JP2010528885A - 窓付きの薄い研磨パッド及び成形プロセス - Google Patents
窓付きの薄い研磨パッド及び成形プロセス Download PDFInfo
- Publication number
- JP2010528885A JP2010528885A JP2010511259A JP2010511259A JP2010528885A JP 2010528885 A JP2010528885 A JP 2010528885A JP 2010511259 A JP2010511259 A JP 2010511259A JP 2010511259 A JP2010511259 A JP 2010511259A JP 2010528885 A JP2010528885 A JP 2010528885A
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- window
- layer
- polishing pad
- aperture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
【選択図】 図4
Description
Claims (15)
- 研磨面を有する研磨層と、
上記研磨層とは反対の上記研磨層の側にある接着剤層と、
上記研磨層を貫通して延び且つ研磨層に成形された固体の光透過窓であって、上記研磨面と同一平面の最上面及び上記接着剤層の下面と同一平面の底面を有している窓と、
を備えた研磨パッド。 - 上記研磨層は、単一の層より成る、請求項1に記載の研磨パッド。
- 上記接着剤層に広がる取り外し可能なライナーを更に備えた、請求項1に記載の研磨パッド。
- 上記ライナーは、上記窓と整列された穴を有する、請求項3に記載の研磨パッド。
- 上記ライナーの上記穴に位置付けられて上記窓に当接する取り外し可能な窓バッキング部片を更に備えた、請求項4に記載の研磨パッド。
- 上記研磨面における溝を更に備えた、請求項1に記載の研磨パッド。
- 上記窓の一部分が上記溝へ突出し、そこに成形される、請求項5に記載の研磨パッド。
- 上記窓の周囲は、でこぼこした経路をたどる、請求項1に記載の研磨パッド。
- 研磨パッドを製造する方法において、
研磨層及び接着剤層を貫通するアパーチャーを形成するステップと、
上記研磨層の研磨面とは反対の側で上記接着剤層にバッキング部片を固定するステップと、
上記アパーチャーに液体ポリマーを投与するステップと、
上記液体ポリマーを硬化して、窓を形成するステップと、
を備えた方法。 - 取り外し可能なライナーに穴を形成するステップを更に備え、バッキング部片を固定する上記ステップは、上記バッキング部片を上記穴に設置することを含む、請求項9に記載の方法。
- 上記研磨面の上に突出する上記窓の一部分を除去するステップを更に備えた、請求項9に記載の方法。
- 上記液体ポリマーは、上記研磨面の溝に流れ込む、請求項9に記載の方法。
- 上記研磨層は、単一の層より成る、請求項9に記載の方法。
- アパーチャーを形成する上記ステップは、上記研磨パッドを型抜き又はカットすることを含む、請求項9に記載の方法。
- 上記窓の周囲は、でこぼこした経路をたどる、請求項9に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US94295607P | 2007-06-08 | 2007-06-08 | |
US60/942,956 | 2007-06-08 | ||
PCT/US2008/065316 WO2008154185A2 (en) | 2007-06-08 | 2008-05-30 | Thin polishing pad with window and molding process |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010528885A true JP2010528885A (ja) | 2010-08-26 |
JP5363470B2 JP5363470B2 (ja) | 2013-12-11 |
Family
ID=39684292
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010511259A Active JP5363470B2 (ja) | 2007-06-08 | 2008-05-30 | 窓付きの薄い研磨パッド及び成形プロセス |
Country Status (4)
Country | Link |
---|---|
US (2) | US8562389B2 (ja) |
JP (1) | JP5363470B2 (ja) |
TW (2) | TWI524965B (ja) |
WO (1) | WO2008154185A2 (ja) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2013039203A1 (ja) * | 2011-09-16 | 2013-03-21 | 東レ株式会社 | 研磨パッド |
WO2013039181A1 (ja) * | 2011-09-15 | 2013-03-21 | 東レ株式会社 | 研磨パッド |
WO2013129426A1 (ja) * | 2012-02-27 | 2013-09-06 | 東レ株式会社 | 研磨パッド |
JP2014515319A (ja) * | 2011-05-23 | 2014-06-30 | ネクスプラナー コーポレイション | 上に別個の突起を有する均一な本体を有する研磨パッド |
US9067298B2 (en) | 2011-11-29 | 2015-06-30 | Nexplanar Corporation | Polishing pad with grooved foundation layer and polishing surface layer |
US9067297B2 (en) | 2011-11-29 | 2015-06-30 | Nexplanar Corporation | Polishing pad with foundation layer and polishing surface layer |
US9597769B2 (en) | 2012-06-04 | 2017-03-21 | Nexplanar Corporation | Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer |
KR20170088444A (ko) * | 2010-05-12 | 2017-08-01 | 어플라이드 머티어리얼스, 인코포레이티드 | 패드 윈도우 삽입 |
US11673224B2 (en) | 2018-05-08 | 2023-06-13 | Ebara Corporation | Light transmitting member, polishing pad, and substrate polishing apparatus |
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US8562389B2 (en) * | 2007-06-08 | 2013-10-22 | Applied Materials, Inc. | Thin polishing pad with window and molding process |
US9017140B2 (en) | 2010-01-13 | 2015-04-28 | Nexplanar Corporation | CMP pad with local area transparency |
US8393940B2 (en) * | 2010-04-16 | 2013-03-12 | Applied Materials, Inc. | Molding windows in thin pads |
US9156124B2 (en) | 2010-07-08 | 2015-10-13 | Nexplanar Corporation | Soft polishing pad for polishing a semiconductor substrate |
WO2012068428A2 (en) * | 2010-11-18 | 2012-05-24 | Cabot Microelectronics Corporation | Polishing pad comprising transmissive region |
JP5893479B2 (ja) * | 2011-04-21 | 2016-03-23 | 東洋ゴム工業株式会社 | 積層研磨パッド |
US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
KR102295988B1 (ko) * | 2014-10-17 | 2021-09-01 | 어플라이드 머티어리얼스, 인코포레이티드 | 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 cmp 패드 구성 |
US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
US10618141B2 (en) | 2015-10-30 | 2020-04-14 | Applied Materials, Inc. | Apparatus for forming a polishing article that has a desired zeta potential |
US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
TWI676526B (zh) * | 2016-02-24 | 2019-11-11 | 智勝科技股份有限公司 | 研磨墊、研磨墊的製造方法及研磨方法 |
US10213894B2 (en) | 2016-02-26 | 2019-02-26 | Applied Materials, Inc. | Method of placing window in thin polishing pad |
TWI629297B (zh) * | 2016-07-05 | 2018-07-11 | 智勝科技股份有限公司 | 研磨層及其製造方法以及研磨方法 |
CN109641342A (zh) * | 2016-08-31 | 2019-04-16 | 应用材料公司 | 具有环形工作台或抛光垫的抛光系统 |
US10596763B2 (en) | 2017-04-21 | 2020-03-24 | Applied Materials, Inc. | Additive manufacturing with array of energy sources |
US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
US11072050B2 (en) | 2017-08-04 | 2021-07-27 | Applied Materials, Inc. | Polishing pad with window and manufacturing methods thereof |
TWI647065B (zh) * | 2017-08-07 | 2019-01-11 | 智勝科技股份有限公司 | 研磨墊及其製造方法以及研磨方法 |
WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME |
JP2020001162A (ja) * | 2018-06-28 | 2020-01-09 | 株式会社荏原製作所 | 研磨パッド積層体、研磨パッド位置決め治具、および研磨パッドを研磨テーブルに貼り付ける方法 |
ES2701950B2 (es) | 2018-08-09 | 2020-01-15 | Demac S A | Dispositivo para el masaje y estiramiento de ciertas partes del cuerpo |
JP7299970B2 (ja) | 2018-09-04 | 2023-06-28 | アプライド マテリアルズ インコーポレイテッド | 改良型研磨パッドのための配合物 |
US11813712B2 (en) | 2019-12-20 | 2023-11-14 | Applied Materials, Inc. | Polishing pads having selectively arranged porosity |
US11806829B2 (en) | 2020-06-19 | 2023-11-07 | Applied Materials, Inc. | Advanced polishing pads and related polishing pad manufacturing methods |
US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
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Cited By (13)
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KR20170088444A (ko) * | 2010-05-12 | 2017-08-01 | 어플라이드 머티어리얼스, 인코포레이티드 | 패드 윈도우 삽입 |
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US9067297B2 (en) | 2011-11-29 | 2015-06-30 | Nexplanar Corporation | Polishing pad with foundation layer and polishing surface layer |
US9931729B2 (en) | 2011-11-29 | 2018-04-03 | Cabot Microelectronics Corporation | Polishing pad with grooved foundation layer and polishing surface layer |
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Also Published As
Publication number | Publication date |
---|---|
TWI580521B (zh) | 2017-05-01 |
JP5363470B2 (ja) | 2013-12-11 |
WO2008154185A3 (en) | 2009-02-12 |
US8562389B2 (en) | 2013-10-22 |
US20080305729A1 (en) | 2008-12-11 |
US20130309951A1 (en) | 2013-11-21 |
US9138858B2 (en) | 2015-09-22 |
TW201618891A (zh) | 2016-06-01 |
WO2008154185A2 (en) | 2008-12-18 |
TW200906543A (en) | 2009-02-16 |
TWI524965B (zh) | 2016-03-11 |
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