JP5474093B2 - 窓支持部を具備する研磨パッドおよび研磨システム - Google Patents
窓支持部を具備する研磨パッドおよび研磨システム Download PDFInfo
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- JP5474093B2 JP5474093B2 JP2011546249A JP2011546249A JP5474093B2 JP 5474093 B2 JP5474093 B2 JP 5474093B2 JP 2011546249 A JP2011546249 A JP 2011546249A JP 2011546249 A JP2011546249 A JP 2011546249A JP 5474093 B2 JP5474093 B2 JP 5474093B2
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- polishing
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- 238000005498 polishing Methods 0.000 title claims description 105
- 125000006850 spacer group Chemical group 0.000 claims description 54
- 239000013307 optical fiber Substances 0.000 claims description 50
- 239000000463 material Substances 0.000 claims description 9
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 27
- 230000003287 optical effect Effects 0.000 description 16
- 238000012544 monitoring process Methods 0.000 description 13
- 239000002002 slurry Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000009825 accumulation Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 229920002635 polyurethane Polymers 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000012705 liquid precursor Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000012625 in-situ measurement Methods 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000004005 microsphere Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 238000012306 spectroscopic technique Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
Claims (15)
- 硬質の光透過性窓を有する研磨パッドと、
一の端部を有する光ファイバと、
貫通する垂直なアパーチャを有するスペーサであって、底部表面が前記光ファイバの前記端部と接触し、上表面が前記窓の下側と接触し、前記垂直なアパーチャが前記光ファイバと位置合わせされているスペーサと
を備えた研磨システム。 - 前記アパーチャが、前記光ファイバの中心軸と位置合わせされている、請求項1に記載の研磨システム。
- 前記研磨パッドを支持するプラテンをさらに備えた、請求項1に記載の研磨システム。
- 前記光ファイバの前記端部が前記プラテンの上表面と同一平面内にある、請求項3に記載の研磨システム。
- 前記スペーサが前記プラテンによって支持されない、請求項3に記載の研磨システム。
- 前記スペーサの外側周辺部が前記プラテンによって支持されている、請求項3に記載の研磨システム。
- 前記スペーサが接着によって前記光ファイバに固定されている、請求項1に記載の研磨システム。
- 前記スペーサが接着によって前記窓に固定されている、請求項1に記載の研磨システム。
- 前記スペーサの外径が前記光ファイバの外径よりも小さい、請求項1に記載の研磨システム。
- 前記研磨パッドが研磨層およびバッキング層を含む、請求項1に記載の研磨システム。
- 前記スペーサが、前記バッキング層から間隔を空けて配置されており、前記バッキング層と接触しない、請求項10に記載の研磨システム。
- 前記スペーサおよび前記バッキング層が同じ材料から形成されている、請求項10に記載の研磨システム。
- 前記スペーサおよび前記バッキング層が同じ厚さを有する、請求項10に記載の研磨システム。
- 前記窓の前記下側が前記研磨層の底部表面と同一平面内にある、請求項10に記載の研磨システム。
- 研磨層と、バッキング層と、前記研磨層内の硬質の光透過性窓と、前記窓に位置合わせされた前記バッキング層内のアパーチャとを有する研磨パッド、および
一の端部を有する光ファイバであって、前記バッキング層内の前記アパーチャの幅が前記光ファイバの直径よりも小さく、前記垂直アパーチャが前記光ファイバと位置合わせされており、前記バッキング層の底部表面が前記光ファイバの前記端部と接触する、光ファイバ
を備えた研磨システム。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14543509P | 2009-01-16 | 2009-01-16 | |
US61/145,435 | 2009-01-16 | ||
PCT/US2009/067587 WO2010082992A2 (en) | 2009-01-16 | 2009-12-10 | Polishing pad and system with window support |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012515092A JP2012515092A (ja) | 2012-07-05 |
JP5474093B2 true JP5474093B2 (ja) | 2014-04-16 |
Family
ID=42337340
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011546249A Active JP5474093B2 (ja) | 2009-01-16 | 2009-12-10 | 窓支持部を具備する研磨パッドおよび研磨システム |
Country Status (6)
Country | Link |
---|---|
US (1) | US8393933B2 (ja) |
JP (1) | JP5474093B2 (ja) |
KR (1) | KR20110120893A (ja) |
CN (1) | CN102281990A (ja) |
TW (1) | TW201032948A (ja) |
WO (1) | WO2010082992A2 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8535115B2 (en) * | 2011-01-28 | 2013-09-17 | Applied Materials, Inc. | Gathering spectra from multiple optical heads |
JP5389973B2 (ja) * | 2012-04-11 | 2014-01-15 | 東洋ゴム工業株式会社 | 積層研磨パッド及びその製造方法 |
US9067299B2 (en) | 2012-04-25 | 2015-06-30 | Applied Materials, Inc. | Printed chemical mechanical polishing pad |
CN103522170A (zh) * | 2012-07-05 | 2014-01-22 | 上海宏力半导体制造有限公司 | 用于化学机械研磨制程的激光衬垫窗口 |
CN106575613B (zh) * | 2014-05-07 | 2019-12-17 | 嘉柏微电子材料股份公司 | 用于化学机械抛光的多层抛光垫 |
US9446498B1 (en) * | 2015-03-13 | 2016-09-20 | rohm and Hass Electronic Materials CMP Holdings, Inc. | Chemical mechanical polishing pad with window |
US9868185B2 (en) * | 2015-11-03 | 2018-01-16 | Cabot Microelectronics Corporation | Polishing pad with foundation layer and window attached thereto |
SG11201806662WA (en) * | 2016-02-26 | 2018-09-27 | Applied Materials Inc | Window in thin polishing pad |
KR102362022B1 (ko) * | 2016-07-12 | 2022-02-10 | 가부시키가이샤 노리타케 캄파니 리미티드 | 연마체 및 그 제조 방법 |
JP2019528187A (ja) | 2016-08-31 | 2019-10-10 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 環状プラテン又は研磨パッドを有する研磨システム |
JP6948868B2 (ja) * | 2017-07-24 | 2021-10-13 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
Family Cites Families (26)
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US42675A (en) * | 1864-05-10 | Improvement in hollow wooden ware | ||
US5007209A (en) * | 1987-06-26 | 1991-04-16 | K.K. Sankyo Seiki Seisakusho | Optical fiber connector polishing apparatus and method |
EP0738561B1 (en) * | 1995-03-28 | 2002-01-23 | Applied Materials, Inc. | Apparatus and method for in-situ endpoint detection and monitoring for chemical mechanical polishing operations |
US6149506A (en) * | 1998-10-07 | 2000-11-21 | Keltech Engineering | Lapping apparatus and method for high speed lapping with a rotatable abrasive platen |
JPH11151663A (ja) * | 1997-11-18 | 1999-06-08 | Canon Inc | 研磨装置および研磨方法 |
US6068539A (en) * | 1998-03-10 | 2000-05-30 | Lam Research Corporation | Wafer polishing device with movable window |
WO2000071971A1 (en) * | 1999-05-24 | 2000-11-30 | Luxtron Corporation | Optical techniques for measuring layer thicknesses |
JP2003510826A (ja) * | 1999-09-29 | 2003-03-18 | ロデール ホールディングス インコーポレイテッド | 研磨パッド |
US6719608B1 (en) * | 2001-04-19 | 2004-04-13 | Oluma, Inc. | Fabrication of devices with fibers engaged to grooves on substrates |
US6966816B2 (en) * | 2001-05-02 | 2005-11-22 | Applied Materials, Inc. | Integrated endpoint detection system with optical and eddy current monitoring |
JP4131632B2 (ja) * | 2001-06-15 | 2008-08-13 | 株式会社荏原製作所 | ポリッシング装置及び研磨パッド |
US6586337B2 (en) * | 2001-11-09 | 2003-07-01 | Speedfam-Ipec Corporation | Method and apparatus for endpoint detection during chemical mechanical polishing |
US6599765B1 (en) * | 2001-12-12 | 2003-07-29 | Lam Research Corporation | Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection |
US6878039B2 (en) * | 2002-01-28 | 2005-04-12 | Speedfam-Ipec Corporation | Polishing pad window for a chemical-mechanical polishing tool |
US6935922B2 (en) * | 2002-02-04 | 2005-08-30 | Kla-Tencor Technologies Corp. | Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishing |
US7040957B2 (en) * | 2002-08-14 | 2006-05-09 | Novellus Systems Inc. | Platen and manifold for polishing workpieces |
JP4542324B2 (ja) * | 2002-10-17 | 2010-09-15 | 株式会社荏原製作所 | 研磨状態監視装置及びポリッシング装置 |
CN101530983B (zh) * | 2002-10-17 | 2011-03-16 | 株式会社荏原制作所 | 抛光状态监测装置和抛光装置以及方法 |
US6991514B1 (en) * | 2003-02-21 | 2006-01-31 | Verity Instruments, Inc. | Optical closed-loop control system for a CMP apparatus and method of manufacture thereof |
JP2006522493A (ja) * | 2003-04-01 | 2006-09-28 | フィルメトリックス・インコーポレイテッド | Cmpのための基板全体用スペクトル画像形成システム |
US20040242121A1 (en) * | 2003-05-16 | 2004-12-02 | Kazuto Hirokawa | Substrate polishing apparatus |
US7264536B2 (en) * | 2003-09-23 | 2007-09-04 | Applied Materials, Inc. | Polishing pad with window |
US20050173259A1 (en) * | 2004-02-06 | 2005-08-11 | Applied Materials, Inc. | Endpoint system for electro-chemical mechanical polishing |
JP2005259979A (ja) * | 2004-03-11 | 2005-09-22 | Tokyo Seimitsu Co Ltd | 化学機械研磨装置及び化学機械研磨方法 |
JP2005347456A (ja) * | 2004-06-02 | 2005-12-15 | Toray Ind Inc | 研磨パッド |
US7764377B2 (en) | 2005-08-22 | 2010-07-27 | Applied Materials, Inc. | Spectrum based endpointing for chemical mechanical polishing |
-
2009
- 2009-12-10 KR KR1020117019050A patent/KR20110120893A/ko not_active Application Discontinuation
- 2009-12-10 JP JP2011546249A patent/JP5474093B2/ja active Active
- 2009-12-10 CN CN2009801547234A patent/CN102281990A/zh active Pending
- 2009-12-10 WO PCT/US2009/067587 patent/WO2010082992A2/en active Application Filing
- 2009-12-22 US US12/644,972 patent/US8393933B2/en active Active
-
2010
- 2010-01-15 TW TW099101087A patent/TW201032948A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
WO2010082992A3 (en) | 2010-09-23 |
TW201032948A (en) | 2010-09-16 |
JP2012515092A (ja) | 2012-07-05 |
US20100184357A1 (en) | 2010-07-22 |
WO2010082992A2 (en) | 2010-07-22 |
US8393933B2 (en) | 2013-03-12 |
CN102281990A (zh) | 2011-12-14 |
KR20110120893A (ko) | 2011-11-04 |
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