SG11201806662WA - Window in thin polishing pad - Google Patents
Window in thin polishing padInfo
- Publication number
- SG11201806662WA SG11201806662WA SG11201806662WA SG11201806662WA SG11201806662WA SG 11201806662W A SG11201806662W A SG 11201806662WA SG 11201806662W A SG11201806662W A SG 11201806662WA SG 11201806662W A SG11201806662W A SG 11201806662WA SG 11201806662W A SG11201806662W A SG 11201806662WA
- Authority
- SG
- Singapore
- Prior art keywords
- polishing
- international
- aperture
- layer
- california
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0045—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by stacking sheets of abrasive material
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
26 54 50 62 64 24 60 701 20 72 86 FIG. 3 80 -28 84, W O 20 17 / 1467 35 Al (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (10) International Publication Number (43) International Publication Date WO 2017/146735 Al 31 August 2017 (31.08.2017) WIPO I PCT 11111111111111011101111111111101011111011101011111111111111101111111111111111110111111 (51) International Patent Classification: H01L 21/304 (2006.01) (21) International Application Number: PCT/US2016/019916 (22) International Filing Date: 26 February 2016 (26.02.2016) (25) Filing Language: English (26) Publication Language: English (71) Applicant: APPLIED MATERIALS, INC. [US/US]; 3050 Bowers Avenue, Santa Clara, California 95054 (US). (72) Inventors: HU, Yongqi; 49204 Park Terrace, Fremont, California 94539 (US). NARENDRNATH, Kadthala Ramaya; 3686 Slopeview Drive, San Jose, California 95148 (US). TERRY, Thomas Lawrence; 585 Tiffany Drive, Hollister, California 95023 (US). (74) Agent: GOREN, David J.; Fish & Richardson P.c., P. 0. Box 1022, Minneapolis, Minnesota 55440-1022 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: with international search report (Art. 21(3)) (54) Title: WINDOW IN THIN POLISHING PAD (57) : A polishing pad includes a polishing layer stack that has a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface. The polishing layer stack includes a polishing layer that has the polishing surface. A flu- id- impermeable layer spans the aperture and the polishing pad. A first adhesive layer of a first adhesive material is in contact with and secures the bottom surface of the polishing layer to the fluid-impermeable layer. The first adhesive layer spans the aperture and the polishing pad. The light-transmitting body is positioned in the aperture and has a lower surface in contact with, is secured to the first adhesive layer, and is spaced apart from a side-wall of the aperture by a gap. An adhesive sealant of a different second material is disposed in and laterally fills the gap.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2016/019916 WO2017146735A1 (en) | 2016-02-26 | 2016-02-26 | Window in thin polishing pad |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201806662WA true SG11201806662WA (en) | 2018-09-27 |
Family
ID=59686484
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201806662WA SG11201806662WA (en) | 2016-02-26 | 2016-02-26 | Window in thin polishing pad |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP3420579B1 (en) |
JP (1) | JP6794464B2 (en) |
KR (2) | KR102664256B1 (en) |
CN (2) | CN108701600B (en) |
SG (1) | SG11201806662WA (en) |
WO (1) | WO2017146735A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20240006369A (en) * | 2022-07-06 | 2024-01-15 | 케이피엑스케미칼 주식회사 | Polishing pad with window and method for preparing thereof |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6224460B1 (en) * | 1999-06-30 | 2001-05-01 | Vlsi Technology, Inc. | Laser interferometry endpoint detection with windowless polishing pad for chemical mechanical polishing process |
WO2001023141A1 (en) * | 1999-09-29 | 2001-04-05 | Rodel Holdings, Inc. | Polishing pad |
CA2317778A1 (en) * | 1999-09-29 | 2001-03-29 | Vivienne E. Harris | Synergistic insecticidal formulations of pyridaben and strobilurins |
US6383058B1 (en) * | 2000-01-28 | 2002-05-07 | Applied Materials, Inc. | Adaptive endpoint detection for chemical mechanical polishing |
KR100548085B1 (en) * | 2001-10-09 | 2006-02-02 | 히다치 가세고교 가부시끼가이샤 | Polishing pad for cmp, method for polishing substrate using it and method for producing polishing pad for cmp |
JP2003133270A (en) * | 2001-10-26 | 2003-05-09 | Jsr Corp | Window material for chemical mechanical polishing and polishing pad |
JP2004098264A (en) * | 2002-09-12 | 2004-04-02 | Shin Etsu Handotai Co Ltd | Method for dressing polishing cloth and method for polishing workpiece |
CN1285457C (en) * | 2002-12-06 | 2006-11-22 | 智胜科技股份有限公司 | Making process of grinding pad with detection window |
US6913514B2 (en) * | 2003-03-14 | 2005-07-05 | Ebara Technologies, Inc. | Chemical mechanical polishing endpoint detection system and method |
JP2004343090A (en) * | 2003-04-22 | 2004-12-02 | Jsr Corp | Polishing pad and method for polishing semiconductor wafer |
US20040224611A1 (en) * | 2003-04-22 | 2004-11-11 | Jsr Corporation | Polishing pad and method of polishing a semiconductor wafer |
JP4514199B2 (en) * | 2004-05-10 | 2010-07-28 | 東洋ゴム工業株式会社 | Polishing pad and semiconductor device manufacturing method |
JP2006190826A (en) * | 2005-01-06 | 2006-07-20 | Toyo Tire & Rubber Co Ltd | Polishing pad and method of manufacturing semiconductor device |
US7942724B2 (en) * | 2006-07-03 | 2011-05-17 | Applied Materials, Inc. | Polishing pad with window having multiple portions |
KR20110120893A (en) * | 2009-01-16 | 2011-11-04 | 어플라이드 머티어리얼스, 인코포레이티드 | Polishing pad and system with window support |
TWI396602B (en) * | 2009-12-31 | 2013-05-21 | Iv Technologies Co Ltd | Method of manufacturing polishing pad having detection window and polishing pad having detection window |
JP5620141B2 (en) * | 2010-04-15 | 2014-11-05 | 東洋ゴム工業株式会社 | Polishing pad |
US20110281510A1 (en) * | 2010-05-12 | 2011-11-17 | Applied Materials, Inc. | Pad Window Insert |
JP2013082035A (en) * | 2011-10-11 | 2013-05-09 | Toyo Tire & Rubber Co Ltd | Laminated polishing pad and method of manufacturing the same |
JP2014104521A (en) * | 2012-11-26 | 2014-06-09 | Toyo Tire & Rubber Co Ltd | Polishing pad |
-
2016
- 2016-02-26 SG SG11201806662WA patent/SG11201806662WA/en unknown
- 2016-02-26 CN CN201680082238.0A patent/CN108701600B/en active Active
- 2016-02-26 CN CN202310204209.9A patent/CN116141191A/en active Pending
- 2016-02-26 WO PCT/US2016/019916 patent/WO2017146735A1/en active Application Filing
- 2016-02-26 EP EP16891844.9A patent/EP3420579B1/en active Active
- 2016-02-26 KR KR1020237014065A patent/KR102664256B1/en active IP Right Grant
- 2016-02-26 JP JP2018544883A patent/JP6794464B2/en active Active
- 2016-02-26 KR KR1020187027588A patent/KR102527886B1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
EP3420579A1 (en) | 2019-01-02 |
CN108701600A (en) | 2018-10-23 |
WO2017146735A1 (en) | 2017-08-31 |
KR20230058559A (en) | 2023-05-03 |
KR102664256B1 (en) | 2024-05-08 |
KR20180117655A (en) | 2018-10-29 |
JP2019508272A (en) | 2019-03-28 |
CN108701600B (en) | 2023-03-14 |
CN116141191A (en) | 2023-05-23 |
EP3420579B1 (en) | 2022-10-19 |
EP3420579A4 (en) | 2019-08-14 |
KR102527886B1 (en) | 2023-04-28 |
JP6794464B2 (en) | 2020-12-02 |
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