SG11201806662WA - Window in thin polishing pad - Google Patents

Window in thin polishing pad

Info

Publication number
SG11201806662WA
SG11201806662WA SG11201806662WA SG11201806662WA SG11201806662WA SG 11201806662W A SG11201806662W A SG 11201806662WA SG 11201806662W A SG11201806662W A SG 11201806662WA SG 11201806662W A SG11201806662W A SG 11201806662WA SG 11201806662W A SG11201806662W A SG 11201806662WA
Authority
SG
Singapore
Prior art keywords
polishing
international
aperture
layer
california
Prior art date
Application number
SG11201806662WA
Inventor
Yongqi Hu
Kadthala Ramaya Narendrnath
Thomas Lawrence Terry
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG11201806662WA publication Critical patent/SG11201806662WA/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/22Lapping pads for working plane surfaces characterised by a multi-layered structure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/205Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0045Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by stacking sheets of abrasive material

Abstract

26 54 50 62 64 24 60 701 20 72 86 FIG. 3 80 -28 84, W O 20 17 / 1467 35 Al (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (10) International Publication Number (43) International Publication Date WO 2017/146735 Al 31 August 2017 (31.08.2017) WIPO I PCT 11111111111111011101111111111101011111011101011111111111111101111111111111111110111111 (51) International Patent Classification: H01L 21/304 (2006.01) (21) International Application Number: PCT/US2016/019916 (22) International Filing Date: 26 February 2016 (26.02.2016) (25) Filing Language: English (26) Publication Language: English (71) Applicant: APPLIED MATERIALS, INC. [US/US]; 3050 Bowers Avenue, Santa Clara, California 95054 (US). (72) Inventors: HU, Yongqi; 49204 Park Terrace, Fremont, California 94539 (US). NARENDRNATH, Kadthala Ramaya; 3686 Slopeview Drive, San Jose, California 95148 (US). TERRY, Thomas Lawrence; 585 Tiffany Drive, Hollister, California 95023 (US). (74) Agent: GOREN, David J.; Fish & Richardson P.c., P. 0. Box 1022, Minneapolis, Minnesota 55440-1022 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: with international search report (Art. 21(3)) (54) Title: WINDOW IN THIN POLISHING PAD (57) : A polishing pad includes a polishing layer stack that has a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface. The polishing layer stack includes a polishing layer that has the polishing surface. A flu- id- impermeable layer spans the aperture and the polishing pad. A first adhesive layer of a first adhesive material is in contact with and secures the bottom surface of the polishing layer to the fluid-impermeable layer. The first adhesive layer spans the aperture and the polishing pad. The light-transmitting body is positioned in the aperture and has a lower surface in contact with, is secured to the first adhesive layer, and is spaced apart from a side-wall of the aperture by a gap. An adhesive sealant of a different second material is disposed in and laterally fills the gap.
SG11201806662WA 2016-02-26 2016-02-26 Window in thin polishing pad SG11201806662WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2016/019916 WO2017146735A1 (en) 2016-02-26 2016-02-26 Window in thin polishing pad

Publications (1)

Publication Number Publication Date
SG11201806662WA true SG11201806662WA (en) 2018-09-27

Family

ID=59686484

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201806662WA SG11201806662WA (en) 2016-02-26 2016-02-26 Window in thin polishing pad

Country Status (6)

Country Link
EP (1) EP3420579B1 (en)
JP (1) JP6794464B2 (en)
KR (2) KR20230058559A (en)
CN (2) CN108701600B (en)
SG (1) SG11201806662WA (en)
WO (1) WO2017146735A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240006369A (en) * 2022-07-06 2024-01-15 케이피엑스케미칼 주식회사 Polishing pad with window and method for preparing thereof

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6224460B1 (en) * 1999-06-30 2001-05-01 Vlsi Technology, Inc. Laser interferometry endpoint detection with windowless polishing pad for chemical mechanical polishing process
US6358130B1 (en) * 1999-09-29 2002-03-19 Rodel Holdings, Inc. Polishing pad
CA2317778A1 (en) * 1999-09-29 2001-03-29 Vivienne E. Harris Synergistic insecticidal formulations of pyridaben and strobilurins
US6383058B1 (en) * 2000-01-28 2002-05-07 Applied Materials, Inc. Adaptive endpoint detection for chemical mechanical polishing
JP4317016B2 (en) * 2001-10-09 2009-08-19 日立化成工業株式会社 Polishing pad for CMP, substrate polishing method using the same, and method for manufacturing CMP polishing pad
JP2003133270A (en) * 2001-10-26 2003-05-09 Jsr Corp Window material for chemical mechanical polishing and polishing pad
JP2004098264A (en) * 2002-09-12 2004-04-02 Shin Etsu Handotai Co Ltd Method for dressing polishing cloth and method for polishing workpiece
CN1285457C (en) * 2002-12-06 2006-11-22 智胜科技股份有限公司 Making process of grinding pad with detection window
US6913514B2 (en) * 2003-03-14 2005-07-05 Ebara Technologies, Inc. Chemical mechanical polishing endpoint detection system and method
KR20040093402A (en) * 2003-04-22 2004-11-05 제이에스알 가부시끼가이샤 Polishing Pad and Method of Polishing a Semiconductor Wafer
JP2004343090A (en) * 2003-04-22 2004-12-02 Jsr Corp Polishing pad and method for polishing semiconductor wafer
JP4514199B2 (en) * 2004-05-10 2010-07-28 東洋ゴム工業株式会社 Polishing pad and semiconductor device manufacturing method
JP2006190826A (en) * 2005-01-06 2006-07-20 Toyo Tire & Rubber Co Ltd Polishing pad and method of manufacturing semiconductor device
US7942724B2 (en) * 2006-07-03 2011-05-17 Applied Materials, Inc. Polishing pad with window having multiple portions
TWI396602B (en) * 2009-12-31 2013-05-21 Iv Technologies Co Ltd Method of manufacturing polishing pad having detection window and polishing pad having detection window
JP5620141B2 (en) * 2010-04-15 2014-11-05 東洋ゴム工業株式会社 Polishing pad
US20110281510A1 (en) * 2010-05-12 2011-11-17 Applied Materials, Inc. Pad Window Insert
JP2013082035A (en) * 2011-10-11 2013-05-09 Toyo Tire & Rubber Co Ltd Laminated polishing pad and method of manufacturing the same
JP2014104521A (en) * 2012-11-26 2014-06-09 Toyo Tire & Rubber Co Ltd Polishing pad

Also Published As

Publication number Publication date
JP2019508272A (en) 2019-03-28
CN108701600B (en) 2023-03-14
WO2017146735A1 (en) 2017-08-31
KR102527886B1 (en) 2023-04-28
EP3420579A4 (en) 2019-08-14
KR20180117655A (en) 2018-10-29
JP6794464B2 (en) 2020-12-02
KR20230058559A (en) 2023-05-03
EP3420579B1 (en) 2022-10-19
EP3420579A1 (en) 2019-01-02
CN108701600A (en) 2018-10-23
CN116141191A (en) 2023-05-23

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