-05-30 | Thin polishing pad with window and molding process |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010528885A JP2010528885A (ja) | 2010-08-26 |
JP5363470B2 true JP5363470B2 (ja) | 2013-12-11 |
Family
ID=39684292
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010511259A Active JP5363470B2 (ja) | 2007-06-08 | 2008-05-30 | 窓付きの薄い研磨パッド及び成形プロセス |
Country Status (4)
Country | Link |
---|---|
US (2) | US8562389B2 (ja) |
JP (1) | JP5363470B2 (ja) |
TW (2) | TWI580521B (ja) |
WO (1) | WO2008154185A2 (ja) |
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US9597769B2 (en) | 2012-06-04 | 2017-03-21 | Nexplanar Corporation | Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer |
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JP6545261B2 (ja) * | 2014-10-17 | 2019-07-17 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 付加製造プロセスを使用する、複合材料特性を有するcmpパッド構造 |
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-
2008
- 2008-05-30 US US12/130,670 patent/US8562389B2/en active Active
- 2008-05-30 WO PCT/US2008/065316 patent/WO2008154185A2/en active Application Filing
- 2008-05-30 JP JP2010511259A patent/JP5363470B2/ja active Active
- 2008-06-03 TW TW104134400A patent/TWI580521B/zh active
- 2008-06-03 TW TW097120628A patent/TWI524965B/zh active
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2013
- 2013-07-23 US US13/948,547 patent/US9138858B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US9138858B2 (en) | 2015-09-22 |
US20080305729A1 (en) | 2008-12-11 |
JP2010528885A (ja) | 2010-08-26 |
US20130309951A1 (en) | 2013-11-21 |
TWI580521B (zh) | 2017-05-01 |
WO2008154185A2 (en) | 2008-12-18 |
TWI524965B (zh) | 2016-03-11 |
TW201618891A (zh) | 2016-06-01 |
WO2008154185A3 (en) | 2009-02-12 |
US8562389B2 (en) | 2013-10-22 |
TW200906543A (en) | 2009-02-16 |
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